Testing device of electronic device

Abstract

The embodiment of the utility model relates to the technical field of electronic product testing, and provides an electronic device testing device, which comprises a lower thermal insulation box, the top of the lower thermal insulation box is provided with a testing groove which is recessed inwards from the top surface of the lower thermal insulation box, and the testing groove is used for placing a to-be-tested electronic device; the air inlet pipe and the air outlet pipe penetrate through the side wall of the lower heat preservation box and are communicated with the testing groove, the air inlet pipe is used for conveying air into the testing groove, and the air outlet pipe is used for conveying the air in the testing groove to the outside; the upper heat preservation box is located above the lower heat preservation box, a heating piece is arranged on the surface, facing the lower heat preservation box, of the upper heat preservation box, and the orthographic projection of the heating piece on the top face of the lower heat preservation box is located in the testing groove; and the shielding assembly is located on the inner wall surface of the test groove. The electronic device testing device provided by the embodiment of the utility model is at least beneficial to improving the testing efficiency and accuracy of the electronic device.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic product testing, and in particular to a testing device for electronic devices. Background Art

[0002] During the production process of electronic devices, it is necessary to test the performance parameters of electronic devices under various environmental conditions, such as high temperature, low temperature, high humidity, low humidity, etc., to ensure that the electronic devices can still guarantee the corresponding technical parameters in the final use environment and will not have performance drift or failure.

[0003] In the current production process, the high and low temperature performance parameters of electronic devices mainly adopt several methods such as sampling inspection, product welding type testing, and box type static fixture testing. These methods cannot meet the production requirements of large quantities of products. At the same time, some manufacturers still use manual measurement for this test, resulting in low accuracy and efficiency of test data. And there are high temperature and low temperature environments during the process, and there are risks of scalding and frostbite when manual operation is involved. Utility Model Content

[0004] The embodiments of the present application provide a testing device for electronic devices, which is at least beneficial to improving the testing efficiency and accuracy of electronic devices.

[0005] According to some embodiments of the present application, on the one hand, the embodiments of the present application provide a testing device for electronic devices, including: a lower insulation box, the top of the lower insulation box has a test slot recessed inward from the top surface of the lower insulation box, and the test slot is used to place the electronic device to be tested; an air inlet pipe and an air outlet pipe, the air inlet pipe and the air outlet pipe penetrate through the side wall of the lower insulation box and are communicated with the test slot, the air inlet pipe is used to convey gas into the test slot, and the air outlet pipe is used to convey the gas in the test slot to the outside; an upper insulation box, the upper insulation box is located above the lower insulation box, a heating sheet is arranged on the surface of the upper insulation box facing the lower insulation box, and the orthographic projection of the heating sheet on the top surface of the lower insulation box is located in the test slot; a shielding component, the shielding component is located on the inner wall surface of the test slot.

[0006] In some embodiments, a pressing plate is arranged on the surface of the upper insulation box facing the lower insulation box, the heating sheet is located on the side of the pressing plate away from the upper insulation box, and the orthographic projection of the pressing plate on the top surface of the lower insulation box overlaps with the orthographic projection of the test slot.

[0007] In some embodiments, sealing strips are arranged around the pressing plate.

[0008] In some embodiments, an elastic member is arranged between the pressing plate and the upper insulation box.

[0009] In some embodiments, a heat conducting sheet is arranged on the surface of the heating sheet facing the lower insulation box.

[0010] In some embodiments, at least one of a temperature sensor, a humidity sensor, or a pressure sensor is disposed in the test slot.

[0011] In some embodiments, it further includes: a base, a lower insulation box is disposed on the base; two slide rails are disposed on the base, and the two slide rails are respectively located on both sides of the lower insulation box; two sliders are respectively movably disposed on the two slide rails; two side plates, the bottoms of the two side plates are respectively fixed to the two sliders, and when the sliders reciprocate along the slide rails, the side plates are driven to reciprocate; a cross beam, both ends of the cross beam are respectively fixed to the tops of the two side plates; a lifting mechanism is disposed on the cross beam, the lifting mechanism is fixed to the upper insulation box, and when the lifting mechanism moves up and down relative to the cross beam, the upper insulation box is driven to move up and down.

[0012] In some embodiments, a guide post is disposed on the top of the upper insulation box, a guide hole is disposed on the cross beam, and the guide post is disposed through the guide hole.

[0013] In some embodiments, a buffer is disposed at the end of the slide rail.

[0014] In some embodiments, a position sensor is disposed on the outer wall of the lower insulation box close to the side plate, and the position sensor is used to detect the relative position between the side plate and the lower insulation box.

[0015] The technical solutions provided by the embodiments of the present application have at least the following advantages:

[0016] In the test device for an electronic device provided by an embodiment of the present application, the lower insulation box has a test slot for placing the electronic device to be tested. The upper insulation box is located above the lower insulation box. After the upper insulation box covers the test slot, a closed test space is formed, which is conducive to adjusting the environmental conditions of the closed test space. Among them, the air inlet pipe and the air outlet pipe penetrate through the side wall of the lower insulation box and communicate with the test slot, and are used to convey air into the test slot or discharge the air in the test slot. By means of the air inlet pipe and the air outlet pipe, it is conducive to adjusting the gas environment in the test slot, such as the humidity, air pressure or temperature in the test slot, etc. In this way, the performance parameters of the electronic device to be tested can be tested under high humidity, low humidity, high pressure, low pressure or low temperature environments. A heating sheet is also provided on the surface of the upper insulation box facing the lower insulation box, and the heating sheet can heat the electronic device to be tested to test the performance parameters of the electronic device to be tested under high temperature conditions. A shielding component is also provided on the inner wall surface of the test slot, and the shielding component can reduce the interference encountered by the electronic device during the test and meet the requirements of product shielding test. The test device for an electronic device provided by an embodiment of the present application can test the electronic device under multiple environmental conditions, such as high temperature, low temperature, high pressure, low pressure, high humidity and low humidity tests. Using the same test device to test the electronic device under multiple environmental conditions is conducive to improving the test efficiency. At the same time, a shielding component is also provided in the test device to reduce the interference during the test and improve the test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplary illustrations do not constitute a limitation on the embodiments. Unless otherwise stated, the figures in the drawings do not constitute a proportional limitation. In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the following described drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1 It is a schematic structural diagram of a test device for an electronic device provided by an embodiment of the present application from a perspective;

[0019] Figure 2 It is a rear view of a test device for an electronic device provided by an embodiment of the present application;

[0020] Figure 3 It is a schematic structural diagram of a test device for an electronic device provided by an embodiment of the present application from another perspective;

[0021] Figure 4 It is a front view of a test device for an electronic device provided by an embodiment of the present application;

[0022] Figure 5 For Figure 4 Cross-sectional view along the AA1 direction. Specific embodiments

[0023] As can be seen from the background art, there are problems of low accuracy and efficiency in the performance parameter testing of electronic devices under multiple environmental conditions.

[0024] In the test device for an electronic device provided by an embodiment of the present application, the lower incubator has a test slot for placing the electronic device to be tested. The upper incubator is located above the lower incubator. After the upper incubator covers the test slot, a closed test space is formed, which is conducive to adjusting the environmental conditions of the closed test space. Among them, the air inlet pipe and the air outlet pipe penetrate through the side wall of the lower incubator and communicate with the test slot, and are used to convey air into the test slot or discharge the air in the test slot. By means of the air inlet pipe and the air outlet pipe, it is conducive to adjusting the gas environment in the test slot, such as the humidity, air pressure or temperature in the test slot. In this way, the performance parameters of the electronic device to be tested can be tested under high humidity, low humidity, high pressure, low pressure or low temperature environments. The surface of the upper incubator facing the lower incubator is also provided with a heating element, which can heat the electronic device to be tested to test the performance parameters of the electronic device to be tested under high temperature conditions. The inner wall surface of the test slot is also provided with a shielding component, which can reduce the interference encountered by the electronic device during the test and meet the requirements of product shielding test. The test device for an electronic device provided by an embodiment of the present application can test the electronic device under multiple environmental conditions, such as high temperature, low temperature, high pressure, low pressure, high humidity and low humidity tests. Using the same test device to test the electronic device under multiple environmental conditions is conducive to improving the test efficiency. At the same time, a shielding component is also provided in the test device to reduce the interference during the test and improve the test accuracy.

[0025] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "a plurality" is more than two, unless otherwise specifically defined.

[0026] Referring to "embodiments" herein means that the specific features, structures or characteristics described in connection with the embodiments may be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0027] In the description of the embodiments of the present application, the orientation or positional relationship indicated by technical terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the embodiments of the present application.

[0028] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0029] In the description of the embodiments of the present application, when a certain component "includes" another component, unless otherwise stated, other components are not excluded, and other components may further be included.

[0030] The terms used in the description of various embodiments herein are only for describing specific embodiments and are not intended to be limiting. As used in the description of the various embodiments and the appended claims, "component" is also intended to include the plural form unless the context clearly indicates otherwise.

[0031] The following will elaborate on the embodiments of the present application in conjunction with the drawings. However, those of ordinary skill in the art can understand that in the embodiments of the present application, many technical details are provided for the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in the present application can still be implemented.

[0032] Figure 1 Schematic diagram of the structure of a test device for an electronic device provided in an embodiment of the present application from a perspective; Figure 2 Rear view of a test device for an electronic device provided in an embodiment of the present application; Figure 3 Schematic diagram of the structure of a test device for an electronic device provided in an embodiment of the present application from another perspective; Figure 4 Front view of a test device for an electronic device provided in an embodiment of the present application; Figure 5 For Figure 4 Cross-sectional view along the AA1 direction.

[0033] ReferenceFigures 1 to 5 , according to some embodiments of the present application, on the one hand, an electronic device testing apparatus is provided, including: a lower insulation box 100, an upper insulation box 200, an intake pipe 301, an exhaust pipe 302, and a shielding component 400. The top of the lower insulation box 100 has a test slot 101 that is recessed inward from the top surface of the lower insulation box 100. The test slot 101 is used to place the electronic device to be tested (not shown in the figure); the intake pipe 301 and the exhaust pipe 302 penetrate through the side wall of the lower insulation box 100 and communicate with the test slot 101. The intake pipe 301 is used to transport gas into the test slot 101, and the exhaust pipe 302 is used to transport the gas in the test slot 101 to the outside; the upper insulation box 200 is located above the lower insulation box 100, and a heating element 201 is provided on the surface of the upper insulation box 200 facing the lower insulation box 100. The orthographic projection of the heating element 201 on the top surface of the lower insulation box 100 is located within the test slot 101; the shielding component 400 is located on the inner wall surface of the test slot 101.

[0034] In the electronic device testing apparatus provided by the embodiments of the present application, the lower insulation box 100 has a test slot 101 for placing the electronic device to be tested. The upper insulation box 200 is located above the lower insulation box 100. After the upper insulation box 200 covers the test slot 101, a closed test space is formed, which is beneficial to adjusting the environmental conditions of the closed test space. Among them, the intake pipe 301 and the exhaust pipe 302 penetrate through the side wall of the lower insulation box 100 and communicate with the test slot 101, and are used to transport air into the test slot 101 or discharge the air in the test slot 101. By means of the intake pipe 301 and the exhaust pipe 302, it is beneficial to adjust the gas environment in the test slot 101, such as the humidity, air pressure, or temperature in the test slot 101. In this way, the performance parameters of the electronic device to be tested can be tested under high humidity, low humidity, high pressure, low pressure, or low temperature environments. A heating element 201 is also provided on the surface of the upper insulation box 200 facing the lower insulation box 100. The heating element 201 can heat the electronic device to be tested to test the performance parameters of the electronic device to be tested under high temperature conditions. A shielding component 400 is also provided on the inner wall surface of the test slot 101. The shielding component 400 can reduce the interference encountered by the electronic device during testing and meet the requirements of product shielding testing. The electronic device testing apparatus provided by the embodiments of the present application can test the electronic device under multiple environmental conditions, such as high temperature, low temperature, high pressure, low pressure, high humidity, and low humidity tests. Using the same testing apparatus to test the electronic device under multiple environmental conditions is beneficial to improving the testing efficiency. At the same time, a shielding component 400 is also provided in the testing apparatus to reduce the interference during the testing process, which can improve the testing accuracy.

[0035] Reference Figure 5, in some embodiments, the thermal insulation material 103 in the lower incubator 100 may include foam boards, heat insulation cotton, or thermal insulation cotton, etc. The foam board may be a board made of polyethylene particles through heating and foaming; the heat insulation cotton may be glass fiber or rock wool, etc.; the thermal insulation cotton may be mineral fiber, plant fiber, or polyurethane, etc.

[0036] In some embodiments, the shape of the test slot 101 of the lower incubator 100 can be designed according to the shape of the electronic device to be tested, which is beneficial to fixing the electronic device to be tested in the test slot 101. In some embodiments, a fixture may be provided in the test slot 101, and the fixture is used to fix the electronic device to be tested in the test slot 101. This avoids the movement of the electronic device to be tested caused by the air flow during the test, resulting in a decrease in the accuracy of the test.

[0037] In some embodiments, at least one of a temperature sensor, a humidity sensor, or a pressure sensor may be provided in the test slot 101. The temperature sensor, the humidity sensor, and the pressure sensor can respectively obtain the temperature, humidity, and pressure in the test slot 101, which is beneficial to monitoring whether the environmental conditions during the test reach the preset conditions, and thus is beneficial to adjusting the test environment.

[0038] Combined with reference Figure 1 and Figure 2 , in some embodiments, a plurality of connection ports may be provided on the outer side wall of the lower incubator 100. The plurality of connection ports can be used to electrically connect to the electronic device to be tested in the test slot 101 to obtain data of the electronic device to be tested; or to electrically connect to other devices in the test slot 101, such as a temperature sensor, a humidity sensor, or a pressure sensor, to obtain the environmental parameters in the test slot 101; it can also be connected to the shielding component 400 in the test slot 101 to control the operation of the shielding component 400.

[0039] In some embodiments, the connection port may be a USB interface, a USB Type-A interface, a USB Type-B interface, a USB Type-C interface, a USB Micro B interface, a USB mini B interface, a Micro USB, a lightning interface, etc.

[0040] In some embodiments, the lower incubator 100 can be connected to the upper incubator 200 through a UBS cable, a radio frequency cable, or a power adapter cable inserted into the connection port, etc., so that the lower incubator 100 and the upper incubator 200 are connected as a whole, facilitating data interaction between the lower incubator 100 and the upper incubator 200.

[0041] Reference Figure 2, in some embodiments, a shielding component 400 is also provided on the outer wall of the lower incubator 100, which is beneficial to improving the overall shielding effect of the test device and avoiding interference from other signals in the environment during the test.

[0042] In some embodiments, the heat insulation material in the upper incubator 200 may include foam boards, heat insulation cotton or thermal insulation cotton, etc. The foam board can be a board made of polyethylene particles through heating and foaming; the heat insulation cotton can be glass fiber or rock wool, etc.; the thermal insulation cotton can be mineral fiber, plant fiber or polyurethane, etc.

[0043] Reference Figures 2 to 5 , in some embodiments, a pressing plate 202 may be provided on the surface of the upper incubator 200 facing the lower incubator 100. The heating sheet 201 is located on the side of the pressing plate 202 away from the upper incubator 200. The orthographic projection of the pressing plate 202 on the top surface of the lower incubator 100 overlaps with the orthographic projection of the test groove 101. In this way, when the upper incubator 200 is aligned with and pressed against the lower incubator 100, the pressing plate 202 can be located in the test groove 101. In this way, the sealing performance of the closed space formed by the pressing plate 202 and the test groove 101 is better, and the test conditions will not fluctuate greatly during the test, which is beneficial to improving the accuracy of the test.

[0044] In some embodiments, sealing strips may be provided around the pressing plate. This can further improve the sealing effect of the pressing plate on the test groove, avoid fluctuations in the test environment caused by excessive differences in temperature, humidity or air pressure between the test process and the external environment, and improve the stability of the environment during the test.

[0045] In some examples, the material of the sealing strip can be rubber materials such as butyl rubber, neoprene, acrylate rubber, etc. The above rubber materials have the characteristics of good compressive resistance, strong acid and alkali resistance, and good high temperature resistance.

[0046] In some embodiments, an elastic member can be provided between the pressing plate and the upper incubator, and the elastic member can be a spring, etc.

[0047] It can be understood that when the pressing plate is pressed into the test groove, it may come into contact with the electronic device to be tested. If the thickness of the pressing plate is too large, or the height of the electronic device to be tested is relatively high, it is easy to cause the problem that the electronic device to be tested is damaged by the pressing plate. Setting an elastic component between the pressing plate and the upper incubator can be beneficial to buffering the force between the pressing plate and the electronic device to be tested. When the electronic device to be tested is placed in the test groove, even if the pressing plate is pressed down into the test groove and comes into contact with the electronic device to be tested, it will not cause the problem that the electronic device to be tested is damaged.

[0048] Combined with reference Figure 1 and Figure 3, in some embodiments, a heat conducting sheet 203 is disposed on the surface of the heating sheet 201 facing the lower incubator 100. The heat conducting sheet 203 can help improve the heat transfer efficiency between the heating sheet 201 and the electronic device to be tested, increase the heating rate of the electronic device to be tested, and is conducive to improving the test efficiency.

[0049] In some embodiments, the material of the heat conducting sheet 203 can be a copper plate, a graphite sheet, a silica gel sheet, etc.

[0050] Reference Figures 1 to 5 , in some embodiments, the test device for an electronic device may further include: a base 501, a slide rail 502, a slider 503, side plates 504, a cross beam 505, and a lifting mechanism 506. The lower incubator 100 is disposed on the base 501; the number of the slide rails 502 is 2, and the two slide rails 502 are both disposed on the base 501 and are respectively located on both sides of the lower incubator 100; the number of the sliders 503 is 2, and the two sliders 503 are respectively movably disposed on the two slide rails 502; the number of the side plates 504 is 2, and the bottoms of the two side plates 504 are respectively fixed to the two sliders 503. When the slider 503 reciprocates along the slide rail 502, it drives the side plate 504 to reciprocate; both ends of the cross beam 505 are respectively fixed to the tops of the two side plates 504; the lifting mechanism 506 is disposed on the cross beam 505, and the lifting mechanism 506 is fixed to the upper incubator 200. When the lifting mechanism 506 moves up and down relative to the cross beam 505, it drives the upper incubator 200 to move up and down.

[0051] In this way, the lifting mechanism 506 on the cross beam 505 can drive the upper incubator 200 to move up and down so that the upper incubator 200 is buckled or separated from the lower incubator 100; the slide rail 502 and the slider 503 on the base 501 can drive the support structure composed of the side plate 504 and the cross beam 505 to move horizontally, and then drive the upper incubator 200 to move horizontally, so that the upper incubator 200 is misaligned with the lower incubator 100, which is conducive to placing or taking out the electronic device to be tested in the lower incubator 100.

[0052] In some embodiments, the test device for an electronic device may further include a telescopic cylinder 507, and the telescopic cylinder 507 is used to drive the movement of the slider 503 on the slide rail 502, which is conducive to realizing the mechanized operation of the test device for an electronic device.

[0053] In some embodiments, the lifting mechanism 506 can be a lifting cylinder to realize the mechanized operation of the test device for an electronic device.

[0054] In some embodiments, the telescopic cylinder 507 and the lifting mechanism 506 can both be connected to a programmable logic controller (PLC). The PLC controller can store instructions for performing operations such as logical operations, sequential control, timing, counting, and arithmetic operations, and control the operation of the telescopic cylinder 507 and the lifting mechanism 506 through digital or analog inputs and outputs, thereby realizing the automated operation of the testing device.

[0055] Reference Figure 1 , in some embodiments, the outer wall of the lower incubator 100 can be provided with a first start button 510, a stop button 520, and a second start button 530. The first start button 510 is used to control the telescopic movement of the telescopic cylinder 507 to control the reciprocating movement of the slider 503 along the slide rail 502, and further drive the horizontal position movement of the upper incubator 200; the second start button 530 is used to control the telescopic movement of the lifting mechanism 506, and further drive the vertical position movement of the upper incubator 200; the stop button 520 is used to control the stop operation of the telescopic cylinder 507 and the lifting mechanism 506 to urgently stop the automated operation of the testing device in case of an emergency and avoid danger to the operator.

[0056] Reference Figures 1 to 5 , in some embodiments, the top of the upper incubator 200 is provided with guide posts 204, and the cross beam 505 is provided with guide holes 508. The guide posts 204 are disposed through the guide holes 508. Thus, when the lifting mechanism 506 drives the upper incubator 200 to move up and down, the guide posts 204 and the guide holes 508 can limit the moving direction of the upper incubator 200, so that the upper incubator 200 moves up and down in the vertical direction, avoiding the problems of shaking or tilting of the upper incubator 200.

[0057] Reference Figure 1 , in some embodiments, a buffer 509 can be provided at the end of the slide rail 502. It can be understood that the buffer 509 prevents the slider 503 from generating an impact force when moving to the end of the slide rail 502, and further avoids the problem of the upper incubator 200 shaking and falling due to the impact.

[0058] In Figure 1 only one end of the slide rail 502 is shown to be provided with a buffer 509. In some embodiments, buffers can be provided at both ends of the slide rail to avoid the shaking of the upper incubator caused by the impact force generated when the slider moves to both ends of the slide rail.

[0059] Reference Figure 3, in some embodiments, a position sensor 102 is provided on the outer wall of the lower insulation box 100 near the side plate. The position sensor 102 is used to detect the relative position between the side plate 504 and the lower insulation box 100. Through the position sensor 102, it can be obtained whether the upper insulation box 200 and the lower insulation box 100 are aligned in the vertical direction, thereby avoiding the situation that the test slot 101 is not sealed due to the misalignment of the upper insulation box 200 and the lower insulation box 100 when they are covered.

[0060] In the test device for electronic devices provided by the embodiments of the present application, the lower insulation box 100 has a test slot 101 for placing the electronic device to be tested. The upper insulation box 200 is located above the lower insulation box 100. After the upper insulation box 200 covers the test slot 101, a closed test space is formed, which is beneficial to adjusting the environmental conditions of the closed test space. Among them, the air inlet pipe 301 and the air outlet pipe 302 penetrate the side wall of the lower insulation box 100 and communicate with the test slot 101, and are used to transport air into the test slot 101 or discharge the air in the test slot 101. By means of the air inlet pipe 301 and the air outlet pipe 302, it is beneficial to adjust the gas environment in the test slot 101, such as the humidity, air pressure or temperature in the test slot 101. In this way, the performance parameters of the electronic device to be tested can be tested under high humidity, low humidity, high pressure, low pressure or low temperature environments. A heating element 201 is also provided on the surface of the upper insulation box 200 facing the lower insulation box 100. The heating element 201 can heat the electronic device to be tested to test the performance parameters of the electronic device to be tested under high temperature conditions. A shielding component 400 is also provided on the inner wall surface of the test slot 101. The shielding component 400 can reduce the interference encountered by the electronic device during the test and meet the requirements of product shielding test. The test device for electronic devices provided by the embodiments of the present application can test the electronic device under multiple environmental conditions, such as high temperature, low temperature, high pressure, low pressure, high humidity and low humidity tests. Using the same test device to test the electronic device under multiple environmental conditions is beneficial to improving the test efficiency. At the same time, a shielding component 400 is also provided in the test device to reduce the interference during the test and improve the test accuracy.

[0061] Those of ordinary skill in the art can understand that the above embodiments are specific embodiments for implementing the present application. In actual applications, various changes can be made to them in form and details without departing from the spirit and scope of the present application. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application should be subject to the scope defined by the claims.

Claims

1. A test device for an electronic device, characterized in that Comprising: A lower incubator, the top of the lower incubator having a test groove recessed inward from the top surface of the lower incubator for placing an electronic device to be tested; An intake pipe and an exhaust pipe, the intake pipe and the exhaust pipe penetrating through the side wall of the lower incubator and communicating with the test groove, the intake pipe for delivering gas into the test groove, and the exhaust pipe for delivering the gas in the test groove to the outside; An upper incubator located above the lower incubator, the surface of the upper incubator facing the lower incubator being provided with a heating sheet, and the orthographic projection of the heating sheet on the top surface of the lower incubator being located within the test groove; A shielding assembly located on the inner wall surface of the test groove.

2. The test device for an electronic device according to claim 1, characterized in that, The surface of the upper incubator facing the lower incubator is provided with a pressing plate, the heating sheet being located on the side of the pressing plate away from the upper incubator, and the orthographic projection of the pressing plate on the top surface of the lower incubator overlapping with the orthographic projection of the test groove.

3. The testing device for an electronic device according to claim 2, characterized in that, Sealing strips are provided around the pressing plate.

4. The test device for an electronic device according to claim 2, characterized in that, An elastic member is provided between the pressing plate and the upper incubator.

5. The test device for the electronic device according to claim 1, characterized in that, A heat conducting sheet is provided on the surface of the heating sheet facing the lower incubator.

6. The test device for the electronic device according to claim 1, wherein, At least one of a temperature sensor, a humidity sensor, or a pressure sensor is provided in the test groove.

7. The test device for an electronic device according to claim 1, wherein, Further comprising: A base, the lower incubator being disposed on the base; Two slide rails disposed on the base, and the two slide rails being respectively located on both sides of the lower incubator; Two sliders respectively movably disposed on the two slide rails; Two side plates, the bottoms of the two side plates being respectively fixed to the two sliders, and the sliders driving the side plates to reciprocate when reciprocating along the slide rails; A cross beam, the two ends of the cross beam being respectively fixed to the tops of the two side plates; A lifting mechanism disposed on the cross beam, the lifting mechanism being fixed to the upper incubator, and the upper incubator being driven to move up and down when the lifting mechanism moves up and down relative to the cross beam.

8. The test device for an electronic device according to claim 7, wherein, A guiding column is provided on the top of the upper incubator, and a guiding hole is provided on the cross beam, and the guiding column is disposed through the guiding hole.

9. The test apparatus for an electronic device according to claim 7, wherein A buffer is provided at the end of the slide rail.

10. The test device for an electronic device according to claim 7, characterized in that, A position sensor is provided on the outer wall of the lower incubator close to the side plate for detecting the relative position between the side plate and the lower incubator.

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