Jig for testing ink shearing force of sapphire wafer

Abstract

The utility model relates to the technical field of sapphire wafer ink shear force testing, in particular to a jig for testing sapphire wafer ink shear force, the jig for testing sapphire wafer ink shear force comprises two same jig groups, and each jig group comprises a first assembly, a second connecting piece and a silica gel plate; a first connecting piece and a fixing assembly are arranged on the first assembly; the second connecting piece is connected with the first connecting piece through a screw; the two silica gel plates are fixed to the inner side of the first connecting piece and the inner side of the second connecting piece respectively. Silica gel plates are fixed on the inner sides of the first connecting piece and the second connecting piece, so that the sapphire wafer can be effectively prevented from being scratched in the testing process; meanwhile, the first connecting piece arranged on the first assembly and the fixing assembly are integrally designed, the stability of the jig can be effectively improved through the integrated design, and the influence of shaking of all the assemblies on the measurement result in the measurement process is avoided; in addition, the device is simple in structure and convenient to operate and carry.

Description

Technical Field

[0001] The present disclosure relates to the technical field of sapphire wafer ink shear force testing, and particularly to a fixture for testing the ink shear force of sapphire wafers. Background Art

[0002] With the development of science and technology, sapphire wafers are increasingly widely used in electronic products such as smart watches and mobile phones. Before application, sapphire wafers are mostly subjected to ink spraying / coating treatment, and the bonding condition between the ink / layer and the sapphire wafer has a great impact on the product quality. However, at present, there are few measuring fixtures available for measuring the shear force of ink / layers on sapphire wafers, and it is easy to scratch the sapphire wafers during use, reducing the product yield. Summary of the Invention

[0003] In order to solve the above technical problems or at least partially solve the above technical problems, the present disclosure provides a fixture for testing the ink shear force of sapphire wafers, which can effectively assist in measuring the ink shear force of sapphire wafers, and can ensure that the sapphire wafers are not scratched, effectively improving the processing efficiency and processing yield.

[0004] The present disclosure provides a fixture for testing the ink shear force of sapphire wafers, including two identical fixture groups, and the fixture group includes:

[0005] A first component, on which a first connecting member and a fixing component are provided;

[0006] A second connecting member, which is connected to the first connecting member by screws;

[0007] Silicone plates, including two pieces, which are respectively fixed on the inner sides of the first connecting member and the second connecting member.

[0008] Optionally, the first component further includes a first reinforcing member and a second reinforcing member.

[0009] Optionally, the first connecting member is provided with a first threaded hole and a first round hole, the second connecting member is provided with a second threaded hole and a second round hole, there are two first round holes, and there are two second round holes; the first threaded hole and the second threaded hole are corresponding in position and the same in size; the first round hole and the second round hole are corresponding in position and the same in size.

[0010] Optionally, the first threaded hole and the first round hole penetrate through the first connecting member, and the second threaded hole and the second round hole penetrate through the second connecting member.

[0011] Optionally, a steel nail is fixed in the first round hole, one end of the steel nail is fixed in the first round hole, and the other end of the steel nail extends out of the first round hole.

[0012] Optionally, the first connecting member further includes a platform surface, and the cross-sectional dimension of the platform surface corresponds to the cross-sectional dimension of the second connecting member.

[0013] Optionally, the fixing assembly includes a fixing member, a fixing nut, and a fixing hole. Threads corresponding to the fixing nut are provided on the fixing member, the fixing nut is threadedly connected to the fixing member, and the fixing hole penetrates through the fixing member.

[0014] Optionally, a first groove is formed inside the first connecting member, and the silica gel plate is fixed to the first connecting member through the first groove; a second groove is formed inside the second connecting member, and the silica gel plate is fixed to the second connecting member through the second groove; the silica gel plate is 5 mm thick.

[0015] Optionally, the positions of the first groove and the second groove correspond to each other and have the same size; both the first component and the second connecting member are made of phenolic plastic.

[0016] The technical solution provided by the embodiment of the present disclosure has the following advantages compared with the prior art:

[0017] The fixture for testing the ink shear force of a sapphire wafer provided by the embodiment of the present disclosure fixes a silica gel plate inside the first connecting member and the second connecting member. Through this setting, it can effectively prevent scratches on the sapphire wafer during the test; at the same time, the first connecting member and the fixing assembly provided on the first component are integrally designed, and this integral design can effectively improve the stability of the fixture and avoid the influence on the measurement result caused by the shaking of each component during the measurement process; in addition, the structure of the present disclosure is simple, easy to operate and convenient to carry. Description of the Drawings

[0018] The drawings here are incorporated into the specification and constitute a part of this specification, showing the embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure.

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 It is the front view of the fixture group of the fixture for testing the ink shear force of a sapphire wafer;

[0021] Figure 2 It is the top view of the fixture group of the fixture for testing the ink shear force of a sapphire wafer;

[0022] Figure 3 It is a side view of a fixture group of a fixture for testing the shear force of ink on a sapphire wafer;

[0023] Figure 4 It is a schematic diagram of the test state of a fixture for testing the shear force of ink on a sapphire wafer;

[0024] In the figure: 1. First component, 11. First connecting piece, 111. First threaded hole, 112. First round hole, 113. Connecting platform, 114. First groove, 115. Steel nail, 12. First reinforcing piece, 13. Second reinforcing piece, 14. Fixing component, 141. Fixing piece, 142. Fixing nut, 143. Fixing hole, 2. Second connecting piece, 21. Second threaded hole, 22. Second round hole, 23. Second groove, 3. Silicone plate, 4. Sapphire wafer, 41. Ink shear zone. Specific embodiments

[0025] In order to more clearly understand the above-mentioned objects, features and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that, without conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other.

[0026] In the following description, many specific details are set forth in order to fully understand the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, rather than all of the embodiments.

[0027] As Figures 1-4 shown, a fixture for testing the shear force of ink on a sapphire wafer includes two identical fixture groups, and is characterized in that the fixture group includes:

[0028] A first component 1, on which a first connecting piece 11 and a fixing component 14 are arranged;

[0029] A second connecting piece 2, which is connected to the first connecting piece 11 by screws;

[0030] A silicone plate 3, which includes two pieces and is respectively fixed on the inner sides of the first connecting piece 11 and the second connecting piece 2.

[0031] Specifically, the silicone plate 3 is fixed on the inner sides of the first connecting piece 11 and the second connecting piece 2. Through this setting, scratches on the sapphire wafer can be effectively prevented during the test; the threaded connection between the first connecting piece 11 and the second connecting piece 2 can be achieved by using screws to connect the second connecting piece 2 and the first connecting piece 11 together.

[0032] During specific use, the two fixture groups are respectively fixed on the universal testing machine through the fixing component 14. The sapphire wafer printed with ink to be tested is placed between the first connecting piece 11 and the second connecting piece 2. The first connecting piece 11 and the second connecting piece 2 are connected together using screws. The universal testing machine is controlled to apply tensile forces in opposite directions to the two fixture groups, thereby measuring the shear force that the ink printed on the sapphire wafer can withstand.

[0033] As Figure 1 and Figure 2 shown in the fixture for testing the shear force of the ink on the sapphire wafer, the first component 1 further includes a first reinforcement member 12 and a second reinforcement member 13.

[0034] Specifically, the first connecting piece 11, the first reinforcement member 12, the second reinforcement member 13, and the fixing component 14 are of an integral variable cross-section structure. This setting can effectively prevent the connections between various components from loosening and improve the stability of the fixture. Among them, the cross-section of the first reinforcement member 12 is larger than that of the first connecting piece, and the cross-section of the second reinforcement member 13 is smaller than that of the first reinforcement member 12. Through this setting, the strength of the fixture can be effectively enhanced, avoiding excessive shear force during testing and thus breaking the fixture. Moreover, this variable cross-section design can save raw materials and reduce costs.

[0035] As Figure 3 shown in the fixture for testing the shear force of the ink on the sapphire wafer, the first connecting piece 11 is provided with a first threaded hole 111 and a first round hole 112, and the second connecting piece 2 is provided with a second threaded hole 21 and a second round hole 22. The positions of the first threaded hole 111 and the second threaded hole 21 correspond to each other and have the same size; the positions of the first round hole 112 and the second round hole 22 correspond to each other and have the same size.

[0036] In some embodiments, the first threaded hole 111 and the first round hole 112 penetrate through the first connecting piece 11, and the second threaded hole 21 and the second round hole 22 penetrate through the second connecting piece 2.

[0037] In some embodiments, a steel nail 115 is fixed in the first round hole 112. One end of the steel nail 115 is fixed in the first round hole 112, and the other end of the steel nail 115 extends out of the first round hole 112.

[0038] Specifically, one end of the steel nail 115 is fixed in the first round hole 112, and the other end extends out of the first round hole 112. Through this setting, the steel nail 115 can not only play a fixing role but also act as a guide rail to facilitate the connection between the first connecting piece 11 and the second connecting piece 2. During specific use, when connecting the first connecting piece 11 and the second connecting piece 2, first pass the second round hole 22 through the part of the steel nail 115 that extends out of the first round hole 112, and then use a screw to connect the first connecting piece 11 and the second connecting piece 2 through the second threaded hole 21 and the second round hole 22.

[0039] Continue to refer to Figure 3 the fixture for the shearing force test of the sapphire wafer ink shown in Figure 3 . The first connecting member 11 further includes a platform surface 113, and the cross-sectional dimension of the platform surface 113 corresponds to the cross-sectional dimension of the second connecting member 2.

[0040] Specifically, the cross-sectional dimension of the platform surface 113 corresponding to the cross-sectional dimension of the second connecting member 2 means that when the first connecting member 11 and the second connecting member 2 are connected, the second connecting member 2 is placed on the platform surface 113. Through this setting, the overall stability of the fixture can be enhanced, and the influence of the shaking of each component during use on the measurement data can be avoided.

[0041] In some embodiments, the fixing component 14 includes a fixing member 141, a fixing nut 142, and a fixing hole 143. A thread corresponding to the fixing nut 142 is provided on the fixing member 141, the fixing nut 142 is threadedly connected to the fixing member 141, and the fixing hole 143 penetrates through the fixing member 141.

[0042] Specifically, the fixing component 14 is connected to the universal testing machine through the fixing hole 143. A connecting hole corresponding to the fixing hole 143 is provided on the universal testing machine. The connection between the fixing hole 143 and the universal testing machine can be a threaded connection of a screw and a nut. The thread corresponding to the fixing nut 142 is provided on the fixing component 14, and the fixing nut 142 being threadedly connected to the fixing member 141 means that the position of the fixing nut 142 on the fixing component 14 can be adjusted by rotation. After the fixing component 14 is connected to the universal testing machine through the fixing hole 143, the fixing nut 142 can be rotated to drive the fixing component 14 to move away from the connection between the fixing hole 143 and the universal testing machine, so as to make the connection between the fixing component 14 and the universal testing machine more stable. Through this setting, the stability of the connection between the fixing component 14 and the universal testing machine can be improved, and the influence of the shaking at the connection between the fixing component 14 and the universal testing machine during testing can be avoided; at the same time, this setting has a simple structure and is convenient for installation and disassembly.

[0043] During specific use, the fixing hole 143 is aligned with the connecting hole on the universal testing machine. A screw is used to pass through the fixing hole 143 and the connecting hole on the universal testing machine, and a nut is installed and tightened at the other end of the screw. The fixing nut 142 is rotated to drive the fixing component 14 to move away from the connection between the fixing hole 143 and the universal testing machine until the fixing nut 142 cannot be rotated.

[0044] In some embodiments, a first groove 114 is provided inside the first connecting member 11, and the silica gel plate 3 is fixed on the first connecting member 11 through the first groove 114; a second groove 23 is provided inside the second connecting member 2, and the silica gel plate 3 is fixed on the second connecting member 2 through the second groove 23; the silica gel plate 3 is 5 mm thick.

[0045] In some embodiments, the positions of the first groove 114 and the second groove 23 correspond to each other and their sizes are the same; both the first component 1 and the second connecting member 2 are made of phenolic plastic.

[0046] As Figure 4 Shown is a schematic diagram of the test state of the fixture for testing the ink shear force of a sapphire wafer. When performing the ink shear force test on a sapphire wafer, two identical sapphire wafers printed with ink are pasted together to form an ink shear zone. The two ends of the pasted sapphire wafers are respectively fixed between the first connecting member 11 and the second connecting member 2 of two fixture groups. The first connecting member 11 and the second connecting member 2 are connected, and the two fixture groups are respectively fixed to a universal testing machine. The universal testing machine is controlled to apply tensile forces in opposite directions to the two fixture groups until the two sapphire wafers are separated.

[0047] It should be noted that in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.

[0048] The above are only specific embodiments of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A fixture for testing the shear force of sapphire wafer ink, comprising two identical fixture groups, characterized in that, The fixture set includes: The first component (1), on which a first connecting piece (11) and a fixing component (14) are provided; The second connecting piece (2), which is connected to the first connecting piece (11) by screws; The silica gel plate (3), which includes two pieces and is respectively fixed on the inner sides of the first connecting piece (11) and the second connecting piece (2).

2. The fixture for testing the ink shear force of the sapphire wafer according to claim 1, characterized in that, The first component (1) further includes a first reinforcing piece (12) and a second reinforcing piece (13).

3. The fixture for testing the ink shear force of the sapphire wafer according to claim 1, characterized in that, The first connecting piece (11) is provided with a first threaded hole (111) and a first round hole (112); the second connecting piece (2) is provided with a second threaded hole (21) and a second round hole (22); there are two first round holes (112), and there are two second round holes (22); the positions of the first threaded hole (111) and the second threaded hole (21) correspond to each other and have the same size; the positions of the first round hole (112) and the second round hole (22) correspond to each other and have the same size.

4. The fixture for testing the ink shear force of the sapphire wafer according to claim 3, wherein The first threaded hole (111) and the first round hole (112) penetrate through the first connecting piece (11), and the second threaded hole (21) and the second round hole (22) penetrate through the second connecting piece (2).

5. The fixture for testing the shear force of the sapphire wafer ink according to claim 4, characterized in that, A steel nail (115) is fixed in the first round hole (112), one end of the steel nail (115) is fixed in the first round hole (112), and the other end of the steel nail (115) extends out of the first round hole (112).

6. The jig for testing the ink shear force of the sapphire wafer according to claim 1, characterized in that, The first connecting piece (11) further includes a platform surface (113), and the cross-sectional size of the platform surface (113) corresponds to the cross-sectional size of the second connecting piece (2).

7. The jig for testing the ink shear force of the sapphire wafer according to claim 1, wherein, The fixing component (14) includes a fixing piece (141), a fixing nut (142), and a fixing hole (143). The fixing piece (141) is provided with threads corresponding to the fixing nut (142), the fixing nut (142) is threadedly connected to the fixing piece (141), and the fixing hole (143) penetrates through the fixing piece (141).

8. The fixture for testing the ink shear force of the sapphire wafer according to claim 1, characterized in that, A first groove (114) is opened on the inner side of the first connecting piece (11), and the silica gel plate (3) is fixed on the first connecting piece (11) through the first groove (114); a second groove (23) is opened on the inner side of the second connecting piece (2), and the silica gel plate (3) is fixed on the second connecting piece (2) through the second groove (23); the silica gel plate (3) is 5 mm thick.

9. The fixture for testing the ink shear force of the sapphire wafer according to claim 8, wherein, The positions of the first groove (114) and the second groove (23) correspond to each other and have the same size.

10. The fixture for testing the ink shear force of the sapphire wafer according to claim 1, characterized in that, The materials of the first component (1) and the second connecting piece (2) are both phenolic plastics.

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