Pipeline structure and semiconductor cooling clothes

Abstract

The utility model discloses a pipeline structure and a semiconductor cooling suit, and relates to the field of heat dissipation devices, the pipeline structure comprises a heat dissipation part, and a water inlet is connected with a water outlet of a water pump; a water pump; the water pipe is communicated with the pipeline; the water adding part is used for adding fluid into the pipeline structure; the joint is used for realizing quick connection of the pipeline; a water inlet of the cooling clothes is communicated with a water outlet of the heat dissipation part, a water outlet of the cooling clothes is communicated with one end of the water adding part, and the other end of the water adding part is communicated with a water inlet of the water pump. And the refrigerating surfaces and the heating surfaces among the plurality of semiconductor refrigerating sheets are attached together. According to the utility model, the water adding part is arranged on the pipeline, so that water can be better added into the pipeline. And by arranging the connectors, quick connection between the pipelines is achieved, and extension between the pipelines can be achieved. And meanwhile, the semiconductor chilling plate is arranged to cool circulating water in the pipeline.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation devices, in particular to a pipeline structure and a semiconductor cooling suit. Background Art

[0002] As a cooling device used outdoors, water-cooling clothing mainly uses water to take away the body's heat to achieve the purpose of cooling. A pipeline structure and a fan are also set on the cooling suit's pipeline. The fan is used to dissipate the heat of the water in the pipeline structure. When the water in the pipeline structure flows through the cooling surface of the semiconductor refrigeration plate, the water temperature will drop. Under the continuous pumping of the water pump, the low-temperature water contacts the human body and takes away the body's heat to achieve the purpose of cooling.

[0003] However, the length of the pipes between the existing water-cooling cooling suits is fixed, and when adding water, the interface of the pipe needs to be removed from the cooling suit and inserted into the water to take water, which is inconvenient when adding water to the cooling suit. Utility Model Content

[0004] The purpose of the utility model is to provide a pipeline structure to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a pipeline structure, comprising:

[0006] Water pump;

[0007] Water pipes, used to connect pipelines;

[0008] A water adding part, used to add fluid into the pipeline structure;

[0009] Connectors are used to quickly connect pipes.

[0010] Preferably, the water adding part has a water adding cavity, and a water adding port is provided on the top of the water adding cavity, and an upper cover is installed at the water adding port through a thread.

[0011] Preferably, the joint comprises a main body, a smooth connecting pipe is fixedly mounted on the other end of the main body, a clamping claw capable of deforming inward is fixedly mounted on the main body outside the connecting pipe, a clamping head is arranged outside the clamping claw, and an extrusion hole is opened on the clamping head;

[0012] The clamping claws are distributed in a circular array with the axis of the connecting pipe as the center;

[0013] The clamping head is rotatably connected to the main body through a thread. When the clamping head moves toward a side close to the main body, the extrusion hole generates pressure on the clamping claw, and the clamping claw clamps the connecting pipe.

[0014] A semiconductor cooling suit adopts the above-mentioned pipeline structure;

[0015] The heat dissipation part, with the water inlet connected to the water outlet of the water pump;

[0016] The cooling suit, with the water inlet of the cooling suit communicating with the water outlet of the heat dissipation part, the water outlet of the cooling suit communicating with one end of the water adding part, and the other end of the water adding part communicating with the water inlet of the water pump.

[0017] Preferably, the heat dissipation part includes a heat dissipation box, the water inlet of the heat dissipation box is connected to the water outlet of the water pump, and the water outlet of the heat dissipation box communicates with the water inlet of the cooling suit;

[0018] Multiple thermoelectric coolers, with the cooling surfaces and the heating surfaces between the multiple thermoelectric coolers attached to each other.

[0019] Preferably, it further includes:

[0020] A support shell, fixedly installed on the side of the heat dissipation box;

[0021] A cooling fan, rotatably installed inside the support shell;

[0022] Heat dissipation fins, attached to the heating surface of the outermost thermoelectric cooler for dissipating heat from the thermoelectric cooler.

[0023] Preferably, at least two thermoelectric coolers are provided. The cooling surface of one thermoelectric cooler is attached to the heat dissipation box, and the cooling surface of the other thermoelectric cooler is attached to the heating surface of its adjacent thermoelectric cooler for dissipating heat from the previous thermoelectric cooler.

[0024] Preferably, the pipes inside the heat dissipation box are arranged in an S shape to increase the water flow path.

[0025] Preferably, damping holes are provided between the thin pipes at the farthest end of the cooling suit.

[0026] Compared with the prior art, the beneficial effects of the present utility model are:

[0027] By providing a water adding part on the pipe, the present utility model can better add water to the pipe. By providing connectors, rapid connection between pipes can be achieved, and extension between pipes can be realized. At the same time, by providing thermoelectric coolers, the temperature of the circulating water in the pipe can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the related structure of the present utility model;

[0029] Figure 2 It is a structural diagram of the cooling suit of the present utility model;

[0030] Figure 3 It is a structural diagram of the water adding part of the present utility model;

[0031] Figure 4 This is the structure diagram of the joint of the present utility model;

[0032] Figure 5 This is the structure diagram of the heat dissipation part of the present utility model.

[0033] In the figure: 1. Heat dissipation part; 2. Water pump; 3. Water adding part; 31. Water adding cavity; 32. Water adding port; 33. Upper cover; 4. Joint; 41. Main body; 42. Pressing claw; 43. Pressing head; 5. Water pipe; 6. Cooling suit; 61. Cooling suit main body; 62. Installation strip; 63. Damping hole; 11. Support shell; 12. Cooling fan; 13. Heat sink; 14. Semiconductor refrigeration sheet; 15. Heat dissipation box. Specific embodiments

[0034] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0035] Please refer Figure 1 As shown, this embodiment provides a pipeline structure and a semiconductor cooling suit, which will be introduced separately below:

[0036] The pipeline structure includes: a water pump 2, a water adding part 3 and a joint 4, and the above three structures are connected by a water pipe 5. The water inlet of the water pump 2 is connected to the water adding part 3 through the water pipe 5, and the other end of the water adding part 3 is connected with a joint 4, and the joint 4 can realize the quick connection of the pipeline. And the water adding part 3 can add water to the whole pipeline. This pipeline structure can be used in a closed water circuit structure, for example: in the application of a water-cooled computer host, or in a cooling suit. In short, the water pump 2 is used to provide the power for the whole water cycle, and the water flows in the whole pipeline without leakage.

[0037] The water adding part 3 includes a water adding cavity 31 with an open top, the open top is a water adding port 32, and an upper cover 33 is installed at the water adding port 32 by threads. When the upper cover 33 is installed with the water adding port 32, the sealing of the water adding port 32 can be realized. When adding water, only the upper cover 33 needs to be removed, which is very convenient for adding water.

[0038] When applied to a water-cooled computer mainframe, the water outlet of the water pump 2 is connected to the water filling part 3 by a water pipe 5, and the other end of the water filling part 3 is connected to the water inlet of the water pump 2 to form a cycle. The water pipe needs to be laid near the computer motherboard, and sufficient water needs to be added to the water filling part 3. Driven by the water pump 2, when the water flows through the computer motherboard, it can achieve the heat dissipation of the computer mainframe motherboard. For the heat dissipation of the water in the pipeline, a fan can be added to blow air at the pipeline to achieve the heat dissipation of the pipeline.

[0039] In this embodiment, taking the semiconductor cooling suit as the focus, the application of the entire pipeline structure will be specifically introduced:

[0040] A semiconductor cooling suit includes a heat dissipation part 1, a water pump 2, a water filling part 3, a joint 4 and a cooling suit 6. The heat dissipation part 1 includes a heat dissipation box 15. The pipelines inside the heat dissipation box 15 are distributed in an S shape to increase the water flow path. The water inlet of the heat dissipation box 15 is connected to the water outlet of the water pump 2, and the water outlet of the heat dissipation box 15 is communicated with the water inlet of the cooling suit 6; the water outlet of the cooling suit 6 is communicated with the water filling part 3, and the other end of the water filling part 3 is connected to the water inlet of the water pump 2, so that the heat dissipation box 15, the water pump 2, the water filling part 3 and the cooling suit 6 form a cycle. And there are two joints 4, which are respectively located on the water outlet pipelines of the water filling part 3 and the cooling suit 6, and on the pipeline between the water outlet of the heat dissipation box 15 and the water inlet of the cooling suit 6, and the two joints 4 are symmetrically arranged.

[0041] The joint 4 includes a main body 41. One end of the main body 41 is fixedly installed with an insertion pipe, and a conical protrusion is arranged on the insertion pipe. The other end of the main body 41 is fixedly installed with a smooth connecting pipe, and a pressing claw 42 capable of deforming inward is fixedly installed on the main body 41 outside the connecting pipe. The pressing claws 42 are distributed in a circular array centered on the axis of the connecting pipe, and a space for the pressing claws 42 to deform is left between adjacent pressing claws 42.

[0042] A pressing head 43 is arranged on the outside of the pressing claw 42, and an extrusion hole matching the pressing claw 42 is opened in the pressing head 43; the pressing head 43 is rotationally connected to the main body 41 by a thread. When installing the water pipe, loosen the pressing head 43, the pressing claws 42 expand outward, insert the water pipe onto the connecting pipe, and then rotate the pressing head in the reverse direction. When the pressing head 43 moves towards the side close to the main body 41, the extrusion hole generates pressure on the pressing claws 42, causing the pressing claws 42 to move inward, and the pressing claws 42 will press the connecting water pipe to achieve the quick connection of the water pipe.

[0043] Here, the purpose of the applicant to set the joint 4 is that the water pipe quickly connected by the joint 4 is used to extend the length of the water pipe and place the heat dissipation part 1 in a suitable position. For example, the heat dissipation part can be placed in a backpack or held in the hand, making it more convenient to use.

[0044] The applicant found that there is only one layer of the semiconductor refrigeration chip 14 in the existing cooling clothing. Since the semiconductor is a mature product, it can be directly customized in the market, so no further elaboration is made here. When cooling the heat dissipation box 15, after the temperature of the heating surface of the semiconductor refrigeration chip 14 rises to the limit value, its cooling effect decreases. Therefore, the applicant designed two layers of semiconductor refrigeration chips 14, and the refrigerating surface of the outer semiconductor refrigeration chip 14 is in contact with the heating surface of the inner semiconductor refrigeration chip 14. This can achieve heat dissipation for the inner semiconductor refrigeration chip 14 and extend the working time of the inner semiconductor refrigeration chip 14.

[0045] The specific design is as follows: The refrigerating surface of one of the semiconductor refrigeration chips 14 is attached to the heat dissipation box 15 to achieve heat dissipation for the heat dissipation box 15. The refrigerating surface of the other semiconductor refrigeration chip 14 is attached to the heating surface of the previous semiconductor refrigeration chip 14 to achieve heat dissipation for the previous semiconductor refrigeration chip 14, which can be used to improve the refrigeration effect of the previous semiconductor refrigeration chip 14, thereby improving the heat dissipation effect for the heat dissipation box 15. In addition, since the pipes inside the heat dissipation box 15 are distributed in an S shape, the residence time of water in the pipes increases, and the cooling effect on water is better.

[0046] On the side of the heat dissipation box 15 where the semiconductor refrigeration chip 14 is installed, a support shell 11 is fixedly installed. Inside the support shell 11, a motor is rotatably and fixedly installed. The output end of the motor is fixedly installed with a heat dissipation fan 12. The motor can drive the heat dissipation fan 12 to rotate and work. A heat dissipation fin 13 is glued to the heating surface of the outermost semiconductor refrigeration chip 14. The heat dissipation fin 13 is located at the opening of the support shell 11. Air holes are provided on the outer side surface of the support shell 11. When the heat dissipation fan 12 works, it will drive the air to flow inside the support shell 11 to dissipate heat from the heat dissipation fin 13. The heat of the heating surface of the semiconductor refrigeration chip 14 is conducted to the heat dissipation fin 13 and taken away by the flowing air, realizing heat dissipation for the semiconductor refrigeration chip 14.

[0047] In this embodiment, the structure of the cooling clothing 6 is as Figure 2 shown, including a cooling clothing main body 61 and a mounting strip 62. The cooling clothing main body 61 and the mounting strip 62 are integrally formed at the corners. When wearing the cooling clothing, the cooling clothing main body 61 is fitted to the human body. After the mounting strip 62 surrounds the shoulder position of the human body, it is adhered to the cooling clothing main body 61 by a magic tape, and the cooling clothing 6 can be worn properly. Under the action of gravity, the cooling clothing main body 61 can keep in contact with the human body.

[0048] The main body 61 of the cooling suit and the mounting strip 62 are provided with interconnected pipes. Water inlets and water outlets are respectively arranged at both ends of the pipes. The water inlet of the cooling suit 6 is communicated with the water outlet of the heat dissipation part 1, the water outlet of the cooling suit 6 is communicated with one end of the water adding part 3, and the other end of the water adding part is communicated with the water inlet of the water pump 2. Under the driving force of the water pump 2, water can flow in the pipes of the main body 61 of the cooling suit and the mounting strip 62.

[0049] Damping holes 63 are arranged between the sides of the pipes of the mounting strip 62 close to the main body 61 of the cooling suit. The diameter of the damping holes 63 is smaller than that of the pipes. That is to say, the resistance suffered by the liquid when flowing through the damping holes is greater than that in the pipes. During normal use, the liquid flows in the pipes of the mounting strip 62. Since the mounting strip 62 is located at the shoulder position of the human body, wrinkles are likely to occur. When wrinkles occur, the pipes are bent, folded and blocked together. When the pipes of the mounting strip 62 are blocked due to folding or bending, the liquid cannot flow in the pipes of the mounting strip 62. Under the continuous pumping of the water pump 2, the pressure in the pipes increases, and water can flow through the damping holes. The situation of pipe breakage caused by pipe blockage is avoided.

[0050] When adding water, turn on the water pump 2, unscrew the upper cover 33 of the water adding part 3, and then add water into the water adding cavity 31. The water added into the interior of the water adding cavity 31 will be pumped into the pipes under the suction of the water pump 2 until all the pipes and the interior of the cooling suit are filled with water, then stop adding water and cover the upper cover 33.

[0051] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A pipeline structure, characterized in that: including a water pump (2); a water pipe (5) for connecting pipelines; a water adding part (3) for adding fluid into the pipeline structure; a joint (4) for realizing quick connection of pipes.

2. The pipeline structure according to claim 1, characterized in that: The water adding part (3) has a water adding cavity (31). A water adding port (32) is opened at the top of the water adding cavity (31), and an upper cover (33) is installed at the water adding port (32) by means of threads.

3. The pipeline structure according to claim 2, characterized in that: The joint (4) includes a main body (41). A smooth connecting pipe is fixedly installed at the other end of the main body (41). Pressing claws (42) capable of deforming inward are fixedly installed on the main body (41) on the outer side of the connecting pipe. A pressing head (43) is arranged on the outer side of the pressing claws (42), and an extrusion hole is opened in the pressing head (43); The pressing claws (42) are distributed in a circular array centered on the axis of the connecting pipe; The pressing head (43) is rotationally connected to the main body (41) by means of threads. When the pressing head (43) moves towards the side close to the main body (41), the extrusion hole generates pressure on the pressing claws (42), and the pressing claws (42) will press the connecting pipe.

4. A semiconductor cooling suit, characterized in that: including the pipeline structure according to any one of claims 1-3; a heat dissipation part (1) whose water inlet is connected to the water outlet of the water pump (2); a cooling suit (6) whose water inlet is communicated with the water outlet of the heat dissipation part (1), the water outlet of the cooling suit (6) is communicated with one end of the water adding part (3), and the other end of the water adding part is communicated with the water inlet of the water pump (2).

5. A semiconductor cooling suit according to claim 4, characterized in that: The heat dissipation part (1) includes a heat dissipation box (15). The water inlet of the heat dissipation box (15) is connected to the water outlet of the water pump (2), and the water outlet of the heat dissipation box (15) is communicated with the water inlet of the cooling suit (6); a plurality of semiconductor refrigeration chips (14), and the refrigerating surfaces and the heating surfaces between the plurality of semiconductor refrigeration chips (14) are attached to each other.

6. The semiconductor cooling suit according to claim 5, wherein: It further includes: a support shell (11) fixedly installed on the side surface of the heat dissipation box (15); a heat dissipation fan (12) rotatably installed inside the support shell (11); heat dissipation fins (13) attached to the heating surface of the outermost semiconductor refrigeration chip (14) for dissipating heat of the semiconductor refrigeration chip (14).

7. A semiconductor cooling suit according to claim 5, characterized in that: At least two semiconductor refrigeration chips (14) are provided. The refrigerating surface of one semiconductor refrigeration chip (14) is attached to the heat dissipation box (15), and the refrigerating surface of another semiconductor refrigeration chip (14) is attached to the heating surface of its adjacent semiconductor refrigeration chip (14) for dissipating heat of the previous semiconductor refrigeration chip (14).

8. A semiconductor cooling suit according to claim 5, characterized in that: The pipeline inside the heat dissipation box (15) is arranged in an S shape to increase the water flow path.

9. A semiconductor cooling suit according to claim 5, characterized in that: Damping holes (63) are arranged between the pipelines of the cooling suit (6).

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