Wafer conveying device and wafer cleaning system

Abstract

The utility model provides a wafer conveying device and a wafer cleaning system, the wafer conveying device comprises a base, a transmission mechanism, a mechanical arm assembly, a turnover mechanism and a clamping mechanism, the transmission mechanism is arranged on the base and is configured to move in the horizontal direction and the vertical direction relative to the base; the first end of the mechanical arm assembly is connected with the transmission mechanism and is configured to circumferentially rotate around the connecting end of the mechanical arm assembly and the transmission mechanism; the turnover mechanism is connected to the second end of the mechanical arm assembly, and the clamping mechanism is fixedly connected to the turnover mechanism, used for clamping the wafer and driven by the turnover mechanism to turn over in the direction perpendicular to the base. The wafer cleaning system comprises the wafer conveying device. According to the wafer conveying device, the wafer overturning device is simplified and integrated in the conveying device, wafer overturning and conveying can be carried out at the same time, the wafer conveying position accuracy and the wafer conveying efficiency during wafer back cleaning are effectively improved, and the risk that the surface of the wafer is polluted in the wafer conveying process can be reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and particularly to a wafer transfer device and a wafer cleaning system. Background Art

[0002] In the integrated circuit manufacturing industry, with the improvement of the requirements for wafer production processes, the industry's requirements for the cleanliness of the wafer surface are also constantly increasing. The cleanliness of the back surface of the wafer has an important impact on the yield of wafer production. Therefore, during the wafer production process, it is usually necessary to clean the back surface of the wafer. Before the cleaning process, it is necessary to use a flipping device to flip the wafer so that its back surface faces up, and then transport the wafer to the wafer cleaning unit for cleaning through a transfer device. The cleaned wafer also needs to be flipped before it can be transported back to the wafer cassette.

[0003] In the prior art, usually two wafer transfer robotic arms and two flipping devices are used in combination. The wafer flipping device and the transfer device are separate independent systems, and the equipment composition is complex. Since the flipping device flips the wafer by clamping it with two robotic arms, during the flipping process, if the positions between the two robotic arms shift, it will affect the accuracy of the wafer position. In addition, the contact area between the flipping robotic arm and the wafer is large, which is likely to cause contamination of the wafer surface. Therefore, there is a need for a device that integrates the functions of wafer transfer and flipping, which can improve the wafer transfer efficiency during the back surface cleaning of the wafer and simplify the equipment composition at the same time. Summary of the Utility Model

[0004] An embodiment of this application provides a wafer transfer device, including a base, a transmission mechanism, a robotic arm assembly, a flipping mechanism, and a clamping mechanism. Among them, the transmission mechanism is arranged on the base and is configured to move relative to the base in the horizontal and vertical directions; the first end of the robotic arm assembly is connected to the transmission mechanism and is configured to rotate circumferentially around the connection end of the robotic arm assembly and the transmission mechanism; the flipping mechanism is connected to the second end of the robotic arm assembly and is configured to flip along the direction perpendicular to the base. The clamping mechanism is fixedly connected to the flipping mechanism and is used for clamping the wafer and flipping along the direction perpendicular to the base under the drive of the flipping mechanism.

[0005] In some embodiments, a guide rail is arranged on the base, and the transmission mechanism is installed on the guide rail and is configured to move along the guide rail.

[0006] In some embodiments, the transmission mechanism includes a horizontal transmission mechanism and a vertical lifting mechanism. The horizontal transmission mechanism is installed on the guide rail and is configured to move along the guide rail. The first end of the vertical lifting mechanism is installed on the horizontal transmission mechanism and is configured to reciprocate vertically relative to the base.

[0007] In some embodiments, the robotic arm assembly includes a first robotic arm and a second robotic arm; a first end of the first robotic arm is vertically connected to a second end of the vertical lifting mechanism and is configured to rotate circumferentially around a second end of the horizontal transmission mechanism; a first end of the second robotic arm is horizontally connected to a top of a second end of the first robotic arm and is configured to perform a circumferential motion around the top of the second end of the first robotic arm.

[0008] In some embodiments, the flipping mechanism is connected to a second end of the second robotic arm and is configured to flip along the direction of the vertical base at the second end of the second robotic arm.

[0009] In some embodiments, one end of the flipping mechanism away from the second robotic arm is horizontally connected to the clamping mechanism, driving the clamping mechanism to flip along the direction of the vertical base.

[0010] In some embodiments, the clamping mechanism includes: a bearing body, including a bearing part and a handle part integrally connected, and a plurality of first clamping members are arranged at an end of the bearing part; a clamping pusher, installed on the bearing part, a side of the clamping pusher close to the handle part of the bearing body is connected to a driving component, and the clamping pusher performs a telescopic motion along the bearing part under the drive of the driving component, and a plurality of second clamping members are arranged at an end of a side of the clamping pusher away from the handle part of the bearing body, and the first clamping members and the second clamping members are jointly used for clamping a wafer.

[0011] In some embodiments, both the first clamping member and the second clamping member include two symmetrical clamping members, arranged at ends of the first clamping member and the second clamping member, and a groove is formed between the two symmetrical clamping members, and the groove is used for limiting the wafer.

[0012] In some embodiments, the clamping member is conical, and the inner side surface of the groove is in point contact with the wafer.

[0013] A wafer cleaning system includes a transfer robotic arm, a wafer transfer rack, and a wafer cleaning unit, and further includes the wafer transfer device according to the above claims, wherein the transfer robotic arm and the wafer transfer device are respectively located on two sides of the wafer transfer rack, and the transfer robotic arm is used to obtain a wafer and transfer the wafer to the wafer transfer rack; the wafer transfer device obtains and flips the wafer from the wafer transfer rack and then transfers it to the wafer cleaning unit.

[0014] The wafer transfer device of the present application integrates a flipping mechanism and a robotic arm assembly. The flipping mechanism drives the clamping mechanism to flip, realizing wafer flipping, and can transfer the wafer while flipping the wafer. The wafer cleaning system of the present application improves the wafer transfer efficiency during backside cleaning of the wafer by using a wafer transfer device that integrates wafer transfer and flipping functions, and also simplifies the equipment composition of the wafer cleaning system. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The following drawings detail exemplary embodiments disclosed in the present application. Wherein the same reference numerals represent similar structures in several views of the drawings. Those of ordinary skill in the art will understand that these embodiments are non-limiting, exemplary embodiments, and the drawings are only for the purpose of illustration and description, and are not intended to limit the scope of the present application. Embodiments in other ways may also achieve the inventive intent in the present application. It should be understood that the drawings are not drawn to scale.

[0016] Wherein:

[0017] Figure 1 is a schematic diagram of a wafer cleaning system shown in the prior art;

[0018] Figure 2 is a perspective schematic diagram of a wafer transfer device shown in some embodiments of the present application;

[0019] Figure 3 is a plan schematic diagram of a wafer transfer device shown in some embodiments of the present application;

[0020] Figure 4 is an overall schematic diagram of a wafer clamping mechanism shown in some embodiments of the present application;

[0021] Figure 5 is a partial schematic diagram of a wafer clamping mechanism shown in some embodiments of the present application;

[0022] Figure 6 is a schematic diagram of the working principle of a wafer clamping mechanism shown in some embodiments of the present application;

[0023] Figure 7 is a schematic diagram of a wafer cleaning system shown in some embodiments of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The following description provides specific application scenarios and requirements of the present application, aiming to enable those skilled in the art to manufacture and use the content of the present application. For those skilled in the art, various partial modifications to the disclosed embodiments are obvious, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of the present application. Therefore, the present application is not limited to the illustrated embodiments, but has the broadest scope consistent with the claims.

[0025] Reference Figure 1 , in production, usually, the first transfer robotic arm 11 first takes out a wafer (not shown) from the wafer cassette 10 and transfers it to and places it on the first flipping device 14 for wafer flipping to turn the wafer to face upward on the back side. Then, the second transfer robotic arm 12 takes out the wafer from the first flipping device 14 and transfers it to the cleaning unit 13 for cleaning. After cleaning, the wafer is taken out from the cleaning unit 13 by the second transfer robotic arm 12 and transported and placed on the second flipping device 15, and the second flipping device 15 flips the wafer to turn it to face upward on the front side. Finally, it is transported back to the wafer cassette 10 by the first transfer robotic arm 11. Therefore, this process requires the cooperation of two wafer transfer robotic arms, namely the first transfer robotic arm 11 and the second transfer robotic arm 12, and two flipping devices, namely the first flipping device 14 and the second flipping device 15. The systems for flipping and transferring the wafer are two separate independent systems. Such a system device has a complex structure. The wafer is usually flipped by the first flipping device 14 and the second flipping device 15 respectively, and the two robotic arms, namely the first transfer robotic arm 11 and the second transfer robotic arm 12, respectively clamp the flipped wafer. If the positions between these two robotic arms shift during the flipping process, it will affect the accuracy of the position of the wafer. In addition, the contact areas of the first flipping device 14 and the second flipping device 15 with the wafer are large, which easily causes contamination on the surface of the wafer, and the wafer flipping and transfer efficiency needs to be improved.

[0026] Also reference Figure 2 and Figure 3, an embodiment of the present application provides a wafer transfer device, including a base 20, a transmission mechanism 21, a robotic arm assembly 22, a flipping mechanism 23, and a clamping mechanism 24. Among them, the transmission mechanism 21 is disposed on the base 20 and is configured to move relative to the base in the horizontal and vertical directions; the first end of the robotic arm assembly 22 is connected to the transmission mechanism 21 and is configured to rotate circumferentially around the connection end of the robotic arm assembly 22 and the transmission mechanism 21; the flipping mechanism 23 is connected to the second end of the robotic arm assembly 22 and is configured to flip along the direction perpendicular to the base. The clamping mechanism 24 is fixedly connected to the flipping mechanism 23 and is used to clamp the wafer and flip along the direction perpendicular to the base 20 under the drive of the flipping mechanism 23. The wafer transfer device drives the clamping mechanism 24 to flip through the flipping mechanism 23 to realize wafer flipping. While the wafer is being flipped, wafer transfer can be carried out, which not only simplifies the structure but also improves the wafer transfer efficiency.

[0027] In some embodiments, guide rails 201 are provided on the base 20, and the transmission mechanism 21 is installed on the guide rails 201 and is configured to move horizontally along the guide rails 201. Specifically, two guide rails 201 are installed on the base 20, and a groove 2111 corresponding to the guide rails 201 is provided at the bottom of the transmission mechanism 21, and the transmission mechanism 21 is installed on the guide rails 201 through the groove 2111. The robotic arm assembly 22, the flipping mechanism 23, and the clamping mechanism 24 are installed on the top of the transmission mechanism 21 and reciprocate horizontally on the guide rails 201 under the drive of the transmission mechanism 21.

[0028] In some embodiments, the transmission mechanism 21 includes a horizontal transmission mechanism 211 and a vertical lifting mechanism 212. The horizontal transmission mechanism 211 is installed on the guide rails 201 and is configured to move horizontally along the guide rails 201. The first end of the vertical lifting mechanism 212 is installed on the horizontal transmission mechanism 211 and is configured to reciprocate vertically relative to the horizontal transmission mechanism 211. In some embodiments, the horizontal transmission mechanism 211 is equipped with a lead screw, a motor, etc. (not shown), and the motor drives the lead screw to rotate, so as to realize the reciprocating movement of the transmission mechanism 21 horizontally along the guide rails 201. In some embodiments, the vertical lifting mechanism 212 is composed of two coaxially nested cylinders. The inner cylinder is equipped with a motor and a lead screw, which can realize vertical movement.

[0029] Reference Figure 3, in some embodiments, the robotic arm assembly 22 includes a first robotic arm 221 and a second robotic arm 222; a first end 2211 of the first robotic arm 221 is vertically connected to a second end 2122 of the vertical lifting mechanism 212 and is configured to rotate circumferentially around the second end of the vertical lifting mechanism 212; a first end 2221 of the second robotic arm 222 is horizontally connected to the top of a second end 2212 of the first robotic arm 221 and is configured to perform a circumferential movement around the top of the second end 2212 of the first robotic arm 221. The first robotic arm 221 and the vertical lifting mechanism 212 are connected by a servo motor (not shown) and can achieve a 360° rotation on a horizontal plane. The second robotic arm 222 and the first robotic arm 221 are connected by a servo motor (not shown) and can achieve a 360° rotation on a horizontal plane.

[0030] In some embodiments, the flipping mechanism 23 is connected to a second end 2222 of the second robotic arm 222 and is configured to flip along the direction of the vertical base 20 at the second end 2222 of the second robotic arm 222. The bottom of the flipping mechanism 23 is connected to the second robotic arm 222, and one side of the flipping mechanism 23 is fixedly connected to the clamping mechanism 24 in the horizontal direction, driving the clamping mechanism 24 to achieve a 360° flip along the direction of the vertical base for wafer flipping.

[0031] Figure 4 The clamping mechanism 24 shown in some embodiments of the present application includes: a carrier body 241 and a clamping pusher 242. The carrier body 241 includes a carrier portion 2411 and a handle portion 2412 connected integrally. A plurality of first clamping members 2413 are provided at the end of the carrier portion 2411; the clamping pusher 242 is installed on the carrier portion 2411. One side of the clamping pusher 242 close to the handle portion 2412 of the carrier body is connected to a driving component and moves telescopically along the carrier portion 2411 under the drive of the driving component. A plurality of second clamping members 2422 are provided at the end of the side of the clamping pusher 242 away from the handle portion 2412 of the carrier body. The first clamping members 2413 and the second clamping members 2422 are jointly used to clamp the wafer. One end of the carrier portion 2411 away from the handle portion 2412 is a Y-shaped wafer fork 24111, and the first clamping members 2413 are fixed to the end of the wafer fork 24111 by bolts. The carrier portion 2411 is used to carry the wafer. Extension portions 2421 are respectively provided at both ends of one side of the clamping pusher 242, and the second clamping members 2422 are fixedly installed at the ends of the extension portions 2421 by bolts. The middle of the other side of the clamping pusher 242 is connected to a cylinder push rod 243. A cylinder (not shown, disposed in the handle portion 2412) controls the telescopic movement of the clamping pusher 242 on the carrier portion 2411, and the clamping mechanism 24 can be switched between a clamping state and a non-clamping state for clamping or releasing the wafer.

[0032] Reference Figure 5, in some embodiments, each of the first clamping members 2413 and the second clamping members 2422 includes two symmetric clamping members disposed at the ends of the first clamping members 2413 and the second clamping members 2422. A groove is formed between the two symmetric clamping members, and the groove is used for limiting the wafer 1 (see Figure 6 ). The first clamping members 2413 and the second clamping members 2422 have the same structure. Taking the first clamping member 2413 as an example, the first clamping member 2413 includes two symmetric clamping members 24131, and there is a groove 24132 between the two clamping members 24131. The shape of the groove 24132 is an arc corresponding to the edge of the wafer, and the arc can be set according to the change of the wafer size.

[0033] In some embodiments, the clamping members are conical, and the inner side of the groove 24132 contacts the wafer in a point contact. The second clamping members 2422 and the first clamping members 2413 have the same structure. Taking the first clamping member 2413 as an example, the two clamping members 24131 of the first clamping member 2413 are both conical, and a groove 24132 is formed between the two clamping members 24131. The shape of the groove is approximately a V-shaped groove. During operation, the wafer is clamped in the groove 24132. The end portions of the first clamping member 2413 and the conical end portions of the second clamping members 2422 contact the upper and lower edges of the wafer respectively, and the contact mode forms a point contact, which greatly reduces the contact area and can reduce the risk of the wafer surface being contaminated.

[0034] Refer to Figure 6 , and in combination with reference to Figures 1 to 5 , in some embodiments, the working principles of the flipping mechanism 23 and the clamping mechanism 24 of the wafer transfer device are described through the following steps:

[0035] ① Through the cooperation between the transmission mechanism 21, the robotic arm assembly 22, the flipping mechanism 23 and the clamping mechanism 24 of the wafer transfer device, the clamping mechanism 24 is delivered directly above the wafer 1, and the clamping pusher 242 is kept in the rear position. The distance between the first clamping member 2413 and the second clamping member 2422 is greater than the diameter of the wafer 1. At this time, the clamping mechanism 24 is in a non-clamping state;

[0036] ② The vertical lifting mechanism 212 lowers the clamping mechanism 24 to the same horizontal plane as the wafer 1;

[0037] ③ Through the cooperation between the robotic arms, the clamping mechanism 24 is moved towards the second clamping member 2422, so that the wafer 1 enters the groove of the first clamping member 2413;

[0038] ④ The cylinder push rod 243 pushes the clamping pusher 242 to clamp the wafer 1 on the bearing part 2411 of the clamping mechanism 24. At this time, the clamping mechanism 24 is in a clamping state;

[0039] ⑤The flipping mechanism 23 flips the wafer 1 by 180°, making the back side of the wafer 1 face upward. While the wafer 1 is being flipped, the transmission mechanism 211 moves along the guide rail 201 on the base 20 and transports the wafer 1 to a target carrier (not shown).

[0040] ⑥When the wafer 1 is transported to the target carrier, the target carrier is located between the bearing part 2411 of the clamping mechanism 24 and the wafer 1. The cylinder push rod 243 controls the clamping pusher 242 to retract, and the wafer 1 is removed from the second clamping member 2422 of the clamping pusher 242. At this time, the clamping mechanism 24 is in a non-clamping state.

[0041] ⑦Through the cooperation of the first robotic arm 221 and the second robotic arm 222, the clamping mechanism 24 is pushed forward to further separate the wafer 1 from the first clamping member 2413 of the bearing part 2411.

[0042] ⑧The vertical lifting mechanism 212 lowers the clamping mechanism 24 below the horizontal plane where the wafer 1 is located.

[0043] ⑨The transmission mechanism 21 and the robotic arm assembly 22 cooperate to move the flipping mechanism 23, and repeat steps ① to ⑧ to perform the flipping and transportation process of the next wafer.

[0044] Reference Figure 7 , in some embodiments, a wafer cleaning system 100 includes a transfer robotic arm 31, a wafer transfer rack 32, a wafer cleaning unit 33, and a wafer transfer device 34. Among them, the transfer robotic arm 31 and the wafer transfer device 34 are respectively located on both sides of the wafer transfer rack 32. The transfer robotic arm 31 is used to obtain the wafer and transfer the wafer to the wafer transfer rack 32; the wafer transfer device 34 obtains and flips the wafer from the wafer transfer rack and then transfers it to the wafer cleaning unit 33. Specifically, first, the mechanical transfer arm 31 takes out the wafer from the wafer cassette 30, transfers and places it on the wafer transfer rack 32; then the wafer transfer device 34 takes out the wafer from the wafer transfer rack 32, flips the wafer while transferring and placing it in the wafer cleaning unit 33 for cleaning; after the wafer is cleaned, the wafer transfer device 34 takes out the wafer from the wafer cleaning unit 33, flips the wafer while transferring and placing it on the wafer transfer rack 32; then the transfer robotic arm 31 takes out the wafer from the wafer transfer rack 32 and transfers and places it at the corresponding position in the corresponding wafer cassette 30.

[0045] The beneficial effects that may be brought by the embodiments of the present application include but are not limited to: providing a wafer transfer device and a wafer cleaning system, integrating the wafer flipping mechanism into the wafer transfer device, flipping the wafer during the process of the wafer transfer device transferring the wafer, simplifying the structure of the wafer cleaning system, improving the wafer transfer position accuracy and the wafer transfer efficiency when cleaning the back side of the wafer, and reducing the risk of contamination on the wafer surface during the wafer transfer process.

[0046] It should be noted that the beneficial effects that may be produced by different embodiments are different. In different embodiments, the beneficial effects that may be produced may be any one or several combinations of the above, or any other beneficial effects that may be obtained.

[0047] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only an example and does not constitute a limitation to this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this specification, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of this application.

[0048] It should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be a rotational connection or a sliding connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood in combination with specific situations.

[0049] In addition, when terms such as "first", "second", "third", etc. are used in the description of this application to describe various features, these terms are only used to distinguish these features and cannot be understood as indicating or implying the relevance, relative importance, or implicitly indicating the quantity of the indicated features.

[0050] In addition, this application specification describes exemplary embodiments by referring to idealized exemplary cross-sectional views and / or plan views and / or three-dimensional views. Therefore, differences from the shapes shown in the figures due to, for example, manufacturing techniques and / or tolerances are foreseeable. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown here, but should include deviations in the shapes caused by, for example, manufacturing. Therefore, the regions shown in the figures are substantially schematic, and their shapes are not for showing the actual shapes of the regions of the device nor for limiting the scope of the exemplary embodiments.

[0051] Meanwhile, this application uses specific terms to describe the embodiments of this specification. For example, "an embodiment", "one embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that the "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more at different positions in this application does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be appropriately combined.

[0052] Similarly, it should be noted that, in order to simplify the presentation of the disclosure of this application and thus help the understanding of one or more embodiments of the invention, in the foregoing description of the embodiments of this application, sometimes multiple features are grouped into one embodiment, drawing, or description thereof. However, this disclosure method does not mean that the features required by the subject matter of this application are more than those mentioned in the claims. In fact, the features of the embodiment are less than all the features of the single embodiment disclosed above.

[0053] Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of this application. Other variations may also fall within the scope of this application. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this application can be regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly introduced and described in this application.

Claims

1. A wafer transfer device, characterized in that, It includes a base, a transmission mechanism, a robotic arm assembly, a flipping mechanism, and a clamping mechanism. Among them, the transmission mechanism is arranged on the base and is configured to move relative to the base in the horizontal and vertical directions; the first end of the robotic arm assembly is connected to the transmission mechanism and is configured to rotate circumferentially around the connection end of the robotic arm assembly and the transmission mechanism; the flipping mechanism is connected to the second end of the robotic arm assembly and is configured to flip along the direction perpendicular to the base; the clamping mechanism is fixedly connected to the flipping mechanism and is used for clamping a wafer and flipping along the direction perpendicular to the base under the drive of the flipping mechanism.

2. The wafer transfer device according to claim 1, wherein A guide rail is provided on the base, and the transmission mechanism is installed on the guide rail and is configured to move along the guide rail.

3. The wafer transfer device according to claim 2, wherein The transmission mechanism includes a horizontal transmission mechanism and a vertical lifting mechanism. The horizontal transmission mechanism is installed on the guide rail and is configured to move along the guide rail. The first end of the vertical lifting mechanism is installed on the horizontal transmission mechanism and is configured to reciprocate in the vertical direction relative to the base.

4. The wafer transfer device according to claim 3, wherein, The robotic arm assembly includes a first robotic arm and a second robotic arm; the first end of the first robotic arm is vertically connected to the second end of the vertical lifting mechanism and is configured to rotate circumferentially around the second end of the horizontal transmission mechanism; the first end of the second robotic arm is horizontally connected to the top of the second end of the first robotic arm and is configured to perform circumferential movement around the top of the second end of the first robotic arm.

5. The wafer transfer device according to claim 4, wherein, The flipping mechanism is connected to the second end of the second robotic arm and is configured to flip along the direction perpendicular to the base at the second end of the second robotic arm.

6. The wafer transfer device according to claim 5, wherein, One end of the flipping mechanism away from the second robotic arm is horizontally connected to the clamping mechanism and drives the clamping mechanism to flip along the direction perpendicular to the base.

7. The wafer transfer device according to claim 1, wherein, The clamping mechanism includes: a carrying body, including a carrying part and a handle part integrally connected. A plurality of first clamping members are provided at the end of the carrying part; a clamping pusher, installed on the carrying part. One side of the clamping pusher close to the handle part of the carrying body is connected to a driving component and moves telescopically along the carrying part under the drive of the driving component. A plurality of second clamping members are provided at the end of the side of the clamping pusher away from the handle part of the carrying body. The first clamping members and the second clamping members are jointly used for clamping the wafer.

8. The wafer transfer device according to claim 7, wherein, Both the first clamping members and the second clamping members include two symmetric clamping components, which are arranged at the ends of the first clamping members and the second clamping members. A groove is formed between the two symmetric clamping components, and the groove is used for limiting the wafer.

9. The wafer transfer device according to claim 8, wherein, The clamping component is conical, and the inner side of the groove contacts the wafer at a point.

10. A wafer cleaning system, comprising a transfer robot arm, a wafer transfer rack, and a wafer cleaning unit, characterized in that, It also includes the wafer transfer device according to any one of claims 1 to 9, wherein, the transfer robotic arm and the wafer transfer device are respectively located on both sides of the wafer transfer rack. The transfer robotic arm is used to obtain the wafer and transfer the wafer to the wafer transfer rack; the wafer transfer device obtains and flips the wafer from the wafer transfer rack and then transfers it to the wafer cleaning unit.

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