Intelligent card structure

Abstract

The utility model discloses an intelligent card structure which comprises surface layers and an interlayer, the surface layers are fixed on the upper surface and the lower surface of the interlayer, a coil and a chip are arranged in the interlayer, one side of the chip is fixedly connected with a fixing block, the interlayer is further provided with a cavity used for providing a moving space for the chip, and the fixing block is fixedly connected with the fixing block. According to the utility model, the coil and the chip are placed in the interlayer, and one side of the chip is fixedly connected with the fixing block, so that the chip can be stably fixed at a specific position, stable support is provided, and the position of the chip in the intelligent card is ensured to be stable; the arrangement of the cavity allows the chip to have a certain movement space when the intelligent card is subjected to external force, so that the risk of damage is reduced, and the damage caused by excessive extrusion or bending is avoided; according to the design, the intelligent card can keep the integrity of internal components when being bent or subjected to slight external force, and the durability of the intelligent card is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of smart card structures, and specifically relates to a smart card structure. Background Art

[0002] With the continuous development of technology, as a medium for information storage and transmission, smart cards have been widely used in various fields. It is usually used in various scenarios such as identity recognition, payment transactions, data storage, etc., greatly improving the convenience and security of information processing. However, in the process of using traditional smart cards, due to the limitations of their structural characteristics and material properties, there are often problems of being easily bent and damaged.

[0003] The bending damage of smart cards is usually due to the relatively fragile connection parts between the internal circuit or storage chip and the card body. When the card is subjected to external forces, these connection parts are prone to breakage or failure, resulting in the loss of card functions. In addition, the bending of smart cards may also cause damage to the card body, further affecting the appearance and service life of the card. Summary of the Invention

[0004] In order to overcome the deficiencies of the prior art solutions, the utility model provides a smart card structure, which can effectively solve the problems raised in the background art.

[0005] The technical solution adopted by the utility model to solve its technical problems is: a smart card structure, including a surface layer and an interlayer, the surface layer is fixed on the upper and lower surfaces of the interlayer, a coil and a chip are arranged in the interlayer, a fixing block is fixedly connected to one side of the chip, the interlayer is also provided with a cavity for providing a moving space for the chip, and the cavity is arranged on one side of the fixing block to surround the chip.

[0006] Preferably, a protection sheet is arranged on the inner side of the cavity, and the protection sheet is arranged on the side that touches the cavity wall when the smart card is bent.

[0007] Preferably, the interlayer is provided with a hard layer, and the hard layer is arranged on the upper and lower surfaces of the interlayer.

[0008] Preferably, a filling layer is arranged between the hard layer and the cavity, and the filling layer is a flexible content filling structure.

[0009] Preferably, the chip is provided with a packaging layer, and the packaging layer wraps the chip.

[0010] Preferably, the chip is provided with a wire, one end of the wire is connected to the chip, and the other end is connected to the coil, and the chip is electrically connected to the coil through the wire.

[0011] Preferably, a spring piece is arranged between the surface layer and the interlayer, and a groove with the same shape and size as the spring piece is arranged on the inner side of the surface layer.

[0012] Preferably, the elastic sheet comprises at least one of a polypropylene elastic sheet, a polycarbonate elastic sheet, and a polyurethane elastic sheet.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows: In the present utility model, the coil and the chip are placed in the interlayer. The fixing block fixedly connected to one side of the chip enables the chip to be stably fixed at a specific position, providing stable support and ensuring the stable position of the chip inside the smart card. The setting of the cavity allows the chip to have a certain space for movement when the smart card is subjected to external forces, thereby reducing the risk of damage and avoiding damage caused by excessive extrusion or bending. This design enables the smart card to maintain the integrity of its internal components when bent or subjected to slight external forces, improving its durability. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic structural diagram of the present utility model;

[0015] Figure 2 is an exploded view of the structure of the present utility model;

[0016] Figure 3 is a schematic structural diagram of the bent state of the present utility model.

[0017] Reference numerals in the figures:

[0018] 1 - interlayer, 2 - surface layer, 3 - elastic sheet, 11 - chip, 12 - cavity, 13 - wire, 14 - coil, 15 - fixing block, 16 - protection sheet, 17 - encapsulation layer, 18 - filling layer, 19 - hard layer, 22 - groove. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The following describes the embodiments of the present disclosure in detail with reference to the accompanying drawings.

[0020] The following illustrates the embodiments of the present disclosure through specific examples. Those skilled in the art can easily understand other advantages and effects of the present disclosure from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of them. The present disclosure can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present disclosure without creative efforts fall within the scope of protection of the present disclosure. Embodiment

[0021] As Figures 1-3As shown, the present utility model provides a smart card structure, including a surface layer 2 and an interlayer 1. The surface layer 2 is fixed on the upper and lower surfaces of the interlayer 1. A coil 14 and a chip 11 are provided inside the interlayer 1. A fixing block 15 is fixedly connected to one side of the chip 11. The interlayer 1 is further provided with a cavity 12 for providing a moving space for the chip 11. The cavity 12 is arranged on one side of the fixing block 15 to surround the chip 11.

[0022] The coil 14 and the chip 11 are placed inside the interlayer 1. The fixing block 15 fixedly connected to one side of the chip 11 enables the chip 11 to be stably fixed at a specific position, providing stable support and ensuring the stable position of the chip 11 inside the smart card. The setting of the cavity 12 allows the chip 11 to have a certain moving space when the smart card is subjected to external forces, thus reducing the risk of damage and avoiding damage caused by excessive squeezing or bending. This design enables the smart card to maintain the integrity of its internal components when bent or subjected to slight external forces, improving its durability.

[0023] See Figure 1 , a protective sheet 16 is provided on the inner side of the cavity 12. The protective sheet 16 is arranged on the side that touches the wall of the cavity 12 when the smart card is bent.

[0024] The protective sheet 16 provides a soft buffer layer, which can provide certain support and buffering effects when the smart card is subjected to external forces. This helps to maintain the stability of the smart card structure, prevent deformation or damage during bending or twisting, reduce the possibility of such direct contact, and thus protect the integrity and functionality of the chip 11 and its surrounding components.

[0025] See Figure 1 , the interlayer 1 is provided with a hard layer 19. The hard layer 19 is arranged on the upper and lower surfaces of the interlayer 1.

[0026] The hard layer 19 enhances the overall structural strength of the smart card. Due to the high hardness and strength of the hard layer 19, they can effectively resist external pressure and impact, preventing the smart card from deforming or being damaged during use.

[0027] See Figure 1 , a filling layer 18 is provided between the hard layer 19 and the cavity 12. The filling layer 18 is a flexible content filling structure.

[0028] The filling layer 18, as a flexible content filling structure, has excellent buffering performance; when the smart card is subjected to external impact or pressure, the filling layer 18 can absorb and disperse these forces, reducing the direct collision and friction between the hard layer 19 and the cavity 12; the presence of the filling layer 18 makes the structure of the cavity 12 more stable; it fills the space between the hard layer 19 and the cavity 12, preventing the cavity 12 from deforming or collapsing when the smart card is bent or twisted, helping to keep the chip 11 fixed in the cavity 12 and preventing it from moving or shaking under the action of external forces, thus ensuring the normal operation of the smart card.

[0029] See Figure 1 , the chip 11 is provided with a packaging layer 17, and the packaging layer 17 wraps the chip 11.

[0030] The packaging layer 17 tightly wraps the chip 11, providing a strong outer shell for the chip 11, which effectively prevents the chip 11 from being damaged by external physical damage, such as scratching, impact, etc., ensuring the integrity and security of the chip 11 during the use of the smart card. The packaging layer 17 can shield external electromagnetic interference, ensuring that the internal circuits and data of the chip 11 are not affected.

[0031] See Figure 1 , the chip 11 is provided with a wire 13, one end of the wire 13 is connected to the chip 11, and the other end is connected to the coil 14, and the chip 11 is electrically connected to the coil 14 through the wire 13.

[0032] The coil 14 receives the signal sent by the card reader and transmits these signals to the chip 11 through the wire 13 for processing.

[0033] See Figure 1 , a shrapnel 3 is provided between the surface layer 2 and the interlayer 1, and a groove 22 with the same shape and size as the shrapnel 3 is provided on the inner side of the surface layer 2.

[0034] The design of the shrapnel 3 makes the connection between the surface layer 2 and the interlayer 1 tighter and more stable; the shrapnel 3 can fill the tiny gap between the surface layer 2 and the interlayer 1, reducing the structural looseness caused by manufacturing errors or material expansion / contraction and other factors. This tight connection helps to enhance the overall structural stability of the smart card, preventing it from deforming or being damaged when subjected to external forces. The shrapnel 3 has certain elasticity and buffering performance. When the smart card is subjected to external impact or pressure, the shrapnel 3 can absorb and disperse these forces, reducing the direct impact on the internal components; this helps to protect the key components such as the chip 11 and the coil 14 inside the smart card from being damaged by external forces. By reasonably designing the shape and size of the shrapnel 3, it can be ensured that it fits tightly with the groove 22 on the inner side of the surface layer 2. This fit can improve the connection strength between the surface layer 2 and the interlayer 1.

[0035] See Figure 1, the elastic piece 3 includes at least one of a polypropylene elastic piece, a polycarbonate elastic piece, and a polyurethane elastic piece.

[0036] Polypropylene has excellent physical and chemical properties, such as a small relative density, excellent mechanical properties, high heat resistance, and stable chemical properties. Its excellent impact resistance can effectively reduce the damage to the internal components of the smart card caused by external impacts; the polypropylene elastic piece can provide stable support and buffering in the smart card structure, ensuring the structural stability of the smart card in various environments.

[0037] Polycarbonate has extremely high strength, which ensures that the elastic piece can effectively withstand external pressure. Polycarbonate also has excellent impact resistance and heat resistance, and can maintain stable performance in various harsh environments.

[0038] The polyurethane elastic piece has high elasticity and wear resistance, and can provide better buffering effects and a longer service life.

[0039] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "middle", "length", "upper", "lower", "front", "rear", "vertical", "horizontal", "inner", "outer", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0040] In the present invention, unless otherwise clearly specified and limited, the first feature being "on" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. The meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically limited.

[0041] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or communicable with each other; it may be directly connected, or indirectly connected through an intermediate medium, and may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] The above is only to illustrate the implementation manners of the present utility model and is not intended to limit the present utility model. For those skilled in the art, any modifications, equivalent replacements, improvements, etc. made without creative efforts within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An intelligent card structure, comprising a surface layer and an interlayer, wherein the surface layer is fixed on the upper and lower surfaces of the interlayer, and a coil and a chip are provided in the interlayer, characterized in that, One side of the chip is fixedly connected with a fixing block. The interlayer is also provided with a cavity for providing an activity space for the chip, and the cavity is arranged on one side of the fixing block to surround the chip.

2. The smart card structure according to claim 1, wherein: A protection sheet is arranged on the inner side of the cavity, and the protection sheet is arranged on the side where the cavity wall is touched when the smart card is bent.

3. An intelligent card structure according to claim 1, characterized in that: The interlayer is provided with a hard layer, and the hard layer is arranged on the upper and lower surfaces of the interlayer.

4. An intelligent card structure according to claim 3, wherein: A filling layer is arranged between the hard layer and the cavity, and the filling layer is a flexible content filling structure.

5. An intelligent card structure according to claim 1, characterized in that: The chip is provided with a packaging layer, and the packaging layer wraps the chip.

6. The smart card structure according to claim 1, wherein: The chip is provided with a wire, one end of the wire is connected to the chip, and the other end is connected to a coil. The chip is electrically connected to the coil through the wire.

7. An intelligent card structure according to claim 1, characterized in that: A shrapnel is arranged between the surface layer and the interlayer, and a groove with the same shape and size as the shrapnel is arranged on the inner side of the surface layer.

8. The smart card structure according to claim 7, wherein: The shrapnel at least includes one of a polypropylene shrapnel, a polycarbonate shrapnel and a polyurethane shrapnel.

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