Bearing jig for electronic packaging piece

Abstract

A bearing jig for an electronic package, the bottom surface of the electronic package being provided with an optical fiber connector and a plurality of conductive bumps, the bearing jig comprising: a bearing structure for bearing the electronic package; the accommodating groove is formed in the top of the bearing structure so as to correspond to and accommodate the plurality of conductive bumps; and the abdicating groove is arranged at the top of the bearing structure so as to correspond to and accommodate the optical fiber connecting piece. Through the implementation of the invention, the bearing structure is provided with the abdicating groove for accommodating the optical fiber connecting piece, so that the conductive bumps of the electronic packaging piece can be completely immersed in the soldering flux to be completely coated, and meanwhile, the optical fiber connecting piece is protected from being polluted by the soldering flux. Therefore, the speed of the manufacturing process can be increased, and the yield can be improved.

Description

Technical Field

[0001] The present application relates to a supporting fixture for electronic packages, and in particular to a supporting fixture for electronic packages with optical fiber connectors. Background Art

[0002] After the evolution of personal computers, mobile communications and artificial intelligence (AI), and stimulated by the changes in life and culture such as mobile Internet access, online shopping, video streaming and online games, modern communication technology has become increasingly eager for communication bandwidth, so optical fibers have begun to replace copper cables in large quantities. The industry has also developed semiconductor components that can be used for optical fiber communications.

[0003] However, if Figure 1 As shown, the conventional semiconductor package Sp for optical fiber communication is provided with an optical fiber socket Po on its lower surface for inserting and connecting an optical fiber (not shown in the figure), and when the conventional semiconductor package Sp is placed on the surface of a circuit board, it is necessary to first adhere flux to the surface of the solder ball Sb at the bottom of the semiconductor package Sp to facilitate the subsequent soldering operation. However, since the height / thickness of the optical fiber socket Po is usually greater than the diameter of the solder ball Sb, if the semiconductor package Sp is placed in a concave portion of a carrier Crr containing a solder flux Flx during the process of adhering the solder flux, and the solder ball Sb and the optical fiber socket Po are placed on the bottom surface of the concave portion of the carrier Crr at the same time, one side of the bottom of the semiconductor package Sp will be supported by the optical fiber socket Po, causing a part of the solder balls Sb also located at the bottom of the semiconductor package Sp to be unable to be completely immersed in the solder flux Flx, resulting in insufficient solder flux Flx adhered to the surface of the solder balls Sb, which in turn leads to the problem of poor soldering in the subsequent process, thereby resulting in a poor process yield. At the same time, the optical fiber socket Po disposed at the bottom of the semiconductor package Sp must be protected from contacting or adhering to the flux Flx to prevent the optical fiber socket Po from being contaminated or even damaged, thereby increasing the complexity of the process and slowing down the process rate.

[0004] Therefore, how to overcome the above-mentioned problems of the prior art has become a topic that needs to be solved urgently. Utility Model Content

[0005] In view of the various deficiencies of the above-mentioned prior art, the present application provides a supporting fixture for an electronic package, wherein a fiber optic connector and a plurality of conductive bumps are disposed on the bottom surface of the electronic package, and the supporting fixture comprises: a supporting structure for supporting the electronic package; a receiving groove disposed on the top of the supporting structure to correspond to and accommodate the plurality of conductive bumps; and a giving way groove disposed on the top of the supporting structure to correspond to and accommodate the fiber optic connector.

[0006] In the foregoing carrier fixture, the depth of the accommodation groove is greater than or equal to the height of the conductive bumps.

[0007] In the foregoing carrier fixture, the depth of the relief groove is greater than or equal to the height of the fiber optic connector.

[0008] In the foregoing carrier fixture, an overflow groove is formed on the outer side of the accommodation groove on the carrier structure.

[0009] In the foregoing carrier fixture, the carrier structure is further provided with a leveling structure. A leveling portion is provided at the bottom of the leveling structure, and the leveling structure can move along the top surface of the carrier structure. The moving direction of the leveling structure is perpendicular to the direction from the accommodation groove to the relief groove.

[0010] In the foregoing carrier fixture, the leveling structure has an opening that penetrates the leveling structure, and the opening corresponds to the accommodation groove when the leveling structure is located above the accommodation groove.

[0011] As can be seen from the above, the carrier fixture for an electronic package of the present application has a relief groove for accommodating a fiber optic connector provided on the top surface of the carrier structure. Therefore, even if the height of the fiber optic connector is greater than the height or diameter of the conductive bumps, when the electronic package is placed on the carrier structure, the conductive bumps can be completely immersed in the solder flux in the accommodation groove. While the surfaces of all the conductive bumps are completely coated with the solder flux, the fiber optic connector can be protected from being contaminated by the solder flux. Therefore, not only can the process rate be accelerated, but the yield can also be improved. Description of the Drawings

[0012] Figure 1 It is a cross-sectional schematic view of an existing semiconductor package adhering to solder flux.

[0013] Figure 2A It is a three-dimensional schematic view of an embodiment of the carrier fixture for an electronic package of the present application.

[0014] Figure 2B It is a cross-sectional schematic view of an embodiment of the carrier fixture for an electronic package of the present application.

[0015] Description of the Main Component Symbols

[0016] 1: Carrier fixture

[0017] 10: Carrier structure

[0018] 11: Accommodation groove

[0019] 12: Relief groove

[0020] 13: Overflow groove

[0021] 20: Leveling structure

[0022] 21 Flattening part

[0023] 22 Opening

[0024] Sp Semiconductor package

[0025] Po Fiber optic socket

[0026] Sb Solder ball

[0027] C Electronic package

[0028] Co Fiber optic connector

[0029] Cb Conductive bump

[0030] Crr Carrier tray

[0031] Flx Flux

[0032] h1, h2 Height

[0033] d1, d2 Depth

[0034] F1, F2 Direction Detailed implementation manners

[0035] The following illustrates the implementation manners of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.

[0036] It should be noted that the structures, ratios, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the implementation conditions of the present application. Therefore, they do not have any technical substance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present application can produce and the purposes that can be achieved, should still fall within the scope that the technical content disclosed in the present application can cover. At the same time, the terms such as "upper", "first", "second", "third", "one", etc. cited in this specification are only for the convenience of clear narration and are not used to limit the implementation scope of the present application. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope that the present application can implement.

[0037] Figure 2A This is a perspective view of an embodiment of the carrier fixture for an electronic package of the present application. Figure 2B This is a cross-sectional view of an embodiment of the carrier fixture for an electronic package of the present application.

[0038] Such as Figure 2A And Figure 2BAs shown in the figure, this embodiment provides a carrier fixture 1 for an electronic package C. The electronic package C is, for example, a silicon photonics integrated circuit, and a fiber optic connector Co and a plurality of conductive bumps Cb are provided on its bottom surface. Among them, the fiber optic connector Co is, for example, a fiber optic socket for inserting and connecting a fiber optic (not shown in the figure). The conductive bumps Cb are, for example, solder balls used to solder the electronic package C to an external circuit.

[0039] The carrier fixture 1 includes a carrier structure 10; a receiving groove 11; and a relief groove 12. The carrier structure 10 is, for example, a carrier platform for carrying the electronic package C. The receiving groove 11 is provided at the top of the carrier structure 10, and its position, shape and size correspond to the plurality of conductive bumps Cb on the bottom surface of the electronic package C. Moreover, the depth d1 of the receiving groove 11 is greater than or equal to the height (diameter) h1 of these conductive bumps Cb, so that these conductive bumps Cb can be received therein. The relief groove 12 is also provided at the top of the carrier structure 10, and its position, shape and size correspond to the fiber optic connector Co connected to the bottom surface of the electronic package C. And the depth d2 of the relief groove 12 is greater than or equal to the height h2 of the fiber optic connector Co to receive the fiber optic connector Co.

[0040] When using this carrier fixture 1, first, an appropriate amount of flux Flx is loaded into the receiving groove 11 on its carrier structure 10, so that when the electronic package C is placed on the carrier structure 10, the plurality of conductive bumps Cb provided on the bottom surface of the electronic package C can all be received in the receiving groove 11, and these conductive bumps Cb can all be completely immersed in the flux Flx contained in the receiving groove 11, so that the surface of each conductive bump Cb can be covered by the flux Flx. At this time, the fiber optic connector Co provided on the bottom surface of the electronic package C is received in the relief groove 12 on the carrier structure 10. Therefore, even if the height h2 of the fiber optic connector Co is greater than the height (diameter) h1 of these conductive bumps Cb, the electronic package C will not be lifted by the fiber optic connector Co during placement, resulting in the conductive bumps Cb not being able to be completely immersed in the flux Flx. Moreover, even if the plurality of conductive bumps Cb located on the bottom surface of the electronic package C have all been immersed in the flux Flx in the receiving groove 11, the fiber optic connector Co can also be protected and blocked by the relief groove 12, so it can not be contaminated by the flux Flx, thus avoiding being contaminated or even eroded by the flux Flx.

[0041] In some preferred embodiments, an overflow groove 13 may also be formed outside the receiving groove 11 on the carrier structure 10. Therefore, if the flux Flx in the receiving groove 11 overflows, the overflowed flux Flx can be pushed or guided into the overflow groove 13 for accommodation.

[0042] In some other preferred embodiments, a leveling structure 20 movable along the top surface of the carrier structure 10 may be further provided on the carrier structure 10. Preferably, the moving direction F2 of the leveling structure 20 is perpendicular to the direction F1 from the accommodation groove 11 towards the relief groove 12. A leveling portion 21 is provided at the bottom of the leveling structure 20. The bottom end of the leveling portion 21 may be planar or linear. The planar or linear leveling portion 21 is parallel to the top surface of the carrier structure 10, so that when the leveling structure 20 moves along the top surface of the carrier structure 10 and in the direction F2, the top surface of the solder flux Flx can be leveled, and the excess solder flux Flx can be pushed away from the top surface of the carrier structure 10 and into the overflow groove 13 for accommodation. And since the moving direction F2 of the leveling structure 20 is perpendicular to the direction F1 from the accommodation groove 11 towards the relief groove 12, the solder flux Flx will not be pushed towards and into the relief groove 12 accommodating the optical fiber connector Co when being pushed away from the top surface of the carrier structure 10, thereby avoiding the optical fiber connector Co accommodated in the relief groove 12 from being contaminated by the excess solder flux Flx.

[0043] In addition, an opening 22 may be provided on the leveling structure 20. The opening 22 communicates the top end and the bottom end of the leveling structure 20 and penetrates through the leveling structure 20, and when the leveling structure 20 moves above the accommodation groove 11, the opening 22 exactly corresponds to the accommodation groove 11, so that the accommodation groove 11 can be filled with the solder flux Flx via the opening 22.

[0044] In summary, the carrier jig for an electronic package of the present application mainly has a relief groove for accommodating an optical fiber connector on the top surface of the carrier structure. Therefore, even if the height of the optical fiber connector is greater than the height (diameter) of the conductive bumps, when the electronic package is placed on the carrier structure, these conductive bumps can be completely immersed in the solder flux in the accommodation groove, so that the surfaces of all the conductive bumps are completely coated with the solder flux, while protecting the optical fiber connector from being contaminated by the solder flux. Therefore, not only can the process rate be accelerated, but also the yield can be improved.

[0045] The above embodiments are only used to exemplarily illustrate the principle and its effects of the present application, rather than to limit the present application. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the scope of the protection of the rights of the present application shall be as listed in the claims.

Claims

1. A carrier fixture for an electronic package, characterized in that, The bottom surface of the electronic package is provided with an optical fiber connector and a plurality of conductive bumps. The fixture includes: a carrier structure for carrying the electronic package; a receiving groove provided at the top of the carrier structure to correspondingly receive the plurality of conductive bumps; and a relief groove provided at the top of the carrier structure to correspondingly receive the optical fiber connector.

2. The carrier fixture according to claim 1, characterized in that, The depth of the receiving groove is greater than or equal to the height of the conductive bumps.

3. The carrying fixture according to claim 1, wherein The depth of the relief groove is greater than or equal to the height of the optical fiber connector.

4. The carrier fixture according to claim 1, wherein, An overflow groove is formed on the outside of the receiving groove on the carrier structure.

5. The carrier fixture according to claim 1, characterized in that, The carrier structure is further provided with a leveling structure. A leveling portion is provided at the bottom of the leveling structure, and the leveling structure can move along the top surface of the carrier structure.

6. The carrier fixture according to claim 5, wherein, The moving direction of the leveling structure is perpendicular to the direction from the receiving groove to the relief groove.

7. The carrier fixture according to claim 5, wherein The leveling structure has an opening that penetrates the leveling structure, and when the leveling structure is located above the receiving groove, the opening corresponds to the receiving groove.

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