Pressing assembly and fixing jig

Abstract

The utility model relates to a pressing assembly and a fixing jig, the pressing assembly is used for pressing a plurality of ceramic substrates distributed in an array on a carrier, the pressing assembly comprises a body, the body is provided with a first positioning hole, two second positioning holes and a plurality of chip holes distributed in an array, and one chip hole corresponds to one ceramic substrate; the two second positioning holes are symmetrically distributed on the outer sides of the plurality of chip holes, the first positioning holes are located on the outer sides of the plurality of chip holes, and the first positioning holes and the two first positioning holes are distributed in a triangular mode; the elastic modules are distributed on the body in an array mode, one elastic module corresponds to one chip hole, and at least part of each elastic module extends into the corresponding chip hole so that the elastic modules can be elastically buckled on the ceramic substrate when the body abuts against the carrier; and the positioning module is in clearance connection with the body and the carrier through the two second positioning holes, and meanwhile, the body and the carrier are in gapless connection through the first positioning holes. According to the technical scheme, the technical problems that a traditional fixing jig is greatly influenced by thermal expansion and is poor in pressing stability are effectively solved.

Description

Technical Field

[0001] This application relates to the technical field of flip-chip processes, and particularly to a pressing assembly and a fixing jig. Background Art

[0002] With the rapid development of electronics and semiconductor technologies, people's requirements for the quality of cameras are getting higher and higher. Currently, the core technology for camera assembly is flip-chip welding technology, which is a technology that flips the chip after the gold balls have been mounted and then welds the chip to the ceramic substrate using ultrasonic waves. To meet the flip-chip assembly of cameras, it is necessary to select appropriate tooling jigs or fixtures to fix the position of the ceramic substrate and prevent welding interference problems caused by inaccurate alignment between the ceramic substrate and the chip.

[0003] In related technologies, generally, a ceramic substrate is fixed on a carrier plate by a pressing plate. Two opposite positioning holes are provided on the pressing plate, and fixing holes are provided on the carrier plate corresponding to the positioning holes. In this way, the pressing plate and the carrier plate can be connected and fastened by passing positioning pins through the positioning holes and the fixing holes in sequence, thereby locking the position of the ceramic substrate. Considering that the carrier plate for carrying the ceramic substrate needs to be preheated in advance, the pressing plate will also be heated. Moreover, the pressing plate will compress the space of the positioning holes on it due to thermal expansion, resulting in the positioning pins being unable to pass through the positioning holes. Therefore, when designing the positioning holes, generally, a thermal expansion gap is left between the positioning holes and the positioning pins to avoid assembly accidents where the positioning pins cannot be inserted into the positioning holes. However, during the actual assembly process, the pressing plate will shake and misalign due to this thermal expansion gap, and accurate alignment between the pressing plate and the carrier plate cannot be achieved, which will cause the pressing plate to not tightly press the ceramic substrate, and even welding interference problems between the two. Therefore, it is urgent to find a pressing plate that can both avoid the influence of thermal expansion and improve the installation stability. Summary of the Utility Model

[0004] This application provides a pressing assembly and a fixing jig to solve the technical problems of the large influence of thermal expansion on traditional fixing jigs and poor pressing stability.

[0005] To this end, in a first aspect, an embodiment of this application provides a pressing assembly for pressing a plurality of ceramic substrates arranged in an array on a carrier. The pressing assembly includes: a body, provided with a first positioning hole, two second positioning holes, and a plurality of chip holes arranged in an array. One chip hole corresponds to one ceramic substrate. The two second positioning holes are symmetrically distributed outside the plurality of chip holes. The first positioning hole is located outside the plurality of chip holes and is distributed in a triangle with the two first positioning holes; a plurality of elastic modules, arrayed on the body. One elastic module corresponds to one chip hole. At least part of the elastic module extends into the chip hole to elastically press on the ceramic substrate when the body is pressed against the carrier; and a positioning module, connecting the body and the carrier with a clearance through the two second positioning holes, and at the same time, connecting the body and the carrier without a clearance through the first positioning hole.

[0006] In a possible implementation, two second positioning holes are spaced apart in the first direction of the body, and the angle between the first positioning hole and any one of the second positioning holes is an acute angle.

[0007] In a possible implementation, the length of the second positioning hole in the first direction is greater than the length of the second positioning hole in the second direction of the body, where the straight line where the second direction is located is perpendicular to the straight line where the first direction is located. The positioning module includes a second positioning member, and the second positioning member is in clearance fit with the second positioning hole.

[0008] In a possible implementation, the length of the first positioning hole in the first direction is equal to the length of the first positioning hole in the second direction. The positioning module further includes a first positioning member, and the first positioning member is in non-clearance fit with the first positioning hole.

[0009] In a possible implementation, the elastic module includes two groups of elastic buckle groups arranged on opposite sides of the chip hole. Each elastic buckle group includes a connecting seat, a spring piece, and a fastener. The connecting seat is arranged on the body, the spring piece is arranged on the side of the connecting seat away from the body, and is connected to the connecting seat through the fastener.

[0010] In a possible implementation, the elastic buckle group further includes a connecting plate. The connecting plate is arranged on the side of the spring piece away from the connecting seat and at least partially abuts against the connecting seat. The connecting plate is connected to the connecting seat through the fastener.

[0011] In a possible implementation, the body is provided with a plurality of first connection notches and a plurality of second connection notches. The plurality of first connection notches are spaced apart along the first direction of the body at the edge of the body, and the plurality of second connection notches are spaced apart along the second direction of the body at the edge of the body.

[0012] In a possible implementation, the body is further provided with a boss. The boss is arranged at the edge of the body corresponding to the first connection notch, and is arranged on the same side as the connecting seat. And in the third direction of the body, the height of the boss is greater than or equal to the height of the connecting seat; and / or,

[0013] The body is further provided with a plurality of sinking grooves. One sinking groove corresponds to one first connection notch. The sinking groove is arranged outside the first connection notch and is arranged opposite to the connecting seat.

[0014] In a second aspect, the present application further provides a fixing fixture, which includes a carrier and the pressing component as described above. The carrier is provided with a first connection hole corresponding to the first positioning hole, two second connection holes corresponding to the two second positioning holes, and a plurality of bearing platforms corresponding to the plurality of chip holes. The ceramic substrate is disposed on the bearing platforms. The body of the pressing component is pressed on the carrier, the elastic module of the pressing component is elastically buckled on the ceramic substrate, and the positioning module connects the body to the carrier through the combination of the first positioning hole and the first connection hole, and the combination of the second positioning hole and the second connection hole.

[0015] In a possible implementation manner, the carrier is provided with a plurality of first locking holes in the first direction of the body. The plurality of first locking holes are spaced apart and distributed on the edge of the carrier. The fixing fixture further includes a plurality of first locking members. One first locking member corresponds to a first connection notch of one body. The first locking member connects and fastens the body and the carrier through the first connection notch and the first locking hole; and / or,

[0016] The carrier is provided with a plurality of second locking holes in the second direction of the body. The plurality of second locking holes are spaced apart and distributed on the edge of the carrier. The fixing fixture further includes a plurality of second locking members. One second locking member corresponds to a second connection notch of one body. The second locking member connects and fastens the body and the carrier through the second connection notch and the second locking hole.

[0017] According to the pressing component and the fixing fixture provided by the embodiments of the present application, the pressing component is used to press a plurality of ceramic substrates arranged in an array on a carrier. The pressing component includes: a body, which is provided with a first positioning hole, two second positioning holes, and a plurality of chip holes arranged in an array. One chip hole corresponds to one ceramic substrate. The two second positioning holes are symmetrically distributed outside the plurality of chip holes. The first positioning hole is located outside the plurality of chip holes and forms a triangular distribution with the two first positioning holes; a plurality of elastic modules are arranged in an array on the body. One elastic module corresponds to one chip hole. At least part of the elastic module extends into the chip hole so that when the body is pressed against the carrier, it elastically presses on the ceramic substrate; and a positioning module is connected to the body and the carrier with a clearance through the two second positioning holes. At the same time, the body and the carrier are connected without clearance through the first positioning hole. In the technical solution of the present application, the clearance fit between the body and the positioning module is realized through the two second positioning holes. At this time, when the pressing component expands due to heat and compresses the assembly space of the second positioning holes, since the second positioning holes are pre-reserved with a thermal expansion clearance, the influence of the thermal expansion of the pressing component can be avoided, which is convenient for the positioning module to be inserted into the second positioning holes to realize the alignment and fixation of the body and the carrier; on this basis, since there will still be an extra thermal expansion clearance after the positioning module is inserted into the second positioning holes and will not completely fill the entire second positioning hole, this will cause the positioning module to shake during installation, resulting in inaccurate alignment and unstable positioning between the body and the carrier. Based on this, the first positioning hole is also provided in this embodiment to realize its non-clearance fit with the positioning module through the first positioning hole, prevent shaking between the body and the carrier, and improve the alignment accuracy and stability between the two; and, a triangular connection relationship is formed between the body and the carrier through the first positioning hole distributed in a triangle and the two second positioning holes, which is beneficial to improving the alignment accuracy and alignment stability between the entire pressing component and the carrier, improving the pressing effect and pressing yield of the pressing component, and improving the product quality. Description of the Drawings

[0018] The drawings here are incorporated into the specification and form a part of this specification, showing the embodiments that conform to the present application, and are used together with the specification to explain the principles of the present application. In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative labor. One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplary illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated, the drawings in the figures do not constitute a proportional limitation.

[0019] Figure 1 It is the back bottom view of the pressing component provided by the embodiment of the present application;

[0020] Figure 2 is Figure 1 a partially enlarged view of;

[0021] Figure 3 is a front top view of the pressing assembly provided by the embodiment of the present application;

[0022] Figure 4 is Figure 3 a partially enlarged view of;

[0023] Figure 5 is a front top view of the carrier of the fixing fixture provided by the embodiment of the present application.

[0024] Description of reference numerals:

[0025] 100, body; 101, first positioning hole; 102, second positioning hole; 103, chip hole; 104, first connection notch; 105, second connection notch; 110, boss; 120, counterbore;

[0026] 200, elastic module; 210, elastic buckle group; 211, connection seat; 212, elastic piece; 213, fastener; 214, connecting plate;

[0027] 10, carrier; 11, first connection hole; 12, second connection hole; 13, bearing table; 14, first locking hole; 15, second locking hole; 20, pressing assembly;

[0028] X, first direction; Y, second direction; Z, third direction. Detailed implementation manners

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0030] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present application. In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplification and clarity and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art can realize the applicability of other processes and / or the use of other materials.

[0031] For ease of description, spatially relative relationship terms may be used in the text to describe the relative positional relationship or movement of one element or feature shown in the figure relative to another element or feature. These relative relationship terms are, for example, "inside", "outside", "inner side", "outer side", "below", "beneath", "above", "over", "front", "rear", etc. Such spatially relative relationship terms are intended to include different orientations of the device in use or operation other than the orientations depicted in the figure. For example, if the device in the figure undergoes a position flip, attitude change, or motion state change, then these directional indications will change accordingly. For example, an element described as "below other elements or features" or "beneath other elements or features" will then be oriented as "above other elements or features" or "over other elements or features". Therefore, the exemplary term "below" can include both upward and downward orientations. The device may be oriented otherwise (rotated 90 degrees or in other directions) and the spatially relative relationship descriptors used in the text are interpreted accordingly.

[0032] Considering that the carrier plate carrying the ceramic substrate needs to be preheated in advance, the pressing plate will also be heated. Moreover, the pressing plate will compress the space of the positioning holes thereon due to thermal expansion, resulting in the positioning pins being unable to pass through the positioning holes. Therefore, when designing the positioning holes, generally a thermal expansion gap is left between the positioning holes and the positioning pins to avoid the assembly accident that the positioning pins cannot be inserted into the positioning holes. However, during the actual assembly process, the pressing plate will shake and be misaligned due to this thermal expansion gap, and it is impossible to achieve precise alignment between the pressing plate and the carrier plate, which will lead to problems such as the pressing plate not being tightly pressed against the ceramic substrate and even welding interference. Based on this, the present application proposes a pressing assembly that can not only avoid the influence of thermal expansion but also improve the installation stability; and has a simple structure and excellent performance.

[0033] See Figures 1 to 4, embodiments of the present application provide a pressing component for pressing a plurality of ceramic substrates arranged in an array on a carrier 10. The pressing component 20 includes: a body 100 provided with a first positioning hole 101, two second positioning holes 102, and a plurality of chip holes 103 arranged in an array. One chip hole 103 corresponds to one ceramic substrate. The two second positioning holes 102 are symmetrically distributed outside the plurality of chip holes 103. The first positioning hole 101 is located outside the plurality of chip holes 103 and forms a triangular distribution with the two first positioning holes 101; a plurality of elastic modules 200 are arranged in an array on the body 100. One elastic module 200 corresponds to one chip hole 103. At least a part of the elastic module 200 extends into the chip hole 103 so that when the body 100 is pressed against the carrier 10, it elastically presses on the ceramic substrate; and a positioning module (not shown in the figure) is connected to the body 100 and the carrier 10 with a clearance through the two second positioning holes 102. At the same time, the body 100 and the carrier 10 are connected without clearance through the first positioning hole 101.

[0034] In this embodiment, the clearance fit between the body 100 and the positioning module is achieved through the two second positioning holes 102. At this time, when the pressing component 20 expands due to heat and compresses the assembly space of the second positioning holes 102, since the second positioning holes 102 are pre-provided with a thermal expansion clearance, the influence of the thermal expansion of the pressing component 20 can be avoided, which facilitates the positioning module to be inserted into the second positioning holes 102 to achieve the alignment and fixation of the body 100 and the carrier 10. On this basis, since there will still be an excessive thermal expansion clearance left after the positioning module is inserted into the second positioning holes 102 and does not completely fill the entire second positioning holes 102, the positioning module will shake during installation, resulting in inaccurate alignment and unstable positioning of the body 100 and the carrier 10. Based on this, the first positioning hole 101 is also provided in this embodiment to achieve a clearance-free fit with the positioning module through the first positioning hole 101, prevent shaking between the body 100 and the carrier 10, and improve the alignment accuracy and stability between the two; and, a triangular connection relationship is formed between the body 100 and the carrier 10 through the first positioning hole 101 distributed in a triangle and the two second positioning holes 102, which is beneficial to improving the alignment accuracy and alignment stability between the entire pressing component 20 and the carrier 10, improving the pressing effect and pressing yield of the pressing component 20, and improving the product quality.

[0035] Specifically, the lamination component 20 is configured to be at least a combined component including the body 100, a plurality of elastic modules 200 and a positioning module. The body 100 can be a plate-like structure, on which a plurality of chip holes 103 are arranged in an array, and the chip holes 103 penetrate through the body 100 to facilitate the installation of chips and observe whether the ceramic substrate is tightly pressed, etc. At the same time, a first positioning hole 101 and two second positioning holes 102 are also provided on the body 100 to achieve precise alignment and positioning of the body 100 and the carrier 10 through the first positioning hole 101 and the second positioning holes 102, so that each ceramic substrate arranged in an array on the carrier 10 can be pressed tightly by the elastic modules 200 arranged in an array on the body 100, facilitating subsequent operations. The elastic module 200 can be a shrapnel structure, which is arranged corresponding to the chip holes 103 and at least partially extends into the chip holes 103. When the body 100 is laminated on the carrier 10, the extending end of the elastic module 200 is buckled on the ceramic substrate to achieve the pressing and fixing of the ceramic substrate. Moreover, the elastic potential energy of the elastic module 200 can buffer the contact stress between its extending end and the ceramic substrate, effectively avoiding the direct action of the elastic module 200 on the ceramic substrate and causing damage to the ceramic substrate, and improving the yield rate of the flip chip product. The positioning module can be a plurality of pin structures. For example, three pins can be provided. One of the pins can be inserted into the body 100 without clearance through the first positioning hole 101. At this time, a first connection hole 11 is provided at the corresponding position of the carrier 10, and the pin is inserted into the first positioning hole 101 and the first connection hole 11 without clearance to achieve the locking of the body 100 and the carrier 10 in the third direction Z. The other two pins are respectively inserted into the body 100 with clearance through the two second positioning holes 102. At this time, a second connection hole 12 is provided at the corresponding position of the carrier 10, and the pins are inserted into the second positioning holes 102 and the second connection holes 12 with clearance. It should be explained that the sizes of the plurality of pins can be the same. When the sizes of the multiple pins are the same, the diameter of the first positioning hole 101 is the same as the minimum diameter of the second positioning holes 102. When the sizes of the multiple pins are different, the diameters of the first positioning hole 101 and the second positioning holes 102 can be selected according to actual needs.

[0036] It should be explained that the third direction Z refers to the thickness direction or height direction of the body 100, and the third direction Z is perpendicular to the first direction X and the second direction Y.

[0037] In a possible implementation, two second positioning holes 102 are spaced apart in the first direction X of the body 100, and the angle between the first positioning hole 101 and any one of the second positioning holes 102 is an acute angle. With such a setting, the positioning area range of the first positioning hole 101 and the two second positioning holes 102 on the body 100 can be larger, enhancing the alignment accuracy and stability between the body 100 and the vehicle 10. For example but not limited to, the first positioning hole 101 and the two second positioning holes 102 are distributed in an isosceles triangle. The first positioning hole 101 can be arranged on the edge of the middle area of the body 100, and the two second positioning holes 102 are respectively arranged on the edges at both ends of the body 100.

[0038] It should be noted that the first direction X refers to the length direction of the body 100, that is, the long side direction of the body 100. At this time, the two second positioning holes 102 are respectively located on the side edges of the two short sides of the body 100, the first positioning hole 101 is located on any one of the long side edges of the body 100, and in the first direction X of the body 100, the first positioning hole 101 is located between the two second positioning holes 102. Of course, the first direction X can also refer to the width direction of the body 100, that is, the short side direction of the body 100. At this time, the two second positioning holes 102 are respectively located on the side edges of the two long sides of the body 100, the first positioning hole 101 is located on any one of the short side edges of the body 100, and in the second direction Y of the body 100, the first positioning hole 101 is located between the two second positioning holes 102. In this way, the area range framed by the first positioning hole 101 and the two second positioning holes 102 on the body 100 can be larger, further enhancing the alignment accuracy and positioning stability between the body 100 and the vehicle 10.

[0039] In a possible implementation, the length of the second positioning hole 102 in the first direction X is greater than the length of the second positioning hole 102 in the second direction Y of the body 100, where the straight line where the second direction Y is located is perpendicular to the straight line where the first direction X is located. The positioning module includes a second positioning member, and the second positioning member is in clearance fit with the second positioning hole 102.

[0040] In this embodiment, the specific shape of the second positioning hole 102 is optimized. Specifically, the second positioning hole 102 is set as a long and narrow positioning hole, whose length in the first direction X is larger and whose length in the second direction Y is smaller. In this way, when the second positioning member is inserted into the second positioning hole 102, an interference fit will be formed in the second direction Y to realize the firm connection between the second positioning member and the second positioning hole 102, and at the same time, a thermal expansion gap will be left in the first direction X, and this thermal expansion gap will reduce the assembly difficulty between the second positioning member and the second positioning hole 102. For example but not limited to, the second positioning member can be a positioning pin.

[0041] In a possible implementation, the length of the first positioning hole 101 in the first direction X is equal to the length of the first positioning hole 101 in the second direction Y. The positioning module further includes a first positioning member, and the first positioning member is in clearance-free fit with the first positioning hole 101.

[0042] In this embodiment, the specific shape of the first positioning hole 101 is optimized. Specifically, the first positioning hole 101 is set as a circular positioning hole, and its length in the first direction X is the same as its length in the second direction Y. In this way, the first positioning member can be fully press-fitted into the first positioning hole 101, avoiding the risk of the second positioning member shaking in the first direction X due to the thermal expansion gap between the second positioning member and the second positioning hole 102 in the first direction X, reducing the probability of misalignment between the body 100 and the carrier 10 and the probability of unstable positioning connection, and improving the alignment accuracy and positioning stability between the body 100 and the carrier 10. For example but not limited to, the first positioning member can be a positioning pin.

[0043] In an example, the aperture of the first positioning hole 101 is 0.05 mm to 0.10 mm larger than the size of the second positioning hole 102 in the second direction Y, and the size of the first positioning member is also slightly larger than the size of the second positioning member. In this way, after eliminating the influence of thermal expansion on the first positioning hole 101 and the second positioning hole 102, the first positioning member and the first positioning hole 101 can achieve an interference fit, preventing the body 100 and the carrier 10 from shaking and moving in the first direction X, and improving the alignment accuracy and alignment stability of the body 100; at the same time, the second positioning member and the second positioning hole 102 can achieve a partial interference fit and a partial clearance fit, enabling the second positioning member to be inserted and facilitating alignment, while improving the alignment accuracy between the body 100 and the carrier 10 and reducing the labor intensity of the alignment operation.

[0044] In a possible implementation, the elastic module 200 includes two groups of elastic buckle groups 210 arranged on opposite sides of the chip hole 103. The elastic buckle group 210 includes a connecting seat 211, a spring piece 212 and a fastener 213. The connecting seat 211 is arranged on the body 100, the spring piece 212 is arranged on the side of the connecting seat 211 away from the body 100, and is connected to the connecting seat 211 through the fastener 213.

[0045] In this embodiment, the specific configuration of the elastic module 200 is optimized. Specifically, the elastic module 200 is configured as a combined component including at least two sets of elastic buckle groups 210. The two elastic buckle groups 210 are arranged oppositely to elastically press against the opposite sides of the ceramic substrate respectively, so as to fix the position of the ceramic substrate and the carrier 10. Further, the elastic buckle group 210 is configured as a combined component including at least a connecting seat 211, a spring piece 212 and a fastener 213. The connecting seat 211 can be a nearly rectangular box-shaped structure, which can be connected to the main body 100 by welding or other means, or can be connected to the main body 100 by components such as screws / bolts; the spring piece 212 can be a T-shaped sheet structure, the wider end of which is arranged at the top of the connecting seat 211, and the narrower end extends into the chip hole 103 for elastically buckling on the ceramic substrate; the fastener 213 can be a screw or a bolt, which can connect and fasten the spring piece 212 to the connecting seat 211. The structure of the elastic module provided in this example is simple, convenient for processing and has a low cost.

[0046] In a possible implementation manner, the elastic buckle group 210 further includes a connecting plate 214. The connecting plate 214 is arranged on the side of the spring piece 212 away from the connecting seat 211 and at least partially abuts against the connecting seat 211. The connecting plate 214 is connected to the connecting seat 211 through the fastener 213.

[0047] In this embodiment, the specific configuration of the elastic buckle group 210 is optimized. Specifically, the elastic buckle group 210 is configured as a combined component including at least a connecting seat 211, a spring piece 212, a fastener 213 and a connecting plate 214. The connecting plate 214 can be a nearly T-shaped structure. At this time, a connecting sink is arranged at the top of the connecting seat 211. The connecting sink is opened outwards from the chip hole 103. There are supporting side walls on both sides of the connecting sink close to the chip hole 103, and there is no supporting side wall structure on both sides away from the chip hole 103. In this way, the wider end of the spring piece 212 is inserted into the connecting sink at the top of the connecting seat 211, and then a connecting plate 214 is covered above the spring piece 212. The wider end of the connecting plate 214 is arranged corresponding to the rear of the connecting sink, and the narrower end is embedded between the two supporting side walls. Finally, the connecting plate 214 and the spring piece 212 are connected and fastened to the connecting seat 211 through the fastener 213. The spring piece 212 of the elastic module 200 provided in this example is detachable, which is beneficial to subsequent maintenance and replacement and reduces the use cost; and during the use process, the spring piece 212 can be protected through the connecting plate 214, and the service life of the spring piece 212 can be extended.

[0048] In a possible implementation, a plurality of first connection notches 104 and a plurality of second connection notches 105 are provided on the body 100. The plurality of first connection notches 104 are spaced along the first direction X of the body 100 at the edge of the body 100, and the plurality of second connection notches 105 are spaced along the second direction Y of the body 100 at the edge of the body 100.

[0049] In this embodiment, the specific configuration of the body 100 is optimized. Specifically, a plurality of first connection notches 104 are provided on both edges of the body 100 in the first direction X, and at the same time, a plurality of second connection notches 105 are provided on both edges of the body 100 in the second direction Y to fix the position of the periphery of the body 100 through the first connection notches 104 and the second connection notches 105, further improving the connection tightness and stability between the body 100 and the vehicle 10, and preventing the body 100 from loosening from the vehicle 10.

[0050] In a possible implementation, a boss 110 is further provided on the body 100. The boss 110 is provided at the edge of the body 100 corresponding to the first connection notch 104. The boss 110 is provided on the same side as the connection seat 211, and in the third direction Z of the body 100, the height of the boss 110 is greater than or equal to the height of the connection seat 211.

[0051] In this embodiment, the specific configuration of the body 100 is further optimized. Specifically, bosses 110 are also provided on both side edges of the body 100 in the first direction X. The bosses 110 can be strip-shaped and run through the entire body 100. The bosses 110 are provided with avoidance notches corresponding to the first connection notches 104, and the sizes of the avoidance notches are equivalent to those of the first connection notches 104. The thickness of the bosses 110 is equivalent to the thickness of the connection seat 211. When the body 100 is pressed on the vehicle 10, the bosses 110 provided on the long side of the body 100 contact the carrier surface of the vehicle 10, and the elastic pieces 212 on the connection seat 211 are buckled on the ceramic substrate on the carrier table 13 of the vehicle 10 to make up for the overall thickness of the carrier table 13 and the ceramic substrate through the thickness of the bosses 110, avoiding the situation that the middle area of the body 100 bulges and does not fit well with the vehicle 10 due to the edge of the body 100 directly pressing on the carrier surface of the vehicle 10, or avoiding the situation that the edge of the body 100 cannot be pressed on the carrier surface of the vehicle 10 and there is no support, resulting in weak connection tightness between the body 100 and the vehicle 10 and the self-weight of the body 100 being shared by a plurality of ceramic substrates and damaging the ceramic substrates, improving the effective connection between the body 100 and the vehicle 10 and the fixing effect on the ceramic substrate.

[0052] In a possible implementation, the body 100 is further provided with a plurality of sinking grooves 120, one sinking groove 120 corresponding to one first connection notch 104. The sinking grooves 120 are arranged outside the first connection notch 104 and are disposed opposite to the connection base 211.

[0053] In this embodiment, the specific configuration of the body 100 is further optimized. Specifically, a plurality of sinking grooves 120 are also provided on the two side edges of the body 100 in the first direction X. The sinking grooves 120 can be nearly U-shaped and are used to accommodate the limiting heads of components such as long screws / long bolts that connect the body 100 and the edge of the carrier 10, improving the overall aesthetics.

[0054] In addition, referring to Figure 5 and Figures 1 to 4 , the present application also provides a fixing jig, including a carrier 10 and the pressing assembly 20 as described above. The carrier 10 is provided with a first connection hole 11 corresponding to the first positioning hole 101, two second connection holes 12 corresponding to the two second positioning holes 102, and a plurality of bearing platforms 13 corresponding to the plurality of chip holes 103. The ceramic substrate is disposed on the bearing platform 13. The body 100 of the pressing assembly 20 is pressed on the carrier 10, and the elastic module 200 of the pressing assembly 20 is elastically buckled on the ceramic substrate. The positioning module connects the body 100 to the carrier 10 through the combination of the first positioning hole 101 and the first connection hole 11, and the combination of the second positioning hole 102 and the second connection hole 12.

[0055] In this embodiment, a fixing jig is provided that can not only avoid the influence of thermal expansion but also improve the installation accuracy and stability, and has a simple structure and excellent performance. Specifically, the fixing jig is configured to include at least a combined component of a carrier 10 and a pressing assembly 20. The carrier 10 is provided with a plurality of bearing platforms 13, a first connection hole 11, and two second connection holes 12 corresponding to the plurality of chip holes 103. One ceramic substrate is placed on one bearing platform 13, and one ceramic substrate is elastically buckled by one elastic module 200 of the fixing jig; the first positioning hole 101 communicates with the first connection hole 11 and is connected without clearance through the positioning module, and the second positioning hole 102 communicates with the second connection hole 12 and is connected with clearance through the positioning module. The alignment accuracy between the body 100 and the carrier 10 of this fixing jig is high, the positioning stability is strong, the structure is simple and compact, the fixing effect on a plurality of ceramic substrates is good, which is beneficial to the production of batch flip chips, with high production efficiency and good product quality.

[0056] Meanwhile, the specific structure of the pressing assembly 20 refers to the above embodiment. Since this fixing jig adopts all the technical solutions of the above all embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, and will not be elaborated one by one here.

[0057] In a possible implementation, the carrier 10 is provided with a plurality of first locking holes 14 in the first direction X of the main body 100. The plurality of first locking holes 14 are spaced apart and distributed on the edge of the carrier 10. The fixing jig further includes a plurality of first locking members. One first locking member corresponds to a first connection notch 104 of the main body 100. The first locking member connects and fastens the main body 100 and the carrier 10 through the first connection notch 104 and the first locking hole.

[0058] In this embodiment, the specific configuration of the fixing jig is further optimized. Specifically, the fixing jig is configured as a combined component at least including the carrier 10, the pressing component 20 and the first locking member. The first locking member can be a long screw / a long bolt, etc. The two sides of the main body 100 in the first direction X are connected and fastened to the carrier 10 by sequentially passing the first locking member through the first connection notch 104 and the first locking hole. The fixing jig provided in this example has strong connection fastening performance, good positioning and fixing effects on a plurality of ceramic substrates, and is convenient for subsequent chip flip-chip operations.

[0059] In a possible implementation, the carrier 10 is provided with a plurality of second locking holes 15 in the second direction Y of the main body 100. The plurality of second locking holes 15 are spaced apart and distributed on the edge of the carrier 10. The fixing jig further includes a plurality of second locking members. One second locking member corresponds to a second connection notch 105 of the main body 100. The second locking member connects and fastens the main body 100 and the carrier 10 through the second connection notch 105 and the second locking hole 15.

[0060] In this embodiment, the specific configuration of the fixing jig is further optimized. Specifically, the fixing jig is configured as a combined component at least including the carrier 10, the pressing component 20 and the second locking member. The second locking member can be a long screw / a long bolt, etc. The two sides of the main body 100 in the second direction Y are connected and fastened to the carrier 10 by sequentially passing the second locking member through the second connection notch 105 and the second locking hole. The fixing jig provided in this example has strong connection fastening performance, good positioning and fixing effects on a plurality of ceramic substrates, and is convenient for subsequent chip flip-chip operations.

[0061] It should be understood that the terms used herein are for the purpose of describing particular example embodiments only and are not intended to be limiting. Unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" as used herein may also include the plural forms. The terms "comprising", "including", "containing", and "having" are inclusive and thus specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the particular order described or illustrated, unless an execution order is explicitly stated. It should also be understood that additional or alternative steps may be used.

[0062] Although the terms first, second, third, etc. may be used herein to describe multiple elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. Unless the context clearly indicates otherwise, terms such as "first", "second", and other numerical terms when used herein do not imply an order or sequence. Thus, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings of the example embodiments.

[0063] The above description is only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather will conform to the broadest scope consistent with the principles and novel features claimed herein.

Claims

1. A pressing assembly for pressing a plurality of ceramic substrates arranged in an array on a carrier, characterized in that, The pressing component includes: A body provided with a first positioning hole, two second positioning holes, and a plurality of chip holes arranged in an array. One of the chip holes corresponds to one of the ceramic substrates. The two second positioning holes are symmetrically distributed outside the plurality of chip holes. The first positioning hole is located outside the plurality of chip holes and forms a triangular distribution with the two first positioning holes; A plurality of elastic modules arranged in an array on the body. One of the elastic modules corresponds to one of the chip holes. At least a part of the elastic module extends into the chip hole so that when the body is pressed against the carrier, it elastically clamps the ceramic substrate; and A positioning module that connects the body and the carrier with a clearance through the two second positioning holes. At the same time, it connects the body and the carrier without a clearance through the first positioning hole.

2. The lamination assembly according to claim 1, characterized in that, The two second positioning holes are spaced apart in the first direction of the body. The included angle between the first positioning hole and any one of the second positioning holes is an acute angle.

3. The lamination assembly according to claim 2, wherein, The length of the second positioning hole in the first direction is greater than the length of the second positioning hole in the second direction of the body. Wherein, the straight line where the second direction is located is perpendicular to the straight line where the first direction is located. The positioning module includes a second positioning member that is in clearance fit with the second positioning hole.

4. The lamination assembly according to claim 3, wherein, The length of the first positioning hole in the first direction is equal to the length of the first positioning hole in the second direction. The positioning module further includes a first positioning member that is in non-clearance fit with the first positioning hole.

5. The lamination assembly according to claim 1, wherein, The elastic module includes two sets of elastic buckle groups arranged on opposite sides of the chip hole. The elastic buckle group includes a connecting seat, a spring piece, and a fastener. The connecting seat is arranged on the body. The spring piece is arranged on the side of the connecting seat away from the body and is connected to the connecting seat through the fastener.

6. The lamination assembly according to claim 5, wherein, The elastic buckle group further includes a connecting plate. The connecting plate is arranged on the side of the spring piece away from the connecting seat and at least partially abuts against the connecting seat. The connecting plate is connected to the connecting seat through the fastener.

7. The lamination assembly according to claim 5, wherein The body is provided with a plurality of first connection notches and a plurality of second connection notches. The plurality of first connection notches are spaced apart along the first direction of the body at the edge of the body. The plurality of second connection notches are spaced apart along the second direction of the body at the edge of the body.

8. The lamination assembly according to claim 7, wherein The body is further provided with a boss. The boss is arranged at the edge of the body corresponding to the first connection notch. The boss is arranged on the same side as the connecting seat. And in the third direction of the body, the height of the boss is greater than or equal to the height of the connecting seat; and / or, The body is further provided with a plurality of sinking grooves. One of the sinking grooves corresponds to one of the first connection notches. The sinking groove is arranged outside the first connection notch and is arranged opposite to the connecting seat.

9. A fixing fixture, characterized in that, Comprising a vehicle and a pressing component as described in any one of claims 1 to 8, a first connection hole corresponding to the first positioning hole, two second connection holes corresponding to the two second positioning holes, and a plurality of bearing platforms corresponding to the plurality of chip holes are provided on the vehicle. The ceramic substrate is disposed on the bearing platforms. The body of the pressing component is pressed on the vehicle. The elastic module of the pressing component is elastically buckled on the ceramic substrate. The positioning module connects the body to the vehicle through the combination of the first positioning hole and the first connection hole and the combination of the second positioning hole and the second connection hole.

10. The fixture according to claim 9, characterized in that, The vehicle is provided with a plurality of first locking holes in a first direction of the body. The plurality of first locking holes are spaced apart and distributed on the edge of the vehicle. The fixing fixture further includes a plurality of first locking members. One of the first locking members corresponds to a first connection notch of the body. The first locking member connects and fastens the body and the vehicle through the first connection notch and the first locking hole; and / or, The vehicle is provided with a plurality of second locking holes in a second direction of the body. The plurality of second locking holes are spaced apart and distributed on the edge of the vehicle. The fixing fixture further includes a plurality of second locking members. One of the second locking members corresponds to a second connection notch of the body. The second locking member connects and fastens the body and the vehicle through the second connection notch and the second locking hole.

Images