Coating device

Abstract

The utility model relates to a coating device. The coating device comprises a coating pot, a bearing ring and a cover plate. The plating pot comprises a carrier ring hole. And the carrying ring hole penetrates through the plating pot. The bearing ring is located in the bearing ring hole. And the cover plate is matched with the bearing ring. The cover plate comprises a ventilation opening which penetrates through the cover plate in the radial direction of the cover plate. At least one vent opening is adjacent an edge of the cover plate. By means of the arrangement, external air can quickly flow into the edge of the inner side of the cover plate from the ventilation opening, the adsorption force between the edge of the cover plate and the semiconductor structure below the edge of the cover plate when the cover plate is lifted is obviously reduced, and the risk that the semiconductor structure is damaged due to the fact that the semiconductor structure is sucked up due to the large adsorption force is reduced.

Description

Technical Field

[0001] This application relates to the field of coating technology, and particularly to a coating device. Background Art

[0002] In the process of manufacturing semiconductor chips, it is often necessary to form a metal film on the surface of a wafer. After the metal film is formed, the wafer needs to be removed from the planetary pot. During the removal process of the wafer, it is necessary to perform a lifting operation on the cover plate covering the wafer. During the lifting process, due to the adsorption force between the cover plate and the wafer, the adsorption force is likely to lift the wafer, which easily causes damage to the wafer. Summary of the Utility Model

[0003] The embodiments of this application provide a coating device to reduce the risk of the semiconductor structure being lifted and damaged due to a large adsorption force, so as to solve at least part of the above technical problems.

[0004] To achieve the above object, the embodiments of this application provide a coating device, including:

[0005] A plating pot, including a carrier ring hole that penetrates through the plating pot;

[0006] A carrier ring, located within the carrier ring hole;

[0007] A cover plate, which cooperates with the carrier ring. The cover plate includes a ventilation opening that penetrates through the cover plate in the radial direction of the cover plate, and at least one of the ventilation openings is adjacent to the edge of the cover plate.

[0008] Optionally, the ventilation opening includes at least two arc-shaped openings arranged at intervals, and the at least two arc-shaped openings are arranged along the circumferential direction of the cover plate.

[0009] Optionally, the cover plate further includes a first connecting portion located between two adjacent arc-shaped openings; in the circumferential direction of the cover plate, the size of at least one of the arc-shaped openings is larger than the size of the first connecting portion.

[0010] Optionally, the cover plate is an arched structure.

[0011] Optionally, the cover plate includes a top cover portion and a circumferential side portion. The circumferential side portion is arranged along the edge of the top cover portion and extends along the axial direction of the cover plate, and the ventilation opening penetrates through the circumferential side portion in the radial direction of the cover plate.

[0012] Optionally, the circumferential side portion further includes a cover edge portion located at the edge of the cover plate. In the axial direction of the cover plate, the ventilation opening is located between the cover edge portion and the top cover portion.

[0013] Optionally, in the axial direction of the cover plate, the size of the cover edge portion is smaller than the size of the ventilation opening.

[0014] Optionally, the thickness of the top cover portion is smaller than the thickness of the circumferential side portion.

[0015] Optionally, the coating device further includes:

[0016] A fixing member, one end of the fixing member is rotatably connected to the plating pot, and at least a partial area of the other end of the fixing member presses the cover plate.

[0017] Optionally, the fixing member includes:

[0018] A second connecting portion, one end of the second connecting portion is rotatably connected to the plating pot;

[0019] A pressing portion, the extending direction of the pressing portion is different from the extending direction of the second connecting portion, one end of the pressing portion is connected to the other end of the second connecting portion, and the other end of the pressing portion is in interference fit with the cover plate.

[0020] In the coating device according to the embodiment of the present application, at least one ventilation opening is adjacent to the edge of the cover plate, so that the outside air can flow into the inner edge of the cover plate faster, and more significantly reduce the adsorption force between the edge of the cover plate and the semiconductor structure below it when lifting the cover plate, reducing the risk of damaging the semiconductor structure due to a large adsorption force sucking up the semiconductor structure. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0022] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings, where the same reference numerals in the following description represent the same parts.

[0023] Figure 1 It is a schematic plan view of the cover plate of a coating device according to an embodiment;

[0024] Figure 2 It is a schematic plan view of a coating device according to some embodiments provided by the present application;

[0025] Figure 3 For Figure 2 It is a schematic side view of the cover plate and the fixing member of the coating device shown;

[0026] Figure 4 is Figure 2 a top view structural schematic diagram of the cover plate of the coating device shown;

[0027] Figure 5 a planar structural schematic diagram of the cover plate of the coating device according to some other embodiments provided by the present application;

[0028] Figure 6 a planar structural schematic diagram of the coating device according to still some other embodiments provided by the present application;

[0029] Figure 7 is Figure 6 a side view of the cover plate of the coating device shown;

[0030] Figure 8 is Figure 6 a planar structural schematic diagram of the circumferential side part of the cover plate of the coating device shown.

[0031] Explanation of reference numerals:

[0032] 1. Coating device;

[0033] 11. Coating pot; 11A. Carrier ring hole;

[0034] 12. Bearing ring;

[0035] 13, 100. Cover plate; 100A. Vent hole; 13A. Vent opening; 13A1. Arc-shaped opening; 131. First connecting part; 132. Top cover part; 132A. Top hole; 133. Circumferential side part; 1331. Cover edge part;

[0036] 134. Handle;

[0037] 14. Fixing part; 141. Second connecting part; 142. Pressing part. Detailed implementation manners

[0038] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present application.

[0039] Referring to Figure 1 shown, it is a planar structural schematic diagram of the cover plate of a coating device in an embodiment. The cover plate 100 includes a vent hole 100A, and the vent hole 100A is adjacent to the top of the cover plate 100.

[0040] After the wafer coating process is completed, it is necessary to Figure 1When the shown cover plate is lifted from the wafer, during the lifting process, there is still an adsorption force between the edge of the cover plate and the wafer, and the adsorption force is relatively large, resulting in the wafer being sucked up. After the wafer is sucked up and then drops, the wafer is damaged.

[0041] Regarding the problem that there is still a relatively large adsorption force between the edge of the cover plate and the wafer, the embodiment of the present application provides a coating device. The coating device includes a coating pot, a carrier ring, and a cover plate. The coating pot includes a carrier ring hole. The carrier ring hole penetrates through the coating pot. The carrier ring is located within the carrier ring hole. The cover plate cooperates with the carrier ring. The cover plate includes a ventilation opening, and the ventilation opening penetrates through the cover plate along the radial direction of the cover plate. At least one ventilation opening is adjacent to the edge of the cover plate. With such a setting, the outside air can flow into the edge inside the cover plate from the ventilation opening more quickly, more significantly reducing the adsorption force between the edge of the cover plate and the semiconductor structure below it when lifting the cover plate, and reducing the risk that the semiconductor structure is damaged due to the relatively large adsorption force sucking up the semiconductor structure.

[0042] The following details the coating device of some embodiments of the present application in combination with specific embodiments.

[0043] Please refer to Figures 2 to 4 as shown in Figure 2 which is a schematic plan view of the coating device of some embodiments provided by the present application, Figure 3 and Figure 2 is a schematic side view of the cover plate and the fixing member of the coating device shown in Figure 4 and Figure 2 is a schematic top view of the cover plate of the coating device shown in

[0044] Referring to Figure 1 as shown, the coating device 1 includes a coating pot 11, a carrier ring 12, and a cover plate 13. The coating pot 11 includes a carrier ring hole 11A. The carrier ring hole 11A penetrates through the coating pot 11. The carrier ring 12 is located within the carrier ring hole 11A. The cover plate 13 cooperates with the carrier ring 12. The cover plate 13 includes a ventilation opening 13A, and the ventilation opening 13A penetrates through the cover plate 13 along the radial direction of the cover plate 13. At least one ventilation opening 13A is adjacent to the edge L of the cover plate 13.

[0045] In the coating device 1 of some embodiments of the present application, the outside air can flow into the edge inside the cover plate 13 from the ventilation opening 13A more quickly, more significantly reducing the adsorption force between the edge of the cover plate 13 and the semiconductor structure below it when lifting the cover plate 13, and reducing the risk that the semiconductor structure is damaged due to the relatively large adsorption force sucking up the semiconductor structure. Moreover, forming the ventilation opening 13A on the cover plate 13 can also reduce the mass of the cover plate 13, reducing the risk that the carrier ring 12 and the like fall off during the evaporation coating process due to the excessive weight of the cover plate 13.

[0046] During the process of depositing a metal film using the coating device 1, the plating pot 11 needs to rotate both axially and circumferentially. The plating pot 11 is in the shape of a round pot. The plating pot 11 includes a metal material to enhance its high-temperature resistance. Refer to Figure 2 As shown, a plurality of carrier ring holes 11A are arranged along the circumferential direction of the plating pot 11. The shape of the carrier ring holes 11A can be circular.

[0047] Refer to Figure 2 As shown, the carrier ring 12 is annular and is detachably installed in the carrier ring holes 11A. In some embodiments, the carrier ring 12 may include an annular mounting portion, an annular connecting portion, and a ring. The two ends of the annular connecting portion are respectively connected to the annular mounting portion and the ring. When the carrier ring 12 is installed in the carrier ring holes 11A, the annular mounting portion is located on the surface of the plating pot 11 around the carrier ring holes 11A, the annular connecting portion is disposed opposite to the side wall of the carrier ring holes 11A, and the ring is used to place the semiconductor structure. The carrier ring 12 includes a metal material to enhance its high-temperature resistance.

[0048] In some embodiments, the semiconductor structure can be a single wafer or a stacked wafer formed by bonding multiple wafers.

[0049] The cover plate 13 is located on the semiconductor structure (not shown in the figure), and the edge of the cover plate 13 presses on the semiconductor structure to avoid problems such as impurities falling on the semiconductor structure during the evaporation process, which may cause contamination or even damage to it, and also reduces the risk of the semiconductor structure moving on the carrier ring 12 and falling off the plating pot 11. The cover plate 13 includes a metal material to enhance its high-temperature resistance.

[0050] In some embodiments, refer to Figure 3 and Figure 4 As shown, the ventilation opening 13A includes at least two arc-shaped openings 13A1 arranged at intervals. The at least two arc-shaped openings 13A1 are arranged along the circumferential direction of the cover plate 13 and are adjacent to the edge L of the cover plate 13. With this arrangement, the ventilation area at the edge L of the cover plate 13 is increased, and further, the adsorption force between the edge of the cover plate 13 and the semiconductor structure below it when lifting the cover plate 13 is reduced, reducing the risk that the semiconductor structure is damaged due to a large adsorption force that sucks up the semiconductor structure. Moreover, the size of the arc-shaped openings 13A1 can be large enough to further reduce the weight of the cover plate 13, and further reduce the risk that the cover plate 13 is too heavy and causes the carrier ring 12, etc. to fall during the evaporation process.

[0051] In some embodiments, the shape of the arc-shaped openings 13A1 can be at least one of circular arc shape and elliptical arc shape. The number of the arc-shaped openings 13A1 can be two or more.

[0052] In some embodiments, when the shape of the arc-shaped opening 13A1 is circular arc-shaped, the arc angle corresponding to the arc-shaped opening 13A1 can be greater than or equal to 30 degrees and less than 180 degrees. With such a setting, while increasing the opening area of the arc-shaped opening 13A1, a part between adjacent arc-shaped openings 13A1 is retained to play a role in fixing the semiconductor structure. Optionally, the arc angle corresponding to the arc-shaped opening 13A1 can be greater than or equal to 60 degrees and less than or equal to 120 degrees.

[0053] In some embodiments, at least two arc-shaped openings 13A1 are the same. With such a setting, it is ensured that the quality of the cover plate 13 tends to be uniform along the circumferential direction of the cover plate 13, and the risk of damage to the semiconductor structure caused by uneven force exerted by the edge L of the cover plate 13 on the semiconductor structure when the cover plate 13 is located on the semiconductor structure is reduced.

[0054] In some other embodiments, the ventilation opening 13A may further include a circular opening, a rectangular opening, and other types of ventilation openings 13A.

[0055] In some embodiments, referring to Figure 4 As shown, the cover plate 13 further includes a first connecting portion 131, and the first connecting portion 131 is located between two adjacent arc-shaped openings 13A1; in the circumferential direction of the cover plate 13, the size of at least one arc-shaped opening 13A1 is larger than the size of the first connecting portion 131. With such a setting, the size of the arc-shaped opening 13A1 in the circumferential direction of the cover plate 13 is larger, further reducing the weight of the cover plate 13, and further reducing the risk of the carrier ring 12 and the like falling during the evaporation process due to the excessive weight of the cover plate 13.

[0056] In some embodiments, referring to Figure 3 As shown, the cover plate 13 is an arched structure. With such a setting, when the cover plate 13 covers the semiconductor structure, there is more space between the inner side of the cover plate 13 and the semiconductor structure, reducing the risk of damage to the semiconductor structure caused by the cover plate 13.

[0057] In some embodiments, the arched structure includes an inner spherical surface, an outer spherical surface, and an annular side surface, and the annular side surface is connected to the inner spherical surface and the outer spherical surface. The outer spherical surface is located on the outer side of the arched structure, and the inner spherical surface is located on the inner side of the arched structure.

[0058] In some embodiments, referring to Figure 2 As shown, the coating device 1 further includes a fixing member 14. One end of the fixing member 14 is rotatably connected to the plating pot 11, and at least a part of the other end of the fixing member 14 presses the cover plate 13. With such a setting, during the coating process, the fixing member 14 presses the cover plate 13, the cover plate 13 presses the semiconductor structure on the carrier ring 12, and the semiconductor structure exerts a force on the carrier ring 12, reducing the risk of movement of the semiconductor structure during the evaporation process.

[0059] In some embodiments, referring to Figure 3 As shown, when the coating device 1 includes a fixing member 14, the fixing member 14 includes a second connecting portion 141 and a pressing portion 142. One end of the second connecting portion 141 is rotatably connected to the plating pot 11. The extending direction of the pressing portion 142 is different from that of the second connecting portion 141. One end of the pressing portion 142 is connected to the other end of the second connecting portion 141, and the other end of the pressing portion 142 is in interference fit with the cover plate 13. With such a setting, the pressing portion 142 of the fixing member can better fix the cover plate 13, reducing the risk of movement of the cover plate 13, the semiconductor structure, and the carrier ring 12.

[0060] In some embodiments, the fixing member 14 may include at least one of an elastic material and a metal material. Exemplarily, the fixing member 14 includes a metal material.

[0061] In some embodiments, referring to Figure 3 As shown, a handle 134 may further be provided on the top of the cover plate 13 to facilitate the taking and placing of the cover plate 13.

[0062] Please refer to Figure 5 As shown, which is a schematic plan view of the cover plate of the coating device according to some other embodiments provided by the present application.

[0063] Figure 5 The cover plate 13 shown is Figure 4 substantially similar to the cover plate 13 shown, except that at least two ventilation openings 13A are provided at the edge L of the cover plate 13. With such a setting, during the evaporation coating process, the contact area between the edge L of the cover plate 13 and the semiconductor structure is small, and the adsorption force between the cover plate 13 and the semiconductor structure can be basically eliminated, eliminating the risk that the semiconductor structure is damaged by being sucked up due to a large adsorption force.

[0064] Please refer to Figures 6 to 8 As shown, Figure 6 which is a schematic plan view of the coating device according to still some other embodiments provided by the present application, Figure 7 is Figure 6 a side view of the cover plate of the coating device shown, Figure 8 and is Figure 6 a schematic plan view of the circumferential side portion of the cover plate of the coating device shown. Figure 6 The coating device 1 shown is Figure 1 substantially similar to the coating device 1 shown, and the same parts will not be described again. The differences are that Figure 6 the cover plate 13 shown is different from Figure 1 the cover plate 13 shown.

[0065] In still some other embodiments, referring to Figure 7As shown, the cover plate 13 includes a top cover portion 132 and a circumferential side portion 133. The circumferential side portion 133 is provided along the edge of the top cover portion 132 and extends axially along the cover plate 13. The ventilation opening 13A penetrates the circumferential side portion 133 in the radial direction of the cover plate 13. With such a setting, the ventilation opening 13A is disposed on the side of the cover plate 13, which more significantly reduces the adsorption force between the edge of the cover plate 13 and the semiconductor structure below it when the cover plate 13 is lifted. At the same time, during the evaporation coating process, the top cover portion 132 also protects the semiconductor structure below the cover plate 13, reducing the risk of impurities falling onto the semiconductor structure and causing contamination or even damage to it.

[0066] In still other embodiments, referring to Figure 6 and Figure 7 as shown, the top cover portion 132 can be disc-shaped. In other embodiments, the top cover portion 132 can be an arched structure.

[0067] In still other embodiments, the circumferential side portion 133 further includes a cover edge portion 1331. The cover edge portion 1331 is located at the edge of the cover plate 13. In the axial direction of the cover plate 13, the ventilation opening 13A is located between the cover edge portion 1331 and the top cover portion 132. With such a setting, the ventilation opening 13A is located at the middle position of the circumferential side portion 133 in the axial direction of the cover plate 13, and the cover edge portion 1331 of the circumferential side portion 133 is annular. During the evaporation coating process, the cover edge portion 1331 can better fix the semiconductor structure, reducing the risk of the semiconductor structure moving and causing the evaporation coating position to shift or being damaged by friction.

[0068] In some embodiments, as Figure 7 shown, in the axial direction of the cover plate 13, the size d1 of the cover edge portion 1331 is smaller than the size d2 of the ventilation opening 13A. With such a setting, the area of the ventilation opening 13A is increased, the weight of the cover plate 13 is reduced, and the risk of the carrier ring 12 and the like falling during the evaporation coating process due to the overweight of the cover plate 13 is reduced.

[0069] In some embodiments, the thickness of the top cover portion 132 is smaller than the thickness of the circumferential side portion 133. With such a setting, the thickness of the top cover portion 132 is relatively thin, further reducing the weight of the cover plate 13 and reducing the risk of the carrier ring 12 and the like falling during the evaporation coating process due to the overweight of the cover plate 13. Among them, the thickness of the top cover portion 132 is equal to the size of the top cover portion 132 in the axial direction of the cover plate 13. The thickness of the circumferential side portion 133 is equal to the size of the circumferential side portion 133 in the radial direction of the cover plate 13.

[0070] In some embodiments, the ventilation opening 13A further includes a top hole 132A which axially penetrates through the top cover portion 132 along the cover plate 13. The area of the top hole 132A is smaller than the area of the arc-shaped opening 13A1 of the circumferential side portion 133. With such an arrangement, the top hole 132A serves to assist in reducing the adsorption force between the edge of the cover plate 13 and the semiconductor structure below it when lifting the cover plate 13, and prevents impurities from falling onto the semiconductor structure below the top cover portion 132. In some embodiments, a plurality of top holes 132A are arranged at intervals along the circumference of the top cover portion 132.

[0071] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0072] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0073] The embodiments, implementation manners and related technical features of the present application can be combined and replaced with each other without conflict.

[0074] The above are only the preferred embodiments of the present application and do not impose any form of limitation on the present application. Although in the embodiments of the present application, the descriptions of the respective embodiments have their own emphases, and for the parts not detailed in a certain embodiment, reference may be made to the relevant content of other embodiments, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application still fall within the scope of the technical solution of the present application.

Claims

1. A coating device, characterized in that, Comprising: A plating pot, including a carrier ring hole that penetrates through the plating pot; A carrier ring, located within the carrier ring hole; A cover plate, which cooperates with the carrier ring. The cover plate includes a ventilation opening that penetrates through the cover plate in the radial direction of the cover plate, and at least one of the ventilation openings is adjacent to the edge of the cover plate.

2. The coating device according to claim 1, characterized in that, The ventilation opening includes at least two arc-shaped openings that are spaced apart from each other, and the at least two arc-shaped openings are arranged circumferentially along the cover plate.

3. The coating device according to claim 2, characterized in that, The cover plate further includes a first connecting portion located between two adjacent arc-shaped openings; in the circumferential direction of the cover plate, the size of at least one of the arc-shaped openings is larger than the size of the first connecting portion.

4. The coating device according to any one of claims 1 to 3, characterized in that The cover plate is an arched structure.

5. The coating device according to any one of claims 1 to 3, characterized in that, The cover plate includes a top cover portion and a circumferential side portion. The circumferential side portion is provided along the edge of the top cover portion and extends axially along the cover plate, and the ventilation opening penetrates through the circumferential side portion in the radial direction of the cover plate.

6. The coating device according to claim 5, characterized in that, The circumferential side portion further includes a cover edge portion located at the edge of the cover plate. In the axial direction of the cover plate, the ventilation opening is located between the cover edge portion and the top cover portion.

7. The coating device according to claim 6, characterized in that, In the axial direction of the cover plate, the size of the cover edge portion is smaller than the size of the ventilation opening.

8. The coating device according to claim 5, characterized in that The thickness of the top cover portion is smaller than the thickness of the circumferential side portion.

9. The coating device according to any one of claims 1 to 3, characterized in that, The coating device further includes: A fixing member, one end of which is rotatably connected to the plating pot, and at least a part of the other end of the fixing member presses the cover plate.

10. The coating device according to claim 9, characterized in that, The fixing member includes: A second connecting portion, one end of which is rotatably connected to the plating pot; A pressing portion, the extending direction of which is different from the extending direction of the second connecting portion. One end of the pressing portion is connected to the other end of the second connecting portion, and the other end of the pressing portion is in interference fit with the cover plate.

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