Semiconductor processing overload monitoring device

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor processing overload monitoring device. Comprising a circular speed control box, an annular liquid injection box and an annular liquid drainage box, the annular liquid injection box and the annular liquid drainage box are fixed and communicated to the two sides of the circular speed control box respectively, a liquid outlet communicated with the annular liquid injection box is formed in the circular speed control box, and a mounting rod located in the circular speed control box is fixedly mounted on an extension part of a stirring shaft; an arc-shaped speed control plate attached to the inner wall of the circular speed control box is fixedly mounted on the mounting rod, and the cross section area of the arc-shaped speed control plate is larger than that of the liquid outlet. Current monitoring is specifically converted in a mechanical kinetic energy mode, so that a current overload monitoring mode does not use a single sensor as a monitoring means, and can be used as the last defense line for monitoring the current overload problem; when a traditional current and voltage sensor goes wrong or a signal transmission line between the traditional current and voltage sensor and a control system is short-circuited, the problem of current overload can still be monitored.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor processing overload monitoring device. Background Art

[0002] In the process of semiconductor manufacturing, the stable operation of equipment is crucial for ensuring product quality. However, due to uncertain factors during the processing, such as current fluctuations, etc., it may lead to equipment overload, which in turn affects production efficiency and even causes equipment damage. There are many steps in semiconductor manufacturing. When cleaning wafers, a stirrer is required. If the stirrer has an overcurrent problem, if the instantaneous current is too large, the stirring blades of the stirrer are likely to damage the wafers. If the voltage is unstable and the current is too small, it is likely to cause poor wafer cleaning effect, and in more serious cases, it may cause damage to both the wafers and the equipment.

[0003] The existing method for monitoring the overcurrent problem is to install current sensors and voltage sensors in the equipment circuit and cooperate with the monitoring unit of the equipment control system for real-time monitoring. However, if the sensors themselves age during long-term use, or the signal transmission line between the sensors and the control system is short-circuited, or the sensor data cannot be processed due to power supply voltage problems, the overcurrent problem cannot be monitored in time. Summary of the Utility Model

[0004] The purpose of the utility model is to propose a semiconductor processing overload monitoring device aiming at the problems existing in the background art.

[0005] The technical solution of the utility model: A semiconductor processing overload monitoring device, the monitoring device is installed on a stirrer for wafer cleaning, and the stirring shaft of the stirrer is provided with a stirring shaft extension part located inside the monitoring device;

[0006] The monitoring device includes a circular speed control box, an annular liquid injection box and an annular liquid discharge box. The annular liquid injection box and the annular liquid discharge box are respectively fixed and communicated on both sides of the circular speed control box. The circular speed control box is provided with a liquid outlet communicated with the annular liquid injection box. The stirring shaft extension part is fixedly installed with an installation rod located inside the circular speed control box. The installation rod is fixedly installed with an arc-shaped speed control plate that fits the inner wall of the circular speed control box. The cross-sectional area of the arc-shaped speed control plate is larger than the cross-sectional area of the liquid outlet;

[0007] The bottom of the annular liquid discharge box is fixedly and communicated with an annular circulation box. The annular circulation box is fixedly and communicated with an annular monitoring box. A liquid level sensor is installed on the top of the annular monitoring box. The liquid level sensor is provided with a threshold value. When the liquid level sensor detects that the liquid reaches the set liquid level at the set time point, it means that no overcurrent occurs. When the liquid level sensor does not detect that the liquid reaches the set liquid level or reaches the liquid level in advance at the set time point, it means that an overcurrent occurs.

[0008] Preferably, a flow dividing device is installed in the annular liquid drainage tank. The flow dividing device includes a conical flow dividing frame communicated with the circular speed control box, and further includes a flow dividing pipe fixedly connected and communicated with the conical flow dividing frame. The end of the flow dividing pipe is communicated with the annular flow box. A flow sensor is arranged at the flow dividing pipe, and the flow sensor is provided with a threshold value.

[0009] Preferably, both the liquid level sensor and the flow sensor are connected to an external circuit. A check valve is arranged at the liquid outlet end of the flow dividing pipe, and a partition plate is arranged in the conical flow dividing frame.

[0010] Preferably, an annular stabilizing plate is fixed in the middle of the circular speed control box. The annular stabilizing plate is provided with an annular groove. The mounting rod penetrates through the annular groove, and an observation cover located outside the circular speed control box is installed at the top of the extending part of the stirring shaft.

[0011] Compared with the prior art, the beneficial effect of the present utility model is that: in this solution, the current monitoring is specifically converted in the form of mechanical kinetic energy, so that the monitoring method of current overload no longer uses a single sensor as the monitoring means. It can be used as the last line of defense for monitoring current overload problems. When problems occur in traditional current and voltage sensors or the signal transmission line between them and the control system is short-circuited, it can still monitor the current overload problem. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic structural diagram of the present utility model;

[0013] Figure 2 is a schematic cross-sectional structural diagram of the present utility model;

[0014] Figure 3 is a schematic structural diagram of the circular speed control box of the present utility model;

[0015] Figure 4 is a schematic structural diagram of the flow dividing device of the present utility model.

[0016] Reference numerals: 1, circular speed control box; 2, annular liquid injection box; 3, annular liquid drainage tank; 4, annular flow box; 5, annular monitoring box; 6, liquid outlet; 7, extending part of stirring shaft; 8, mounting rod; 9, arc speed control plate; 10, conical flow dividing frame; 11, liquid level sensor; 12, flow sensor; 13, flow dividing pipe; 14, partition plate; 15, observation cover; 16, annular stabilizing plate; 17, annular groove; 18, check valve. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0018] Referring to the attached Figures 1-4 , a semiconductor processing overload monitoring device, the monitoring device is installed on a stirrer for wafer cleaning, and a stirrer shaft extension 7 located inside the monitoring device is provided on the stirrer shaft;

[0019] The monitoring device includes a circular speed control box 1, an annular liquid injection box 2 and an annular liquid discharge box 3. The annular liquid injection box 2 and the annular liquid discharge box 3 are respectively fixed and communicated on both sides of the circular speed control box 1. The circular speed control box 1 is provided with a liquid outlet 6 communicated with the annular liquid injection box 2. An installation rod 8 located inside the circular speed control box 1 is fixedly installed on the stirrer shaft extension 7. An arc-shaped speed control plate 9 that fits against the inner wall of the circular speed control box 1 is fixedly installed on the installation rod 8. The cross-sectional area of the arc-shaped speed control plate 9 is larger than the cross-sectional area of the liquid outlet 6;

[0020] The bottom of the annular liquid discharge box 3 is fixedly and communicated with an annular circulation box 4. An annular monitoring box 5 is fixedly and communicated with the annular circulation box 4. A liquid level sensor 11 is installed on the top of the annular monitoring box 5. The liquid level sensor 11 is provided with a threshold value. When the liquid level sensor 11 detects that the liquid reaches the set liquid level at the set time point, it means that no current overload has occurred. When the liquid level sensor 11 does not detect that the liquid reaches the set liquid level or reaches the liquid level in advance at the set time point, it means that a current overload has occurred.

[0021] When the stirrer is operating, its stirrer shaft will rotate, so that the stirrer shaft extension 7 drives the installation rod 8 to rotate. The rotation of the installation rod 8 will drive the arc-shaped speed control plate 9 to move rapidly along the inner wall of the circular speed control box 1, so that the arc-shaped speed control plate 9 can intermittently block the liquid outlet 6.

[0022] During specific operation, a certain amount of liquid is input into the annular liquid injection box 2 through the liquid injection port provided in the annular liquid injection box 2. The liquid will flow into the circular speed control box 1 through the liquid outlet 6. The intermittent blockage of the liquid outlet 6 by the arc-shaped speed control plate 9 can control the liquid output volume of the liquid outlet 6 per unit time. The liquid output from the liquid outlet 6 will flow into the annular circulation box 4 through the annular liquid discharge box 3 and finally enter the annular monitoring box 5 to be detected by the liquid level sensor 11. When the stirrer is cleaning the wafer, if there is no current overload problem, the rotation speed of its stirrer shaft is stable. Then, the moving speed of the arc-shaped speed control plate 9 driven by the installation rod 8 is stable, so the liquid output volume of the liquid outlet 6 is also stable. Thus, at the set time point, the liquid flows into the annular monitoring box 5 and reaches the specified liquid level and is detected by the liquid level sensor 11, indicating that the current is not overloaded. When the current is overloaded, the voltage and current of the stirrer are unstable, which will affect the rotation speed of the stirrer shaft, thus affecting the moving speed of the arc-shaped speed control plate 9 driven by the stirrer shaft extension 7, so that the liquid output volume controlled by the arc-shaped speed control plate 9 at the liquid outlet 6 is changed. Then, the liquid level sensor 11 will not detect the corresponding liquid level at the set time point, indicating that the current is overloaded.

[0023] By setting it in this way, the current overload monitoring method no longer uses a single sensor as the monitoring means. By specifically converting the current detection in a mechanical kinetic energy manner, it can serve as the last line of defense for monitoring current overload problems. When problems occur with traditional current and voltage sensors or when the signal transmission line between them and the control system is short-circuited, it can still monitor current overload problems.

[0024] It should be noted that in this embodiment, a flow splitting device is installed in the annular liquid drainage tank 3. The flow splitting device includes a conical flow splitting frame 10 communicating with the circular speed control tank 1, and also includes a flow splitting pipe 13 fixedly connected and communicating with the conical flow splitting frame 10. The end of the flow splitting pipe 13 communicates with the annular flow box 4. A flow sensor 12 is provided at the flow splitting pipe 13, and the flow sensor 12 has a threshold value.

[0025] After the liquid enters the circular speed control tank 1, it will flow into the conical flow splitting frame 10. The liquid in the conical flow splitting frame 10 will enter the flow splitting pipe 13, and the flow splitting pipe 13 will discharge the liquid. Whether a current overload problem occurs is judged by detecting the flow rate of the liquid per unit time. When the liquid discharge amount at the liquid outlet 6 is stable, the amount of liquid entering the conical flow splitting frame 10 is stable, so the flow rate of the liquid discharged through the flow splitting pipe 13 is also stable. The flow rate detected by the flow sensor 12 per unit time conforms to the threshold value within the set time. When a current overload occurs, the amount of liquid discharged from the circular speed control tank 1 into the conical flow splitting frame 10 per unit time may decrease. Then, the liquid flow rate in the flow splitting pipe 13 will decrease due to the decrease in the amount of liquid in the conical flow splitting frame 10, so that the flow rate detected by the flow sensor 12 per unit time does not conform to the threshold value within the set time, and a current overload problem occurs.

[0026] And it should be noted that it can be used as a reference monitoring means.

[0027] It should also be noted that both the liquid level sensor 11 and the flow sensor 12 are connected to an external circuit. A check valve 18 is provided at the liquid discharge end of the flow splitting pipe 13, and a partition 14 is provided in the conical flow splitting frame 10. The liquid level sensor 11 and the flow sensor 12 are not in the same circuit as the stirrer, which ensures that when the stirrer circuit is overloaded, the liquid level sensor 11 and the flow sensor 12 will not be affected.

[0028] In addition, an annular stabilizing plate 16 is fixed in the middle of the circular speed control tank 1. The annular stabilizing plate 16 is provided with an annular groove 17. The mounting rod 8 passes through the annular groove 17, and an observation cover 15 located outside the circular speed control tank 1 is installed at the top of the extension part 7 of the stirring shaft.

[0029] In this way, when the stirring shaft extension part 7 rotates, it can be externally detected whether the stirring shaft extension part 7 is operating through the observation cover 15. Moreover, when the stirring shaft extension part 7 rotates, it drives the mounting rod 8 to rotate, and the mounting rod 8 will rotate within the annular groove 17, ensuring the stable rotation of the mounting rod 8.

[0030] The above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes, should be covered within the protection scope of the present invention.

Claims

1. A semiconductor processing overload monitoring device, characterized in that, The monitoring device is installed on the stirrer for wafer cleaning, and the stirring shaft of the stirrer is provided with a stirring shaft extension part (7) located inside the monitoring device; The monitoring device includes a circular speed control box (1), an annular liquid injection box (2) and an annular liquid discharge box (3). The annular liquid injection box (2) and the annular liquid discharge box (3) are respectively fixed and communicated on both sides of the circular speed control box (1). The circular speed control box (1) is provided with a liquid outlet (6) communicated with the annular liquid injection box (2). An installation rod (8) located inside the circular speed control box (1) is fixedly installed on the stirring shaft extension part (7). An arc-shaped speed control plate (9) that fits against the inner wall of the circular speed control box (1) is fixedly installed on the installation rod (8). The cross-sectional area of the arc-shaped speed control plate (9) is larger than the cross-sectional area of the liquid outlet (6); The bottom of the annular liquid discharge box (3) is fixedly and communicated with an annular flow box (4). An annular monitoring box (5) is fixedly and communicated on the annular flow box (4). A liquid level sensor (11) is installed on the top of the annular monitoring box (5). The liquid level sensor (11) is provided with a threshold value. When the liquid level sensor (11) detects that the liquid reaches the set liquid level at the set time point, it means that no current overload has occurred. When the liquid level sensor (11) does not detect that the liquid reaches the set liquid level or reaches the liquid level in advance at the set time point, it means that a current overload has occurred.

2. The semiconductor processing overload monitoring device according to claim 1, characterized in that, A flow dividing device is installed in the annular liquid discharge box (3). The flow dividing device includes a conical flow dividing frame (10) communicated with the circular speed control box (1), and also includes a flow dividing pipe (13) fixedly and communicated with the conical flow dividing frame (10). The end of the flow dividing pipe (13) is communicated with the annular flow box (4). A flow sensor (12) is provided at the flow dividing pipe (13). The flow sensor (12) is provided with a threshold value.

3. The semiconductor processing overload monitoring device according to claim 2, characterized in that, Both the liquid level sensor (11) and the flow sensor (12) are connected to an external circuit. A check valve (18) is provided at the liquid outlet end of the flow dividing pipe (13). A partition plate (14) is provided inside the conical flow dividing frame (10).

4. A semiconductor processing overload monitoring device according to claim 1, characterized in that, An annular stabilizing plate (16) is fixed in the middle of the circular speed control box (1). The annular stabilizing plate (16) is provided with an annular groove (17). The installation rod (8) passes through the annular groove (17). An observation cover (15) located outside the circular speed control box (1) is installed on the top of the stirring shaft extension part (7).

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