Electronic moisture-proof and mildew-proof tea caddy
By using the dehumidification structure of semiconductor refrigeration chips and moisture absorbing boxes in tea cans, the problem of regular replacement of moisture-proof agents in traditional tea cans is solved, and the long-term dryness maintenance and storage convenience is achieved.
Patent Information
- Application Number
- CN202422126044.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-08-30
AI Technical Summary
The moisture-proof agent in traditional tea cans needs to be replaced regularly, which increases storage costs and is inconvenient, making it difficult to maintain dryness for a long time.
The dehumidification structure consisting of a semiconductor refrigeration chip and a moisture absorbing box is used to separate the moisture in the air through condensation and drainage holes, replace traditional desiccants, and automatically dehumidification is achieved using power supply.
There is no need to change the moisture absorbent regularly, and maintain the dryness in the tea pot for a long time, improving the practicality and convenience of the storage environment.
Smart Images
Figure CN223149249U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of tea cans, and specifically to an electronic moisture-proof and mildew-proof tea can. Background Technique
[0002] A tea can is a container specifically designed for storing and preserving tea, aiming to maintain the freshness, aroma, and flavor of the tea. The design and materials of the tea can usually take into account the characteristics of the tea to ensure the best storage conditions.
[0003] Traditional tea cans store tea by creating a sealed environment using the can body to increase the dryness of the tea storage environment, thereby reducing the occurrence of tea mildew. At the same time, a moisture-proof agent is used to absorb the water vapor contained in the tea can. However, during the storage process, the use of the moisture-proof agent has a certain periodicity and needs to be replaced irregularly according to the weather. Therefore, there will inevitably be a process of opening the tea can for replacement, which undoubtedly increases the tea storage cost. For this reason, an electronic moisture-proof and mildew-proof tea can is proposed to solve the above-mentioned problems. Utility Model Content
[0004] In view of the deficiencies of the prior art, this application provides an electronic moisture-proof and mildew-proof tea can, which uses a power-supplied dehumidification functional component to replace the traditional dehumidification agent for dehumidification. It is more convenient than the traditional method using a dehumidification agent, and greatly improves the dryness inside the tea can, ensuring an excellent storage environment.
[0005] To achieve the above object, this application provides the following technical solution: An electronic moisture-proof and mildew-proof tea can, including a can body and a can lid, the can lid is threadedly connected to the can body, a tea grid is fixedly installed at the inner bottom of the can body, and a dehumidification structure is provided at the bottom of the can body;
[0006] The dehumidification structure includes a semiconductor refrigeration chip fixedly installed on the inner bottom wall of the can body and a moisture absorption box located outside the semiconductor refrigeration chip. A heat sink is fixedly installed at one end of the semiconductor refrigeration chip facing the outside of the can body. An axial flow fan is also fixedly installed outside the semiconductor refrigeration chip and located between the heat sinks. A drain hole communicating with the inside of the moisture absorption box is also penetrated through the bottom wall of the can body.
[0007] Further, a condensation column is fixedly installed on one side of the semiconductor refrigeration chip facing the moisture absorption box, and the condensation columns are arranged in an array and extend into the moisture absorption box.
[0008] Further, a cover is buckled on the top of the moisture absorption box, and a water-locking paper is also squeezed and fixed between the cover and the moisture absorption box.
[0009] Further, the heat sinks are circularly arranged around the outside of the axial flow fan.
[0009]
[0010] Further, a bracket is fixedly installed at the bottom of the tank body, and a support pipe located outside the bracket is also fixedly installed at the bottom of the tank body.
[0011] Further, a diversion plate is fixedly installed on the inner wall of the moisture absorption box, and the diversion plate is inclined toward the side of the drain hole.
[0012] Further, a plurality of holes penetrate through the cover, which are only used to fix the water-locking paper at the upper opening of the moisture absorption box and can not hinder the natural flow of air.
[0013] Compared with the prior art, the technical solution of the present application has the following beneficial effects:
[0014] In this electronic moisture-proof and mildew-proof tea canister, a semiconductor refrigeration chip is connected to a condensation column and located inside the tank body. The tea is blocked by a tea grid, and a moisture absorption box is installed to condense the air inside the tank body, so as to separate the moisture contained in the air, thereby replacing the use of desiccants to remove the water vapor inside the tank body. Due to the controllability and reusability of the semiconductor refrigeration chip, there is no need to regularly replace the moisture absorbent, and through the provided support pipe and axial flow fan, the long-term use effect of the semiconductor refrigeration chip is also good, improving the practicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 is a schematic diagram of the overall structure of the present application;
[0016] Figure 2 is a schematic diagram of the heating surface structure of the semiconductor refrigeration chip of the present application;
[0017] Figure 3 is a three-dimensional structure diagram of the connection between the diversion plate and the condensation column of the present application.
[0018] In the figure: 1, tank body; 2, tank cover; 3, tea grid; 4, moisture absorption box; 5, cover; 6, water-locking paper; 7, semiconductor refrigeration chip; 8, condensation column; 9, diversion plate; 10, drain hole; 11, heat sink; 12, axial flow fan; 13, bracket; 14, support pipe. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0019] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
[0020] Please refer to Figures 1 to 3, An electronic moisture-proof and mildew-proof tea canister in this embodiment includes a can body 1 made of ceramic material and a can lid 2. The can lid 2 is threadedly connected to the can body 1 to close the upper opening of the can body 1.
[0021] In this embodiment, a tea grid 3 is fixedly installed at the inner bottom of the can body 1 for placing tea leaves and providing a certain setting space by suspending the tea leaves. The holes of the tea grid 3 should be smaller than the size of broken tea leaves to prevent a large amount of tea leaves from falling below the tea grid 3.
[0022] It should be noted that a dehumidification structure for dehumidifying the inside of the can body 1 is also provided at the bottom of the can body 1. The dehumidification structure includes a semiconductor refrigeration chip 7 fixedly installed on the inner bottom wall of the can body 1 and a moisture absorption box 4 located outside the semiconductor refrigeration chip 7.
[0023] Preferably, a condensation column 8 is fixedly installed on one side of the semiconductor refrigeration chip 7 facing the moisture absorption box 4. The condensation column 8 extends into the moisture absorption box 4 in an array arrangement, and the condensation column 8 is made of a metal with a good thermal conductivity, such as a copper rod.
[0024] In order to prevent the condensation column 8 from condensing the gas inside the can body 1 in the moisture absorption box 4 and causing water vapor to overflow, a cover 5 is buckled on the top of the moisture absorption box 4 in this embodiment, and a water-locking paper 6 is also fixedly installed by extrusion between the cover 5 and the moisture absorption box 4.
[0025] Preferably, a plurality of holes are penetrated through the cover 5, which are only used to fix the water-locking paper 6 at the upper opening of the moisture absorption box 4 and can not hinder the natural flow of air.
[0026] In this embodiment, a heat sink 11 is fixedly installed at one end of the semiconductor refrigeration chip 7 facing the outside of the can body 1, and an axial flow fan 12 is also fixedly installed outside the semiconductor refrigeration chip 7 and located between the heat sinks 11.
[0027] It should be noted that the heat sink 11 is circularly surrounded outside the axial flow fan 12 to improve the heat dissipation effect on one side of the semiconductor refrigeration chip 7, and both the axial flow fan 12 and the semiconductor refrigeration chip 7 are connected to the same circuit and can be powered by a mobile power source or a USB power supply.
[0028] In order to protect the exposed axial flow fan 12, a bracket 13 is fixedly installed at the bottom of the can body 1 in this embodiment, and a support tube 14 is also fixedly installed outside the bracket 13 at the bottom of the can body 1.
[0029] With such a design, the can body 1 can be supported by the support tube 14, so as to facilitate the support of the can body 1 when the axial flow fan 12 is provided.
[0030] Preferably, ventilation holes are also opened on the outer wall of the support tube 14 to facilitate the axial flow fan 12 to blow air for heat dissipation.
[0031] Since the water-containing air in the tank body 1 will condense water droplets on the outside of the condensation column 8, in this embodiment, a drain hole 10 communicating with the inside of the moisture absorption box 4 is also penetrated through the bottom wall of the tank body 1 for discharging water outside the tank body 1.
[0032] It should be noted that a flow guide plate 9 is also fixedly installed on the inner wall of the moisture absorption box 4. The flow guide plate 9 is inclined towards the side of the drain hole 10, which can facilitate the water condensed and converged in the moisture absorption box 4 to flow to the drain hole 10 and be discharged.
[0033] The working principle of the above embodiment is as follows:
[0034] By connecting the axial flow fan 12 and the semiconductor refrigeration chip 7 to the power supply through a USB cable, the semiconductor refrigeration chip 7 and the axial flow fan 12 start working at the same time. The refrigerating surface of the semiconductor refrigeration chip 7 faces the inside of the moisture absorption box 4. The condensation column 8 on one side of the semiconductor refrigeration chip 7 contacts the air inside the tank body 1, so that the water vapor contained in the air condenses on the condensation column 8 when it meets cold, and then flows along the surface of the condensation column 8 to the flow guide plate 9 and flows towards the drain hole 10 on one side and is discharged from the inside of the tank body 1. The other side of the semiconductor refrigeration chip 7 blows air to the heat sink 11 through the axial flow fan 12 to dissipate heat, so as to maintain the refrigeration effect of the semiconductor refrigeration chip 7.
[0035] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the element.
[0036] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present application. The scope of the present application is defined by the appended claims and their equivalents.
Claims
1. An electronic moisture-proof and mildew-proof tea canister, comprising a can body (1) and a can lid (2), characterized in that: The can lid (2) is threadedly connected to the can body (1). A tea grid (3) is fixedly installed on the inner bottom of the can body (1), and a dehumidification structure is provided at the bottom of the can body (1). The dehumidification structure includes a semiconductor refrigeration chip (7) fixedly installed on the inner bottom wall of the can body (1) and a moisture absorption box (4) located outside the semiconductor refrigeration chip (7). A heat sink (11) is fixedly installed at one end of the semiconductor refrigeration chip (7) facing the outside of the can body (1). An axial flow fan (12) is also fixedly installed outside the semiconductor refrigeration chip (7) and between the heat sinks (11). A drain hole (10) communicating with the inside of the moisture absorption box (4) is also penetrated through the bottom wall of the can body (1).
2. The electronic moisture-proof and mildew-proof tea can according to claim 1, wherein: A condensation column (8) is fixedly installed on one side of the semiconductor refrigeration chip (7) facing the moisture absorption box (4), and the condensation columns (8) are arranged in an array and extend into the moisture absorption box (4).
3. The electronic moisture-proof and mildew-proof tea can according to claim 1, characterized in that: A cover (5) is buckled on the top of the moisture absorption box (4), and a water-locking paper (6) is also fixedly pressed between the cover (5) and the moisture absorption box (4).
4. An electronic moisture-proof and mildew-proof tea can according to claim 1, characterized in that: The heat sinks (11) are circularly arranged around the outside of the axial flow fan (12).
5. An electronic moisture-proof and mildew-proof tea can according to claim 1, characterized in that: A bracket (13) is fixedly installed at the bottom of the can body (1), and a support pipe (14) is also fixedly installed outside the bracket (13) at the bottom of the can body (1).
6. The electronic moisture-proof and mildew-proof tea can according to claim 1, characterized in that: A flow guide plate (9) is fixedly installed on the inner wall of the moisture absorption box (4), and the flow guide plate (9) is inclined towards the side of the drain hole (10).
7. An electronic moisture-proof and mildew-proof tea can according to claim 1, characterized in that: A plurality of holes are penetrated through the cover (5), which are only used to fix the water-locking paper (6) at the upper opening of the moisture absorption box (4) and can not hinder the natural flow of air.