Hot pressing structure for gyro electrode indium sealing and gyro electrode indium sealing device

Abstract

The utility model discloses a gyro electrode indium seal hot-pressing structure and gyro electrode indium seal device, including universal ball adjustment subassembly and hot-pressing head, universal ball adjustment subassembly includes mounting portion and universal ball head, universal ball head includes sphere and fixed connection in the first connection portion of sphere lower end, the mounting portion bottom surface is equipped with the accommodation groove, and the accommodation groove is equipped with the universal ball head. The ball body is rotationally arranged in the containing groove, and the first connecting part extends out of the containing groove and is fixedly connected with the hot pressing head. According to the utility model, the time of the leveling step during indium sealing can be saved, so that the production efficiency is improved, and the device has the advantages of no error in leveling angle, good stability and convenience in operation.

Description

Technical Field

[0001] The utility model relates to the technical field of gyro production and assembly, and particularly relates to a hot pressing structure for indium sealing of gyro electrodes and a gyro electrode indium sealing device. Background Technique

[0002] During the production and assembly process of a ring laser gyro, it is necessary to perform hot pressing and indium sealing on a metal electrode and a glass cavity. In a conventional indium sealing device, a hot pressing head 11 in a traditional manner is generally used. As Figure 1 shown, the hot pressing head 11 is fixed at the lower end of a guide plate 5. The guide plate 5 is slidably arranged on two guide columns 41. The lower ends of the two guide columns 41 are fixed on a horizontally arranged workbench 2, and their upper ends are installed on a horizontally arranged mounting plate 42. A displacer 3 is fixed on the mounting plate 42 and is in transmission connection with the guide plate 5. A glass cavity 6 is placed on the workbench 2, and an indium wire coil 7 is placed thereon. A metal electrode 8 is placed on the indium wire coil. The displacer 3 drives the guide plate 5 to move downward, thereby driving the hot pressing head 11 to move downward until it abuts against the metal electrode 8 and applies pressure. The heat energy of the hot pressing head 11 is transmitted to the indium wire coil 7 through the metal electrode 8 to soften it below the melting point. The softened indium wire presses and indium seals the metal electrode 8 and the glass cavity 6 under the action of pressure, as Figure 2 shown. To achieve a flat indium sealing effect, before indium sealing, a level is required to detect the levelness of the guide plate 5, and four adjusting screws 6 on the guide plate 5 of the hot pressing head 11 are adjusted to adjust the guide plate 5 to a horizontal state, reaching a state where the contact surfaces between the electrode and the hot pressing head 11 are parallel to each other, so as to obtain a flat indium sealing effect. However, this leveling process is time-consuming and laborious, and there are still a small number of angular deviation problems after leveling, resulting in a situation where the position of the indium-sealed electrode shifts due to an increase in pressure, affecting the indium sealing effect. Content of the Utility Model

[0003] Aiming at the problems in the background technique, the utility model proposes a hot pressing structure for indium sealing of gyro electrodes, which can save the time of the leveling step during indium sealing, thereby improving production efficiency, and has no error in leveling angle, good stability performance, and convenient operation. In addition, a gyro electrode indium sealing device with this hot pressing structure is provided.

[0004] The utility model adopts the following technical solutions:

[0005] A hot pressing structure for indium sealing of gyro electrodes includes a universal ball adjusting component and a hot pressing head. The universal ball adjusting component includes a mounting part and a universal ball head. The universal ball head includes a sphere and a first connecting part fixedly connected to the lower end of the sphere. A receiving groove is formed on the bottom surface of the mounting part, and the sphere is rotatably placed in the receiving groove. The first connecting part extends out of the receiving groove and is fixedly connected to the hot pressing head.

[0006] Preferably, the first connecting part is a screw, and a threaded hole matching with the screw is formed on the upper end surface of the hot pressing head, and the screw is screwed into the threaded hole so that the screw and the hot pressing head are threadedly connected.

[0007] Preferably, a heating rod is provided in the thermal compression head.

[0008] Preferably, a temperature sensor is provided in the thermal compression head.

[0009] As a general inventive concept, the utility model also provides a gyroscope electrode indium sealing device, including a workbench, a displacer and a mounting frame, and also includes the above-mentioned hot pressing structure, the workbench is used to place the glass cavity of the gyroscope, the metal electrode of the gyroscope is placed on the glass cavity, and an indium wire ring is provided between the two, the mounting frame is arranged on the workbench, the displacer is placed on the mounting frame and is transmission-connected to the hot pressing structure, and is used to drive the hot pressing structure to move downward until its hot pressing head abuts against the metal electrode and applies pressure, the heat energy of the hot pressing head is transferred to the indium wire ring through the metal electrode to soften it, and the metal electrode and the glass cavity are indium-sealed after the softened indium solidifies.

[0010] Preferably, it also includes a guide plate, which is slidably mounted on the mounting frame. The mounting portion of the hot pressing structure is placed on the upper end surface of the guide plate and is transmission-connected to the displacer. A through hole is provided on the guide plate. The first connecting portion of the hot pressing structure is fixedly connected to the hot pressing head after passing through the through hole. The through hole has space for the ball to rotate.

[0011] Preferably, the mounting frame includes two vertically arranged guide columns, and a mounting plate fixed to the upper ends of the two guide columns, and the guide plate is slidably disposed on the two guide columns.

[0012] Preferably, the guide plate is mounted on the guide column via a ball bearing sleeve.

[0013] Preferably, the displacer is fixed to the upper end of the mounting plate, and its driving end passes through the mounting plate and is detachably connected to the mounting portion of the hot pressing structure.

[0014] Compared with the prior art, the advantages of the utility model are:

[0015] Based on the existing general precision processing requirements of laser gyroscopes and metal electrodes, the utility model provides a hot pressing head with a universal ball head adjuster. On the one hand, its silky angle steering can automatically level the contact angle between the hot pressing head and the electrode when the indium sealing device presses down the hot pressing head. On the other hand, due to the extremely high precision of the flatness and roughness of the contact surface of the laser gyroscope and the metal electrode, under the action of the universal ball head, the two can achieve a smooth fit of the indium seal under the action of adaptive gravity adjustment, thereby ensuring the flatness of the contact surface of the two. Therefore, the utility model can save the time of the leveling step during indium sealing, thereby improving production efficiency, and the leveling angle has good error-free stability and convenient operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more easily understand the present utility model, the present utility model will be described in more detail by referring to the specific embodiments shown in the accompanying drawings. These drawings only depict the typical embodiments of the present utility model and should not be considered as a limitation on the protection scope of the present utility model.

[0017] Figure 1 Schematic structural diagram of the indium sealing device for the gyro electrode in the prior art.

[0018] Figure 2 Schematic structural diagram of the indium sealing of the electrode and cavity of the gyro.

[0019] Figure 3 Schematic cross-sectional structural diagram of the hot pressing structure for indium sealing the gyro electrode in Embodiment 1 of the present utility model.

[0020] Figure 4 Schematic cross-sectional structural diagram of the hot pressing head in Embodiment 1 of the present utility model.

[0021] Figure 5 Schematic structural diagram of the indium sealing device for the gyro electrode in Embodiment 2 of the present utility model.

[0022] Reference numerals:

[0023] 1. Hot pressing structure; 11. Hot pressing head; 111. Threaded hole; 12. Mounting part; 13. Universal ball head; 131. Sphere; 132. First connecting part; 121. Accommodating groove; 14. Heating rod; 15. Temperature sensor; 2. Workbench; 3. Displacer; 4. Mounting frame; 41. Guide post; 42. Mounting plate; 43. Ball bushing; 5. Guide plate; 51. Through hole; 6. Glass cavity; 7. Indium wire loop; 8. Metal electrode. Specific embodiments

[0024] The following describes the embodiments of the present utility model with reference to the accompanying drawings, so that those skilled in the art can better understand the present utility model and be able to implement it. However, the listed embodiments are not intended as limitations of the present utility model. Without conflict, the following embodiments and the technical features in the embodiments can be combined with each other, and the same components are denoted by the same reference numerals.

[0025] Embodiment 1:

[0026] As Figure 3 and Figure 4As shown in the figure, this embodiment provides a hot pressing structure for indium sealing of gyro electrodes, which includes a universal ball adjusting component and a hot pressing head 11. The universal ball adjusting component includes a mounting part 12 and a universal ball head 13. The universal ball head 13 includes a sphere 131 and a first connecting part 132 fixedly connected to the lower end of the sphere 131. A receiving groove 121 is formed on the bottom surface of the mounting part 12. The sphere 131 is rotatably placed in the receiving groove 121. The first connecting part 132 extends out of the receiving groove 121 and is fixedly connected to the hot pressing head 11.

[0027] Therefore, based on the existing general precision processing requirements of laser gyroscopes and metal electrodes, the present utility model provides a hot pressing head with a universal ball head adjuster. On the one hand, its smooth angle rotation can automatically level the contact angle between the hot pressing head and the electrode when the hot pressing head is pressed down by the indium sealing device. On the other hand, due to the extremely high flatness and roughness accuracy of the contact surface between the laser gyroscope and the metal electrode, under the action of the universal ball head 13, the two can achieve flat indium sealing and fitting under the action of self-adaptive gravity adjustment, thereby ensuring the flatness of the contact surface between the two. Therefore, the present utility model can save the time of the leveling step during indium sealing, thereby improving production efficiency, and the leveling angle has no error and good stability performance, and the operation is convenient.

[0028] In this embodiment, the first connecting part 132 is a screw rod, and a threaded hole 111 matching with the screw rod is formed on the upper end surface of the hot pressing head 11. The screw rod is screwed into the threaded hole 111 so that the screw rod and the hot pressing head 11 are threadedly connected.

[0029] The universal ball adjusting component and the hot pressing head 11 adopt a threaded fit, which is convenient for disassembly. The material of the universal ball adjusting component is stainless steel, and the main material of the hot pressing head is brass.

[0030] In this embodiment, a heating rod 14 and a temperature sensor 15 are provided in the hot pressing head 11. The heating rod 14 is turned on when the hot pressing structure moves down until its hot pressing head 11 abuts against the metal electrode, so that the hot pressing head 11 reaches a temperature above the indium softening temperature. The temperature sensor 15 is used to monitor the temperature of the hot pressing head 11. The heat energy of the hot pressing head 11 is transmitted to the indium wire coil through the metal electrode to soften it. After the softened indium solidifies, the metal electrode and the glass cavity are indium sealed.

[0031] Embodiment 2:

[0032] As Figure 5As shown, this embodiment provides a gyroscope electrode indium sealing device, including a workbench 2, a displacer 3 and a mounting frame 4, and also includes the hot pressing structure 1 of Example 1, the workbench 2 is used to place the glass cavity 6 of the gyroscope, the metal electrode 8 of the gyroscope is placed on the glass cavity 6, and an indium wire ring 7 is provided between the two, the mounting frame 4 is arranged on the workbench 2, the displacer 3 is placed on the mounting frame 4 and is transmission-connected with the hot pressing structure 1, and is used to drive the hot pressing structure 1 to move downward until its hot pressing head 11 abuts against the metal electrode 8 and applies pressure, and the heat energy of the hot pressing head 11 is transferred to the indium wire ring 7 through the metal electrode 8 to soften it, and the metal electrode 8 and the glass cavity 6 are indium-sealed after the softened indium is solidified.

[0033] The above hot pressing process adopts a universal ball head leveling method, which can automatically level the contact surface between the electrode and the hot pressing head, thereby reducing the leveling time and operation errors.

[0034] In this embodiment, a guide plate 5 is also included. The guide plate 5 is slidably mounted on the mounting frame 4. The mounting portion 12 of the hot pressing structure 1 is placed on the upper end surface of the guide plate 5 and is transmission-connected to the displacement device 3. That is, the mounting portion 12 is flat against the guide plate 5. Figure 3 As shown, a through hole 51 is formed on the guide plate 5 , and the first connecting portion 132 of the hot pressing structure 1 passes through the through hole 51 and is fixedly connected to the hot pressing head 11 . The through hole 51 has a space for the ball 131 to rotate.

[0035] In this embodiment, the mounting frame 4 includes two vertically arranged guide columns 41 and a mounting plate 42 fixed to the upper ends of the two guide columns 41 . The guide plate 5 is slidably mounted on the two guide columns 41 via a ball bushing 43 .

[0036] In this embodiment, the displacer 3 is fixed to the upper end of the mounting plate 42 , and its driving end passes through the mounting plate 42 and is detachably connected to the mounting portion 12 of the hot pressing structure 1 .

[0037] The embodiments described above are only preferred specific implementations of the present invention. The phrases "in one embodiment", "in another embodiment", "in yet another embodiment" or "in other embodiments" used in this specification may refer to one or more of the same or different embodiments according to the present disclosure. Common changes and substitutions made by those skilled in the art within the scope of the technical solution of the present invention should be included in the protection scope of the present invention.

Claims

1. A hot pressing structure for indium sealing of gyro electrodes, comprising a universal ball adjustment assembly and a hot pressing head (11), wherein the universal ball adjustment assembly comprises a mounting portion (12) and a universal ball head (13), wherein the universal ball head (13) comprises a sphere (131) and a first connecting portion (132) fixedly connected to the lower end of the sphere (131), wherein a receiving groove (121) is provided on the bottom surface of the mounting portion (12), wherein the sphere (131) is rotatably placed in the receiving groove (121), and wherein the first connecting portion (132) extends out of the receiving groove (121) and is fixedly connected to the hot pressing head (11).

2. The hot pressing structure for indium sealing of a gyro electrode according to claim 1, characterized in that, The first connecting portion (132) is a screw rod, and the upper end surface of the hot pressing head (11) is provided with a threaded hole (111) that matches the screw rod. The screw rod is screwed into the threaded hole (111) so that the screw rod and the hot pressing head (11) are threadedly connected.

3. The hot pressing structure for indium sealing of the gyro electrode according to claim 1 or 2, characterized in that, A heating rod (14) is provided inside the hot pressing head (11).

4. The hot pressing structure for indium sealing of a gyro electrode according to claim 1 or 2, characterized in that, A temperature sensor (15) is provided inside the thermal compression head (11).

5. A gyro electrode indium sealing device, comprising a workbench (2), a displacer (3) and a mounting bracket (4), characterized in that, It also includes a hot pressing structure (1) as described in any one of claims 1 to 4, a workbench (2) for placing a glass cavity (6) of the gyroscope, a metal electrode (8) of the gyroscope placed on the glass cavity (6), and an indium wire ring (7) is provided between the two, a mounting frame (4) is provided on the workbench (2), a displacement device (3) is placed on the mounting frame (4) and is transmission-connected to the hot pressing structure (1), and is used to drive the hot pressing structure (1) to move downward until its hot pressing head (11) abuts against the metal electrode (8) and applies pressure, the heat energy of the hot pressing head (11) is transferred to the indium wire ring (7) through the metal electrode (8) to soften it, and after the softened indium is solidified, the metal electrode (8) and the glass cavity (6) are indium-sealed.

6. The indium sealing device for gyro electrodes according to claim 5, characterized in that, The hot pressing structure (1) also includes a guide plate (5) which is slidably mounted on the mounting frame (4). The mounting portion (12) of the hot pressing structure (1) is placed on the upper end surface of the guide plate (5) and is transmission-connected to the displacer (3). A through hole (51) is provided on the guide plate (5). The first connecting portion (132) of the hot pressing structure (1) passes through the through hole (51) and is fixedly connected to the hot pressing head (11). The through hole (51) has a space for the ball (131) to rotate.

7. The indium sealing device for gyro electrodes according to claim 6, characterized in that, The mounting frame (4) comprises two vertically arranged guide columns (41) and a mounting plate (42) fixed to the upper ends of the two guide columns (41), and the guide plate (5) is slidably mounted on the two guide columns (41).

8. The indium sealing device for gyro electrodes according to claim 7, characterized in that, The guide plate (5) is arranged on the guide column (41) through a ball bushing (43).

9. The indium sealing device for gyro electrodes according to claim 7 or 8, characterized in that, The displacer (3) is fixed to the upper end of the mounting plate (42), and its driving end passes through the mounting plate (42) and is detachably connected to the mounting portion (12) of the hot pressing structure (1).

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