Domain controller with heat dissipation mechanism and vehicle

Abstract

The utility model discloses a domain controller with a heat dissipation mechanism, which comprises a shell and a mainboard arranged in the shell, and the shell is provided with an air inlet and an air outlet; a conductive metal elastic sheet is arranged on the main board; the area controller further comprises a fan assembly which is arranged in the shell, the fan assembly comprises fan blades and a flexible circuit board electrically connected with the fan blades, the flexible circuit board is provided with a conductive area, and the fan assembly is inserted into the main board so that the metal elastic pieces can abut against the conductive area correspondingly in an interference mode. Therefore, the main board is electrically connected with the fan assembly.

Description

Technical Field

[0001] The utility model relates to a heat dissipation mechanism, in particular to a domain controller with a heat dissipation mechanism. Background Art

[0002] In order to solve the heat dissipation problem of the domain controller, most current domain controllers have a cooling system. One of the cooling systems is to use a fan to blow air for heat dissipation and cooling.

[0003] When using a fan as the cooling system, the fan is generally connected to the female end of the circuit board of the domain controller through a connection wire joint. Such a connection method generally requires an operator to complete it manually, which takes a lot of working hours. Moreover, the force of manual wiring insertion is uncontrollable. Excessive insertion force is likely to cause the stress of the circuit board to exceed the standard and damage the circuit board. Too small insertion force is likely to cause poor phenomena such as virtual insertion and incomplete insertion.

[0004] Not only that, the fan connection wire generally needs to reserve a certain length for easy connection and insertion by the operator. Such a long wire is suspended in the domain controller housing, which will generate vibration and bring noise risks. Summary of the Utility Model

[0005] One of the purposes of the utility model is to provide a domain controller with a heat dissipation mechanism, which can realize the electrical connection between the heat dissipation mechanism and the main board of the domain controller without using a connection wire, thereby avoiding many adverse effects brought by the connection wire.

[0006] In order to achieve the above purpose, the utility model proposes a domain controller with a heat dissipation mechanism, which includes a housing and a main board arranged in the housing, wherein:

[0007] The housing is provided with an air inlet and an air outlet;

[0008] The main board is provided with a conductive metal elastic sheet;

[0009] The domain controller further includes a fan assembly, which is arranged in the housing. The fan assembly includes a fan blade and a flexible circuit board electrically connected to the fan blade. The flexible circuit board is provided with a conductive area. The fan assembly is inserted on the main board so that the metal elastic sheet is in interference fit and correspondingly abuts against the conductive area to realize the electrical connection between the main board and the fan assembly.

[0010] Further, in the domain controller of the utility model, the end of the metal elastic sheet includes an arc-shaped convex part with elastic deformation for abutting against the conductive area and an arc-shaped guiding part connected to the arc-shaped convex part.

[0011] Further, in the domain controller of the utility model, the air inlet or the air outlet is arranged at a position corresponding to the fan assembly.

[0012] Furthermore, in the domain controller of the present utility model, there are vertical heat dissipation fins inside the housing.

[0013] Furthermore, in the domain controller of the present utility model, there is a heat dissipation boss protruding from the surface of the housing, and the top surface of the heat dissipation boss has a heat dissipation adhesive layer that contacts at least the chip of the main board.

[0014] Furthermore, in the domain controller of the present utility model, the housing includes an upper cover and a lower cover connected together. The inner surface of the upper cover has an upper cover card slot, and the inner surface of the lower cover is provided with a lower cover card slot. The two ends of the fan assembly in the height direction are respectively clamped in the upper cover card slot and the lower cover card slot.

[0015] Furthermore, in the domain controller of the present utility model, the air inlet is arranged on the opposite side of the air outlet.

[0016] Furthermore, in the domain controller of the present utility model, there are at least two conductive regions provided on the flexible circuit board, and at least two metal elastic pieces corresponding in number are provided on the main board.

[0017] Furthermore, in the domain controller of the present utility model, the fan assembly further includes:

[0018] A rigid inner frame, on which the fan blades and the flexible circuit board are arranged;

[0019] A flexible outer frame, which is sleeved outside the rigid inner frame, and the flexible outer frame has a flexible connection part connected to the main board and the housing.

[0020] Furthermore, in the domain controller of the present utility model, the flexible connection part is set as a tapered connection pin extending in the height direction.

[0021] Furthermore, in the domain controller of the present utility model, the radial cross-sectional area of the connection pin gradually increases from the end to the center.

[0022] Another object of the present utility model is to provide a vehicle having the domain controller as described above.

[0023] For the domain controller of the present utility model, the electrical connection between the heat dissipation mechanism and the main board of the domain controller can be achieved without using connecting wires. The installation process is stable and easy to operate, and the automatic assembly of the production line can be easily realized. Moreover, there are no many problems such as excessive stress on the board or virtual insertion caused by manual connection wires.

[0024] Since the domain controller of the present utility model does not use connecting wires, the noise problem caused by the long wires shaking and colliding inside the product is eliminated. Brief Description of the Drawings

[0025] Figure 1 Disclosed is a domain controller with a heat dissipation mechanism connected by connection lines.

[0026] Figure 2 Shows a schematic diagram of the external structure of the domain controller according to the present invention in an embodiment from one perspective.

[0027] Figure 3 Shows a schematic diagram of the external structure of the domain controller according to the present invention in an embodiment from another perspective.

[0028] Figure 4 Shows the main board and fan assembly of the domain controller according to the present invention in an embodiment.

[0029] Figure 5 Shows the structure of the domain controller according to the present invention in an embodiment from a top-down perspective.

[0030] Figure 6 is Figure 5 a cross-sectional view taken along line B-B in

[0031] Figure 7 is Figure 6 a partial enlarged view at C in

[0032] Figure 8 Shows a schematic diagram of a partially disassembled fan assembly of the domain controller according to the present invention in an embodiment from one perspective.

[0033] Figure 9 Shows a schematic diagram of a partially disassembled fan assembly of the domain controller according to the present invention in an embodiment from one perspective.

[0034] Figure 10 Shows a schematic diagram of the split structure of the fan assembly of the domain controller according to the present invention in an embodiment.

[0035] Figure 11 Shows a schematic diagram of the split structure of the domain controller according to the present invention in an embodiment.

[0036] Figure 12 Shows the structure inside the housing of the domain controller according to the present invention in an embodiment.

[0037] Figure 13 is Figure 5 a cross-sectional view taken along line D-D in

[0038] Figure 14Shows the main board of the domain controller according to the present utility model in another embodiment.

[0039] Figure 15 Shows the main board and the fan assembly of the domain controller according to the present utility model in another embodiment. Detailed implementation manners

[0040] The domain controller and the vehicle according to the present utility model will be further explained and described below in conjunction with the accompanying drawings of the specification and specific embodiments. However, such explanations and descriptions shall not unduly limit the technical solutions of the present utility model.

[0041] Figure 1 Shows a domain controller with a heat dissipation mechanism connected by connecting wires.

[0042] As Figure 1 shown, in order to solve the heat dissipation problem of the domain controller, a fan 300 is connected to the main board 2 of the domain controller, and the fan 300 is connected to the main board 2 of the domain controller through a connecting wire 400.

[0043] Such a connection method generally needs to be completed manually by an operator, which takes a relatively long time, and the force of manual plugging of the wire is uncontrollable. Excessive insertion force is likely to cause the stress of the circuit board to exceed the standard and damage the circuit board. Too small insertion force is likely to cause poor phenomena such as loose insertion and incomplete insertion.

[0044] Moreover, a certain length generally needs to be reserved for the fan connecting wire to facilitate the connection and plugging by the operator. In this way, the too long wire is suspended in the domain controller housing, which will generate vibrations and bring noise risks.

[0045] In order to solve the above problems, in one embodiment of the present utility model, a domain controller is proposed that can realize the electrical connection between the heat dissipation mechanism and the main board without using a connecting wire.

[0046] Figure 2 Shows a schematic diagram of the external structure of the domain controller according to the present utility model from one perspective in one embodiment.

[0047] Figure 3 Shows a schematic diagram of the external structure of the domain controller according to the present utility model from another perspective in one embodiment.

[0048] As Figure 2 and Figure 3 shown, in one embodiment, the domain controller may include a housing 1 with a hollow cavity inside, and an air inlet 11 and an air outlet 12 are provided on the housing.

[0049] Figure 4 Shows the main board and the fan assembly of the domain controller according to the present utility model in one embodiment.

[0050] As shown Figure 4 In the housing 1 shown in the figure, a main board 2 and a fan assembly 3 are provided. The fan assembly includes a fan blade 31 and a flexible printed circuit board (FPC) 32 electrically connected to the fan blade 31. A conductive area 321 is provided on the flexible printed circuit board. A slot area for accommodating the fan assembly is provided on the main board 2. The fan assembly 3 is arranged in the slot area. At the same time, a conductive metal elastic piece 21 is provided on the main board 2. The metal elastic piece 21 is in interference fit and abuts against the conductive area 321 to realize the electrical connection between the main board 2 and the fan assembly 3.

[0051] In some more specific embodiments, at least two conductive areas 321 are provided on the flexible printed circuit board 32. Correspondingly, at least two metal elastic pieces 21 corresponding to the number of the conductive areas 321 are provided on the main board 2. For example, as Figure 4 shown in the figure, the flexible printed circuit board 32 has two conductive areas 321 at the front end corresponding to the main board to respectively correspond to the positive electrode and the negative electrode, and is used to contact the two metal elastic pieces 21 of the main board 2 to realize the function of powering on the fan of the air supply component.

[0052] The present utility model realizes conduction through the interference contact between the metal elastic piece 21 and the conductive area 321. At the same time, the metal elastic piece 21 and the conductive area 321 always maintain contact with a certain deformation pressure. Even if vibration occurs, the interference contact also makes the electrical connection not break. When the domain controller needs to dissipate heat, the main board is electrically connected to the flexible printed circuit board through the metal elastic piece, and the flexible printed circuit board is electrically connected to the fan blade, thereby controlling the rotation of the fan to realize heat dissipation.

[0053] In some more specific examples, the conductive area 321 can be a copper exposed area. In some more specific embodiments, the metal elastic piece 21 can be made of copper or a material with better electrical conductivity.

[0054] In some more specific embodiments, the metal elastic piece 21 can be fixedly arranged on the main board 2 by welding.

[0055] Figure 5 The structure of the domain controller described in the present utility model is shown from a top-down perspective in one embodiment.

[0056] Figure 6 For Figure 5 the cross-sectional view at B-B in the figure.

[0057] Figure 7 For Figure 6 the partial enlarged view at C in the figure.

[0058] Figure 5 、 Figure 6 and Figure 7Further shows the structure of the metal shrapnel of the domain controller according to the present utility model in an embodiment.

[0059] As Figure 5 , Figure 6 and Figure 7 shown, the end of the metal shrapnel 21 includes an arc-shaped convex portion 211 with elastic deformation for abutting against the conductive region 321 and an arc-shaped guiding portion 212 connected to the arc-shaped convex portion 211. In this embodiment, during the connection process, as the fan assembly 3 is inserted into the slot area of the main board 2 from top to bottom, the arc-shaped guiding portion 212 provides a guiding function for this insertion process, making the installation and insertion process of the fan assembly more labor-saving. Once the fan assembly 3 is installed on the main board 2, the arc-shaped convex portion 211 always maintains an interference abutment with the conductive region through its own elastic deformation, thus ensuring a stable electrical connection.

[0060] Figure 8 Shows a schematic diagram of partial disassembly of the fan assembly of the domain controller according to the present utility model in an embodiment from one perspective.

[0061] Figure 9 Shows a schematic diagram of partial disassembly of the fan assembly of the domain controller according to the present utility model in an embodiment from one perspective.

[0062] Figure 10 Shows a schematic diagram of the split structure of the fan assembly of the domain controller according to the present utility model in an embodiment.

[0063] As Figure 8 , Figure 9 and Figure 10 shown, in some specific embodiments, the fan assembly 3 includes: a fan blade 31, a flexible circuit board 32, a rigid inner frame 33, and a flexible outer frame 34. Among them, the fan blade 31 and the flexible circuit board 32 are arranged on the rigid inner frame 33, the flexible outer frame 34 is sleeved outside the rigid inner frame 33, and the flexible outer frame 34 has a flexible connection portion 342 for connecting to the main board 2 and the housing 1. The rear end of the flexible circuit board 32 is connected to the circuit board inside the fan blade 31 to achieve electrical connection with the fan blade 31.

[0064] In this embodiment, the rigid inner frame 33 can provide more stable support for the fan blade 31 and the flexible circuit board 32, and it can strengthen the strength of the flexible circuit board during transportation and assembly to prevent it from deforming and being damaged. And the flexible outer frame 34, through its flexible characteristics, can more conveniently and quickly realize the connection with the main board and the housing.

[0065] In some more specific embodiments, the rigid inner frame can be a plastic inner frame, and the flexible outer frame can be a rubber outer frame that can undergo a certain amount of elastic deformation.

[0066] In some more specific embodiments, the rigid inner frame 33 can be connected to the flexible outer frame through a snap 331 provided thereon and a corresponding outer frame slot 341 on the flexible outer frame 34.

[0067] As Figure 8 、 Figure 9 and Figure 10 shown, in some more specific embodiments, the flexible connecting portion 342 is provided as a tapered connecting stud extending in the height direction. In some more specific embodiments, the flexible connecting portion can be made of rubber material that can undergo a certain elastic deformation.

[0068] In some more specific embodiments, the radial cross-sectional area of the connecting stud gradually increases from the end to the center. Since the middle part of the fan assembly is connected to the main board, through this setting method, the tapered connecting stud can provide a guiding function for the fan assembly to insert into the slot area of the main board, and at the same time, the middle part with the largest radial cross-sectional area can achieve an interference fit with the main board, thereby ensuring the stable connection between the fan assembly and the main board. The two ends of the connecting stud are respectively connected to the housing.

[0069] In some more specific embodiments, in order to further improve the heat dissipation effect, the air inlet 11 or the air outlet 12 is arranged at a position on the housing 1 corresponding to the fan assembly 3. For example, as Figure 3 shown, the air outlet 12 is arranged at a position corresponding to the fan assembly 3.

[0070] In some more specific embodiments, in order to further improve the heat dissipation effect, as Figure 2 and Figure 3 shown, the air inlet 11 is arranged on the opposite side of the air outlet 12. This way of arranging the air inlet 11 and the air outlet 12 opposite to each other can increase the length of the cooling air duct inside the housing and improve the convection effect.

[0071] Figure 11 shows a schematic exploded view of the domain controller according to the present invention in one embodiment.

[0072] Figure 12 shows the internal structure of the housing of the domain controller according to the present invention in one embodiment.

[0073] As Figure 11 and Figure 12As shown, for the convenience of assembly, in some more specific embodiments, the housing includes an upper cover 14 and a lower cover 13 connected together. The inner surface of the lower cover 13 has a lower cover card slot for connecting to one end of the flexible connecting portion of the fan assembly, especially the flexible outer frame of the fan assembly. Similarly, the inner surface of the upper cover 14 is also provided with an upper cover card slot 141 for connecting to the other end of the flexible connecting portion of the fan assembly, especially the flexible outer frame of the fan assembly. Those skilled in the art need to know that the upper cover and the lower cover in the present utility model are only descriptions of relative positions and do not serve as special limitations on the lid structure.

[0074] When assembling the domain controller, the fan assembly can be first installed into the upper cover 14, and the position of the fan is pre-fixed through the upper cover card slot 141. Then the motherboard 2 is installed downward. After the motherboard is installed in place, its metal elastic sheet 21 is in interference contact with the conductive area 321 of the fan assembly. Then the lower cover 13 is covered on the motherboard 2, and the upper end of the fan assembly is correspondingly inserted into the lower cover card slot of the lower cover to realize the up and down fixation of the fan assembly, and the lower cover will not press directly above the fan to prevent deformation of the rigid inner frame caused by pressure. The elastic deformation trend designed for the metal elastic sheet 21 on the motherboard 2 is opposite to the direction in which the motherboard is installed downward, which is beneficial to the downward assembly of the motherboard and will not damage the metal elastic sheet. Then the screw 6 passes through the lower cover 13 and the motherboard 2 and is finally locked into the screw post of the upper cover 14.

[0075] In some more specific embodiments, an antenna cover 7 can also be provided on the side of the housing to cover the exposed part of the on-board antenna, playing a role in protecting the motherboard. The antenna cover 7 can be fixed to the side screw holes of the upper cover 14 through fastening screws 8.

[0076] As Figure 12 and Figure 13 shown, in order to further improve the heat dissipation effect, several upright heat dissipation fins 15 can be provided in the housing (for example, on the upper cover 14) to increase the surface area of the upper cover, thereby improving the heat dissipation effect.

[0077] As Figure 13 shown, in order to further improve the heat dissipation effect, at least one heat dissipation boss 16 protruding from the surface can be provided on one side of the upper cover 14 of the housing facing the motherboard 2. The top surface of the heat dissipation boss 16 has a heat dissipation adhesive layer 17, and the heat dissipation adhesive layer 17 is in contact with at least one chip 23 of the motherboard 2, thereby further improving the heat dissipation effect on the chip 23.

[0078] It should be noted that the number of the conductive area and the metal elastic sheet in the present utility model can also be more than two.

[0079] For example Figure 14 and Figure 15Shows the main board and the connection status between the main board and the fan assembly in another embodiment.

[0080] In this embodiment, four conductive regions are provided on the flexible circuit board of the fan assembly. At the same time, as Figure 13 shown, the corresponding main board 2 has four metal shrapnel 21.

[0081] As Figure 15 shown, the flexible circuit board can be arranged on the side of the fan assembly. The fan assembly 3 is still inserted into the slot area 22 of the main board 2, and the four metal shrapnel 21 on the main board 2 are in interference contact corresponding to the four conductive regions on the flexible circuit board.

[0082] In some other embodiments, the fan assembly can also be designed to have 3 pins, that is, three conductive regions. Correspondingly, the metal shrapnel can also be set to three.

[0083] It can be seen that for the domain controller described in the present invention, the electrical connection between the heat dissipation mechanism and the domain controller main board can be realized without using connecting wires. The installation process is stable and easy to operate. Therefore, the automatic assembly of the production line can be realized without relying on manual operation, and at the same time, many problems such as excessive board stress or virtual insertion caused by manual plugging of wires are avoided.

[0084] In addition, since the domain controller described in the present invention does not use connecting wires, the noise problem caused by the shaking and collision of long wires inside the product is eliminated.

[0085] In another embodiment, the present invention also provides a vehicle having the domain controller as described above. Since the present invention does not improve other components of the vehicle, the other components of the vehicle will not be described in detail here.

[0086] It should be noted that the prior art part in the protection scope of the present invention is not limited to the embodiments given in the present invention document. All prior arts that do not conflict with the solutions of the present invention, including but not limited to prior patent documents, prior published publications, prior public uses, etc., can be included in the protection scope of the present invention.

[0087] In addition, the combination methods of the technical features in this case are not limited to the combination methods recorded in the claims of this case or the combination methods recorded in the specific embodiments. All the technical features recorded in this case can be freely combined or combined in any way, unless contradictions occur between each other.

[0088] It should also be noted that the above-listed embodiments are only specific embodiments of the present utility model. Obviously, the present utility model is not limited to the above embodiments, and similar changes or deformations made therefrom that can be directly obtained by those skilled in the art from the disclosed content of the present utility model or are easily conceivable shall all fall within the protection scope of the present utility model.

Claims

1. A domain controller with a heat dissipation mechanism, which includes a housing (1) and a main board (2) disposed inside the housing, and is characterized in that: An air inlet (11) and an air outlet (12) are provided on the housing; A conductive metal elastic sheet (21) is provided on the main board; The domain controller further includes a fan assembly (3), which is disposed inside the housing. The fan assembly includes a fan blade (31) and a flexible circuit board (32) electrically connected to the fan blade. A conductive area (321) is provided on the flexible circuit board. The fan assembly is inserted on the main board so that the metal elastic sheet is press-fitted and correspondingly abutted against the conductive area to realize the electrical connection between the main board and the fan assembly.

2. The domain controller according to claim 1, wherein The end of the metal elastic sheet (21) includes an arc-shaped convex portion (211) with elastic deformation for abutting against the conductive area and an arc-shaped guiding portion (212) connected to the arc-shaped convex portion.

3. The domain controller according to claim 1, characterized in that The air inlet or the air outlet is arranged at a position corresponding to the fan assembly.

4. The domain controller according to claim 1, characterized in that, The housing has upright heat dissipation fins (15); and / or there is a heat dissipation boss (16) protruding from the surface of the housing inside the housing. The top surface of the heat dissipation boss has a heat dissipation adhesive layer (17), and the heat dissipation adhesive layer is in contact with at least the chip (23) of the main board.

5. The domain controller according to claim 1, wherein The housing includes an upper cover (14) and a lower cover (13) connected together. The inner surface of the upper cover has an upper cover card slot (141), and the inner surface of the lower cover is provided with a lower cover card slot. Both ends of the fan assembly in the height direction are respectively clamped in the upper cover card slot and the lower cover card slot.

6. The domain controller according to claim 1, wherein The air inlet (11) is arranged on the opposite side of the air outlet (12).

7. The domain controller according to claim 1, wherein At least two conductive areas (321) are provided on the flexible circuit board (32), and at least two metal elastic sheets (21) with corresponding quantities are provided on the main board (2).

8. The domain controller according to any one of claims 1-7, characterized in that, The fan assembly further includes: A rigid inner frame (33), on which the fan blade and the flexible circuit board are disposed; A flexible outer frame (34), which is sleeved outside the rigid inner frame. The flexible outer frame has a flexible connection portion (342) connected to the main board and the housing.

9. The domain controller according to claim 8, characterized in that, The flexible connection portion (342) is set as a tapered connection pin extending in the height direction.

10. The domain controller according to claim 9, wherein The radial cross-sectional area of the connection pin gradually increases from the end to the center.

11. A vehicle, characterized in that, It has the domain controller as described in any one of claims 1-10.

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