Pressing plate for temporarily pressing substrate during chip mounting
Through the electromagnetic fixing seat and magnetic pressure-absorbing plate structure, the problem that traditional pressure plates cannot quickly adapt to changes in substrate width is solved, and the rapid adjustment of pressure plates and efficient chip mounting is achieved.
Patent Information
- Application Number
- CN202422238384.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-12
AI Technical Summary
The width of the traditional press plate is fixed, and it cannot quickly adapt to the changes in the width of different substrates, resulting in low processing efficiency.
The electromagnetic fixing seat and magnetic pressure-absorbing plate structure are adopted to quickly replace the piezoelectric plate through the power-on and power-off of the electromagnet, adapting to different substrate widths.
It realizes that the fixing bolts are not required to be removed when the substrate width changes, and the compaction plate is quickly replaced, which improves the working efficiency of the substrate mounting chip.
Smart Images
Figure CN223140761U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a pressing plate for temporarily pressing a substrate during chip mounting, belonging to the technical field of chip mounting. Background Art
[0002] Chip mounting is completed in a die bonder. Specifically: the two sides of the substrate are respectively placed on the front and rear slide rails in the die bonder and can slide on the slide rails. The substrate is pressed down by the pressing plate, and then the robot mounts the chip on the substrate.
[0003] As Figure 1 、 2 shown, the traditional pressing plate includes a fixing plate 11 at the rear side and a pressing and fixing plate 2 at the front side. The pressing and fixing plate 2 is lower than the fixing plate 11. There is a vertically arranged connecting member such as a connecting column or a connecting plate connecting the rear end of the fixing plate 11 and the front end of the pressing and fixing plate 2, and the pressing and fixing plate 2 and the fixing plate 11 become a rigidly connected whole. The fixing plate 11 is provided with bolt holes 111 for fixing bolts to fix the fixing plate 11 on the mounting body 8 above the rear slide rail. The middle of the pressing and fixing plate 2 is a rectangular space 23 that is open up and down. On the left and right sides of the rectangular space 23 are the left panel 21 and the right panel 22 of the pressing and fixing plate 2. On the left panel 21 and the right panel 22 are respectively provided with bolt slots 24 that run through up and down in the front-rear direction. Pressing claws 5 are respectively provided on the left panel 21 and the right panel 22. The pressing claw 5 has a pressing arm 51. One end of the pressing arm 51 is the upper pressing end 511, and the other end is the lower pressing end 512. The upper pressing end 511 presses on the left panel 21 or the right panel 22, and the lower pressing end 512 turns and extends downward from the rectangular space 23 to the lower side of the pressing and fixing plate 2 for pressing the lower substrate 9. There is a bolt hole in the middle of the pressing arm 51, and an adjusting bolt 52 passes through the bolt hole and the bolt slot 24 to apply a downward pressure to the pressing arm 51 (the adjusting bolt 52 is provided with a nut below the bolt slot 24), so that the lower pressing end 512 can tightly press the substrate 9.
[0004] The front and rear width of the above traditional pressing plate is fixed, while the width of the substrate has various types. When the width of the substrate changes, it is necessary to remove the fixing bolts and replace the pressing plate with the corresponding width, which is very time-consuming and laborious and reduces the processing efficiency. Content of the Utility Model
[0005] The technical problem to be solved by the utility model is: how to adapt to the width change of different substrates, quickly adjust the width of the pressing plate, and improve the processing efficiency.
[0006] In response to the above problems, the technical solution proposed by the utility model is:
[0007] A pressing plate used for temporarily pressing a substrate during chip mounting, comprising an electromagnetic fixing seat and a pressing and fixing plate. The electromagnetic fixing seat has a fixing plate and a magnetic attraction frame rigidly connected to the fixing plate. The frame edges on both the left and right sides of the magnetic attraction frame are magnetic attraction side platforms with built-in electromagnets. Between the two magnetic attraction side platforms is a cavity inside the frame. The left and right sides of the pressing and fixing plate respectively have magnetic attraction pressing plates rigidly connected to the pressing and fixing plate. The height of the pressing and fixing plate is lower than that of the magnetic attraction pressing plates. When the electromagnet is powered on, the magnetic attraction pressing plates on both sides of the pressing and fixing plate are firmly attracted to the magnetic attraction side platforms on both the left and right sides of the magnetic attraction frame, and the pressing and fixing plate can press the substrate below from the cavity inside the frame.
[0008] A plurality of mounting holes are provided on the magnetic attraction side platform from front to back, and the electromagnet composed of an iron core and a coil wound around the iron core is installed in the mounting holes.
[0009] A cover plate that covers the electromagnet and is fixed to the magnetic attraction side platform is provided on the magnetic attraction side platform.
[0010] The coil is connected to an external DC power supply through a power line, and a power button capable of disconnecting and connecting the power line is provided on the fixing plate.
[0011] The middle of the pressing and fixing plate has a rectangular space that communicates up and down. The left and right sides are a left panel and a right panel. Pressing claws are respectively provided on the left panel and the right panel. One end of the pressing claw is a downward pressing end, and the downward pressing end turns and extends downward from the rectangular space to the lower side of the pressing and fixing plate for pressing the substrate below.
[0012] The left panel and the right panel respectively have bolt slots that communicate up and down and run in the front-back direction. The pressing claw has a pressing arm. The downward pressing end is provided at one end of the pressing arm. The other end of the pressing arm is an upward pressing end, and the upward pressing end presses on the left panel or the right panel. There is a bolt hole in the middle of the pressing arm, and a pressure regulating bolt passes through the bolt hole and the bolt slot to apply a downward pressure to the pressing arm so that the downward pressing end presses the substrate tightly.
[0013] The height of the fixing plate is higher than that of the magnetic attraction frame, and the front end of the fixing plate is connected to the rear end of the magnetic attraction frame through a connecting member.
[0014] The fixing plate, the connecting member, and the magnetic attraction frame are integrally formed.
[0015] The pressing and fixing plate has multiple specifications with different widths in the front-back direction.
[0016] Beneficial effects: When the width of the substrate used in the application process changes, the electromagnetic fixing seat can maintain a fixed state with the installation body in the chip die bonder. By cutting off and connecting the power supply of the electromagnet, the pressing and fixing plate can be quickly replaced, so that the pressing plate can easily adapt to various substrates with different widths, thereby improving the working efficiency of chip mounting on the substrate. Description of the Drawings
[0017] Figure 1Schematic three-dimensional view of a platen used in the prior art for chip mounting during application;
[0018] Figure 2 Schematic three-dimensional view of the prior art and the present technology using a press jaw;
[0019] Figure 3 Schematic three-dimensional view of the platen described in the present application;
[0020] Figure 4 Schematic three-dimensional view of the electromagnetic fixing seat of the platen described in the present application;
[0021] Figure 5 Schematic three-dimensional view of the cover plate of the platen described in the present application;
[0022] Figure 6 Schematic three-dimensional view of the pressing plate of the platen described in the present application;
[0023] Figure 7 Schematic three-dimensional view of pressing plates of different specifications of the platen described in the present application.
[0024] In the figure: 1. Electromagnetic fixing seat; 11. Fixing plate; 111. Bolt hole; 12. Magnetic attraction frame; 121. Magnetic attraction side platform; 122. Inner cavity of the frame; 123. Cover plate; 2. Pressing plate; 21. Left panel; 22. Right panel; 23. Rectangular space; 24. Bolt slot; 3. Magnetic attraction platen; 4. Electromagnet; 41. Iron core; 42. Coil; 5. Press jaw; 51. Pressing arm; 511. Upper pressing end; 512. Lower pressing end; 52. Pressure regulating bolt; 6. Power cord; 7. Power button; 8. Installation body; 9. Substrate. Detailed implementation manners
[0025] The following further describes the present utility model in conjunction with the attached drawings:
[0026] As Figure 3 、 4As shown in FIGS. 6, a pressing plate for temporarily pressing a substrate during chip mounting includes an electromagnetic fixing seat 1 and a pressing plate 2. The electromagnetic fixing seat 1 has a fixing plate 11 and a magnetic attracting frame 12 rigidly connected to the fixing plate 11. The frame edges on both the left and right sides of the magnetic attracting frame 12 are magnetic attracting side platforms 121 with built-in electromagnets 4. Between the two magnetic attracting side platforms 121 is a frame inner cavity 122. The left and right sides of the pressing plate 2 respectively have magnetic attracting pressing plates 3 rigidly connected to the pressing plate 2. The height of the pressing plate 2 is lower than that of the magnetic attracting pressing plates 3. When the electromagnet 4 is energized, the magnetic attracting pressing plates 3 on both sides of the pressing plate 2 are firmly attracted to the magnetic attracting side platforms 121 on the left and right sides of the magnetic attracting frame 12, and the pressing plate 2 can press the underlying substrate 9 from the frame inner cavity 122. In application, the electromagnetic fixing seat 1 is fixed to the mounting body 8 in the chip die bonder through the fixing plate 11 and fixing bolts. When the width of the substrate 9 used in the application process changes, the electromagnetic fixing seat 1 remains fixed to the mounting body 8 in the chip die bonder. By cutting off the power supply of the electromagnet 4, removing the original pressing plate 2, replacing it with a pressing plate 2 of a suitable width, and then turning on the power supply, it is not necessary to replace the pressing plate 2 by disassembling the fixing bolts as in the prior art. Thus, the pressing plate can easily and quickly adapt to the pressing of various substrates 9 with different widths, thereby improving the working efficiency of chip mounting on the substrate 9.
[0027] As Figure 7 shown, the pressing plate 2 has various specifications with different widths in the front-rear direction, but the front-rear length of the magnetic attracting frame 12 is set based on the width of the substrate 9 with the smallest width.
[0028] As Figure 4 shown, a plurality of mounting holes are provided on the magnetic attracting side platform 121 from front to back, and the electromagnet 4 composed of an iron core 41 and a coil 42 wound around the iron core 41 is installed in the mounting holes.
[0029] As Figure 3 、 5 shown, a cover plate 123 fixed to the magnetic attracting side platform 121 and covering the electromagnet 4 is provided on the magnetic attracting side platform 121 to prevent the upper end surface of the electromagnet 4 from being exposed. The cover plate 123 can be fixed by bolts or by welding.
[0030] As Figure 4 shown, the coil 42 is connected to an external DC power supply through a power cord 6, and a power button 7 for disconnecting and connecting the power cord 6 is provided on the fixing plate 11. When replacing the pressing plate 2, only need to press the power button 7 once.
[0031] The height of the fixing plate 11 is higher than that of the magnetic attracting frame 12. The front end of the fixing plate 11 is connected to the rear end of the magnetic attracting frame 12 through a connecting member. The fixing plate 11, the connecting member, and the magnetic attracting frame 12 are integrally formed.
[0032] As Figure 6As shown in the figure, the middle of the pressing plate 2 has a rectangular space 23 that communicates up and down. The left and right sides are the left panel 21 and the right panel 22. Pressing claws 5 are respectively provided on the left panel 21 and the right panel 22. One end of the pressing claw 5 is the downward pressing end 512, and the downward pressing end 512 turns and extends downward from the rectangular space 23 to the lower side of the pressing plate 2 for pressing the substrate 9 below.
[0033] On the left panel 21 and the right panel 22, there are respectively bolt slots 24 that communicate up and down and run in the front-back direction. The pressing claw 5 has a pressing arm 51. The downward pressing end 512 is provided at one end of the pressing arm 51, and the other end of the pressing arm 51 is the upward pressing end 511. The upward pressing end 511 presses on the left panel 21 or the right panel 22. There is a bolt hole in the middle of the pressing arm 51, and a pressure regulating bolt 52 passes through the bolt hole and the bolt slot 24 to apply a downward pressure to the pressing arm 51 so that the downward pressing end 512 presses the substrate 9 tightly. The setting of the bolt slot 24 enables the pressing claw 5 to move the pressing position back and forth as needed.
[0034] The above embodiments are only used to describe the present invention more clearly and should not be regarded as limiting the protection scope covered by the present invention. Any equivalent form of modification should be regarded as falling within the protection scope covered by the present invention.
Claims
1. A pressing plate for temporarily pressing a substrate during chip mounting, characterized in that: It includes an electromagnetic fixing base (1) and a pressing plate (2). The electromagnetic fixing base (1) has a fixing plate (11) and a magnetic attraction frame (12) rigidly connected to the fixing plate (11). The frame edges on both the left and right sides of the magnetic attraction frame (12) are magnetic attraction side platforms (121) with built-in electromagnets (4). Between the two magnetic attraction side platforms (121) is a cavity (122) inside the frame. The left and right sides of the pressing plate (2) respectively have magnetic attraction pressing plates (3) rigidly connected to the pressing plate (2). The height of the pressing plate (2) is lower than that of the magnetic attraction pressing plates (3). When the electromagnet (4) is powered on, the magnetic attraction pressing plates (3) on both sides of the pressing plate (2) are firmly attracted to the magnetic attraction side platforms (121) on both the left and right sides of the magnetic attraction frame (12), and the pressing plate (2) can press the substrate (9) below from the cavity (122) inside the frame.
2. The pressing plate for temporarily pressing the substrate during chip mounting according to claim 1, wherein: A plurality of mounting holes are provided on the magnetic attraction side platform (121) from front to back, and the electromagnet (4) composed of an iron core (41) and a coil (42) wound around the iron core (41) is installed in the mounting holes.
3. The pressing plate for temporarily pressing the substrate during chip mounting according to claim 2, wherein: A cover plate (123) that covers the electromagnet (4) and is fixed to the magnetic attraction side platform (121) is provided on the magnetic attraction side platform (121).
4. The pressing plate for temporarily pressing the substrate during chip mounting according to claim 2, wherein: The coil (42) is connected to an external DC power supply through a power cord (6), and a power button (7) capable of disconnecting and connecting the power cord (6) is provided on the fixing plate (11).
5. The pressing plate for temporarily pressing the substrate during chip mounting according to claim 1, wherein: The middle of the pressing plate (2) has a rectangular space (23) that communicates up and down. The left and right sides are a left panel (21) and a right panel (22). Pressing claws (5) are respectively provided on the left panel (21) and the right panel (22). One end of the pressing claw (5) is a downward pressing end (512), and the downward pressing end (512) turns and extends downward from the rectangular space (23) to the lower side of the pressing plate (2) for pressing the substrate (9) below.
6. The pressing plate for temporarily pressing the substrate during chip mounting according to claim 5, wherein: Bolting slots (24) that communicate up and down and run in the front-back direction are respectively provided on the left panel (21) and the right panel (22). The pressing claw (5) has a pressing arm (51). The downward pressing end (512) is provided at one end of the pressing arm (51), and the other end of the pressing arm (51) is an upward pressing end (511). The upward pressing end (511) presses on the left panel (21) or the right panel (22). A bolt hole is in the middle of the pressing arm (51), and a pressure regulating bolt (52) passes through the bolt hole and the bolting slot (24) to apply a downward pressure to the pressing arm (51) so that the downward pressing end (512) presses the substrate (9) tightly.
7. The pressing plate for temporarily pressing the substrate during chip mounting according to claim 1, wherein: The height of the fixing plate (11) is higher than that of the magnetic attraction frame (12), and the front end of the fixing plate (11) is connected to the rear end of the magnetic attraction frame (12) through a connecting member.
8. The pressing plate for temporarily pressing the substrate during chip mounting according to claim 7, characterized in that: The fixing plate (11), the connecting member, and the magnetic attraction frame (12) are integrally formed.
9. The pressing plate for temporarily pressing the substrate during chip mounting according to any one of claims 1-8, characterized in that: The pressing plate (2) has various specifications with different widths in the front-back direction.