Chip electrode and transformer
By designing the conductive structure of the chip electrode, the high-temperature damage and lead collision problems during electrode welding and lead wire are solved, and thermal isolation and lead protection are achieved to ensure product performance.
Patent Information
- Application Number
- CN202422376402.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-27
AI Technical Summary
The high temperature of the electrode damages the patch portion and leads of the electrodes and the leads are easily damaged by collisions.
A chip electrode is designed, including a first conductive part, a second conductive part and a third conductive part sequentially connected along the length direction. The second conductive part is recessed in the first conductive part and the third conductive part on one side adjacent to the lead, and the first conductive part protrudes from the third conductive part, forming a heat transmission channel narrowing and line-through area to reduce heat transmission to the patch part and reduce the chance of damage to the lead.
Effectively reduce the risk of high-temperature damage to the patch part, reduce the chance of leads being damaged by collision, and ensure product performance.
Smart Images
Figure CN223140527U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of electromagnetic devices, and particularly relates to a chip electrode and a transformer. Background Art
[0002] With the rapid development of technology, especially the emergence of multifunctional devices, the demand for the entire passive components is increasing. As one of the passive components, electromagnetic devices are also widely used. Requirements such as high current, high frequency, and high reliability are constantly upgraded. To meet these requirements, the application of electromagnetic devices is becoming more and more extensive. An electromagnetic device at least includes a magnet, a winding, and an electrode. The electrode is mainly used for welding with the lead of the winding, so as to achieve electrical connection between the lead and a circuit board (such as a PCB, that is, a Printed Circuit Board) when the electromagnetic device performs SMT (Surface Mounted Technology) chip mounting. When the electrode is welded to the lead, the welding temperature is relatively high, and the heating rate is usually 480°C / 1sec. The high temperature will not only burn out the insulation layer on the surface of the lead, increasing the risk of short circuit, but also transfer to other parts of the electrode, especially to the chip mounting part of the electrode, that is, the chip mounting part (which can also be called "chip electrode" or "chip pin") that performs SMT, thus easily causing the chip mounting part of the electromagnetic device to have its surface plating damaged due to excessive temperature. In addition, in the path from the magnet to the electrode, the lead usually directly adheres to the surface of the magnet, exposing and protruding from the electrode, making the lead easily damaged by collision and also affecting the product performance. Summary of the Utility Model
[0003] In view of this, this application provides a chip electrode and a transformer, which can improve the problems that the high temperature generated by welding the electrode to the lead will damage the chip mounting part of the electrode and the lead is easily damaged by collision.
[0004] A chip electrode provided by this application is used for an electromagnetic device. The chip electrode includes a first conductive part, a second conductive part, and a third conductive part that are sequentially connected along a first direction. The first direction is the length direction of the chip electrode. The third conductive part is provided with a welding surface for welding with the lead of the electromagnetic device. The side of the second conductive part adjacent to the lead is recessed from the first conductive part and the third conductive part. The first conductive part protrudes from the third conductive part, so that in the electromagnetic device, the welding surface of the third conductive part is lower than the same side surface of the first conductive part.
[0005] Optionally, the cross-sectional area of the second conductive part is S0, and the cross-sectional area of the lead is S L , satisfying S0≥2*S L .
[0006] Optionally, the width of the second conductive part is D1, and the width of the third conductive part is D2, satisfying D1 ≤ 1 / 2 * D2.
[0007] Optionally, the height by which the first conductive part protrudes from the third conductive part is greater than the diameter of the lead.
[0008] Optionally, the first side of the first conductive part and the second side of the second conductive part are both adjacent to the lead; the second side of the second conductive part is recessed from the first conductive part and the third conductive part; the third conductive part is provided with a third side and a fourth side adjacent to the lead, the third side and the fourth side being perpendicular to each other, wherein the third side extends along the first direction, and the lead extends to the solder surface of the third conductive part via the fourth side.
[0009] Optionally, the second side of the second conductive part is parallel to the first direction; along the second direction, the intersection point of the lead and the fourth side is located between the second side and the third side, the second direction being the width direction of the chip electrode.
[0010] Optionally, the third conductive part is used for welding with multiple leads, and the first side of the first conductive part is at least parallel to the nearest lead.
[0011] Optionally, the chip electrode further includes a fourth electrode part, the fourth electrode part being connected to an end of the first conductive part facing away from the second electrode part, and the fourth electrode part extending along a third direction, the third direction being perpendicular to the first direction.
[0012] A transformer provided by the present application includes the chip electrode as described in any one of the above.
[0013] Optionally, the transformer includes a magnet, the chip electrode is disposed on the magnet, the first conductive part, the second conductive part and the third conductive part are located on the same side of the magnet, and the lead is flush with or lower than the first conductive part.
[0014] As described above, the chip electrode of the present application includes a first conductive portion, a second conductive portion, and a third conductive portion that are sequentially connected along the length direction of the electrode. The third conductive portion is used for welding with a lead. One side of the second conductive portion adjacent to the lead is recessed from the first conductive portion and the third conductive portion, which is equivalent to narrowing the heat transfer channel between the third conductive portion and the first conductive portion. This can reduce the heat generated by the welding of the third conductive portion from being transmitted towards the patch portion of the electromagnetic device, improving or even eliminating the risk of damaging the coating of the patch portion due to high temperature. Additionally, the first conductive portion protrudes from the third conductive portion. When the chip electrode is assembled to the magnet, the welding surface of the third conductive portion is lower than the same side surface of the first conductive portion, and the lead can be flush with or lower than the first conductive portion. This is equivalent to forming a wire passing area here when the chip electrode is assembled to the magnet, which is beneficial for the lead to be as flush with or lower than the chip electrode as possible, reducing the probability of the lead being damaged by collision, and further beneficial for ensuring the product performance. Description of the Drawings
[0015] Figure 1 is a schematic structural diagram of a chip electrode according to an embodiment of the present application;
[0016] Figure 2 is a schematic structural diagram of a chip electrode according to another embodiment of the present application;
[0017] Figure 3 is a schematic structural diagram of a transformer according to an embodiment of the present application from a first perspective;
[0018] Figure 4 is a schematic structural diagram of a transformer according to an embodiment of the present application from a second perspective;
[0019] Figure 5 is a schematic structural diagram of a transformer according to an embodiment of the present application from a third perspective.
[0020] First direction x, Second direction y, Third direction z, Preset direction L
[0021] Chip electrode 1
[0022] First conductive portion 11, Second conductive portion 12, Third conductive portion 13, Fourth electrode portion 14
[0023] Welding surface 130, Same side surface 110
[0024] First side 111, Second side 121, Third side 131, Fourth side 132
[0025] Electromagnetic device 2
[0026] Winding 21, Magnet 22, Lead 210 Detailed Description of the Embodiments
[0027] To solve the above technical problems existing in the prior art, in the chip electrode and transformer of the present application, a first conductive part, a second conductive part, and a third conductive part are sequentially connected along the length direction of the electrode. The third conductive part is a welding part. The side of the second conductive part adjacent to the lead is recessed from the first conductive part and the third conductive part, which is equivalent to narrowing the heat transfer channel between the third conductive part and the first conductive part, thereby reducing the heat generated by the third welding from being transmitted towards the patch part of the electromagnetic device and improving or even eliminating the risk of damaging the coating of the patch part due to this high temperature. Additionally, the first conductive part protrudes from the third conductive part. When the chip electrode is assembled to the magnet, the welding surface of the third conductive part is lower than the same side surface of the first conductive part, and the lead can be flush with or lower than the first conductive part, thereby reducing the probability of the lead being damaged by collision.
[0028] The specific forms of parameters such as the shape, quantity, size, etc. of any one of the first conductive part, the second conductive part, and the third conductive part can be determined adaptively according to the requirements of the actual scenario.
[0029] To make the objectives, technical solutions, and advantages of the present application clearer, the following will clearly describe the technical solutions of the present application in combination with specific embodiments and the corresponding drawings. Obviously, the embodiments described below are only a part of the embodiments of the present application, rather than all the embodiments. Without conflict, the technical features of the following various embodiments can be combined with each other, and they also belong to the technical solutions of the present application.
[0030] In the description of the embodiments of the present application, the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the technical solutions of the corresponding embodiments, rather than indicating or implying that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as a limitation to the present application.
[0031] Refer to Figures 1 to 5 , the chip electrode 1 of this example is provided with a first conductive part 11, a second conductive part 12, and a third conductive part 13, and the chip electrode 1 is applicable to the electromagnetic device 2.
[0032] The electromagnetic device 2 further includes a winding 21 and a magnet 22. The winding 21 can be wound turn by turn by leads 210 of types such as enameled wires, and the winding method is determined adaptively; the winding 21 is disposed within the magnet 22, and each end of the lead 210 can extend outside the magnet 22 and be welded to the corresponding chip electrode 1. For example, in Figures 3 to 5In the illustrated example, the electromagnetic device 2 is a common-mode transformer. The winding 21 is provided with eight ends, and the electromagnetic device 2 is provided with six chip electrodes 1. Four of the ends are respectively welded to four of the chip electrodes 1 in a one-to-one correspondence. Two of the remaining four ends are welded to one chip electrode 1, and the remaining two of the other two ends are welded to another chip electrode 1.
[0033] For the sake of convenience in description and understanding, in combination with Figures 3 to 5 the illustrated placement orientation, the height direction of the electromagnetic device 2 is referred to as the first direction x, the width direction is referred to as the second direction y, and the thickness direction is referred to as the third direction z. The first direction x, the second direction y, and the third direction z are perpendicular to each other pairwise and can be regarded as the three coordinate axes of a three-dimensional rectangular coordinate system. It should be understood that throughout the present application, the so-called perpendicular does not require the angle between the two to be necessarily 90°, but allows a deviation of, for example, ±10°. That is, the so-called perpendicular can be understood as the angle between any two directions being 80° to 100°. Similarly, throughout the present application, the so-called parallel does not require the angle between the two to be necessarily 0° or 180°, but allows a deviation of, for example, ±10°. That is, the so-called parallel can be understood as the angle between any two directions being 0° to 10° or 170° to 190°.
[0034] The first conductive portion 11, the second conductive portion 12, and the third conductive portion 13 are sequentially connected along the first direction x. For the chip electrode 1, the first direction x is the length direction of the chip electrode 1. The portion of the first conductive portion 11 extending to the bottom of the magnet 22 can be used as the patch portion of this chip electrode 1.
[0035] The third conductive portion 13 is provided with a welding surface 130, and the welding surface 130 is the surface for welding with the end of the lead 210 of the electromagnetic device 2. In one example, this welding surface 130 can be the entire outer surface of the third conductive portion 13, that is, the x-y surface. After the lead 210 of the electromagnetic device 2 extends out from within the magnet 22, it extends along a preset direction L to the welding surface 130 of the third conductive portion 13 and is welded to this welding surface 130.
[0036] The side of the second conductive portion 12 adjacent to the lead 210 is recessed from the first conductive portion 13 and the third conductive portion 13. The so-called recess can be understood as: on the side adjacent to the lead 210, the side edge of the second conductive portion 12 and the side edges of the first conductive portion 13 and the third conductive portion 13 are not a straight line parallel to the second direction y, and the side edge of the second conductive portion 12 is recessed in a direction away from the lead 210.
[0037] For example, in Figures 1 to 5In an example, the first side 111 of the first conductive part 11 is connected to the second side 121 of the second conductive part 12, and this connection is an indirect connection, that is, a side parallel to the second direction y is provided at one end of the first conductive part 11 adjacent to the second conductive part 12, and the straight second side 121 is connected to the second side 121 through this side; in other examples, the first side 111 of the first conductive part 11 may be directly connected to the second side 121 of the second conductive part 12. Both the first side 111 and the second side 121 are adjacent to the lead 210. Optionally, in the scenario where the third conductive part 13 is used for welding with multiple leads 210, for example, when welding with the two leads 210 shown in Figure 1 and Figures 3 to 5 , the first side 111 of the first conductive part 11 is at least parallel to the closest one of the leads 210; when the third conductive part 13 shown in Figure 2 and Figures 3 to 5 is only used for welding with one lead 210, the first side 111 of the first conductive part 11 is only parallel to this single lead 210. The second side 121 of the second conductive part 12 is recessed from the first conductive part 11 and the third conductive part 13, and the second side 121 of the second conductive part 12 is parallel to the first direction x; the third conductive part 13 is provided with a third side 131 and a fourth side 132 adjacent to the lead 210, and the third side 131 and the fourth side 132 are perpendicular to each other, wherein the third side 131 extends along the first direction x, and the lead 210 extends to the solder surface 130 of the third conductive part 13 through the fourth side 132 and is welded; along the line-of-sight direction of the second direction y, the intersection point of the lead 210 and the fourth side 132 is located between the second side 121 and the third side 131. The side of the second conductive part 12 away from the lead 210 may be flush with the first conductive part 13 and the third conductive part 13, that is, the side of the chip electrode 1 away from the lead 210 is a straight line parallel to the second direction y.
[0038] This concave design is equivalent to narrowing the heat transfer channel between the third conductive part 13 and the first conductive part 11, which can reduce the heat generated by the welding of the third conductive part 13 from being transmitted to the first conductive part 11 and the patch part of the electromagnetic device 2, that is, achieve thermal isolation, improve or even eliminate the influence of this high temperature on the patch part, and reduce the risk of damage to the plating layer of the patch part.
[0039] In an example, the cross-sectional area (i.e., the area in the x - y plane) of the second conductive part 12 is S0, and the cross-sectional area of the lead 210 is S L , and it satisfies S0≥2*S L . In this way, it can not only ensure that the resistance of the second conductive part 12 can meet the electrical connection requirements between the third conductive part 13 and the first conductive part 11, but also ensure a good thermal isolation effect, and finally achieve the balance between electrical connection and thermal isolation.
[0040] In one example, the width of the second conductive portion 12 (i.e., the length along the second direction y) is D1, and the width of the third conductive portion 13 (i.e., the length along the second direction y) is D2, satisfying D1 ≤ 1 / 2 * D2. This width design can also ultimately achieve a balance between electrical connection and thermal insulation.
[0041] Please continue to refer to Figures 1 to 5 , the first conductive portion 11 protrudes from the third conductive portion 13, so that when the chip electrode 1 is assembled in the electromagnetic device 2, the welding surface 130 of the third conductive portion 13 is lower than the same side surface 110 of the first conductive portion 11. This is equivalent to forming a wire passing area on the side of the chip electrode 1 when the chip electrode 1 is assembled to the magnet 22, which is beneficial for the lead 210 to be as flush with or lower than the first conductive portion 11 of the chip electrode 1, reducing the probability of the lead 210 being damaged by collision and buffering the local excessive force on the lead 210, further facilitating the ensuring of product performance.
[0042] In one example, the height by which the first conductive portion 11 protrudes from the third conductive portion 13 (i.e., the protruding height along the second direction y) is greater than the diameter of the lead 210, so as to ensure that the lead 210 is lower than the first conductive portion 11 of the chip electrode 1 and avoid the lead 210 being damaged by collision.
[0043] Please continue to refer to Figures 1 to 5 As shown, the chip electrode 1 may further include a fourth electrode portion 14. The fourth electrode portion 14 is connected to one end of the first conductive portion 11 facing away from the second electrode portion 12, and the fourth electrode portion 14 extends along the third direction z. When the chip electrode 1 is assembled to the magnet 22, the fourth electrode portion 14 can serve as a patch electrode of the electromagnetic device 2, or a patch pin.
[0044] For the scenario where a single chip electrode 1 is connected to multiple leads 210, for example Figure 1 , Figures 3 to 5 as shown when a single chip electrode 1 is connected to two leads 210, the number of the fourth electrode portions 14 can be two, and these two fourth electrode portions 14 are arranged oppositely along the second direction y.
[0045] The embodiment of the present application further provides a transformer, including a magnet and the chip electrode 1 as described in any one of the above examples. Therefore, the transformer at least has the beneficial effects generated by the chip electrode 1 in the corresponding example, which will not be elaborated here. For example, in combination with Figures 1 to 5As shown, in an electromagnetic device 2 such as a transformer, etc., a chip electrode 1 having a single fourth electrode portion 14 and a chip electrode 1 having two fourth electrode portions 14 can be provided simultaneously; in addition, when the chip electrode 1 in any of the foregoing examples is assembled to the magnet 22, the first conductive portion 11, the second conductive portion 12, and the third conductive portion 13 of the single chip electrode 1 are located on the same side of the magnet 22, and the lead 210 is flush with or lower than the first conductive portion 11.
[0046] The foregoing are only some embodiments of the present application, and thus do not limit the patent scope of the present application. For those of ordinary skill in the art, any equivalent structural transformation made by using the content of this specification and the drawings is equally included in the patent protection scope of the present application.
[0047] Although terms such as "first" and "second" are used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other conductively. In addition, the singular forms "a", "an", and "the" are also intended to include the plural forms. The terms "or" and "and / or" are interpreted as inclusive, or mean any one or any combination. An exception to this definition only occurs when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.
Claims
1. A chip electrode for an electromagnetic device, characterized in that, It includes a first conductive part, a second conductive part, and a third conductive part connected in sequence along a first direction, and the first direction is the length direction of the chip electrode; a soldering surface is provided on the third conductive part, and the soldering surface is used for soldering with the lead of the electromagnetic device; the side of the second conductive part adjacent to the lead is recessed from the first conductive part and the third conductive part; the first conductive part protrudes from the third conductive part, so that the soldering surface of the third conductive part in the electromagnetic device is lower than the same side surface of the first conductive part.
2. The chip electrode according to claim 1, characterized in that, The cross-sectional area of the second conductive part is S0, and the cross-sectional area of the lead is S L , satisfying S0 ≥ 2 * S L .
3. The chip electrode according to claim 1 or 2, characterized in that, The width of the second conductive part is D1, and the width of the third conductive part is D2, satisfying D1≤1 / 2*D2.
4. The chip electrode according to claim 1, characterized in that, The height by which the first conductive part protrudes from the third conductive part is greater than the diameter of the lead.
5. The chip electrode according to claim 1, wherein The first side of the first conductive part and the second side of the second conductive part are both adjacent to the lead; the second side of the second conductive part is recessed from the first conductive part and the third conductive part; The third conductive part is provided with a third side and a fourth side adjacent to the lead, and the third side and the fourth side are perpendicular to each other. Among them, the third side extends along the first direction, and the lead extends to the soldering surface of the third conductive part via the fourth side.
6. The chip electrode according to claim 5, characterized in that, The second side of the second conductive part is parallel to the first direction; along a second direction, the intersection point of the lead and the fourth side is located between the second side and the third side, and the second direction is the width direction of the chip electrode.
7. The chip electrode according to claim 5, wherein The third conductive part is used for soldering with multiple leads, and the first side of the first conductive part is at least parallel to the nearest lead.
8. The chip electrode according to claim 1, characterized in that The chip electrode further includes a fourth electrode part, and the fourth electrode part is connected to the end of the first conductive part facing away from the second conductive part, and the fourth electrode part extends along a third direction, and the third direction is perpendicular to the first direction.
9. A transformer, characterized in that, It includes the chip electrode according to any one of claims 1 to 8.
10. The transformer according to claim 9, characterized in that, The transformer includes a magnet, the chip electrode is arranged on the magnet, the first conductive part, the second conductive part and the third conductive part are located on the same side of the magnet, and the lead is flush with or lower than the first conductive part.