Combined waistcoat structure memory bank
Through the design of a combined vest structure and thermal grease sheet, the problem of degumming of memory vests at high temperatures is solved, and the stability of the structure and heat dissipation effect is improved. The combination and disassembly are convenient and firm, protecting memory particles.
Patent Information
- Application Number
- CN202422472436.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-14
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-10-14
AI Technical Summary
The existing memory stick vest structure is prone to colloid degumming at high temperatures, resulting in the front and rear vest boards falling off, poor structural stability and complex assembly.
The combined vest structure is adopted, and the combination of vest combination end cover, combined slot, combined vest side plate, sliding slot, positioning slot and U-shaped card strip are used to dissipate heat by using thermal grease sheet and thermal conduction holes to avoid colloid bonding and achieve firm fixation.
It improves the stability and heat dissipation effect of the memory stick vest structure, avoids the problem of high-temperature degumming, and is simple and firm in combination to protect memory particles.
Smart Images

Figure CN223140381U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of memory module accessories, and particularly relates to a memory module with a combined heat sink structure. Background Art
[0002] The memory module is one of the essential hardware components of a computer. With the development of computers, the performance of machines has been continuously improved, and the power consumption has also been increasing. The drawback of improving performance is a significant increase in heat generation. Therefore, heat sink vests for memory modules have emerged. The memory module heat sink vest mainly has three functions: First, it optimizes heat dissipation. By using a metal with better thermal conductivity to increase the heat dissipation area, it assists the memory module in dissipating heat and ensures the performance of the memory module. Second, it protects the memory module particles. When the memory encounters accidental bumps, the memory module heat sink vest can withstand the impact from the outside and prevent damage to the internal PCB and storage particles of the memory module. The existing memory module heat sink vests can clamp the memory module by relying on the front aluminum sheet, thermal paste, and rear aluminum sheet to achieve heat dissipation and protection. However, in this patent, the front aluminum plate, light bar fixing seat, and rear aluminum plate of the memory module heat sink vest are connected by screws, the structure is relatively complex, and after long-term use, the screws are prone to rust, resulting in poor structural stability and weak anti-drop performance.
[0003] For this reason, a memory module heat sink vest with the publication number of "CN220627409U" belongs to the field of memory module accessories. It includes a front heat sink plate and a rear heat sink plate. A buckling step is arranged on the inner side surface of the front heat sink plate, and a buckling groove is arranged on the inner side surface of the rear heat sink plate. The buckling step is buckled in the buckling groove. The advantage of the utility model is that compared with the prior art: the connection between the front heat sink plate and the rear heat sink plate of this memory module heat sink vest is realized through a structure of mutual buckling of upper and lower hooks, the assembly is simple, the connection area between the front heat sink plate and the rear heat sink plate can be increased, the structural stability is improved, it is not easy to come off, and it has excellent anti-drop effect, and can better protect the chip particles. A groove is also arranged on the memory module heat sink vest, which can increase the heat dissipation area and improve the heat dissipation effect.
[0004] However, for the above-mentioned anti-drop memory module heat sink vest, although the front heat sink plate and the rear heat sink plate are buckled through a structure of mutual buckling of upper and lower hooks and then fixed by bonding with a colloid, the assembly is simple, the connection area between the front heat sink plate and the rear heat sink plate can be increased, the structural stability is improved, and the front and rear heat sink plates are not easy to come off, and it has excellent anti-drop effect. There are still the following obvious defects during use: after the front and rear heat sink plates are clamped by the upper and lower hook groups and then bonded to the memory module with a prosthesis, during the operation of the memory module, due to the high temperature, it is easy to cause the problem of high-temperature degumming between the colloid and the front and rear heat sink plates, resulting in the detachment of the front and rear heat sink plates. Summary of the Utility Model
[0005] The purpose of the present utility model is to provide a combined vest structure memory module to solve the problems raised in the above-mentioned background technology.
[0006] To achieve the above object, the present utility model provides the following technical solution: A combined vest structure memory module, comprising:
[0007] A memory module, a vest combination end cover for protecting the upper end of the memory module is inserted and combined at the upper end of the memory module. The two sides of the vest combination end cover are combined and clamped through a combination card slot with a combined vest side plate for protecting the two side surfaces of the memory module. A sliding card slot for combining and clamping the combined vest side plate is provided on the outer surface of the combined vest side plate. Positioning slots for docking and combining with the sliding card slot are provided at both ends of the vest combination end cover. A U-shaped card strip for buckling and clamping the combination of the combined vest side plate and the vest combination end cover is slid into and clamped through the docking combination of the positioning slot and the sliding card slot. Memory particle protection fixing slots are provided on the inner side surface of the combined vest side plate corresponding to the positions of the memory particles on both side surfaces of the memory module.
[0008] Preferably, clamping fixed blocks are provided on both sides of one end inside the U-shaped card strip, and the U-shaped card strip is slid into from both ends of the sliding card slot to clamp and fix the combination of the vest combination end cover and the combined vest side plate, realizing the combination of the vest combination end cover, the combined vest side plate and the memory module and clamping and fixing them by using the U-shaped card strip to be inserted into the sliding card slot.
[0009] Preferably, a clamping slot is provided at the corresponding position where the U-shaped card strip is inserted into the sliding card slot, and the clamping fixed block on the U-shaped card strip is positioned and inserted into the clamping slot. An auxiliary slot for pulling the clamping fixed block outwards for disassembly is provided at the corresponding upper end of the clamping slot, which is beneficial to removing the U-shaped card strip from the sliding card slot and disassembling the combination of the two memory module vests.
[0010] Preferably, a thermal conductive silicone grease sheet is provided on the inner wall of the memory particle protection fixing slot on the inner side of the combined vest side plate, and heat dissipation holes are uniformly penetrated through the other side of the thermal conductive silicone grease sheet at corresponding positions. A strip-shaped combination insertion block clamped on both sides of the vest combination end cover is provided on the side surface of the combined vest side plate, realizing the positioning and heat dissipation effects of the memory module particles.
[0011] Preferably, a protection groove is provided on the lower end surface of the vest combination end cover, and a reticulated protective foam pad is provided at the top end inside the protection groove. The top end of the memory module is combined and inserted into the protection groove and abuts against the protective foam pad, so that the vest structure can well protect the memory module.
[0012] Preferably, two buckle slots for buckling and clamping by using a buckle when the memory module is inserted into a memory slot on the main board are provided on both sides of the memory module, realizing inserting the memory module into the computer main board and fixing it by using the buckle on the upper memory slot to be snapped into the buckle slot.
[0013] Compared with the prior art, the technical effects and advantages of the utility model are as follows: the combined vest structure memory stick, through the combined use of the memory stick storage vest combined end cover, combined card slot, combined vest side panel, sliding card slot, positioning slot, U-shaped card strip, card connection positioning block and auxiliary slot, the vest combined end cover is fixedly carded to the end of the memory stick by using the protective slot, and the combined vest side panel is inserted into the combined card slot by using the strip-shaped combined plug-in block to be fixed on both sides of the vest combined end cover, so that the sliding card slot and the positioning slot are butted together, so as to realize the combined installation and fixation of the vest structure, and at the same time, the U-shaped card strip is slid into the vest combined end cover and the combined vest side panel from both ends of the sliding card slot to clamp and fix them, and then the card connection blocks on the two side walls inside the U-shaped card strip are carded in the clamping slot, so as to realize the installation and fixation of the vest structure, and then the problem of degumming and falling of the colloid-bonded vest structure due to the high temperature of the memory stick will not occur, and the vest structure combination is simple and convenient to assemble and disassemble, and it is more firm.
[0014] By combining the vest side panels with the memory particle protection groove, the thermal grease sheet, and the thermal outlet holes, after the combined vest side panels are assembled and fixed on both sides of the memory stick, the memory particles on the memory stick are placed in the memory particle protection groove, and the surface of the memory particles is pressed against the thermal grease sheet, so that after the vest structure is assembled on the memory stick, the memory particles are protected, and there is no need to fix them on the memory particles through colloid bonding. As a result, after the vest structure is assembled and installed, the memory stick can use the thermal grease sheet to dissipate the generated heat from the thermal outlet holes, thereby further improving the effective heat dissipation and protection of the memory stick with the vest structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the structure of the utility model;
[0016] Figure 2 This is a schematic diagram of the structure of the memory stick of the utility model in the first combination state;
[0017] Figure 3 This is a schematic diagram of the structure of the memory stick of the utility model in the second combination state;
[0018] Figure 4 This is a schematic diagram of the top view structure of the utility model;
[0019] Figure 5 The figure is a top view structural diagram of the U-shaped clip of the utility model.
[0020] In the figure: 1, memory module; 2, combined end cover of the heat sink; 3, combined card slot; 4, combined side plate of the heat sink; 5, sliding card slot; 6, positioning slot; 7, U-shaped card strip; 8, fixed slot for protecting memory chips; 9, fixed clamping block; 10, auxiliary slot; 11, thermal grease sheet; 12, thermal outlet hole; 13, protective slot; 14, protective foam pad; 15, buckle slot; 16, clamping slot; 17, strip-shaped combined insertion block. Detailed implementation
[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0022] Please refer to Figures 1-5 , the present invention provides a technical solution: a combined heat sink structure memory module, including:
[0023] Memory module 1, a combined end cover of the heat sink 2 for protecting the upper end of the memory module 1 is inserted and combined at the upper end of the memory module 1. The combined end cover of the heat sink 2 is fixedly installed at the top of the memory module 1 by using the protective slot 13. On both sides of the combined end cover of the heat sink 2, a combined side plate of the heat sink 4 for protecting both sides of the memory module 1 is combined and clamped through the combined card slot 3. The combined side plate of the heat sink 4 can be combined and fixed on both sides of the memory module 1 by inserting the strip-shaped combined insertion block 17 into the combined card slot 3. By disassembling and assembling the combination between the heat sink structure and the memory module 1, a sliding card slot 5 for combining and clamping and fixing the combined side plate of the heat sink 4 is provided on the outer surface of the combined side plate of the heat sink 4, so that the U-shaped card strip 7 is snapped into the sliding card slots 5 on both sides of the combined side plate of the heat sink 4 on both sides of the combined end cover of the heat sink 2. Both ends of the combined end cover of the heat sink 2 are provided with positioning slots 6 that are docked and combined with the sliding card slots 5, so that after the U-shaped card strip 7 is snapped into the sliding card slot 5, one end of it is combined and clamped in the positioning slot 6. The positioning slot 6 is slidably snapped into the sliding card slot 5 with a U-shaped card strip 7 for buckling and clamping the combination of the combined side plate of the heat sink 4 and the combined end cover of the heat sink 2, realizing the clamping and fixing after the heat sink structure is combined on the memory module 1. Memory chip protection fixing slots 8 are provided on the inner side surfaces of the combined side plates of the heat sink 4 corresponding to the positions of the memory chips on both sides of the memory module 1, realizing the effects of positioning protection and heat conduction discharge of the memory chips.
[0024] On both sides of one end inside the U-shaped clamping strip 7, there are clamping fixed blocks 9. After the U-shaped clamping strip 7 slides into the sliding clamping groove 5, the clamping fixed blocks 9 are inserted into the clamping slots 16 to clamp the vest structure onto the memory module 1. And the U-shaped clamping strip 7 slides into the sliding clamping groove 5 from both ends to clamp and fix the combined ends of the vest combination end cap 2 and the combined vest side plate 4. At the corresponding position where the U-shaped clamping strip 7 is inserted into the sliding clamping groove 5, there are clamping slots 16, so that the clamping fixed blocks 9 are inserted into the clamping slots 16 to clamp and combine the combined vest side plate 4. And the clamping fixed blocks 9 on the U-shaped clamping strip 7 are positioned and inserted into the clamping slots 16. An auxiliary slot 10 is opened at the upper end corresponding to the clamping slot 16, which is beneficial for pulling the clamping fixed block 9 outwards for disassembly. During the disassembly process, the clamping fixed block 9 can be pulled out by using auxiliary tools, and then the U-shaped clamping strip 7 can be removed from the sliding clamping groove 5.
[0025] On the inner wall of the memory particle protection fixed groove 8 on the inner side of the combined vest side plate 4, there is a thermal conductive silicone grease sheet 11, which is used for the heat conduction and dissipation of the memory particles. And on the other side of the thermal conductive silicone grease sheet 11, there are uniformly penetrated thermal conductive holes 12 corresponding to the position, through which the generated heat can be discharged to the outside. On the side of the combined vest side plate 4, there are strip-shaped combined insertion blocks 17 clamped on both sides of the vest combination end cap 2, to realize the combined fixation of the combined vest side plate 4 on both sides of the memory module 1. On the lower end face of the vest combination end cap 2, there is a protection groove 13. At the top end inside the protection groove 13, there is a mesh-shaped protective foam pad 14, to play a protective role on the top of the memory module 1 after the vest structure is combined and fixed, to avoid abrasion during combination. The top end of the memory module 1 is combined and inserted into the protection groove 13 and abuts against the protective foam pad 14. On both sides of the memory module 1, there are two snap grooves 15, through which the memory module 1 is inserted into the memory slots on the main board and clamped by snaps, to realize the insertion and clamping of the memory module 1 with the vest structure in the memory slots of the computer main board storage.
[0026] Specifically, when in use, firstly, the vest combination end cover 2 is inserted into the end of the memory stick 1 by using the protective groove 13, and the protective foam pad 14 in the protective groove 13 protects the top of the memory stick 1, and then the combined vest side panel 4 is inserted into the combined card slot 3 on both sides of the vest combination end cover 2 by using the strip combination plug-in block 17, and the combined vest side panel 4 can be combined on both sides of the memory stick 1, and the sliding card slot 5 is connected with the positioning slot 6 as a whole, so that the combined installation and fixation of the vest structure can be realized, and at the same time, the U-shaped card strip 7 is slid into the two ends of the sliding card slot 5 to clamp and fix the vest combination end cover 2 and the combined vest side panel 4, and then the clamping blocks 9 on the two side walls inside the U-shaped card strip 7 are clamped in the clamping slot 16, so as to realize the installation and fixation of the vest structure. , and the problem of the colloid-bonded vest structure debonding and falling off due to the high temperature of the memory stick 1 will not occur, and the vest structure assembly is simple and convenient to assemble and disassemble, and is more secure. Finally, after the combined vest side panels 4 are assembled and fixed to the two sides of the memory stick 1, the memory particles on the memory stick 1 are placed in the memory particle protection grooves 8, and the surface of the memory particles is pressed against the thermal grease sheet 11, so that after the vest structure is assembled on the memory stick 1, the memory particles are protected, and there is no need to fix them on the memory particles through colloid bonding, so that after the vest structure is assembled and installed, the memory stick 1 can use the thermal grease sheet 11 to discharge the generated heat from the heat outlet hole 12, thereby further improving the effective heat dissipation and protection of the memory stick 1 with the vest structure.
[0027] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A combined vest - structured memory module, characterized in that, Including: A memory module (1), on the upper end of which is plugged and combined with a combined end cover of a vest (2) for protecting the upper end of the memory module (1). On both sides of the combined end cover of the vest (2), there are combined and clamped through combined card slots (3) with combined vest side plates (4) for protecting both side surfaces of the memory module (1). On the outer surface of the combined vest side plates (4), there are sliding card slots (5) for combined clamping and fixing the combined vest side plates (4). At both ends of the combined end cover of the vest (2), there are positioning slots (6) for docking and combining with the sliding card slots (5). The positioning slots (6) and the sliding card slots (5) are docked and combined, and a U-shaped card strip (7) for clamping and fastening the combination of the combined vest side plates (4) and the combined end cover of the vest (2) is slid into and clamped. At the positions corresponding to the memory particles on both side surfaces of the memory module on the inner side surface of the combined vest side plates (4), there are memory particle protection fixing slots (8).
2. The combined vest-structured memory module according to claim 1, wherein: On both sides of one end inside the U-shaped card strip (7), there are clamping fixed blocks (9), and the U-shaped card strip (7) is slid into from both ends of the sliding card slot (5) to clamp and fix the combination of the combined end cover of the vest (2) and the combined vest side plates (4) after combination.
3. The combined vest-structured memory module according to claim 2, wherein: At the corresponding positions where the U-shaped card strip (7) is inserted into the sliding card slot (5), there are clamping slots (16), and the clamping fixed blocks (9) on the U-shaped card strip (7) are positioned and inserted into the clamping slots (16). At the upper end corresponding to the clamping slots (16), there are auxiliary slots (10) which are beneficial for pulling the clamping fixed blocks (9) outwards for disassembly.
4. A combined vest-structured memory module according to claim 1, characterized in that: On the inner wall of the memory particle protection fixing slots (8) on the inner side of the combined vest side plates (4), there are thermal conductive silicone grease sheets (11), and on the other side corresponding to the thermal conductive silicone grease sheets (11), there are uniformly penetrated thermal conductive holes (12). On the side surface of the combined vest side plates (4), there are strip-shaped combined insertion blocks (17) clamped on both sides of the combined end cover of the vest (2).
5. The combined vest structure memory module according to claim 1, wherein: On the lower end surface of the combined end cover of the vest (2), there is a protection slot (13). At the top end inside the protection slot (13), there is a protective foam pad (14) in a mesh shape. The top end of the memory module (1) is combined and inserted into the protection slot (13) and abuts against the protective foam pad (14).
6. The combined vest-structured memory module according to claim 1, characterized in that: On both sides of the memory module (1), there are two buckle slots (15) for inserting the memory module (1) into the memory slots on the motherboard and clamping it with a buckle.
Citation Information
Patent Citations
Drop-resistant memory bank waistcoat
CN220627409U