Planar LED packaging structure
By adopting a planar LED packaging structure, the LED chip is welded using BT substrate and solid crystal pad, and the LED chip is wrapped with molding process and white wall glue, the problem of limited size of the traditional packaging structure is solved, achieving a smaller and more flexible design and higher heat dissipation performance.
Patent Information
- Application Number
- CN202422320254.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-24
AI Technical Summary
Existing electronic consumer and display LED packaging products are developing towards small pitch and small granularity. Traditional SMD packaging with bowl and cup is limited by the fixed size of the bracket and cannot meet market demand.
The flat LED packaging structure is adopted, and the LED chip is soldered using BT substrate and solid crystal pad. The packaging glue layer and fluorescent glue layer adopt a molding process, and the LED chip is wrapped with opaque white wall glue to replace the traditional dispensing process.
A smaller and more flexible dimensional design is achieved, reducing ohmic impedance, improving heat dissipation performance, avoiding color temperature shifts, and improving production efficiency and finished product consistency.
Smart Images
Figure CN223125241U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED packaging, and specifically, to a planar LED packaging structure. Background Art
[0002] Most of the existing LED packaging products for consumer electronics and displays rely on bowl-cup PPA plastic brackets for dispensing packaging operations. However, the existing LED packaging products for consumer electronics and displays are gradually developing towards smaller pitch and smaller particles; the traditional SMD bowl-cup packaging will soon not meet the market demand due to the limited fixed size of the brackets. Summary of the Utility Model
[0003] Aiming at the problems existing in the prior art, the purpose of the utility model is to provide a planar LED packaging structure, which is smaller than the traditional LED packaging structure, has a more flexible size design space, and replaces the traditional dispensing process, effectively improving the diversification and refinement of the finished product size.
[0004] To achieve the above purpose, the utility model adopts the following technical solutions;
[0005] A planar LED packaging structure, comprising: a BT substrate and two die bonding pads fixed on the BT substrate, an LED chip is welded on the top between the two die bonding pads, an encapsulation glue layer is encapsulated on the BT substrate, the die bonding pads and the LED chip are both surrounded by the encapsulation glue layer, a fluorescent glue layer is fixedly connected on the top between the LED chip and the encapsulation glue layer, and a finished product bottom pad is arranged at the bottom of the BT substrate.
[0006] As a further description of the above technical solution:
[0007] The welding method of the die bonding pad and the LED chip uses small-particle-sized powder solder paste and a flip-chip gold bonding pad for welding and die bonding.
[0008] As a further description of the above technical solution:
[0009] Both the encapsulation glue layer and the fluorescent glue layer are formed by a molding process.
[0010] As a further description of the above technical solution:
[0011] The encapsulation glue layer is an opaque white wall glue, and the periphery of the LED chip is wrapped by the white wall glue.
[0012] As a further description of the above technical solution:
[0013] The fluorescent glue layer covers the top of the encapsulation glue layer, and the bottom edge of the fluorescent glue layer is flush with the edge of the encapsulation glue layer for transition.
[0014] Compared with the prior art, the advantages of the present utility model are as follows:
[0015] In this solution, the structure is relatively smaller than the traditional LED packaging structure, and the size design space is more flexible; the ohmic impedance is effectively reduced, and the heat dissipation performance is improved;
[0016] The molding fluorescent glue and cutting process replace the traditional dispensing process, effectively improving the diversification and refinement of the finished product size;
[0017] The side of the LED chip is wrapped with opaque white wall glue to avoid the color temperature shift problem caused by the exposure of blue light. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic structural diagram of the present utility model;
[0019] Figure 2 It is a schematic connection structure diagram of the die bonding pad and the LED chip of the present utility model;
[0020] Figure 3 It is a schematic connection structure diagram of the LED chip and the encapsulation glue layer of the present utility model;
[0021] Figure 4 It is a schematic inverted view structure diagram of the present utility model.
[0022] Description of the reference numerals in the drawings:
[0023] 1. BT substrate; 2. Die bonding pad; 3. LED chip; 4. Encapsulation glue layer; 5. Fluorescent glue layer; 6. Bottom solder pad of the finished product. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model.
[0025] Please refer to Figures 1-4 , in the present utility model, a planar LED packaging structure includes: a BT substrate 1 and two die bonding pads 2 fixed on the BT substrate. An LED chip 3 is welded on the top between the two die bonding pads 2. An encapsulation glue layer 4 is encapsulated on the BT substrate 1. The die bonding pad 2 and the LED chip 3 are both surrounded by the encapsulation glue layer 4. A fluorescent glue layer 5 is fixedly connected to the top between the LED chip 3 and the encapsulation glue layer 4. A bottom solder pad 6 of the finished product is provided at the bottom of the BT substrate 1.
[0026] In the present utility model, by welding the LED chip 3 onto two die bonding pads 2 mounted on the BT substrate 1, the gold bonding pads of the LED chip 3 are respectively connected to the two die bonding pads 2, and the installation of the LED package is facilitated through the finished product bottom pad 6, reducing the connection path, having a shorter signal path and lower resistance, improving the power of the LED chip 3, and encapsulating the LED chip 3 with the encapsulation glue layer 4 and the fluorescent glue layer 5. The structure is smaller than the traditional LED packaging structure, and the size design space is more flexible.
[0027] Please refer to Figure 1 and Figure 2 , wherein: the welding method between the die bonding pad 2 and the LED chip 3 uses small-particle-size powder solder paste to weld and fix the die with the flip-chip gold bonding pad.
[0028] In the present utility model, an electrical connection with low resistance and high reliability is achieved, and a dielectric tin is used to combine the die bonding pad 2 and the LED chip 3, which can effectively improve the heat dissipation performance.
[0029] Please refer to Figure 1 , 3 and 4, wherein: both the encapsulation glue layer 4 and the fluorescent glue layer 5 are formed by a compression molding process.
[0030] In the present utility model, the compression molding process replaces the traditional dispensing process, effectively improving the diversification and refinement of the finished product size, and can also improve the production efficiency, consistency, reliability, and appearance quality of the LED package, while reducing costs and material waste.
[0031] Please refer to Figure 3 , wherein: the encapsulation glue layer 4 is an opaque white wall glue, and the LED chip 3 is surrounded by the white wall glue.
[0032] In the present utility model, using the white wall glue to build a dam around the LED chip 3 effectively solves the problem of color temperature shift caused by blue light leakage and improves color consistency.
[0033] Please refer to Figure 1 and Figure 4 , wherein: the fluorescent glue layer 5 covers the top of the encapsulation glue layer 4, and the bottom edge of the fluorescent glue layer 5 is flush with the edge of the encapsulation glue layer 4 for a smooth transition.
[0034] In the present utility model, the integrity of the LED packaging structure and the aesthetics of the package are ensured.
[0035] The above is only a preferred specific embodiment of the present utility model; however, the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and its improvement concept of the present utility model, makes an equivalent substitution or change, and all should be covered within the protection scope of the present utility model.
Claims
1. A planar LED packaging structure, characterized in that, Including: A BT substrate (1) and two die bonding pads (2) fixed on the BT substrate. An LED chip (3) is welded on the top between the two die bonding pads (2). An encapsulation glue layer (4) is encapsulated on the BT substrate (1). The die bonding pads (2) and the LED chip (3) are both surrounded by the encapsulation glue layer (4). A fluorescent glue layer (5) is fixedly connected to the top between the LED chip (3) and the encapsulation glue layer (4). A finished product bottom pad (6) is arranged at the bottom of the BT substrate (1).
2. The planar LED packaging structure according to claim 1, wherein: The welding method between the die bonding pad (2) and the LED chip (3) is to use small-particle-size powder solder paste to weld and fix the die with the flip-chip gold pad.
3. A planar LED packaging structure according to claim 1, characterized in that: Both the encapsulation glue layer (4) and the fluorescent glue layer (5) are formed by a molding process.
4. A planar LED packaging structure according to claim 1, characterized in that: The encapsulation glue layer (4) is an opaque white wall glue, and the LED chip (3) is surrounded by the white wall glue.
5. A planar LED packaging structure according to claim 1, characterized in that: The fluorescent glue layer (5) covers the top of the encapsulation glue layer (4), and the bottom edge of the fluorescent glue layer (5) is flush and transitions with the edge of the encapsulation glue layer (4).