Wafer jacking mechanism and wafer processing device

Abstract

The utility model discloses a wafer jacking mechanism and a wafer processing device. The jacking mechanism comprises a guide groove seat; a mounting block; a jacking member; the first directional roller is rotatably arranged on the mounting block around a first rotating shaft; the second directional roller is rotatably arranged on the mounting block around a second rotating shaft; wherein the axis of the first rotating shaft is perpendicular to a first plane, the axis of the second rotating shaft is perpendicular to a second plane and parallel to the first plane, and the first plane and the second plane are perpendicular to each other and are jointly perpendicular to a third plane. The guide groove seat is provided with a first groove wall and a second groove wall which are arranged in the guide groove, the first directional roller is in rolling contact with the first groove wall, and the second directional roller is in rolling contact with the second groove wall, so that the mounting block is allowed to slide up and down along the guide groove. The wafer jacking mechanism provided by the utility model is small in resistance in the moving process, and is not easy to block.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor manufacturing equipment, and relates to a wafer lifting mechanism and a wafer processing device. Background Art

[0002] In the production and processing of wafers, after the wafers are cleaned, a lot of water or residues of cleaning liquid will remain on the wafer surface. Since impurities are dissolved in these water or residues of cleaning liquid, if these residual liquids are allowed to evaporate and dry by themselves, these impurities will re-bond to the wafer surface, causing contamination and even damaging the wafer structure. For this reason, it is necessary to dry the wafer surface to remove these residual liquids. During the cleaning and drying process, it is necessary to cooperate with a lifting mechanism through a manipulator or a follow-up mechanism, etc., to transfer the wafers between the cleaning tanks and the drying tanks. However, in the prior art, when the lifting mechanism lifts and moves the wafers, it is not stable enough, and even gets stuck. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a wafer lifting mechanism and a wafer processing device, in which the resistance during the movement of the lifting mechanism is small, it is not easy to get stuck and is stable.

[0004] The technical solution adopted by the utility model is as follows:

[0005] A wafer lifting mechanism, the lifting mechanism includes:

[0006] A guide groove seat, which has a guide groove extending up and down;

[0007] A mounting block, which is slidably arranged in the guide groove seat along the guide groove;

[0008] A lifting member, which is used to lift the wafer, and the lifting member is arranged on the mounting block;

[0009] A first directional roller, which is rotatably arranged on the mounting block around a first rotation axis;

[0010] A second directional roller, which is rotatably arranged on the mounting block around a second rotation axis;

[0011] Wherein, the axis line of the first rotation axis is perpendicular to a first plane, the axis line of the second rotation axis is perpendicular to a second plane and parallel to the first plane, the first plane and the second plane are perpendicular to each other and jointly perpendicular to a third plane, the guide groove seat has a first groove wall and a second groove wall arranged in the guide groove, the first directional roller is in rolling contact with the first groove wall, and the second directional roller is in rolling contact with the second groove wall, so as to allow the mounting block to slide up and down along the guide groove.

[0012] In a preferred embodiment, the guiding grooves are arranged in pairs on the guiding groove seat, at least two first guiding rollers and at least two second guiding rollers are respectively provided, at least two of the first guiding rollers are respectively restricted to move along the first groove wall within the guiding grooves, and at least two of the second guiding rollers respectively move along the second groove wall.

[0013] In a preferred embodiment, the wafer lifting mechanism is made of PVC material.

[0014] This embodiment also provides a wafer processing device, which at least includes the above-mentioned wafer lifting mechanism.

[0015] In a preferred embodiment, the wafer processing device further includes:

[0016] A processing tank, which includes a first bottom plate and a first side plate connected to the first bottom plate. The first bottom plate and the first side plate form a receiving cavity for storing a processing liquid. The wafer lifting mechanism is located inside the processing tank and is installed on the first side plate;

[0017] A driving mechanism, which is installed outside the processing tank and can drive the wafer lifting mechanism to move up and down.

[0018] In a more preferred embodiment, a magnetic attracting member is provided on one of the driving mechanism and the lifting mechanism, and a magnet cooperating with the magnetic attracting member is further provided on the other of the driving mechanism and the lifting mechanism. An attracting force is generated between the magnetic attracting member and the magnet to make the lifting mechanism move up and down.

[0019] In a preferred embodiment, the lifting mechanism further includes a mounting portion connected to the mounting block. The mounting portion faces the driving mechanism, and the mounting portion has a sealed space, and the magnet or the magnetic attracting member is installed in the sealed space.

[0020] In a preferred embodiment, the side plate further includes a recessed portion, and at least part of the mounting portion is located in the recessed portion.

[0021] In a preferred embodiment, the wafer processing device further includes an overflow tank. The processing tank is located inside the overflow tank, and the overflow tank further includes a second bottom plate and a second side plate connected to the second bottom plate. The processing tank is installed on the second side plate, and the lifting mechanism, the first side plate, and the second side plate are arranged in sequence from the inside to the outside.

[0022] In a preferred embodiment, the driving mechanism includes a driving member and a driving portion connected to the driving member, and the magnet or the magnetic attracting member is installed on the driving portion;

[0023] A through groove is provided on the second side plate, and at least a part of the driving part is located in the through groove so that the driving mechanism drives the lifting mechanism to move up and down.

[0024] The present utility model adopts the above scheme and has the following advantages compared with the prior art:

[0025] In the wafer lifting mechanism of the present utility model, a first directional roller and a second directional roller are provided on the mounting block. When the mounting block slides along the guiding groove, the first directional roller rolls in contact with the first groove wall, and the second directional roller rolls in contact with the second groove wall to ensure that the mounting block rolls stably along the established direction of the guiding groove without deviating from the predetermined track. Moreover, since both the first directional roller and the second directional roller have fixed rolling directions, only one-direction friction is generated when each roller rolls, and multi-direction friction is not generated, making the contact with the groove wall relatively stable. It can continuously roll the mounting block with relatively small resistance and sufficient stability, is not easily stuck, and can more smoothly lift the wafer. Description of the Drawings

[0026] In order to more clearly illustrate the technical solutions of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0027] Figure 1 A perspective view of a wafer processing apparatus according to an embodiment of the present utility model;

[0028] Figure 2 Another perspective view of a wafer processing apparatus according to an embodiment of the present utility model;

[0029] Figure 3 A structural schematic diagram of the wafer processing apparatus;

[0030] Figure 4 A schematic diagram of a lifting mechanism according to an embodiment of the present utility model;

[0031] Figure 5 Another schematic diagram of a lifting mechanism according to an embodiment of the present utility model;

[0032] Figure 6 Another schematic diagram of a lifting mechanism according to an embodiment of the present utility model;

[0033] Figure 7 A top view of the lifting mechanism.

[0034] Wherein,

[0035] 100, Wafer Processing Device;

[0036] 1. Lifting Mechanism; 11. Guide Groove Base; 111. Guide Groove; 112. First Groove Wall; 1121. First Inner Surface; 1122. Second Inner Surface; 113. Second Groove Wall; 12. Mounting Block; 13. Lifting Member; 14. First Directional Roller; 15. Second Directional Roller; 17. Magnet; 2. Processing Tank; 23. First Side Plate; 231. Concave Portion; 3. Driving Mechanism; 31. Magnetic Absorbing Member; 33. Driving Member; 34. Driving Portion; 42. Second Side Plate; 421. Through Slot. Detailed Embodiment

[0037] The following elaborates on the preferred embodiments of the present utility model in conjunction with the accompanying drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art. It should be noted here that the description of these embodiments is used to help understand the present utility model, but does not constitute a limitation to the present utility model.

[0038] Referring to Figures 1 to 7 As shown, this embodiment provides a wafer processing device 100, including a wafer lifting mechanism 1, a processing tank 2, a driving mechanism 3, and an overflow tank. Among them, the processing tank 2 and the overflow tank are interconnected and store the processing liquid for processing wafers. The lifting mechanism 1 is disposed in the processing tank 2 containing the processing liquid, and the driving mechanism 3 can drive the lifting mechanism 1 to move relative to the processing tank 2 to drive the wafer to move relative to the processing tank 2.

[0039] Referring to Figures 4 to 7 As shown, the lifting mechanism 1 includes a guide groove base 11, a mounting block 12, a lifting member 13 disposed on the mounting block 12, and a first directional roller 14 and a second directional roller 15 disposed on the mounting block 12.

[0040] Furthermore, the lifting mechanism 1 is installed in the processing tank 2 through the guide groove base 11. The guide groove base 11 has a guide groove 111 extending vertically. The mounting block 12 is slidably disposed in the guide groove base 11 along the guide groove 111 through the first directional roller 14 and the second directional roller 15 to drive the lifting member 13 to move up and down along the guide groove 111, so that the wafer moves relative to the processing tank 2.

[0041] Specifically, the first guiding roller 14 is rotatably arranged on the mounting block 12 around the first rotating shaft, and the second guiding roller 15 is rotatably arranged on the mounting block 12 around the second rotating shaft. The guiding groove seat 11 has a first groove wall 112 disposed in the guiding groove 111 and a second groove wall 113 disposed on one side of the guiding groove 111. The first guiding roller 14 is in rolling contact with the first groove wall 112, and the second guiding roller 15 is in rolling contact with the second groove wall 113, so as to allow the mounting block 12 to slide up and down along the guiding groove 11. The process of the mounting block 12 moving is relatively smooth, with less resistance and not easily jammed. Among them, the axis line of the first rotating shaft is perpendicular to the first plane, the axis line of the second rotating shaft is perpendicular to the second plane and parallel to the first plane, and the first plane and the second plane are perpendicular to each other and jointly perpendicular to the third plane.

[0042] Referring to Figure 5 and Figure 6 As shown, the guiding grooves 111 are arranged in pairs on the guiding groove seat 11. There are at least two first guiding rollers 14 and at least two second guiding rollers 15 respectively. At least two first guiding rollers 14 are respectively restricted to roll along the first groove wall 112 in the guiding groove 111, and at least two second guiding rollers 15 roll along the second groove wall 113 respectively. Specifically, the first groove wall 112 includes a first inner surface 1121 and a second inner surface 1122 arranged opposite to each other in the first direction. The distance between the first inner surface 1121 and the second inner surface 1122 is approximately the same as the diameter of the first guiding roller 14, so that the surface of the first guiding roller 14 can roll while fitting the first inner surface 1121 and / or the second inner surface 1122. Combining with the second guiding roller 15 and the second groove wall 113, the stability of the mounting block 12 moving up and down on the guiding groove seat 11 is further improved. In this embodiment, the number of the first guiding rollers 14 and the second guiding rollers 15 is four respectively.

[0043] It should be emphasized that in this embodiment, the guiding groove 111 is a straight groove. On the one hand, both the first guiding roller 14 and the second guiding roller 15 can roll in the straight groove along a specific single direction, ensuring that the moving direction of the mounting block 12 always remains on a straight track without deviation in direction. Moreover, the single direction of the guiding roller makes its contact with the straight guiding groove relatively stable, and the friction mode between the guiding roller and the guiding groove is single, and the generated resistance is easy to control. During the straight-line movement process, the friction resistance between the guiding roller and the straight groove is small and relatively constant, and smooth movement can be achieved with lower energy consumption. On the other hand, when the guiding roller drives the mounting block and the wafer to move in the straight groove, it can provide stable support and guidance for the wafer, making the movement process smoother, improving the stability, and reducing the vibration and bump of the wafer.

[0044] The lifting member 13 is used to lift the wafer, referring to Figure 6As shown, the lifting member 13 is provided on the mounting block 12. When the mounting block 12 slides up and down along the guiding groove 11, it drives the lifting member 13 and the wafer on the lifting member 13 to move up and down. Since the sliding of the mounting block is relatively smooth, the process of lifting the wafer is also relatively smooth.

[0045] Referring Figure 1 and Figure 2 As shown, the processing tank 2 includes a first bottom plate (not shown in the figure) and a first side plate 23 connected to the first bottom plate. The first bottom plate and the first side plate 23 form a receiving cavity for storing the processing liquid. The wafer lifting mechanism 1 is located inside the processing tank 2 and is mounted on the first side plate 23.

[0046] In this embodiment, the processing tank 2 is a wafer cleaning and drying tank. Therefore, the processing liquid is pure water so that the wafer can be dried after removing the residual liquid medicine in the previous processing process of the wafer by pure water.

[0047] The processing tank 2 is located inside an overflow tank (only a part is shown in the figure). The overflow tank further includes a second bottom plate and a second side plate 42 connected to the second bottom plate. The processing tank 2 is mounted on the second side plate 42. The lifting mechanism 1, the first side plate 23, and the second side plate 42 are arranged in sequence from the inside to the outside.

[0048] As described above, the driving mechanism 3 can drive the wafer lifting mechanism 1 to move up and down, and the driving mechanism 3 is mounted outside the processing tank 2 to achieve non-contact driving between the driving mechanism and the wafer lifting mechanism, avoiding contact between the driving mechanism 3 and the processing liquid, thereby preventing the driving mechanism 3 from contaminating the processing liquid. In this embodiment, the wafer lifting mechanism is made of PVC material. The PVC material has certain corrosion resistance and will not contaminate the processing liquid when placed in the processing liquid.

[0049] Specifically, a magnetic attracting member 31 is provided on one of the driving mechanism 3 and the lifting mechanism 1, and a magnet 17 cooperating with the magnetic attracting member 31 is also provided on the other of the driving mechanism 3 and the lifting mechanism 1. The adsorption force generated between the magnetic attracting member 31 and the magnet 17 causes the lifting mechanism 1 to move up and down. Specifically in this embodiment, the magnetic attracting member 31 is provided on the driving mechanism 3, and the magnet 17 is provided on the lifting mechanism 1.

[0050] The lifting mechanism 1 further includes a mounting portion connected to the mounting block 12. The mounting portion faces the driving mechanism 3 and has a sealed space. The magnet 17 is mounted in the sealed space, and the magnet 17 is wrapped inside the mounting portion to avoid contact with the processing liquid in the processing tank 2. Only the mounting block is shown in this embodiment, and the mounting portion is not shown.

[0051] More specifically, the driving mechanism 3 includes a driving member 33 and a driving portion 34 connected to the driving member 33. The magnetic attraction member 31 is installed on the driving portion 34. The driving member 33 drives the magnetic attraction member 31 within the driving portion 34 to move, thereby driving the magnet 17 installed within the installation portion within the processing tank 2 to move, and thus driving the entire lifting mechanism 1 to move up and down.

[0052] Furthermore, the first side plate 23 further includes a recessed portion 231, and at least a part of the installation portion is located within the recessed portion 231, so that the distance between the magnet 17 within the installation portion and the driving portion 34 is smaller. Even further, a through groove 421 is provided on the second side plate 42, and at least a part of the driving portion 34 is located within the through groove 421, further reducing the distance between the magnet 17 and the magnetic attraction member 31, ensuring a greater acting force between the magnet 17 and the magnetic attraction member 31, and enabling the driving mechanism 3 to drive the mounting block 12 to move more smoothly, that is, the driving mechanism 3 drives the lifting mechanism 1 to move up and down.

[0053] In the lifting mechanism 1 of this embodiment, a magnet 17 is provided, and a magnetic attraction member 31 is provided on the driving mechanism 3. By driving the movement of the driving portion 34 to drive the magnetic attraction member 31 to move, the magnetic attraction member 31 and the magnet 17 cooperate with each other, enabling the lifting member 13 to move up and down along the guiding groove 111. At the same time, when the mounting block 12 slides along the guiding groove 111, the first directional roller 14 and the first groove wall 112 are in rolling contact, and the second directional roller 15 and the second groove wall 113 are in rolling contact. The resistance of the lifting mechanism 1 during movement is small, it is not easily jammed, and it can lift the wafer more smoothly.

[0054] As shown in this specification and the claims, the terms "comprising" and "including" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0055] It can be further understood that in the present disclosure, "a plurality of" means two or more, and other quantifiers are similar thereto.

[0056] It can be further understood that the terms "first", "second", etc. are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other, and do not represent a specific order or importance. In fact, the expressions such as "first" and "second" can be used interchangeably. For example, without departing from the scope of the present disclosure, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information.

[0057] The above embodiments are only for illustrating the technical concept and features of the present utility model, and are a preferred embodiment. The purpose is that those who are familiar with this technology can understand the content of the present utility model and implement it accordingly, and the protection scope of the present utility model cannot be limited thereby.

Claims

1. A wafer lifting mechanism, characterized in that, The lifting mechanism includes: A guide groove seat having a guide groove extending vertically; A mounting block slidably disposed in the guide groove seat along the guide groove; A lifting member for lifting the wafer, the lifting member being disposed on the mounting block; A first directional roller rotatably disposed on the mounting block about a first rotation axis; A second directional roller rotatably disposed on the mounting block about a second rotation axis; Wherein, the axis line of the first rotation axis is perpendicular to a first plane, the axis line of the second rotation axis is perpendicular to a second plane and parallel to the first plane, the first plane and the second plane are perpendicular to each other and commonly perpendicular to a third plane, the guide groove seat has a first groove wall and a second groove wall disposed in the guide groove, the first directional roller is in rolling contact with the first groove wall, and the second directional roller is in rolling contact with the second groove wall to allow the mounting block to slide up and down along the guide groove.

2. The wafer lifting mechanism according to claim 1, wherein The guide grooves are provided in pairs on the guide groove seat, at least two first directional rollers and at least two second directional rollers are respectively provided, at least two of the first directional rollers are respectively restricted to move along the first groove wall in the guide groove, and at least two of the second directional rollers respectively move along the second groove wall.

3. The wafer lifting mechanism according to claim 1, characterized in that, The wafer lifting mechanism is made of PVC material.

4. A wafer processing apparatus, characterized in that, At least includes the wafer lifting mechanism according to any one of claims 1 to 3.

5. The wafer processing apparatus according to claim 4, wherein The wafer processing apparatus further includes: A processing tank including a first bottom plate and a first side plate connected to the first bottom plate, the first bottom plate and the first side plate form a receiving cavity for storing a processing liquid, and the wafer lifting mechanism is located inside the processing tank and mounted on the first side plate; A driving mechanism mounted outside the processing tank and capable of driving the wafer lifting mechanism to move up and down.

6. The wafer processing apparatus according to claim 5, wherein, One of the driving mechanism and the lifting mechanism is provided with a magnetic attracting member, and the other of the driving mechanism and the lifting mechanism is further provided with a magnet cooperating with the magnetic attracting member, and an adsorption force is generated between the magnetic attracting member and the magnet to make the lifting mechanism move up and down.

7. The wafer processing apparatus according to claim 6, wherein, The lifting mechanism further includes a mounting portion connected to the mounting block, the mounting portion faces the driving mechanism, and the mounting portion has a sealed space, and the magnet or the magnetic attracting member is mounted in the sealed space.

8. The wafer processing apparatus according to claim 7, wherein, The first side plate further includes a recessed portion, and at least part of the mounting portion is located in the recessed portion.

9. The wafer processing apparatus according to claim 6, wherein The wafer processing apparatus further includes an overflow tank, the processing tank is located inside the overflow tank, and the overflow tank further includes a second bottom plate and a second side plate connected to the second bottom plate, the processing tank is mounted on the second side plate, and the lifting mechanism, the first side plate, and the second side plate are arranged in sequence from inside to outside.

10. The wafer processing apparatus according to claim 9, wherein, The driving mechanism includes a driving member and a driving portion connected to the driving member, and the magnet or the magnetic attracting member is mounted on the driving portion; A through groove is provided on the second side plate, and at least part of the driving portion is located in the through groove so that the driving mechanism drives the lifting mechanism to move up and down.

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