Spraying plate
By alternately distributing the pore circles on the shower plate and adjusting the proportion of the pores, the problem of unevenness of the film deposited on the wafer surface is solved, and the uniform distribution of the reaction gas on the wafer surface is achieved, and the film uniformity and processing effect are improved.
Patent Information
- Application Number
- CN202422044970.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-08-22
AI Technical Summary
There is a problem of unevenness when the existing spray plates deposit films on the wafer surface, especially in thick middle and thin edges, and it is difficult to evenly distribute a variety of reaction gases at the same time.
A shower plate is designed to adjust the arrangement of the air outlets by alternately distributing the first air outlet ring and the second air outlet ring in the center of the end surface, especially in the second zone, reduce the number of the second air outlet holes, and reasonably set the proportion of each zone to ensure the uniform distribution of the reaction gas on the wafer surface.
The uniformity of the wafer surface deposition film is improved, the problems of high reaction gas concentration in the middle area and low edge area concentration are avoided, and the wafer processing effect is enhanced.
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Figure CN223134581U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing technology, and particularly relates to a shower plate. Background Art
[0002] Depositing a thin film on the surface of a wafer is a common process in the wafer processing. To make the deposited thin film have good uniformity, the reaction gas reaching the wafer surface should be as uniform as possible. To achieve the purpose of uniform distribution, a showerhead is generally used to disperse the reaction gas introduced into the process chamber where the wafer is located.
[0003] Since the process chamber for processing the wafer usually intakes gas above the wafer through an intake device and exhausts gas through an exhaust port arranged along the circumferential direction of the wafer, the film thickness deposited on the wafer surface is usually uneven, showing a phenomenon of thick in the middle and thin at the edges. In addition, for some deposition processes, such as Flowable-CVD (FCVD), two or more reaction gases need to be introduced into the process chamber simultaneously, and it is required that some reaction gases cannot be mixed before the process chamber. Therefore, the proportion of the air holes in different areas of the shower plate and the arrangement mode of the air holes for introducing different reaction gases greatly affect the uniformity of the thin film deposited on the wafer surface.
[0004] Therefore, it is necessary to develop a shower plate to improve the uniformity of the thin film deposited on the wafer surface by adjusting the arrangement mode of the air holes on the shower plate. Summary of the Utility Model
[0005] The purpose of this application is to provide a shower plate to improve the uniformity of the thin film deposited on the wafer surface by adjusting the arrangement mode of the air holes on the shower plate.
[0006] An embodiment of the present application provides a spray plate, including: a plate body, on at least one end face of the plate body, a first air hole circle and a second air hole circle are alternately distributed with the center of the end face as the center of the circle; any one of the first air hole circles is composed of a plurality of first air outlet holes distributed at equal intervals; any one of the second air hole circles is composed of a plurality of the first air outlet holes and a plurality of second air outlet holes, wherein the first air outlet holes are distributed at equal intervals, and the second air outlet holes are located between adjacent first air outlet holes; the cross-sectional area of the second air outlet hole is larger than the cross-sectional area of the first air outlet hole; wherein, the end face includes a first area, a second area and a third area arranged in sequence from the center of the end face to the edge; the length ratios of the first area, the second area and the third area along the radial direction of the end face are (50-60):(90-120):(38-58); for the first area and the third area, the second air outlet holes are arranged at intervals between every two adjacent first air outlet holes in the second air hole circle; for the second area, the second air outlet holes are not arranged at intervals between some adjacent first air outlet holes in the second air hole circle.
[0007] In some embodiments, the second area is provided with a plurality of the second air hole circles, and the number of intervals without the second air outlet holes between adjacent first air outlet holes in each second air hole circle is 6 or 12.
[0008] In some embodiments, for the second air hole circle in the second area, the intervals without the second air outlet holes between adjacent first air outlet holes are equally distributed.
[0009] In some embodiments, the second area includes 5 second air hole circles. From the center of the end face to the edge of the end face, the number of intervals without the second air outlet holes between adjacent first air outlet holes in the second air hole circle is 6, 6, 6, 12 and 6 in sequence.
[0010] In some embodiments, the sum of the cross-sectional areas of the plurality of first air outlet holes in the second area accounts for 1.8% - 2.2% of the total surface area of the second area, and the sum of the cross-sectional areas of the plurality of second air outlet holes in the second area accounts for 5.6% - 6.0% of the total surface area of the second area.
[0011] In some embodiments, the sum of the cross-sectional areas of the plurality of second air outlet holes in the first area accounts for 6.8% - 7.2% of the total surface area of the first area; the sum of the cross-sectional areas of the plurality of second air outlet holes in the third area accounts for 7.6% - 8.0% of the total surface area of the third area; the sum of the cross-sectional areas of the plurality of first air outlet holes in the first area accounts for 2.1% - 2.5% of the total surface area of the first area; and the sum of the cross-sectional areas of the plurality of first air outlet holes in the second area accounts for 1.4% - 1.8% of the total surface area of the third area.
[0012] In some embodiments, the cross-sectional area of a single second air outlet is 38 - 40 mm 2 ; and / or the cross-sectional area of a single first air outlet is 3.0 - 3.2 mm 2 .
[0013] In some embodiments, the first region includes three first air hole rings and two second air hole rings; the second region includes five first air hole rings; and the third region includes two first air hole rings and two second air hole rings.
[0014] In some embodiments, a second gas flow channel and a first gas flow channel are provided inside the plate body, which are respectively communicated with the second air outlet and the first air outlet.
[0015] In some embodiments, the plate body includes a first plate body and a second plate body stacked in sequence. The second gas flow channel penetrates through the first plate body and the second plate body at the same time and is communicated with the second air outlet; the first gas flow channel is located between the first plate body and the second plate body and is communicated with the first air outlet penetrating through the second plate body.
[0016] In some embodiments, the first gas flow channel includes an air inlet flow channel and a plurality of gas dispersion flow channels communicated with the air inlet flow channel. The air inlet of the air inlet flow channel is located on the side wall of the plate body, and the plurality of gas dispersion flow channels are annularly distributed and communicated with the first air outlet.
[0017] The beneficial effects of the spray plate provided by the present application include but are not limited to the following:
[0018] By arranging the air holes of the spray plate into the first air hole ring and the second air hole ring, which are adapted to the shape of the wafer, the spray plate provided by the present application can provide the uniformity of the distribution of reaction gas on the surface of the wafer during the wafer processing, and improve the processing effect of the wafer. In addition, by arranging the first air hole ring and the second air hole ring in a staggered manner, and reasonably setting the proportion of the second air outlet and the first air outlet in the second region of the end face, the uniformity of the distribution of reaction gas on the surface of the wafer is further improved, thereby improving the uniformity of the thin film deposited on the surface of the wafer. Description of the Drawings
[0019] The following drawings detail the exemplary embodiments disclosed in the present application. Wherein the same reference numerals represent similar structures in several views of the drawings. Those of ordinary skill in the art will understand that these embodiments are non-limiting, exemplary embodiments, and the drawings are only for the purpose of illustration and description, and are not intended to limit the scope of the present application. Embodiments in other ways may also achieve the inventive intent of the present application. It should be understood that the drawings are not drawn to scale.
[0020] Wherein:
[0021] Figure 1 is a schematic diagram of the end face structure of a spray plate according to some embodiments of the present application;
[0022] Figure 2 is Figure 1 a partial cross-sectional view of the spray plate cut perpendicular to the spray plate along the A-A direction; and
[0023] Figure 3 is a schematic diagram of the structure of the surface of the second plate body facing the first plate body according to some embodiments of the present application. Specific Embodiments
[0024] The following description provides specific application scenarios and requirements of the present application, aiming to enable those skilled in the art to manufacture and use the content of the present application. For those skilled in the art, various partial modifications to the disclosed embodiments are obvious, and without departing from the spirit and scope of the present application, the general principles defined here can be applied to other embodiments and applications. Therefore, the present application is not limited to the illustrated embodiments, but has the broadest scope consistent with the claims.
[0025] An embodiment of the present application provides a spray plate, including: on at least one end face of the plate body, a first air hole circle and a second air hole circle are alternately distributed with the center of the end face as the center of the circle; any one of the first air hole circles is composed of a plurality of first air outlet holes distributed at equal intervals; any one of the second air hole circles is composed of a plurality of the first air outlet holes and a plurality of second air outlet holes, wherein the first air outlet holes are distributed at equal intervals, and the second air outlet holes are located between adjacent first air outlet holes; the cross-sectional area of the second air outlet holes is larger than the cross-sectional area of the first air outlet holes; wherein, the end face includes a first area, a second area, and a third area arranged in sequence from the center of the end face to the edge; the length ratios of the first area, the second area, and the third area along the radial direction of the end face are (50-60):(90-120):(38-58); for the first area and the third area, the second air outlet holes are arranged at intervals between every two adjacent first air outlet holes in the second air hole circle; for the second area, the second air outlet holes are not arranged at intervals between some adjacent first air outlet holes in the second air hole circle.
[0026] The shower plate provided by the present application can make the reaction gas disperse evenly on the surface of the wafer by setting a first air hole circle and a second air hole circle that are alternately distributed with the center of the end face as the center and match the shape of the wafer. In addition, the present application also reduces the number of second air outlet holes in the second area of the shower plate, that is, the second air outlet holes are not provided in the interval between the first air outlet holes adjacent to each other in the second air hole circle, so as to reduce the amount of reaction gas transmitted through the second air outlet holes in the second area, further adjust the distribution uniformity of the reaction gas on the surface of the wafer, avoid the situation that the concentration of the reaction gas in the middle area of the wafer is high and the concentration of the reaction gas in the center and edge areas is low, and thus improve the processing effect on the wafer.
[0027] The shower plate provided by the application will be described in detail below in conjunction with the embodiments and the drawings.
[0028] Refer to Figures 1 to 3 , an embodiment of the present application provides a shower plate, and the process gas flows to the surface of the wafer through the shower plate.
[0029] The shower plate includes a plate body 100, and at least one end face of the plate body 100 is provided with a circular first air hole circle and a second air hole circle, and the first air hole circle and the second air hole circle are alternately distributed with the center of the end face as the center and extend to the edge of the end face alternately.
[0030] Any one of the first air hole circles is composed of a plurality of first air outlet holes 300 distributed at equal intervals.
[0031] Any one of the second air hole circles is composed of a plurality of the first air outlet holes 300 and a plurality of second air outlet holes 200, wherein the first air outlet holes 300 are distributed at equal intervals, and the second air outlet holes 200 are located between adjacent first air outlet holes 300.
[0032] The cross-sectional area of the second air outlet hole 200 is larger than the cross-sectional area of the first air outlet hole 300;
[0033] A second gas flow channel 400 and a first gas flow channel 500 that are respectively communicated with the second air outlet hole 200 and the first air outlet hole 300 are arranged inside the plate body 100. It should be noted that, in order to make the drawings show more clearly, Figure 3 the number and the array number of the second air outlet holes 200 and the first air outlet holes 300 are simplified in
[0034] In some embodiments, the plate body 100 includes a first plate body 110 and a second plate body 120 stacked in sequence. The second gas flow channel 400 penetrates through the first plate body 110 and the second plate body 120 at the same time and communicates with the second air outlet 200. When the spray plate works, the first reaction gas is dispersed from the second air outlet 200 to the surface of the wafer through the second gas flow channel 400 on one side of the plate body 100.
[0035] In some embodiments, referring to Figure 3 , the first gas flow channel 500 is located between the first plate body 110 and the second plate body 120 and communicates with the first air outlet 300 penetrating through the second plate body 120. In some embodiments, the first gas flow channel 500 includes an air inlet flow channel 501 and a plurality of gas dispersion flow channels 502 communicated with the air inlet flow channel 501. The air inlet 501a of the air inlet flow channel 501 is located on the side wall of the plate body 100, and the plurality of gas dispersion flow channels 502 are annularly distributed and communicated with the first air outlet 300. When the spray plate works, the second reaction gas flows into the first gas flow channel 500 from the air inlet 501a and then flows to the process chamber from the first air outlet 300.
[0036] In some embodiments, the first gas flow channel 500 can be arranged on the surface of the first plate body 110 facing the second plate body 120, or can be arranged on the surface of the second plate body 120 facing the first plate body 110. Referring to Figure 3 , in some embodiments, the second flow channel is arranged on the surface of the second plate body 120 facing the first plate body 110.
[0037] In some embodiments, the second gas flow channel 400 and the first gas flow channel 500 are respectively used for transporting the first reaction gas and the second reaction gas
[0038] In some embodiments, the first reaction gas is different from the second reaction gas. For example, in a deposition process for filling high-aspect-ratio trenches, the first reaction gas is NH3 or O2, and the second reaction gas is trisilylamine TSA. The first reaction gas reacts with the second reaction gas to deposit a thin film on the surface of the wafer.
[0039] In the present application, the first air hole circle and the second air hole circle are alternately distributed with the center of the end face as the center, that is, they are alternately distributed in a circular shape, which is adapted to the shape of the wafer, and can improve the uniformity of the distribution of the first reaction gas and the second reaction gas on the surface of the wafer.
[0040] Since the process chamber for processing the wafer usually intakes gas above the wafer through the gas intake device and exhausts gas through the exhaust ports arranged along the circumferential direction of the wafer, the film thickness usually deposited on the wafer surface is uneven, showing a phenomenon of thick in the middle and thin at the edges. In this application, by simulating and analyzing the flow state of the gas flow in the gas intake device and the process chamber, the second air outlet 200 and the proportion of the second air holes in different regions of the end face are regulated and designed to control the flow rates of the first reaction gas and the second reaction gas introduced onto the wafer surface, so as to make the film deposit more uniformly on the wafer surface.
[0041] Reference Figure 1 , the end face is sequentially defined as the first region 101, the second region 102, and the third region 103 from the center to the edge according to the distance from the center of the end face (in Figure 1 , the dotted lines represent the dividing lines of the first region 101, the second region 102, and the third region 103).
[0042] The length ratios of the first region 101, the second region 102, and the third region 103 along the radial direction of the end face are (50 - 60):(90 - 120):(38 - 58).
[0043] In some embodiments, the distance ranges from the center of the end face to the end face along the radial direction of the first region 101, the second region 102, and the third region 103 are 0 - 60 mm, 60 - 170 mm, and 170 - 208 mm respectively.
[0044] The sum of the cross-sectional areas of the plurality of second air outlets 200 in the first region 101 accounts for 6.8% - 7.2% of the total surface area of the first region 101; the sum of the cross-sectional areas of the plurality of second air outlets 200 in the second region 102 accounts for 5.6% - 6.0% of the total surface area of the second region 102; and the sum of the cross-sectional areas of the plurality of second air outlets 200 in the third region 103 accounts for 7.6% - 8.0% of the total surface area of the third region 103; the sum of the cross-sectional areas of the plurality of first air outlets 300 in the first region 101 accounts for 2.1% - 2.5% of the total surface area of the first region 101; the sum of the cross-sectional areas of the plurality of first air outlets 300 in the second region 102 accounts for 1.8% - 2.2% of the total surface area of the second region 102; and the sum of the cross-sectional areas of the plurality of first air outlets 300 in the second region 102 accounts for 1.4% - 1.8% of the total surface area of the third region 103.
[0045] In some embodiments, the sum of the cross-sectional areas of the plurality of second air outlets 200 in the first region 101 accounts for 6.8%, 6.91%, 7.09%, 7.16%, or 7.2% of the total surface area of the first region 101.
[0046] In some embodiments, the sum of the cross-sectional areas of the plurality of second air outlets 200 in the second region 102 accounts for 5.6%, 5.63%, 5.77%, 5.82%, or 6.0% of the total surface area of the second region 102.
[0047] In some embodiments, the ratio of the sum of the cross-sectional areas of the plurality of second air outlets 200 in the third region 103 to the total surface area of the third region 103 is 7.6%, 7.74%, 7.83%, 7.96%, or 8.0%.
[0048] In some embodiments, the sum of the cross-sectional areas of the plurality of first air outlets 300 in the first region 101 accounts for 2.1%, 2.21%, 2.29%, 2.43%, or 2.5% of the total surface area of the first region 101.
[0049] In some embodiments, the sum of the cross-sectional areas of the plurality of first air outlets 300 in the second region 102 accounts for 1.8%, 1.89%, 1.96%, 2.13%, or 2.2% of the total surface area of the second region 102.
[0050] In some embodiments, the ratio of the sum of the cross-sectional areas of the plurality of first air outlets 300 in the second region 102 to the total surface area of the third region 103 is 1.4%, 1.53%, 1.6%, 1.72%, or 1.8%.
[0051] In some embodiments, the cross-sectional area of a single second air outlet 200 is 38 - 40 mm 2 ; and / or the cross-sectional area of a single first air outlet 300 is 3.0 - 3.2 mm 2 . In some embodiments, the cross-sections of the second air outlets 200 and the first air outlets 300 can be regular polygons, circles, or irregular shapes. Preferably, the cross-sections of the second air outlets 200 and the first air outlets 300 are circular. In some embodiments, the diameter of the second air outlet 200 is 6.95 mm, 7 mm, or 7.05 mm. In some embodiments, the diameter of the first air outlet 300 is 1.95 mm, 2 mm, or 2.05 mm.
[0052] For the first region 101 and the third region 103, a second air outlet is provided at intervals between each adjacent pair of the first air outlets 300; for the second region 102, second air outlets 200 are not provided at intervals between some adjacent pairs of the first air outlets 300, reducing the proportion of the second air outlets 200 in the second region 102.
[0053] In some embodiments, a plurality of the second air hole rings are provided in the second region 102, and the number of intervals without the second air holes between adjacent first air holes in each second air hole ring is 6 or 12.
[0054] In some embodiments, for the second air hole rings in the second region 102, the intervals without the second air holes between adjacent first air holes 300 are equally spaced.
[0055] In some embodiments, the second region 102 includes 5 second air hole rings. From the center of the end face to the edge of the end face, the numbers of intervals without the second air holes 200 between adjacent first air holes 300 in the second air hole rings are 6, 6, 6, 12, and 6 in sequence.
[0056] In some embodiments, the end face includes nine second air hole rings, and the distribution of the second air hole rings and the numbers of the first air holes 300 and the second air holes 200 that make up the second air hole rings are as follows:
[0057] The first region 101 includes two second air hole rings, and the relationship between the number of the second air holes 200 that make up a single second air hole ring and the sequence number of the second air hole ring is:
[0058] N c = 6t, where t = 1 or 2,
[0059] where, N c represents the number of the second air holes 200 that make up a single second air hole ring in the first region 101; t represents the sequence number of the second air hole ring, and the sequence number is counted from the center of the end face to the edge;
[0060] The relationship between the number of the first air holes 300 that make up a single second air hole ring and the sequence number of the second air hole ring is:
[0061] M c = 6t, where t = 1 or 2,
[0062] where, M c represents the number of the first air holes 300 that make up a single second air hole ring in the first region 101; t represents the sequence number of the second air hole ring, and the sequence number is counted from the center of the end face to the edge;
[0063] The second region 102 includes five second air hole rings, and the relationship between the number of the second air holes 200 that make up a single second air hole ring and the sequence number of the second air hole ring is:
[0064] N m= 6(t - 1), where t = 3, 4, 5 or 7; and
[0065] N m = 6(t - 2), where t = 6,
[0066] where N m represents the number of the second air outlet holes 200 that form a single second air hole ring in the second region 102; t represents the ordinal number of the second air hole ring, and the ordinal number is counted from the center of the end face to the edge; and
[0067] The relationship between the number of the first air outlet holes 300 that form a single second air hole ring and the ordinal number of the second air hole ring is:
[0068] M m = 6t, where t is any integer from 3 to 7;
[0069] where M m represents the number of the first air outlet holes 300 that form a single second air hole ring in the second region 102; t represents the ordinal number of the second air hole ring, and the ordinal number is counted from the center of the end face to the edge;
[0070] In some embodiments, when t = 3 or t = 6, the multiple second air outlet holes 200 that form the second air hole ring are equally spaced in groups of two; when t = 4, the multiple second air outlet holes 200 that form the second air hole ring are equally spaced in groups of three; when t = 5, the multiple second air outlet holes 200 that form the second air hole ring are equally spaced in groups of four; and when t = 7, the multiple second air outlet holes 200 that form the second air hole ring are equally spaced in groups of five; in some embodiments, referring to Figure 1 , the intervals of the second air outlet holes 200 located in the second region 102 present a turbo-like shape;
[0071] The third region 103 includes two second air hole rings, and the relationship between the number of the second air outlet holes 200 that form a single second air hole ring and the ordinal number of the second air hole ring is:
[0072] N o = 6t, where t = 8 or 9,
[0073] where N o represents the number of the second air outlet holes 200 that form a single second air hole ring in the third region 103; t represents the ordinal number of the second air hole ring, and the ordinal number is counted from the center of the end face to the edge; and
[0074] The relationship between the number of the first air outlet holes 300 that form a single second air hole ring and the ordinal number of the second air hole ring is:
[0075] M o = 6t, where t = 8 or 9
[0076] where M o represents the number of the first gas outlet holes 300 that form a single second gas hole ring in the third area 103; t represents the serial number of the second gas hole ring, and the serial number is counted from the center of the end face to the edge.
[0077] In some embodiments, the number of the first gas hole rings is ten. The first area 101 includes three of the first gas hole rings, the second area 102 includes five of the first gas hole rings, and the third area 103 includes two of the first gas hole rings. The relationship between the number of the first gas outlet holes 300 that form a single first gas hole ring and the number of the first gas hole rings is as follows:
[0078] M = 6f, where f is any positive integer from 1 to 9; and
[0079] M = 54, where f = 10;
[0080] where M represents the number of the first gas outlet holes 300 that form a single first gas hole ring; f represents the serial number of the first gas hole ring, and the serial number is counted from the center of the end face to the edge.
[0081] In some embodiments, the distance between adjacent second gas hole rings is 17 - 19 mm, for example, 17 mm, 18 mm, or 19 mm. The distance refers to the distance between the center lines of adjacent second gas hole rings.
[0082] In some embodiments, the distance between an adjacent first gas hole ring and the second gas hole ring is 8 - 10 mm, for example, 8 mm, 9 mm, or 10 mm. The distance refers to the distance between the center line of the first gas hole ring and the diameter of the center line of the second gas hole.
[0083] In some embodiments, the process of performing a deposition process using the shower plate provided by the present application is as follows: Install the shower plate provided by the present application in a process chamber, such that the end face provided with the second gas outlet holes 200 and the first gas outlet holes 300 faces the wafer to be processed. Introduce a first reaction gas on the side of the shower plate away from the wafer, such that the first reaction gas flows into the process chamber through the second gas flow channel 400 from the second gas outlet holes; introduce a second reaction gas into the air inlet 501a, such that the second reaction gas flows into the process chamber through the first gas flow channel 500 from the first gas outlet holes 300.
[0084] The beneficial effects of the shower plate provided by the present application include, but are not limited to, the following:
[0085] The spray plate provided in this application is adapted to the shape of the wafer by arranging the air holes of the spray plate into a first air hole ring and a second air hole ring, which can provide the uniformity of the distribution of reaction gases on the surface of the wafer during the wafer processing, and improve the processing effect of the wafer. In addition, by arranging the first air hole ring and the second air hole ring in a staggered manner, and reasonably setting the proportion of the second air outlet hole and the first air outlet hole in the second area of the end face, the uniformity of the distribution of reaction gases on the surface of the wafer is further improved, thereby improving the uniformity of the thin film deposited on the surface of the wafer.
[0086] It should be noted that the beneficial effects that may be produced by different embodiments are different. In different embodiments, the beneficial effects that may be produced may be any one or several combinations of the above, or any other beneficial effects that may be obtained.
[0087] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only an example and does not constitute a limitation to this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this specification, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of this application.
[0088] It should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be a rotational connection or a sliding connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood in combination with specific situations.
[0089] In addition, when terms such as "first", "second", and "third" are used in the description of this application to describe various features, these terms are only used to distinguish these features, and cannot be understood as indicating or implying the correlation, relative importance, or implicitly indicating the quantity of the indicated features.
[0090] In addition, the specification of the present application describes exemplary embodiments by referring to idealized exemplary cross-sectional views and / or plan views and / or three-dimensional views. Therefore, differences from the shapes shown in the drawings due to, for example, manufacturing techniques and / or tolerances are foreseeable. Accordingly, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but should include deviations in the shapes caused by, for example, manufacturing. Thus, the regions shown in the figures are substantially schematic, and their shapes are not intended to show the actual shape of the regions of the device nor to limit the scope of the exemplary embodiments.
[0091] At the same time, the present application uses specific words to describe the embodiments of this specification. Terms such as "one embodiment", "an embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that the "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more at different positions in the present application does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the present application may be combined appropriately.
[0092] Similarly, it should be noted that, in order to simplify the presentation of the disclosure of the present application and thus help the understanding of one or more inventive embodiments, in the foregoing description of the embodiments of the present application, sometimes multiple features are grouped into one embodiment, drawing, or description thereof. However, this disclosure method does not mean that the features required by the subject matter of the present application are more than those mentioned in the claims. In fact, the features of the embodiments are fewer than all the features of the single embodiments disclosed above.
[0093] Finally, it should be understood that the embodiments described in the present application are only used to illustrate the principles of the embodiments of the present application. Other variations may also fall within the scope of the present application. Therefore, by way of example and not limitation, alternative configurations of the embodiments of the present application may be regarded as consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.
Claims
1. A spray plate, characterized in that, Comprising: A plate body, on at least one end face of the plate body, a first air hole ring and a second air hole ring are alternately distributed with the center of the end face as the center of the circle; any one of the first air hole rings is composed of a plurality of first air outlet holes distributed at equal intervals; any one of the second air hole rings is composed of a plurality of the first air outlet holes and a plurality of second air outlet holes, wherein the first air outlet holes are distributed at equal intervals, and the second air outlet holes are located between adjacent first air outlet holes; the cross-sectional area of the second air outlet hole is larger than the cross-sectional area of the first air outlet hole; Wherein, the end face includes a first area, a second area and a third area arranged in sequence from the center of the end face to the edge; the length ratios of the first area, the second area and the third area in the radial direction of the end face are (50 - 60):(90 - 120):(38 - 58); For the first area and the third area, the second air outlet holes are arranged at intervals between every two adjacent first air outlet holes in the second air hole ring; for the second area, the second air outlet holes are not arranged at intervals between some adjacent first air outlet holes in the second air hole ring.
2. The spray plate according to claim 1, characterized in that, A plurality of the second air hole rings are arranged in the second area, and the number of intervals where the second air outlet holes are not arranged between adjacent first air outlet holes in each second air hole ring is 6 or 12.
3. The shower plate according to claim 2, characterized in that, For the second air hole rings in the second area, the intervals where the second air outlet holes are not arranged between adjacent first air outlet holes are equally spaced.
4. The shower plate according to claim 3, wherein, The second area includes 5 second air hole rings. From the center of the end face to the edge of the end face, the number of intervals where the second air outlet holes are not arranged between adjacent first air outlet holes in the second air hole rings are 6, 6, 6, 12 and 6 in sequence.
5. The shower plate according to claim 4, characterized in that, The sum of the cross-sectional areas of the plurality of first air outlet holes in the second area accounts for 1.8% - 2.2% of the total surface area of the second area, and the sum of the cross-sectional areas of the plurality of second air outlet holes in the second area accounts for 5.6% - 6.0% of the total surface area of the second area.
6. The shower plate according to claim 5, characterized in that, The sum of the cross-sectional areas of the plurality of second air outlet holes in the first area accounts for 6.8% - 7.2% of the total surface area of the first area; The sum of the cross-sectional areas of the plurality of second air outlet holes in the third area and 7.6% - 8.0% of the total surface area of the third area; The sum of the cross-sectional areas of the plurality of first air outlet holes in the first area accounts for 2.1% - 2.5% of the total surface area of the first area; And The sum of the cross-sectional areas of the plurality of first air outlet holes in the second area and 1.4% - 1.8% of the total surface area of the third area.
7. The shower plate according to claim 6, characterized in that, The cross-sectional area of a single said second air outlet is 38 to 40 mm 2 ; and / or the cross-sectional area of a single said first air outlet is 3.0 to 3.2 mm 2 .
8. The shower plate according to claim 7, characterized in that, The first area includes three first air hole rings and two second air hole rings; the second area includes five first air hole rings; and the third area includes two first air hole rings and two second air hole rings.
9. The shower plate according to claim 1, characterized in that, A second gas flow channel and a first gas flow channel are arranged inside the plate body and are respectively communicated with the second air outlet holes and the first air outlet holes.
10. The shower plate according to claim 9, characterized in that, The plate body includes a first plate body and a second plate body stacked in sequence. The second gas flow channel penetrates through the first plate body and the second plate body at the same time and communicates with the second air outlet; the first gas flow channel is located between the first plate body and the second plate body and communicates with the first air outlet penetrating through the second plate body.
11. The spray plate according to claim 10, wherein, The first gas flow channel includes an inlet air flow channel and a plurality of gas dispersion flow channels communicated with the inlet air flow channel. The air inlet of the inlet air flow channel is located on the side wall of the plate body, and the plurality of gas dispersion flow channels are annularly distributed and communicated with the first air outlet.