Horizontal adjusting mechanism of wafer bearing table

Abstract

The utility model provides a horizontal adjusting mechanism of a wafer bearing table, which comprises a plurality of adjusting assemblies arranged along the circumferential direction of the wafer bearing table at intervals, and the adjusting assemblies are used for adjusting the height of the wafer bearing table. The adjusting assembly comprises a leveling block, a leveling base, a transmission piece and a driving mechanism, the driving mechanism is installed on the leveling base, and the driving mechanism can drive the transmission piece to drive the pushing part to move downwards so that the pushing part can push the leveling block to move in the direction close to the wafer bearing table. According to the utility model, the driving mechanism drives the transmission member to move downwards so as to push the leveling block to move towards the direction close to the wafer bearing table, vertical movement is converted into horizontal movement, the levelness of the wafer bearing table can be adjusted after the semiconductor equipment is installed, the requirement on the levelness in the actual use process is met, and the production efficiency is improved. And the defect of insufficient installation and maintenance space is overcome.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and more specifically, it relates to a horizontal adjustment mechanism for a wafer carrier stage. Background Art

[0002] In semiconductor equipment, during the actual process of wafer processing, the wafer carrier stage for carrying the wafer has certain flatness requirements to ensure that the actual position of the wafer during the process is consistent with the theoretical design, and at the same time, ensuring the flatness of the wafer can also guarantee the process stability during the process. The currently known solutions generally involve adjusting the flatness during the installation process of the equipment when different units are docked to ensure that the flatness of each unit is within a certain range. However, since there is a sequence in the equipment installation process, positioning pins are usually added between the sealing surfaces to ensure the relative position of the contact surfaces. Therefore, it is often difficult to adjust the flatness of the wafer carrier stage in the core area of the last unit, or it is at the limit of the Spec (standard) requirements. In addition, since the core components of the wafer process are usually not installed during the docking process, the previous horizontal adjustment and the flatness of the wafer carrier stage are often not exactly the same. If it is found that the horizontal requirements cannot be met subsequently, the workload is relatively large. Summary of the Utility Model

[0003] Based on the technical problems existing in the prior art, the utility model provides a horizontal adjustment mechanism for a wafer carrier stage, aiming to solve the technical problem that it is difficult to adjust the flatness of the wafer carrier stage after the installation of the previous equipment in the prior art.

[0004] To achieve the above object, according to the first aspect of the utility model, a horizontal adjustment mechanism for a wafer carrier stage is provided. The wafer carrier stage is disposed above the installation base of the semiconductor equipment. The horizontal adjustment mechanism includes a plurality of adjustment components spaced apart along the circumference of the wafer carrier stage. The adjustment components are used to adjust the height of the wafer carrier stage. Each adjustment component includes a leveling block, a leveling base, a transmission member, and a driving mechanism. The leveling block is disposed between the wafer carrier stage and the installation base and is slidably connected to the installation base. The leveling block has a first inclined surface, and the first inclined surface contacts the bottom edge of the wafer carrier stage. The leveling base is installed on the side wall of the installation base. The transmission member is slidably connected to the leveling base and is located above the leveling block. The transmission member has a pushing portion. The driving mechanism is installed on the leveling base, and the driving mechanism can drive the transmission member to drive the pushing portion to move downward, so that the pushing portion pushes the leveling block to move towards the wafer carrier stage.

[0005] Further, the leveling block includes a sliding portion and a transmission portion perpendicularly arranged to the sliding portion. A first inclined surface is connected between the surface of the transmission portion close to the wafer carrier stage and the surface of the sliding portion close to the wafer carrier stage. The sliding portion is located between the wafer carrier stage and the mounting base, the transmission portion is located outside the side wall of the wafer carrier stage, and a second inclined surface is provided on the side of the transmission portion away from the wafer carrier stage.

[0006] Wherein, the transmission member is a wedge block, and the wedge block has a third inclined surface adapted to the second inclined surface, and the third inclined surface is the pushing portion.

[0007] Furthermore, the driving mechanism includes a fixing block and a leveling bolt. The fixing block is fixedly connected above the leveling base, and the fixing block is located above the wedge block. The leveling bolt is threadedly connected to the fixing block, and the screw rod of the leveling bolt is used to abut against the wedge block.

[0008] Furthermore, the fixing block is provided with a threaded hole, and the leveling bolt passes through the threaded hole; the leveling base includes a side plate and a bottom plate connected to the bottom end of the side plate. A guiding groove is provided on the side plate, the side plate is spaced from the side wall of the wafer carrier stage, the bottom plate is connected to the side wall of the mounting base, and a slider adapted to the guiding groove is provided on the side of the wedge block close to the side plate.

[0009] Preferably, a limiting platform is provided on the side plate, the limiting platform is located below the transmission member, and the transmission member can slide between the fixing block and the limiting platform. A chute with an opening is formed between the bottom of the wafer carrier stage and the mounting base on the side wall of the mounting base, and the sliding portion slides in the chute; the sliding portion is adapted to the chute; the number of the adjusting components is three and they are evenly arranged along the circumferential direction of the wafer carrier stage.

[0010] Compared with the prior art, the beneficial effects of the horizontal adjustment mechanism of the wafer carrier stage provided by the present utility model are as follows:

[0011] (1) For the horizontal adjustment mechanism of the wafer carrier stage provided by the present utility model, by providing a plurality of adjusting components, the adjusting components drive the transmission member to move downward through the driving mechanism to push the leveling block to move towards the wafer carrier stage, so as to adjust the height of the wafer carrier stage through the first inclined surface of the leveling block, thereby realizing the horizontal adjustment of the core area inside the unit even after the semiconductor device has been positioned and the anchor bolts have been fixed through the plurality of adjusting components;

[0012] (2) For the horizontal adjustment mechanism of the wafer carrier stage provided by the present utility model, the driving mechanism drives the transmission member to move downward to push the leveling block to move towards the wafer carrier stage, converting the vertical movement into horizontal movement, and solving the drawback of insufficient installation and maintenance space on the side of the chamber during the actual equipment debugging process;

[0013] (3) The horizontal adjustment mechanism of the wafer carrier provided by the present utility model makes the adjustment of the levelness of the wafer carrier a controllable factor, thereby realizing the adjustment of the semiconductor device to a better process performance by adjusting the levelness of the wafer carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0015] Figure 1 Structural schematic diagram of the semiconductor device provided by the embodiment of the present utility model;

[0016] Figure 2 Structural schematic diagram of the horizontal adjustment mechanism of the wafer carrier provided by the embodiment of the present utility model;

[0017] Figure 3 Top view schematic diagram of the horizontal adjustment mechanism of the wafer carrier provided by the embodiment of the present utility model;

[0018] Figure 4 Cross-sectional view schematic diagram of the horizontal adjustment mechanism of the wafer carrier provided by the embodiment of the present utility model;

[0019] Figure 5 Assembly schematic diagram of the transmission member and the leveling base provided by the embodiment of the present utility model;

[0020] Figure 6 Assembly schematic diagram of the leveling block and the mounting base provided by the embodiment of the present utility model;

[0021] Figure 7 is Figure 4 Enlarged view of part A in

[0022] The label details involved in the above-mentioned drawings are as follows:

[0023] 100, chamber;

[0024] 10, wafer carrier;

[0025] 20, mounting base; 21, chute;

[0026] 30, adjustment assembly;

[0027] 31, leveling block; 311, first inclined surface; 312, sliding part; 313, transmission part; 314, second inclined surface;

[0028] 32. Leveling base; 321. Side plate; 322. Bottom plate; 323. Limit platform;

[0029] 33. Transmission part; 331. Third inclined plane; 332. Slide block;

[0030] 34. Driving mechanism; 341. Fixed block; 342. Leveling bolt. Detailed implementation mode

[0031] In order to make the purpose, technical solution and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0032] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. Without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other. The present utility model will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0033] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present utility model.

[0034] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality" means two or more unless otherwise specifically defined.

[0035] In order to illustrate the technical solution described in the present utility model, the following will be described with reference to specific drawings and embodiments.

[0036] See Figures 1 to 4As shown in the figure, an embodiment of the first aspect of the present utility model provides a horizontal adjustment mechanism for a wafer carrier stage. The wafer carrier stage 10 is disposed above the mounting base 20 of a semiconductor device. Among them, the semiconductor device has a chamber 100, the mounting base 20 is disposed in the chamber 100, and a wafer carrier stage 10 for carrying wafers is placed above the mounting base 20. The horizontal adjustment mechanism includes a plurality of adjustment components 30 spaced apart along the circumference of the wafer carrier stage 10. The adjustment components 30 are used to adjust the height of the wafer carrier stage 10. The adjustment component 30 includes a leveling block 31, a leveling base 32, a transmission member 33, and a driving mechanism 34. The leveling block 31 is disposed between the wafer carrier stage 10 and the mounting base 20 and is slidably connected to the mounting base 20. The leveling block 31 has a first inclined surface 311, and the first inclined surface 311 contacts the bottom edge of the wafer carrier stage 10. The leveling base 32 is mounted on the side wall of the mounting base 20. The transmission member 33 is slidably connected to the leveling base 32 and is located above the leveling block 31. The transmission member 33 has a pushing portion. The driving mechanism 34 is mounted on the leveling base 32. The driving mechanism 34 can drive the transmission member 33 to drive the pushing portion to move downward, so that the pushing portion pushes the leveling block 31 to move in the direction close to the wafer carrier stage 10.

[0037] In this embodiment, the leveling base 32 is a supporting component, which can be plate-shaped, block-shaped, or a combination of various shapes. The leveling block 31 can move horizontally to approach or move away from the wafer carrier stage 10. The transmission member 33 can move up and down in the vertical direction to approach or move away from the leveling block 31. The pushing portion of the transmission member 33 is used to push the leveling block 31 to move horizontally. The driving mechanism 34 is used to drive the transmission member 33 to move downward. The first inclined surface is a plane, and the first inclined surface 311 can play a role of guiding and supporting. After the bottom edge of the wafer carrier stage 10 contacts the first inclined surface 311, it will move along the first inclined surface 311. When performing the leveling adjustment, the driving mechanism 34 drives the transmission member 33 to drive the pushing portion to move downward, so that the pushing portion pushes the leveling block 31 to move horizontally in the direction close to the wafer carrier stage 10. The leveling block 31 abuts against the first inclined surface 311 and moves along the first inclined surface 311. The relative position between the wafer carrier stage 10 and the mounting base 20 is adjusted through the first inclined surface 311, so as to realize the adjustment of the levelness of the wafer carrier stage 10.

[0038] Applying the horizontal adjustment mechanism of the wafer carrier stage provided by the above embodiments of the present invention, by setting a plurality of adjustment components 30, the adjustment components 30 drive the transmission member 33 to move downward through the drive mechanism 34 to push the leveling block 31 to move towards the wafer carrier stage 10, so as to adjust the height of the wafer carrier stage 10 through the first inclined surface 311 of the leveling block 31. Thus, after the semiconductor equipment has been positioned and the feet are fixed, the leveling of the core area inside the unit can still be adjusted through a plurality of adjustment components 30; by driving the transmission member 33 to move downward through the drive mechanism 34 to push the leveling block 31 to move towards the wafer carrier stage, the vertical movement is converted into horizontal movement, solving the drawback of insufficient installation and maintenance space on the side of the chamber 100 during the actual equipment debugging process; the horizontal adjustment mechanism of the wafer carrier stage of the present invention makes the adjustment of the level of the wafer carrier stage 10 a controllable factor, so as to realize adjusting the semiconductor equipment to a better process performance by adjusting the level of the wafer carrier stage 10.

[0039] In other embodiments of the present invention, the drive mechanism 34 can drive the transmission member 33 to move up and down.

[0040] In other embodiments of the present invention, the first inclined surface 311 is an arc surface.

[0041] See Figure 4 As shown, in the embodiment of the present invention, the leveling block 31 includes a sliding portion 312 and a transmission portion 313 perpendicular to the sliding portion 312. A first inclined surface 311 is connected between the surface of the transmission portion 313 close to the wafer carrier stage 10 and the surface of the sliding portion 312 close to the wafer carrier stage 10. The sliding portion 312 is located between the wafer carrier stage 10 and the mounting base 20, the transmission portion 313 is located outside the side wall of the wafer carrier stage 10, and a second inclined surface 314 is provided on the side of the transmission portion 313 away from the wafer carrier stage 10; the transmission member 33 is a wedge-shaped block, and the wedge-shaped block has a third inclined surface 331 adapted to the second inclined surface 314, and the third inclined surface 331 is a pushing portion. Among them, the first inclined surface 311 is inclined downward from the transmission portion 313 to the sliding portion 312. When the leveling block 31 moves in the direction close to the wafer carrier stage 10, the wafer carrier stage 10 gradually rises. As Figure 7 shown, the distance between the highest point of the first inclined surface 311 and the upper surface of the sliding portion 312 is d. For example, if d is 0.5 mm, the height adjustment range of the wafer carrier stage 10 is 0 - 0.5 mm.

[0042] See Figure 4As shown in the figure, in the embodiment of the present utility model, the driving mechanism 34 includes a fixing block 341 and a leveling bolt 342. The fixing block 341 is fixedly connected above the leveling base 32, and the fixing block 341 is located above the wedge block. The leveling bolt 342 is threadedly connected to the fixing block 341, and the screw rod of the leveling bolt 342 is used to abut against the wedge block. The leveling bolt 342 passes through the fixing block 341. When adjusting the levelness, the nut of the leveling bolt 342 is screwed. The bottom of the screw rod of the leveling bolt 342 abuts against the transmission member 33, so that the transmission member 33 drives the third inclined surface 331 to move towards the leveling block 31. Under the cooperation of the third inclined surface 331 and the second inclined surface 314, the second inclined surface 314 and the leveling block 31 are driven to horizontally move towards the wafer chucking stage 10, changing the contact position between the first inclined surface 311 and the wafer chucking stage 10, and finely adjusting the height of the wafer chucking stage 10, thereby realizing the adjustment of the levelness of the wafer chucking stage 10.

[0043] See Figure 4 As shown in the figure, in the embodiment of the present utility model, the fixing block 341 is provided with a threaded hole (not shown in the figure), and the leveling bolt 342 passes through the threaded hole. The threaded connection between the two is realized through the internal thread of the threaded hole and the external thread on the screw rod of the leveling bolt 342. The above structure is simple and convenient for processing and operation.

[0044] See Figure 4 and Figure 5 As shown in the figure, in the embodiment of the present utility model, the leveling base 32 includes a side plate 321 and a bottom plate 322 connected to the bottom end of the side plate 321. The side plate 321 is provided with a guide groove (not shown in the figure). The side plate 321 is spaced from the side wall of the wafer chucking stage 10. The bottom plate 322 is connected to the side wall of the mounting base 20. A slider 332 matched with the guide groove is arranged on one side of the wedge block close to the side plate 321. Specifically, a guide groove is arranged on one side of the side plate 321 facing the wafer chucking stage 10, and the guide groove extends in the vertical direction. The slider 332 is connected in the guide groove. Among them, the slider 332 and the guide groove are of T-shaped structure. The cooperation of the guide groove and the slider 332 makes the sliding of the slider 332 in the guide groove more stable, and at the same time provides a clear sliding path for the slider 332, and the structure is stable and reliable.

[0045] See Figure 4 As shown in the figure, in the embodiment of the present utility model, a limit platform 323 is arranged on the side plate 321. The limit platform 323 is located below the transmission member 33, and the transmission member 33 can slide between the fixing block 341 and the limit platform 323. The limit platform 323 is spaced below the fixing block 341, so that the transmission member 33 is located between the fixing block 341 and the limit platform 323, and the limit platform 323 is used to block the transmission member 33 to limit the downward displacement of the transmission member 33.

[0046] See Figure 4 andFigure 6 As shown, in the embodiment of the present utility model, a chute 21 with an opening is formed on the side wall of the mounting base 20 between the bottom of the wafer carrier 10 and the mounting base 20, and the sliding portion 312 slides in the chute 21. A chute 21 is formed between the mounting base 20 and the wafer carrier 10, and the sliding portion 312 is arranged in the chute 21, so that the sliding portion 312 is restricted between the mounting base 20 and the wafer carrier 10 by using the chute 21.

[0047] See Figure 4 and Figure 6 As shown, in the embodiment of the present utility model, the sliding portion 312 is adapted to the chute 21, which can make the sliding portion 312 slide stably along the chute 21 and prevent the sliding portion 312 from slipping out of the chute 21.

[0048] See Figure 2 and Figure 3 As shown, in the embodiment of the present utility model, the number of the adjustment components 30 is three, and they are evenly arranged along the circumferential direction of the wafer carrier 10. The three adjustment components 30 are spaced from each other and evenly distributed along the circumferential direction of the wafer carrier 10. By adjusting each adjustment component 30 respectively, the levelness of the wafer carrier 10 can meet the process requirements. Among them, the number of the adjustment components 30 is two or more, which can be set according to the actual situation.

[0049] See Figure 1 As shown, according to the second aspect of the present utility model, a semiconductor device is provided, which includes a horizontal adjustment mechanism of a wafer carrier as described in any one of the embodiments of the first aspect. Since the semiconductor device in this embodiment includes the horizontal adjustment mechanism of the wafer carrier in the above embodiment, that is, the semiconductor device in this embodiment has all the technical features and technical effects of the embodiments of the above horizontal adjustment mechanism of the wafer carrier. For details, refer to the above embodiments and will not be repeated here.

[0050] In summary, implementing the horizontal adjustment mechanism of the wafer carrier provided in this embodiment has at least the following beneficial technical effects:

[0051] (1) By providing a plurality of adjustment components 30, the adjustment components 30 drive the transmission member 33 to move downward through the driving mechanism 34 to push the leveling block 31 to move towards the wafer carrier 10, so as to adjust the height of the wafer carrier 10 through the first inclined surface 311 of the leveling block 31. Thus, after the semiconductor device has been positioned and the feet have been fixed, the leveling of the core area inside the unit can still be adjusted through a plurality of adjustment components 30. And under the condition that the external shape structure and installation interface of the device remain unchanged, it is convenient to install and use, and can meet the adjustment requirements for levelness in the actual use process;

[0052] (2) The driving mechanism 34 drives the transmission member 33 to move downward to push the leveling block 31 to move toward the wafer carrier stage, converting the vertical movement into horizontal movement, which solves the disadvantage of insufficient installation and maintenance space on the side of the chamber 100 during the actual equipment debugging process;

[0053] (3) The horizontal adjustment mechanism of the wafer carrier stage of the present invention makes the adjustment of the level of the wafer carrier stage 10 a controllable factor, so as to realize adjusting the semiconductor equipment to a better process performance by adjusting the level of the wafer carrier stage 10.

[0054] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A horizontal adjustment mechanism for a wafer carrier stage, characterized in that The wafer carrier is disposed above the mounting base of the semiconductor device. The horizontal adjustment mechanism includes a plurality of adjustment components spaced apart along the circumference of the wafer carrier, and the adjustment components are used to adjust the height of the wafer carrier. Each adjustment component includes a leveling block, a leveling base, a transmission member, and a driving mechanism. The leveling block is disposed between the wafer carrier and the mounting base and is slidably connected to the mounting base. The leveling block has a first inclined surface that contacts the bottom edge of the wafer carrier. The leveling base is mounted on the side wall of the mounting base. The transmission member is slidably connected to the leveling base and is located above the leveling block. The transmission member has a pushing portion. The driving mechanism is mounted on the leveling base, and the driving mechanism can drive the transmission member to drive the pushing portion to move downward, so that the pushing portion pushes the leveling block to move toward the wafer carrier.

2. The horizontal adjustment mechanism of the wafer carrier according to claim 1, characterized in that, The leveling block includes a sliding portion and a transmission portion perpendicular to the sliding portion. A first inclined surface is connected between the surface of the transmission portion close to the wafer carrier and the surface of the sliding portion close to the wafer carrier. The sliding portion is located between the wafer carrier and the mounting base, the transmission portion is located outside the side wall of the wafer carrier, and a second inclined surface is provided on the side of the transmission portion away from the wafer carrier.

3. The horizontal adjustment mechanism of the wafer carrier according to claim 2, characterized in that, The transmission member is a wedge block, and the wedge block has a third inclined surface adapted to the second inclined surface, and the third inclined surface is the pushing portion.

4. The horizontal adjustment mechanism of the wafer carrier according to claim 3, characterized in that, The driving mechanism includes a fixing block and a leveling bolt. The fixing block is fixedly connected above the leveling base and is located above the wedge block. The leveling bolt is threadedly connected to the fixing block, and the screw rod of the leveling bolt is used to abut against the wedge block.

5. The horizontal adjustment mechanism of the wafer carrier according to claim 4, characterized in that, The fixing block is provided with a threaded hole, and the leveling bolt passes through the threaded hole. The leveling base includes a side plate and a bottom plate connected to the bottom end of the side plate.

6. The horizontal adjustment mechanism of the wafer carrier according to claim 5, characterized in that, A guiding groove is provided on the side plate. The side plate is spaced from the side wall of the wafer carrier. The bottom plate is connected to the side wall of the mounting base. A slider adapted to the guiding groove is provided on the side of the wedge block close to the side plate.

7. The horizontal adjustment mechanism of the wafer carrier according to claim 6, characterized in that, A limiting platform is provided on the side plate and is located below the transmission member. The transmission member can slide between the fixing block and the limiting platform.

8. The horizontal adjustment mechanism of the wafer susceptor according to claim 7, characterized in that, A chute with an opening is formed between the bottom of the wafer carrier and the mounting base on the side wall of the mounting base. The sliding portion slides in the chute; the sliding portion is adapted to the chute. The number of adjustment components is three and they are evenly arranged along the circumference of the wafer carrier.

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