Pot cover, heating structure and cooking utensil

By setting a buffer between the lid of the pot cover and the thermally conductive substrate, the problem of heat insulation material crushing caused by assembly errors between the pot cover and the heating mechanism is solved, and the stable heating and high reliability of the pot cover are achieved.

CN223143305UActive Publication Date: 2025-07-25FOSHAN SHUNDE MIDEA ELECTRICAL HEATING APPLIANCES MFG CO LTD
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Patent Information

Application Number
CN202422208066.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-09
Publication Date
2025-07-25
Estimated Expiration
2034-09-09

AI Technical Summary

Technical Problem

In existing cooking utensils, the assembly error between the pot cover and the heating mechanism causes the insulation material to easily crush the heating mechanism, affecting the practicality and reliability of the pot cover.

Method used

A buffer member is provided between the cover body of the pot cover and the thermally conductive substrate, and the elastic compression deformation is used to adapt to assembly errors, prevent the heating assembly from being crushed, and the elastic contact between the buffer member and the thermally conductive substrate and the cover is used to ensure stable heating operation.

Benefits of technology

Improve the assembly stability and reliability of the pot lid, avoid damage to the heating components, and ensure the structural stability and reliability of the pot lid during transportation and use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a pot cover, a heating structure and a cooking utensil, and relates to the technical field of cooking equipment.The pot cover comprises a cover body, a heating assembly and a buffering piece, and the cover body is used for covering or opening a pot body; the heating assembly is connected to the cover body and comprises a heat conduction substrate and a heating film, and the heating film is attached to the surface, facing the cover body, of the heat conduction substrate; the buffer piece is arranged between the cover body and the heat conduction substrate and abuts against the cover body and the heat conduction substrate to generate elastic compression deformation. According to the technical scheme, stable operation of the heating assembly is guaranteed, and practicability and reliability of the pot cover are improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of cooking appliances, and particularly relates to a pot cover, a heating structure and a cooking appliance. Background Art

[0002] In the related art, cooking appliances such as rice cookers and steamers usually can be provided with a heating mechanism in the pot cover, and the heating mechanism is used to heat the inner cover surface of the pot cover covering the pot body, so that the temperature of the inner cover surface of the pot cover can be kept consistent with the temperature of the water vapor in the pot body, reduce the formation of condensed water on the inner cover surface of the pot cover, and better improve the cooking effect of the cooking appliance.

[0003] However, in the existing cooking appliances, most of the pot covers are provided with heat insulation materials such as rigid heat-resistant plastics and heat-insulating woods between the heating mechanism and the pot cover to avoid the heat generated by the heating mechanism acting on the pot cover and prevent the pot cover from being deformed due to the action of greater heat, so as to ensure the stable operation of other components in the pot cover.

[0004] However, there are mostly certain assembly errors in the gap between the cover body and the heating mechanism. When using rigid heat insulation materials, interference fit with the cover body and the heating mechanism is usually required during assembly to ensure the assembly stability of the heat insulation materials, resulting in that the heat insulation materials are easy to damage the heating mechanism, affecting the heating effect of the pot cover, and reducing the practicability and reliability of the pot cover. Summary of the Utility Model

[0005] The main purpose of the utility model is to provide a pot cover, a heating structure and a cooking appliance, aiming to prevent the heating component from being damaged by the elastic action of the buffer member, ensure the stable operation of the heating component, and improve the practicability and reliability of the pot cover.

[0006] To achieve the above purpose, the pot cover provided by the utility model includes a cover body, a heating component and a buffer member. The cover body is used to cover or open the pot body; the heating component is connected to the cover body, and the heating component includes a heat-conducting substrate and a heating film, and the heating film is attached to the surface of the heat-conducting substrate facing the cover body; the buffer member is arranged between the cover body and the heat-conducting substrate and abuts against the cover body and the heat-conducting substrate to generate elastic compression deformation.

[0007] In an embodiment, the pot cover is further provided with a mica sheet, and the mica sheet is arranged between the heat-conducting substrate and the buffer member and covers the heating film.

[0008] In an embodiment, the pot cover further includes a thermostat, and the thermostat is arranged between the cover body and the heat-conducting substrate and penetrates through the buffer member and the mica sheet, and the thermostat is used to detect and regulate the temperature of the heating component.

[0009] In one embodiment, the cover body is provided with an elastic member, and the elastic member connects the thermostat and the cover body.

[0010] In one embodiment, the heating assembly is provided with a heat conducting member, and the heat conducting member is disposed between the thermostat and the heating assembly and abuts against the thermostat and the heating assembly.

[0011] In one embodiment, the thermostat is provided with a fastener, and the fastener connects the thermostat and the mica sheet.

[0012] In one embodiment, define the elastic modulus of the buffer member as k, 10 3 N / m 2 ≤k≤10 7 N / m 2 . And / or, the material of the buffer member is an elastic heat insulating material.

[0013] In one embodiment, the heating assembly is further provided with an insulating layer, and the insulating layer adheres to the surface of the heat conducting substrate facing the cover body and covers the heating film.

[0014] In one embodiment, the cover body is provided with a support member, and the support member is disposed at a relative interval with respect to the surface of the cover body, and the heating assembly and the buffer member are clamped between the support member and the surface of the cover body. And / or, the material of the heat conducting substrate is glass.

[0015] In one embodiment, the cover body is provided with a mounting groove, and the heating assembly and the buffer member are disposed in the mounting groove. The heating assembly further includes a sealing ring, and the sealing ring surrounds the heat conducting substrate and is clamped to the inner side wall of the mounting groove.

[0016] In one embodiment, define the thickness of the buffer member as W, W≥2mm. And / or, the buffer member is one or more of aerogel, heat insulating cotton or heat insulating colloid.

[0017] The present utility model further provides a cooking appliance, the cooking appliance includes a pot body and a pot lid, the pot lid is the above-mentioned pot lid, and the pot lid is used to open or close the pot body. And / or, a partition column is provided on one side of the cover body facing the heating assembly, and the partition column abuts against the buffer member.

[0018] The present utility model further provides a heating structure, the heating structure includes a heating assembly and a buffer member, the heating assembly includes a glass substrate and a heating film, and the heating film adheres to the surface of the glass substrate; the buffer member is disposed between the glass substrate and the mounting member.

[0019] The technical solution of the present utility model can, by arranging a buffer member between the cover body and the heat-conducting substrate, utilize the elastic compression effect of the buffer member during installation, enabling the buffer member to well overcome the installation error between the cover body and the heating assembly for assembly, achieving elastic contact between the buffer member and the heating assembly. This is conducive to preventing the heating assembly from being subjected to a large instantaneous impact force during transportation or use by means of the elastic buffering effect of the buffer member, avoiding damage to the heating assembly, ensuring the stable heat generation operation of the heating assembly, and effectively improving the practicability and reliability of the pot lid. Brief Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following-described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0021] Figure 1 The bottom view of an embodiment of the pot lid provided by the present utility model;

[0022] Figure 2 is Figure 1 the cross-sectional view at A-A in

[0023] Figure 3 is Figure 2 the partial enlarged view at C in

[0024] Figure 4 is Figure 1 the cross-sectional view at B-B in

[0025] Figure 5 is Figure 4 the partial enlarged view at D in

[0026] Figure 6 is Figure 1 the top view of an embodiment of the heating assembly of the pot lid of

[0027] Explanation of the Reference Numerals in the Drawings:

[0028] 100, pot lid; 10, cover body; 11, elastic member; 13, installation groove; 15, partition column; 17, support member; 30, heating assembly; 31, heat-conducting substrate; 33, heating film; 35, sealing ring; 50, buffer member; 70, mica sheet; 90, temperature controller;

[0029] The realization of the purpose, functional features and advantages of the present utility model will be further described with reference to the embodiments and the drawings. Detailed Embodiments

[0030] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0031] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0032] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution where A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0033] In existing cooking utensils, most of the pot lids are provided with heat insulation materials such as rigid heat-resistant plastic and heat-insulating wood between the heating mechanism and the pot lid to prevent the heat generated by the heating mechanism from acting on the pot lid, prevent the pot lid from deforming due to the action of excessive heat, and ensure the stable operation of other components in the pot lid. However, there are usually certain assembly errors in the gap between the lid body and the heating mechanism. When using rigid heat insulation materials, it is usually necessary to have an interference fit with the lid body and the heating mechanism during assembly to ensure the assembly stability of the heat insulation materials, resulting in the heat insulation materials being easily damaged to the heating mechanism, affecting the heating effect of the pot lid, and reducing the practicability and reliability of the pot lid. To solve the above problems, the present utility model proposes a pot lid 100.

[0034] Please refer to Figures 1 to 6, in an embodiment of the present utility model, the pot lid 100 includes a lid body 10, a heating assembly 30, and a buffer member 50. The lid body 10 is used to cover or open the pot body; the heating assembly 30 is connected to the lid body 10. The heating assembly 30 includes a heat-conducting substrate 31 and a heating film 33, and the heating film 33 is attached to the surface of the heat-conducting substrate 31 facing the lid body 10; the buffer member 50 is disposed between the lid body 10 and the heat-conducting substrate 31, and abuts against the lid body 10 and the heat-conducting substrate 31 to generate elastic compression deformation.

[0035] It can be understood that the pot lid 100 can cover the cooking cavity of the pot body so that the food ingredients can be stably heated and cooked in the cooking cavity. During the cooking process, the cooking appliance can control the heating film 33 on the pot lid 100 to be energized and generate heat. The heating film 33 can be made of a heat-generating material such as graphene. At this time, the heat generated by the heating film 33 can conduct the heat to the heat-conducting substrate 31. The heat-conducting substrate 31 can be made of a metal, glass, etc. with good heat-conducting performance. When the pot lid 100 covers the pot body, the heat-conducting substrate 31 can be located in the cooking cavity. By controlling the operating power of the heating film 33, the temperature of the heat-conducting substrate 31 can be kept consistent with the temperature of the cooking cavity of the pot body, which can prevent the water vapor in the pot body from spreading to the pot lid 100 and forming condensed water on the pot lid 100, and avoid condensed water droplets falling into the cooking cavity when the pot lid 100 is opened, so that the food ingredients can have a better taste after cooking.

[0036] Since the lid body 10 usually can also be configured with components such as a control panel, and the lid body 10 is mostly made of materials such as plastic, during assembly, a certain distance usually needs to be maintained between the lid body 10 and the heating assembly 30 to avoid the heat generated by the heating assembly 30 acting on the lid body 10 and causing the lid body 10 to be deformed by heat or affecting the stable operation of other components in the lid body 10. By providing a buffer member 50 between the lid body 10 and the heating assembly 30, the buffer member 50 can be made of a buffer material with a certain elasticity, such as a rubber material, an elastic fiber material, etc., so that the buffer member 50 can abut against the lid body 10 and the heat-conducting substrate 31, and the buffer member 50 can undergo a certain elastic compression deformation under the pressing action of the heat-conducting substrate 31 and the lid body 10 to support the heat-conducting substrate 31. Among them, the heating film 33 can be made of a heating material such as graphene, and the heating assembly 30 can be produced and processed by sticking and attaching it to the heat-conducting substrate 31; or, a heating film 33 formed by coating a material such as graphene ink or carbon fiber conductive ink on the plate surface of the heat-conducting substrate 31 can be used to realize the production and processing of the heating assembly 30.

[0037] During the production and assembly process of the pot lid 100, the assembly of the heating component 30 on the lid body 10 can have a certain surplus, resulting in a certain error between the spacing between the heating component 30 and the lid body 10 and the actually designed reserved spacing. By arranging a buffer member 50 with a certain elasticity between the lid body 10 and the heating component 30, the buffer member 50 can undergo elastic compression deformation during assembly to adjust the thickness dimension of the buffer member 50, so that the buffer member 50 can better adapt to the assembly error setting between the lid body 10 and the heating component 30, and better ensure the assembly stability and reliability of the pot lid 100. Compared with a rigid heat insulation member, using the elastic deformation of the buffer member 50 to stably arrange the buffer member 50 between the lid body 10 and the heating component 30 can prevent the heating film 33 or the heat conduction substrate 31 from deforming, which is beneficial to better avoid the heating film 33 from being damaged, ensure the overall structural stability of the heat conduction substrate 31, avoid the heat conduction substrate 31 made of materials such as glass from being cracked, and better improve the overall structural stability and reliability of the pot lid 100. In addition, during the transportation or use of the cooking appliance, the cooking appliance is prone to a certain shaking force. At this time, under the elastic buffering effect of the buffer member 50, it can effectively prevent the heating film 33 or the heat conduction substrate 31 from being affected by a large instantaneous impact force, which is beneficial to better avoid the heating component 30 from being damaged, ensure the stable operation of the heating component 30, and improve the structural stability and reliability of the pot lid 100.

[0038] The technical solution of the present utility model arranges a buffer member 50 between the lid body 10 and the heat conduction substrate 31. During installation, the elastic compression of the buffer member 50 can be utilized to enable the buffer member 50 to well overcome the installation error between the lid body 10 and the heating component 30 for assembly, realizing elastic contact between the buffer member 50 and the heating component 30. This is beneficial to using the elastic buffering effect of the buffer member 50 during transportation or use to prevent the heating component 30 from being affected by a large instantaneous impact force, avoid the heating component 30 from being damaged, ensure the stable heat generation operation of the heating component 30, and effectively improve the practicability and reliability of the pot lid 100.

[0039] Refer to Figures 2 to 5 In the embodiment of the present utility model, the pot lid 100 is further provided with a mica sheet 70. The mica sheet 70 is arranged between the heat conduction substrate 31 and the buffer member 50 and covers the heating film 33.

[0040] In this embodiment, the pot lid 100 may further be provided with a mica sheet 70 between the heat-conducting substrate 31 and the buffer member 50. The heat-insulating property of the mica sheet 70 can better cooperate with the buffer member 50 to isolate the heat released by the heating assembly 30 from acting on the lid body 10, achieving a better heat-insulating effect and further improving the structural stability and reliability of the pot lid 100. In addition, when the buffer member 50 is made of materials such as aerogel or heat-insulating cotton, the buffer member 50 is prone to powder dropping and other situations under the long-term high-temperature action. At this time, by providing a mica sheet 70 between the buffer member 50 and the heat-conducting substrate 31, it is also beneficial to collect the powder dropped by the buffer member 50 on the mica sheet 70, preventing the powder of the buffer member 50 from dropping and accumulating on the heat-conducting substrate 31, which may affect the insulation performance of the electrothermal film 33 with a certain probability and avoid potential safety hazards, further improving the structural stability and reliability of the pot lid 100.

[0041] Refer to Figures 2 to 4 , in the embodiment of the present utility model, the pot lid 100 further includes a thermostat 90. The thermostat 90 is disposed between the lid body 10 and the heat-conducting substrate 31 and passes through the buffer member 50 and the mica sheet 70. The thermostat 90 is used to detect and regulate the temperature of the heating assembly 30.

[0042] In this embodiment, by providing the thermostat 90 between the lid body 10 and the heat-conducting substrate 31, the temperature-measuring element of the thermostat 90 can be in contact with the heat-conducting substrate 31 or the heating film 33, and then the temperature of the heating assembly 30 can be monitored, which is beneficial to better obtain the temperature of the heating assembly 30 for corresponding regulation, so that the temperature of the heating assembly 30 can better match the temperature of the cooking cavity of the pot body, prevent condensed water from forming on the surface of the heat-conducting substrate 31, and at the same time avoid overheating of the heating assembly 30, which may reduce the service life of the heating film 33 with a certain probability, further improving the practicality and reliability of the pot lid 100. Among them, through-hole structures can be correspondingly provided on the buffer member 50 and the mica sheet 70 so that the thermostat 90 is disposed through the through-holes of the buffer member 50 and the mica sheet 70, preventing the thermostat 90 from interfering with the buffer member 50 and the mica sheet 70, ensuring the stable operation of the thermostat 90, and further improving the structural stability and reliability of the pot lid 100.

[0043] Refer to Figure 3 , in the embodiment of the present utility model, the lid body 10 is provided with an elastic member 11, and the elastic member 11 connects the thermostat 90 and the lid body 10.

[0044] In this embodiment, by using the elastic member 11 to connect the thermostat 90 and the cover body 10, the elastic member 11 can be formed into a spring made of heat-resistant material or heat-resistant rubber, heat-resistant silica gel, etc. with certain elasticity. Under the action of the elastic deformation of the elastic member 11, the thermostat 90 can be arranged between the cover body 10 and the heat-conducting substrate 31 in a liftable and movable manner. Furthermore, when the pot lid 100 is assembled, the elastic member 11 can be compressed to generate a certain elastic deformation, so that the thermostat 90 can stably contact the heating component 30 under the elastic force of the elastic member 11 for temperature measurement, avoiding poor contact between the thermostat 90 and the heating component 30, and ensuring the reliable temperature measurement of the thermostat 90 and the stable regulation of the temperature of the heating component 30. In addition, using the elastic member 11 to connect the cover body 10 and the thermostat 90 to make the thermostat 90 stably abut against the heating component 30 is also beneficial to utilize the buffering effect of the elastic member 11 to better reduce the instantaneous impact force of the thermostat 90 on the heating component 30 during the transportation or use of the cooking appliance, preventing the heating film 33 or the heat-conducting substrate 31 from being damaged or cracked by the thermostat 90, ensuring the stable operation of the heating component 30, and further improving the structural stability and reliability of the pot lid 100.

[0045] In an embodiment of the present utility model, the heating component 30 is provided with a heat-conducting member, and the heat-conducting member is arranged between the thermostat 90 and the heating component 30 and abuts against the thermostat 90 and the heating component 30.

[0046] In this embodiment, the heating component 30 can be provided with heat-conducting silicone grease, elastic heat-conducting materials and other heat-conducting members between the thermostat 90 and the heat-conducting substrate 31 or the heating film 33. Under the action of the heat-conducting member, the heat generated on the heating component 30 can be quickly transferred to the temperature-measuring element of the thermostat 90, ensuring the stable temperature measurement of the thermostat 90 for the heating component 30. By arranging the heat-conducting member between the thermostat 90 and the heating component 30, since the heat-conducting member has a certain softness, the temperature-measuring element of the thermostat 90 can be prevented from directly contacting the heating film 33 or the heat-conducting substrate 31 under the action of the heat-conducting member, avoiding wear or scratching between the thermostat 90 and the heating film 33 or the heat-conducting substrate 31, ensuring the stable operation of the thermostat 90 and the heating component 30, and further improving the overall structural stability and reliability of the pot lid 100.

[0047] In an embodiment of the present utility model, the thermostat 90 is provided with a fastener, and the fastener connects the thermostat 90 and the mica sheet 70.

[0048] In this embodiment, the thermostat 90 can be connected to the mica sheet 70 by fasteners such as bolts and buckles. At this time, the mica sheet 70 can be provided with a bent flange on the outer periphery of the thermostat 90, and the fastener connects the bent flange of the mica sheet 70 and the outer wall of the thermostat 90 to achieve a stable connection between the thermostat 90 and the mica sheet 70. Furthermore, under the connection action of the mica sheet 70 and the thermostat 90, the thermostat 90 can be more stably abutted against the heating substrate or the heating film 33 by the installation of the mica sheet 70 on the heat-conducting substrate 31, avoiding the separation of the thermostat 90 from the heating component 30 and having a certain probability of affecting the temperature measurement accuracy of the thermostat 90, so that the thermostat 90 can achieve more accurate temperature measurement and control, further improving the practicability and reliability of the pot lid 100.

[0049] In the embodiment of the present utility model, the heating component 30 is further provided with an insulating layer, and the insulating layer is attached to the surface of the heat-conducting substrate 31 facing the cover body 10 and covers the heating film 33.

[0050] In this embodiment, the heating component 30 can coat an insulating paint on the heat-conducting substrate 31 to cover the heating film 33 to form an insulating layer; or a film made of an insulating material can be attached to the heat-conducting substrate 31 and cover the heating film 33 to form an insulating layer. Under the action of the insulating layer, the electrical isolation of the heating film 33 can be well realized, avoiding the electrical contact between the heating film 33 and the cover body 10 or the buffer member 50, and ensuring the overall structural stability of the pot lid 100. Among them, when the pot lid 100 is provided with a thermostat 90 for temperature measurement and regulation of the working power of the heating film 33, the thermostat 90 can abut against the insulating layer and is arranged corresponding to the heat generation position of the heating film 33. At this time, under the action of the insulating layer, it can better prevent the electric energy of the heating film 33 from acting on the thermostat 90, ensure the stable operation of the thermostat 90, realize a better insulation effect of the heating component 30, and further improve the overall structural stability and reliability of the pot lid 100. In addition, setting an insulating layer on the heat-conducting substrate 31 to cover the heating film 33 is also beneficial to protecting the heating film 33 to a certain extent by the insulating layer, avoiding the mutual contact and friction between the heating film 33 and other components, preventing the heating film 33 from being worn, and ensuring the stable heating effect of the heating component 30.

[0051] Refer to Figure 5 In the embodiment of the present utility model, the cover body 10 is provided with a support member 17, and the support member 17 is relatively spaced from the surface of the cover body 10, and the heating component 30 and the buffer member 50 are clamped between the support member 17 and the surface of the cover body 10. And / or, the material of the heat-conducting substrate 31 is glass.

[0052] In this embodiment, the cover body 10 may be provided with a support member 17 on the surface covering the pot body. The support member 17 may be arranged in an annular structure, or the support member 17 may be a plurality of block structures arranged at intervals around the edge of the surface of the heat conduction substrate 31 facing away from the cover body 10. By relatively spacing the support member 17 from the surface of the cover body 10, the heating component 30 and the buffer member 50 can be clamped and fixed between the support member 17 and the surface of the cover body 10, realizing the assembly and fixation of the pot cover 100 to the heating component 30 and the buffer member 50, and ensuring the stable operation of the pot cover 100.

[0053] However, due to a certain dimensional difference and assembly error between the distance between the support member 17 and the surface of the cover body 10 and the thickness dimension of the heating component 30, the heating component 30 has a certain displacement space between the support member 17 and the cover body 10. When the heat conduction substrate 31 is made of a fragile material such as glass, it is easy to cause the heat conduction substrate 31 to be stressed and cracked. Therefore, compared with directly clamping and fixing the heating component 30 by using the support member 17 and the cover body 10 on the pot cover 100, by arranging the buffer member 50 between the cover body 10 and the heat conduction substrate 31, and making the support member 17 and the cover body 10 clamp the heating component 30 and the buffer member 50, the elastic deformation of the buffer member 50 can be used to better buffer the acting force received by the heating component 30, which is beneficial to better avoid the cracking of the heat conduction substrate 31 made of fragile materials such as glass, ensure the stable operation of the pot cover 100, and further improve the overall structural stability and reliability of the pot cover 100.

[0054] In addition, the heat conduction substrate 31 may be made of a glass material with a certain light transmittance. At this time, the heating film 33 may be installed on the surface of the heat conduction substrate 31 by means of adhesion, or the conductive heating coating may be directly applied on the surface of the heat conduction substrate 31 to form the heating film 33. The insulating performance and certain heat conduction performance of the glass material can be used to ensure the stable and reliable heating of the heating film to the heat conduction substrate 31, which is beneficial to better prevent the heat conduction substrate 31 from making electrical contact with the water vapor in the pot body, reduce the electricity consumption hidden danger of the cooking appliance, and at the same time, the heat conduction substrate 31 made of glass material can be used to better improve the aesthetics of the pot cover 100, and further improve the practicality and reliability of the pot cover 100.

[0055] Refer to Figures 2 to 5 In the embodiment of the present utility model, the cover body 10 is provided with an installation groove 13, and the heating component 30 and the buffer member 50 are arranged in the installation groove 13. The heating component 30 further includes a sealing ring 35, and the sealing ring 35 surrounds the heat conduction substrate 31 and is clamped to the inner side wall of the installation groove 13.

[0056] In this embodiment, the cover body 10 may be provided with an installation groove 13 on the inner cover surface facing the pot body. When the pot cover 100 covers the pot body, the installation groove 13 may be located in the cooking cavity of the pot body. By arranging the heating component 30 and the buffer member 50 in the installation groove 13, the installation groove 13 can be used to fix the heating component 30, ensuring the stable operation of the heating component 30 on the cover body 10. Among them, by sleeving a sealing ring 35 on the outer periphery of the heat-conducting substrate 31, the sealing ring 35 can be installed in the installation groove 13 by interference fit with the inner side wall of the installation groove 13, so that the heating component 30 can be stably fixed in the installation groove 13, and it can better prevent gaps from existing between the heat-conducting substrate 31 and the inner side wall of the installation groove 13, preventing water vapor from entering the installation groove 13 through the gap between the heat-conducting substrate 31 and the inner side wall of the installation groove 13, which may affect the stable operation of the heating film 33 with a certain probability. Furthermore, under the action of the installation groove 13 and the sealing ring 35, the heating film 33 can be hermetically protected, ensuring the stable operation of the heating component 30, and further improving the overall structural stability and reliability of the pot cover 100. Among them, a surrounding edge may be provided at the edge of the notch of the installation groove 13, and the surrounding edge can be used to abut against the sealing ring 35 to prevent the sealing ring 35 from slipping out of the installation groove 13, which is beneficial to better improving the assembly stability and reliability of the heating component 30 on the cover body 10. In addition, the sealing ring 35 may be made of a temperature-resistant and heat-insulating material with a certain elasticity, so that the sealing ring 35 can be more stably clamped in the installation groove 13 by using its own elastic deformation, and the heat-insulating property of the sealing ring 35 can be used to better prevent the heat released from the heating component 30 from acting on the cover body 10, achieving a better heat-insulating effect inside the pot cover 100, and further improving the overall structural stability and reliability of the pot cover 100.

[0057] Refer to Figure 3 , in the embodiment of the present utility model, the thickness of the buffer member 50 is defined as W, and W≥2mm. And / or, the buffer member 50 is one or more of aerogel, heat-insulating cotton or heat-insulating colloid. And / or, a partition column 15 is provided on the side of the cover body 10 facing the heating component 30, and the partition column 15 abuts against the buffer member 50.

[0058] In this embodiment, the thickness of the buffer member 50 can be limited within a range greater than or equal to 2mm. Within this range, the buffer member 50 can have a relatively large thickness dimension to isolate the heat transfer from the heating component 30 to the cover body 10, achieving a better heat-insulating effect; at the same time, it can enable the buffer member 50 to better meet the spacing dimension setting between the cover body 10 and the heating component 30, so that the buffer member 50 can be more stably arranged between the cover body 10 and the heating component 30 and abut against the cover body 10 and the heating component 30, further improving the practicability and reliability of the pot cover 100.

[0059] In addition, the buffer member 50 can also be made of an elastic heat-insulating material with good high-temperature resistance, so that when the buffer member 50 is installed in the pot cover to abut against the supporting cover body 10 and the heat-conducting substrate 31, the buffer member 50 can be used to better isolate the heat generated by the heating film 33 from being transferred to the cover body 10, further preventing the cover body 10 from being affected by the heat of the heating component 30, thereby ensuring the stable operation of the cooking appliance.

[0060] Furthermore, the buffer 50 can be made of elastic materials with certain temperature resistance and heat insulation properties, such as aerogel, heat insulation cotton or heat insulation colloid, so that the buffer 50 can have a good elastic buffering effect, realize stable heat insulation and buffering protection of the heating component 30, better ensure the stable operation of the pot cover 100, and further improve the practicality and reliability of the pot cover 100. Among them, the buffer 50 can be made of a single material, or can be made of multiple materials in a certain ratio, so that the buffer 50 can achieve more stable and reliable physical properties under the cooperation of multiple materials, and further improve the overall structural stability and reliability of the pot cover 100.

[0061] A plurality of partition columns 15 may be protruded on the inner cover surface of the cover body 10 facing the heating assembly 30, and the partition columns 15 may be used to abut against the surface of the buffer member 50 facing away from the heating assembly 30, so that the buffer member 50 is stably arranged between the cover body 10 and the heating assembly 30. Furthermore, under the action of the partition columns 15, a certain cavity may be provided between the surface of the buffer member 50 facing away from the heating assembly 30 and the inner cover surface of the cover body 10, and the air in the cavity may be used to achieve further heat insulation, which is beneficial to better prevent the heat released from the heating assembly 30 from being transferred to the cover body 10, ensure the stable and reliable operation of other components in the cover body 10, and further improve the overall structural stability and reliability of the pot cover 100.

[0062] In the embodiment of the present invention, the elastic modulus of the buffer 50 is defined as k, 10 3 N / m 2 ≤k≤10 7 N / m 2 .

[0063] In some embodiments, the buffer member 50 may have an elastic modulus greater than or equal to 10 3 N / m 2 , and less than or equal to 10 7 N / m 2It is made of an elastic material. The buffer member 50 made of an elastic material within this elastic modulus range can have sufficient elastic force to buffer and support the heat-conducting substrate 31 when elastically compressed between the cover body 10 and the heat-conducting substrate 31, better avoiding the heat-conducting substrate 31 from being subjected to a large instantaneous impact force; at the same time, it can better avoid the elastic modulus of the buffer member 50 being too large, which may lead to an excessive elastic buffer force after the buffer member 50 is compressed and deformed, better preventing the heating component 30 from being damaged, and further improving the practicability and reliability of the pot lid 100.

[0064] The present utility model also proposes a heating structure, including a heating component 30 and a buffer member 50. The heating component 30 includes a glass substrate and a heating film 33, and the heating film 33 is attached to the surface of the glass substrate; the buffer member 50 is disposed between the glass substrate and the mounting member.

[0065] It can be understood that the heating film 33 can be made of a heat-generating material such as graphene, and the heating film 33 can be attached to the glass substrate using an adhesive to realize the production and processing of the heating component 30; or, a heating film 33 formed by coating a material such as graphene ink or carbon fiber conductive ink on the surface of the glass substrate can be used to realize the production and processing of the heating component 30. The heat generated by the heating film 33 can be conducted to the glass substrate, and the heat-conducting characteristics of the glass substrate can be utilized to make the entire glass substrate have a certain temperature, realizing a large-range heat generation effect of the heating structure.

[0066] The heating structure can be applied in various environments where heat needs to be generated. For example, it can be set on the pot lid 100 of a cooking appliance. The heating structure can be set on the side of the pot lid 100 facing the pot body, so that the cooking appliance can use the heating structure to generate heat to prevent the water vapor generated by heating the food from condensing on the surface of the pot lid 100 and avoid the condensed water droplets from falling onto the food and affecting the cooking effect of the food.

[0067] Among them, in the device accommodating the heating structure, the glass substrate can be fixedly installed by mounting members such as buckles and clip clips corresponding to the size of the glass substrate to ensure the stable operation of the heating structure in the device. However, due to certain assembly errors that are likely to occur during the actual assembly process, there may be a certain gap between the glass substrate and the mounting member. At this time, by setting the buffer member 50 at the gap between the glass substrate and the mounting member, the buffer member 50 can be made of a material with a certain elasticity, so that the buffer member 50 can undergo a certain elastic compression deformation under the abutting action of the glass substrate and the mounting member. Furthermore, the buffer member 50 can fill the gap between the glass substrate and the mounting member, effectively preventing the glass substrate from loosening at the mounting member and having a certain probability of cracking. At the same time, the elastic force of the buffer member 50 can buffer the force received by the glass substrate, avoiding the glass substrate from being subjected to a large instantaneous impact force, and better improving the stability and reliability of the heating structure.

[0068] The present utility model further provides a cooking appliance, which includes a pot body and a pot cover 100. The specific structure of the pot cover 100 refers to the above embodiments. Since this cooking appliance adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated herein one by one.

[0069] The above description is only an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformation made under the technical concept of the present utility model by using the content of the specification and drawings of the present utility model, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present utility model.

Claims

1. A pot lid, characterized in that, Comprising: A cover body, which is used to cover or open the pot body; A heating component, which is connected to the cover body. The heating component includes a heat-conducting substrate and a heating film, and the heating film is attached to the surface of the heat-conducting substrate facing the cover body; And A buffer member, which is arranged between the cover body and the heat-conducting substrate and abuts against the cover body and the heat-conducting substrate to generate elastic compressive deformation.

2. The pot lid according to claim 1, characterized in that, The pot cover is also provided with a mica sheet, which is arranged between the heat-conducting substrate and the buffer member and covers the heating film.

3. The pot lid according to claim 2, wherein The pot cover also includes a thermostat, which is arranged between the cover body and the heat-conducting substrate and passes through the buffer member and the mica sheet. The thermostat is used to detect and regulate the temperature of the heating component.

4. The pot lid according to claim 3, characterized in that, The cover body is provided with an elastic member, and the elastic member connects the thermostat and the cover body.

5. The pot lid according to claim 3, wherein, The heating component is provided with a heat-conducting member, which is arranged between the thermostat and the heating component and abuts against the thermostat and the heating component.

6. The pot lid according to claim 3, characterized in that, The thermostat is provided with a fastener, and the fastener connects the thermostat and the mica sheet.

7. The pot lid according to any one of claims 1 to 6, characterized in that, Define the elastic modulus of the buffer as k, 10 3 N / m 2 ≤k≤10 7 N / m 2 ; And / or, the buffer member is made of an elastic heat-insulating material.

8. The pot lid according to any one of claims 1 to 6, characterized in that The heating component is also provided with an insulating layer, which is attached to the surface of the heat-conducting substrate facing the cover body and covers the heating film.

9. The pot lid according to any one of claims 1 to 6, characterized in that, The cover body is provided with a support member, and the support member is arranged at a relative interval with the surface of the cover body. The heating component and the buffer member are clamped between the support member and the surface of the cover body; And / or, the heat-conducting substrate is made of glass.

10. The pot lid according to any one of claims 1 to 6, characterized in that, The cover body is provided with a mounting groove, and the heating component and the buffer member are arranged in the mounting groove; The heating component also includes a sealing ring, which surrounds the heat-conducting substrate and is clamped to the inner side wall of the mounting groove.

11. The pot lid according to any one of claims 1 to 6, characterized in that, Define the thickness of the buffer member as W, W≥2mm; And / or, the buffer member is one of aerogel, heat-insulating cotton or heat-insulating colloid; And / or, a partition column is arranged on one side of the cover body facing the heating component, and the partition column abuts against the buffer member.

12. A heating structure, characterized in that, Comprising: A heating component, which includes a glass substrate and a heating film, and the heating film is attached to the surface of the glass substrate; And A buffer member, which is configured between the glass substrate and the mounting member.

13. A cooking appliance, characterized in that, The cooking appliance includes a pot body and a pot cover, and the pot cover is the pot cover according to any one of claims 1 to 11. The pot cover is used to open or cover the pot body.