Jig for grinding curved sapphire wafer

Abstract

The utility model relates to the technical field of sapphire wafer grinding, in particular to a jig for grinding a curved sapphire wafer, and the jig for grinding the curved sapphire wafer comprises a base, a bearing and a connecting piece; the base comprises a first cavity, a second cavity and a third cavity; the bearing is fixed in the second cavity; and the connecting piece is movably arranged in the cavity of the bearing inner ring. The bearing is arranged in the second cavity of the base, the bearing can drive the base to rotate, through the arrangement, when the curved sapphire wafer grinding device is used, the curved sapphire wafer grinding device only moves in one direction, all parts of a curved sapphire wafer can be evenly ground, the situation that the surface removal amount is not uniform when the curved sapphire wafer is ground is avoided, and meanwhile the machining efficiency is improved; in addition, a third cavity is further formed in the base, the third cavity is arranged in a clearance mode, the surface of the bearing can be prevented from being excessively abraded, and the service life of the jig is prolonged.

Description

Technical Field

[0001] The present disclosure relates to the technical field of sapphire wafer grinding, and particularly to a fixture for grinding a curved sapphire wafer. Background Art

[0002] Most sapphire heart rate wafers are small-sized curved wafers, and such small-sized curved wafers are usually ground and processed individually by a six-axis precision grinding machine. In the prior art, this processing method has a long processing time, and it is not easy to control the grinding removal amount of each part of the wafer surface, and it is easy to have insufficient or excessive surface removal amount. Summary of the Invention

[0003] In order to solve the above technical problems or at least partially solve the above technical problems, a fixture for grinding a curved sapphire wafer provided by the present disclosure has a simple structure, and can uniformly grind each part of the curved sapphire wafer, avoiding uneven surface removal amount during the grinding of the curved sapphire wafer.

[0004] In order to achieve the above object, a fixture for grinding a curved sapphire wafer provided by the present disclosure includes: a base, the base includes a first cavity, a second cavity and a third cavity;

[0005] A bearing, the bearing is fixed in the second cavity;

[0006] A connecting member, the connecting member is movably disposed in the cavity of the inner ring of the bearing.

[0007] Optionally, the base further includes two through holes, and the through holes are symmetrically distributed on the bottom surface of the first cavity.

[0008] Optionally, the base further includes a blind hole and a first inclined surface, and the blind hole is disposed on the edge of the first cavity.

[0009] Optionally, the connecting member includes a first cylinder, a second cylinder and a third cylinder, and the first cylinder, the second cylinder and the third cylinder are of an integral structure.

[0010] Optionally, a pin hole is provided on the top surface of the first cylinder.

[0011] Optionally, the diameter of the second cylinder is larger than the inner diameter of the bearing.

[0012] The technical solution provided by the embodiments of the present disclosure has the following advantages compared with the prior art:

[0013] A fixture for grinding a curved sapphire wafer provided by an embodiment of the present disclosure is provided with a bearing in the second cavity of the base. The bearing can drive the base to rotate. Through this setting, when the present disclosure is used, it can be moved only in one direction, and each part of the curved sapphire wafer can be evenly ground, avoiding uneven removal of the surface of the curved sapphire wafer during grinding, and improving the processing efficiency at the same time. In addition, a third cavity is also provided in the base. The third cavity is provided with clearance to prevent excessive wear on the surface of the bearing and improve the service life of the fixture. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure.

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0016] Figure 1 The front view of the base of the fixture for grinding a curved sapphire wafer;

[0017] Figure 2 The top view of the base of the fixture for grinding a curved sapphire wafer;

[0018] Figure 3 The front view of the fixture for grinding a curved sapphire wafer;

[0019] Figure 4 The front view of the connecting member of the fixture for grinding a curved sapphire wafer

[0020] Figure 5 The top view of the connecting member of the fixture for grinding a curved sapphire wafer;

[0021] Figure 6 The schematic diagram of the working state of the fixture for grinding a curved sapphire wafer;

[0022] Wherein: 1. Base, 11. First cavity, 12. Second cavity, 13. Third cavity, 14. Through hole, 15. Blind hole, 16. First inclined surface, 2. Bearing, 3. Connecting member, 31. First cylinder, 311. Pin hole, 32. Second cylinder, 33. Third cylinder. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] In order to more clearly understand the above-mentioned objects, features, and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that, without conflict, the embodiments of the present disclosure and the features in the embodiments may be combined with each other.

[0024] In the following description, many specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, rather than all of the embodiments.

[0025] As Figures 1 - 3 shown, an embodiment of the present disclosure provides a fixture for grinding a curved sapphire wafer, which includes: a base, a bearing, and a connecting member; the base includes a first cavity, a second cavity, and a third cavity; the bearing is fixed in the second cavity; the connecting member can be movably placed in the cavity of the inner ring of the bearing.

[0026] Specifically, the fact that the bearing is fixed in the second cavity means that by setting the sizes of the second cavity and the bearing, the bearing is snap-fitted in the second cavity. Through this setting, the bearing can drive the base to rotate; the base further includes a third cavity, and the third cavity is provided with clearance. Through this setting, the wear during the use of the bearing of the fixture can be reduced, and its service life can be increased; the fact that the connecting member can be movably placed in the cavity of the inner ring of the bearing means that the size of the part of the connecting member placed in the cavity of the inner ring of the bearing is slightly smaller than the size of the inner ring of the bearing. This setting facilitates the taking and placing of the connecting member.

[0027] During specific use, the fixture is installed on a grinding device, and there are components on the grinding device that are matched with the connecting member. By controlling the connecting member to drive the bearing and the base to move, during this process, the bearing can drive the base to rotate, thereby fully grinding the curved sapphire wafer.

[0028] In some embodiments, the base 1 further includes two through holes 14, and the through holes 14 are symmetrically distributed on the bottom surface of the first cavity 11.

[0029] Specifically, the through holes 14 are symmetrically distributed on the bottom surface of the first cavity 11. Through the setting of the through holes 14, the installation and disassembly of the bearing 2 can be made more convenient.

[0030] As Figure 2 shown, the base 1 further includes a blind hole 15 and a first inclined surface 16, and the blind hole 15 is provided on the edge of the first cavity 11.

[0031] Specifically, the blind hole 15 being provided on the edge of the first cavity 11 means that the center of the circle of the blind hole 15 is located on the edge of the first cavity 11. Half of the blind hole 15 is inside the first cavity 11, and the other half is outside the first cavity 11. The half of the blind hole 15 outside the first cavity 11 is located above the first inclined surface 16. The combined setting of the first inclined surface 16 and the blind hole 15 causes the first inclined surface 16 to form a notch at the position of the blind hole 15. After grinding is completed, the sapphire wafer can be easily removed through this notch, reducing the difficulty of wafer removal after grinding.

[0032] As Figure 3 shown, the connecting member 3 includes a first cylinder 31, a second cylinder 32, and a third cylinder 33. The first cylinder 31, the second cylinder 32, and the third cylinder 33 are of an integral structure.

[0033] In some embodiments, a pin hole 311 is provided on the top surface of the first cylinder 31.

[0034] In some embodiments, the diameter of the second cylinder 32 is greater than the inner diameter of the bearing 2.

[0035] As Figure 6 shown, when the fixture for grinding a curved sapphire wafer provided by the embodiment of the present disclosure is specifically used, the curved sapphire wafer is placed in the first cavity 11, and then the fixture is placed on the grinding plate of the grinding equipment. The probe of the grinding equipment is inserted into the pin hole 311, and the fixture is controlled to move back and forth in one direction. During this process, the bearing 2 drives the base 1 to rotate, so as to evenly grind each part of the curved sapphire wafer.

[0036] It should be noted that in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the element.

[0037] The above are only specific embodiments of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments herein, but rather will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A fixture for grinding a curved sapphire wafer, characterized in that Comprising: A base (1), the base (1) comprising a first cavity (11), a second cavity (12) and a third cavity (13); A bearing (2), the bearing (2) being fixed in the second cavity (12); A connecting piece (3), the connecting piece (3) being movably arranged in the cavity of the inner ring of the bearing (2).

2. The fixture for grinding the curved sapphire wafer according to claim 1, characterized in that, The base (1) further comprises two through holes (14), the through holes (14) being symmetrically distributed on the bottom surface of the first cavity (11).

3. The fixture for grinding the curved sapphire wafer according to claim 1, wherein The base (1) further comprises a blind hole (15) and a first inclined surface (16), the blind hole (15) being arranged on the edge of the first cavity (11).

4. The fixture for grinding a curved sapphire wafer according to claim 1, wherein, The connecting piece (3) comprises a first cylinder (31), a second cylinder (32) and a third cylinder (33), the first cylinder (31), the second cylinder (32) and the third cylinder (33) being of an integral structure.

5. The fixture for grinding the curved sapphire wafer according to claim 4, characterized in that, A pin hole (311) is arranged on the top surface of the first cylinder (31).

6. The fixture for grinding the curved sapphire wafer according to claim 4, wherein, The diameter of the second cylinder (32) is larger than the inner diameter of the bearing (2).

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