Single wafer cup type electroplating device

Abstract

The utility model discloses a single wafer cup type electroplating device which comprises a hot disc for heating and placing a wafer, the hot plate is provided with at least two protruding structures used for fixing the edge of a wafer. The protruding structure can move in the radial direction of the wafer and is in sliding connection with the hot plate. The single wafer cup type electroplating device further comprises a rotating piece and a first driving piece. The rotating piece is connected with the hot plate, the rotating piece is provided with clamping grooves and releasing grooves which correspond to the protruding structures in number, and the clamping grooves and the releasing grooves communicate with each other; with the circle center of the wafer as the center, the radius of the clamping groove is larger than that of the releasing groove; one end of the protruding structure is in sliding connection with the clamping groove and the releasing groove. The first driving piece is fixedly connected with the hot disc and used for driving the rotating piece to rotate relative to the hot disc so that the protruding structure can be far away from or close to the wafer. Therefore, the technical scheme of the utility model solves the problem that the wafer is easy to damage in the electroplating process.

Description

Technical Field

[0001] The utility model relates to the technical field of chip manufacturing, in particular to a single-wafer cup electroplating device. Background Art

[0002] Electroplating refers to the process of depositing a required metal thin film on the surface of an object through an electrochemical reaction. Generally, when depositing a metal thin film on the surface of a wafer, in order to improve the uniformity of the metal thin film, a cup-type rotary electroplating process is adopted. Specifically, the wafer base rotates, including uniform speed, variable speed, and reciprocating rotation. Those skilled in the art know from experience that the film quality produced by reciprocating rotation is better and can better adapt to the complex and changeable chemical vapor deposition environment. However, reciprocating rotation may cause the wafer to slip, thereby affecting the uniformity of the metal thin film. The existing wafer fixing technology is to fix the wafer by clamping, but clamping is likely to cause the edge of the wafer to break, thus increasing the material loss in the chip production and processing process. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a single-wafer cup electroplating device to solve the problem that the wafer is easily damaged during electroplating.

[0004] To achieve this purpose, the utility model adopts the following technical solutions:

[0005] A single-wafer cup electroplating device includes a hot plate for heating and placing the wafer; at least two raised structures for fixing the edge of the wafer are arranged on the hot plate;

[0006] The raised structure can move along the radial direction of the wafer and is slidably connected to the hot plate;

[0007] The single-wafer cup electroplating device further includes a rotating member and a first driving member; the rotating member is connected to the hot plate, and the rotating member has clamping grooves and release grooves corresponding to the number of the raised structures, and the clamping grooves and the release grooves communicate with each other; with the center of the wafer as the center, the radius of the clamping groove is greater than the radius of the release groove;

[0008] One end of the raised structure is slidably connected to the clamping groove and the release groove; the first driving member is fixedly connected to the hot plate and is used to drive the rotating member to rotate relative to the hot plate so as to make the raised structure move away from or close to the wafer.

[0009] Optionally, the raised structure has a limiting portion and a guiding portion; the limiting portion is fixedly connected to the guiding portion, the hot plate has a guiding hole for making the limiting portion close to or away from the wafer, and the guiding portion passes through the guiding hole;

[0010] The rotating member is connected to the hot plate. The rotating member is provided with a first fitting portion, a second fitting portion, and a third fitting portion corresponding to the number of the convex structures. The second fitting portion is arc-shaped and is concentrically arranged relative to the hot plate. The first fitting portion and the third fitting portion are located at both ends of the second fitting portion. The first fitting portion is arranged towards the outer edge of the rotating member, and the third fitting portion is arranged towards the inside of the clamping groove.

[0011] The first fitting portion, the second fitting portion, and the outer edge of the rotating member jointly enclose to form the release groove.

[0012] The second fitting portion, the third fitting portion, and the inner edge of the rotating member jointly enclose to form the clamping groove.

[0013] During the rotation of the rotating member in the first direction, the surface of the first fitting portion close to the inside of the rotating member cooperates with the guiding portion so that the guiding portion is located in the clamping groove.

[0014] During the rotation of the rotating member in the direction opposite to the first direction, the surface of the third fitting portion close to the edge of the rotating member cooperates with the guiding portion so that the guiding portion is located in the release groove.

[0015] Optionally, the third fitting portion is an elastic piece. The elastic piece is connected to the second fitting portion and is arranged close to the inside of the rotating member.

[0016] Optionally, the rotating member, the first fitting portion, and the second fitting portion are integrally formed.

[0017] Optionally, the convex structure further includes a sliding cover. The limiting portion, the sliding cover, and the guiding portion are fixedly connected in sequence. The hot plate has a sliding groove. The sliding cover is located in the sliding groove and is used to cover the guiding hole.

[0018] Optionally, the convex structure further includes a bushing. The bushing is sleeved on the guiding portion and is movably matched with the first fitting portion, the second fitting portion, and the third fitting portion.

[0019] Optionally, the first driving member is connected with a gear. The rotating member is fixedly connected with an internal gear ring. The gear can drive the internal gear ring to rotate.

[0020] Optionally, the hot plate is provided with an arc-shaped groove. The rotating member is provided with a guiding member. The guiding member is located in the arc-shaped groove and can enable the rotating member to rotate relatively.

[0021] Compared with the prior art, the utility model has the following beneficial effects:

[0022] The technical solution of the present utility model realizes the limit fixation of the wafer by setting a convex structure and a rotating member, so that the wafer is fixed during the rotation or reciprocating rotation of the hot plate, improving the uniformity of the metal thin film deposited on the surface of the wafer. Further, the setting of the rotating member enables the convex structure to move towards or away from the wafer. After the convex structure approaches the wafer, the limit during the rotation of the wafer is realized; after the limiting portion moves away from the wafer, the contact between the limiting portion and the wafer is avoided, reducing the collision between the wafer and the convex structure when the robotic arm picks up the wafer, damaging the wafer and causing material loss. Therefore, the technical solution of the present utility model realizes the limit fixation of the wafer while avoiding the collision damage of the wafer during the picking process and reducing material loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0024] The structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limited conditions that the present utility model can be implemented. Therefore, they do not have technical essential significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present utility model can produce and the purposes that can be achieved, should still fall within the scope that the technical content disclosed by the present utility model can cover.

[0025] Figure 1 It is a schematic structural diagram of an embodiment of the present utility model;

[0026] Figure 2 It is a schematic structural diagram of an embodiment of the present utility model;

[0027] Figure 3 It is a top view of an embodiment of the present utility model;

[0028] Figure 4 It is a schematic structural diagram of an embodiment of the rotating member of the present utility model;

[0029] Figure 5 It is a schematic structural diagram of an embodiment of the hot plate of the present utility model;

[0030] Figure 6 It is a top view of another embodiment of the rotating member of the present utility model;

[0031] Illustration: 100, single-wafer cup electroplating device; 110, hot plate; 111, guiding hole; 112, sliding groove; 113, arc groove; 120, convex structure; 121, limiting part; 122, guiding part; 123, sliding cover; 124, bushing; 130, rotating part; 130a, release groove; 130b, clamping groove; 131, first mating part; 132, second mating part; 133, third mating part; 134, guiding part; 140, first driving part; 141, gear; 142, internal gear ring; 20, wafer. Detailed implementation

[0032] In order to make the technical objectives, features, and advantages of the present utility model more obvious and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the embodiments described below are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0033] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be an intermediate component present.

[0034] The technical solutions of the present utility model will be further described below with reference to the accompanying drawings and through specific implementation manners.

[0035] The embodiment of the present utility model provides a single-wafer cup electroplating device 100.

[0036] Please refer to Figure 1 、 Figure 2 、 Figure 4 and Figure 5 , the single-wafer cup electroplating device 100 includes a hot plate 110 for heating and placing the wafer; the hot plate 110 is provided with at least two convex structures 120 for fixing the edge of the wafer;

[0037] The convex structure 120 can move along the radial direction of the wafer and is slidably connected to the hot plate 110;

[0038] The single-wafer cup electroplating device 100 further includes a rotating member 130 and a first driving member 140; the rotating member 130 is connected to the hot plate 110, and the rotating member 130 has clamping grooves 130b and releasing grooves 130a corresponding to the number of the convex structures 120, and the clamping grooves 130b and the releasing grooves 130a communicate with each other; with the center of the wafer as the center, the radius of the clamping groove 130b is greater than the radius of the releasing groove 130a;

[0039] One end of the convex structure 120 is slidably connected to the clamping groove 130b and the releasing groove 130a; the first driving member 140 is fixedly connected to the hot plate 110 and is used to drive the rotating member 130 to rotate relative to the hot plate 110 so as to make the convex structure 120 move away from or close to the wafer.

[0040] It can be understood that the technical solution of the present invention realizes the limiting and fixing of the wafer 20 by arranging the convex structure 120 and the rotating member 130, so that the wafer 20 is fixed during the rotation or reciprocating rotation of the hot plate 110, and the uniformity of the metal thin film deposited on the surface of the wafer is improved. Further, the arrangement of the rotating member 130 enables the convex structure 120 to move in a direction close to or away from the wafer 20, and realizes the limiting during the rotation of the wafer 20 after the convex structure 120 approaches the wafer 20; after the limiting portion 121 moves away from the wafer 20, the contact between the convex structure 120 and the wafer 20 is avoided, and the collision between the wafer 20 and the convex structure 120 during the process of the robotic arm picking up the wafer 20 is reduced, the wafer 20 is damaged, and the material loss is caused. Therefore, the technical solution of the present invention realizes the limiting and fixing of the wafer 20 while avoiding the collision damage of the wafer 20 during the picking process and reducing the material loss.

[0041] On the other hand, the convex structure 120 in the technical solution of the present application does not clamp the wafer 20, but only limits the wafer 20, so there is no situation that the edge of the wafer 20 is easily broken due to clamping and fixing.

[0042] Please refer to Figure 4 , in a specific embodiment of the present invention, the convex structure 120 has a limiting portion 121 and a guiding portion 122; the limiting portion 121 is fixedly connected to the guiding portion 122, and the hot plate 110 has a guiding hole 111 for making the limiting portion 121 approach or move away from the wafer, and the guiding portion 122 passes through the guiding hole 111;

[0043] The rotating member 130 is connected to the hot plate 110. The rotating member 130 is provided with a first mating portion 131, a second mating portion 132, and a third mating portion 133 corresponding to the number of the protruding structures 120. The second mating portion 132 is arc-shaped and is concentrically arranged relative to the hot plate 110. The first mating portion 131 and the third mating portion 133 are located at both ends of the second mating portion 132. The first mating portion 131 is arranged towards the outer edge of the rotating member 130, and the third mating portion 133 is arranged towards the inside of the clamping groove 130b.

[0044] The first mating portion 131, the second mating portion 132, and the outer edge of the rotating member 130 jointly enclose to form the release groove 130a.

[0045] The second mating portion 132, the third mating portion 133, and the inner edge of the rotating member 130 jointly enclose to form the clamping groove 130b.

[0046] During the rotation of the rotating member 130 in the first direction, the surface of the first mating portion 131 close to the inside of the rotating member 130 cooperates with the guiding portion 122, so that the guiding portion 122 is located in the clamping groove 130b.

[0047] During the rotation of the rotating member 130 in the direction opposite to the first direction, the surface of the third mating portion 133 close to the edge of the rotating member 130 cooperates with the guiding portion 122, so that the guiding portion 122 is located in the release groove 130a.

[0048] Please refer to Figure 6 , in an embodiment, the third mating portion 133 is an elastic piece. The elastic piece is connected to the second mating portion 132 and is arranged close to the inside of the rotating member 130.

[0049] It should be noted that the elastic piece can move towards the direction close to the first mating portion 131. Preferably, when the third mating portion 133 is an elastic piece, the third mating portion 133 is parallel to the other first mating portion 131, avoiding the movement of the protruding structure 120 in the direction away from the wafer 20.

[0050] As Figure 4 shown, in a preferred embodiment, for the convenience of manufacturing, the rotating member 130, the first mating portion 131, the second mating portion 132, and the third mating portion 133 are integrally formed.

[0051] Please refer to Figure 2 and Figure 3, in a specific embodiment, the convex structure 120 further includes a sliding cover 123, and the limiting portion 121, the sliding cover 123, and the guiding portion 122 are fixedly connected in sequence; the hot plate 110 has a sliding groove 112, and the sliding cover 123 is located in the sliding groove 112 and is used to cover the guiding hole 111. It can be understood that the setting of the sliding cover 123 avoids the pollution or blockage of the guiding hole 111.

[0052] Optionally, as Figure 1 shown, the convex structure 120 further includes a bushing 124, the bushing 124 is sleeved on the guiding portion 122, and is movably matched with the first mating portion 131, the second mating portion 132, and the third mating portion 133. It can be understood that the bushing 124 can improve the flexibility of the movement of the guiding portion 122.

[0053] Optionally, a rolling bearing can also be used to replace the bushing 124.

[0054] Optionally, in an implementable solution, the first driving member 140 is connected with a gear 141, the rotating member 130 is fixedly connected with an internal gear ring 142, and the gear 141 can drive the internal gear ring 142 to rotate. The first driving member 140 is used to drive the rotating member 130 to rotate relative to the hot plate 110, and to move the limiting member closer to or away from the wafer 20.

[0055] It should be noted that the hot plate 110 is provided with arc-shaped grooves 113 corresponding to the number of the convex structures 120, and the rotating member 130 is provided with a guiding member 134, the guiding member 134 is located in the arc-shaped grooves 113, and can enable the rotating member 130 to rotate relatively. It can be understood that the setting of the arc-shaped grooves 113 can also make the connection between the rotating member 130 and the hot plate 110 more stable.

[0056] Optionally, the cross section of the arc-shaped groove 113 is in a T shape.

[0057] As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A single-wafer cup electroplating device, characterized in that, It includes a hot plate for heating and placing a wafer; at least two convex structures for fixing the edge of the wafer are provided on the hot plate; The convex structures can move along the radial direction of the wafer and are slidably connected to the hot plate; The single-wafer cup electroplating device further includes a rotating member and a first driving member; the rotating member is connected to the hot plate, and the rotating member has clamping grooves and release grooves corresponding to the number of the convex structures, and the clamping grooves and the release grooves communicate with each other; with the center of the wafer as the center, the radius of the clamping groove is greater than the radius of the release groove; One end of the convex structure is slidably connected to the clamping groove and the release groove; the first driving member is fixedly connected to the hot plate and is used to drive the rotating member to rotate relative to the hot plate so that the convex structure moves away from or approaches the wafer.

2. The single-wafer cup electroplating apparatus according to claim 1, wherein The convex structure has a limiting portion and a guiding portion; the limiting portion is fixedly connected to the guiding portion, and the hot plate has a guiding hole for making the limiting portion approach or move away from the wafer, and the guiding portion passes through the guiding hole; The rotating member is connected to the hot plate, and the rotating member is provided with a first matching portion, a second matching portion and a third matching portion corresponding to the number of the convex structures. The second matching portion is arc-shaped and is concentrically arranged relative to the hot plate; the first matching portion and the third matching portion are located at both ends of the second matching portion. The first matching portion is arranged towards the outer edge of the rotating member, and the third matching portion is arranged towards the inside of the clamping groove; The first matching portion, the second matching portion and the outer edge of the rotating member together enclose to form the release groove; The second matching portion, the third matching portion and the inner edge of the rotating member together enclose to form the clamping groove; During the rotation of the rotating member in the first direction, the surface of the first matching portion close to the inside of the rotating member cooperates with the guiding portion so that the guiding portion is located in the clamping groove; During the rotation of the rotating member in the direction opposite to the first direction, the surface of the third matching portion close to the edge of the rotating member cooperates with the guiding portion so that the guiding portion is located in the release groove.

3. The single-wafer cup electroplating device according to claim 2, characterized in that, The third matching portion is an elastic piece, and the elastic piece is connected to the second matching portion and is arranged close to the inside of the rotating member.

4. The single-wafer cup electroplating device according to claim 2, wherein The rotating member, the first matching portion and the second matching portion are integrally formed.

5. The single-wafer cup electroplating apparatus according to claim 2, wherein, The convex structure further includes a sliding cover, and the limiting portion, the sliding cover and the guiding portion are fixedly connected in sequence; the hot plate has a sliding groove, and the sliding cover is located in the sliding groove and is used to cover the guiding hole.

6. The single-wafer cup electroplating apparatus according to claim 2, wherein, The convex structure further includes a bushing, and the bushing is sleeved on the guiding portion and is movably matched with the first matching portion, the second matching portion and the third matching portion.

7. The single-wafer cup electroplating apparatus according to claim 1, wherein, The first driving member is connected with a gear, and the rotating member is fixedly connected with an internal gear ring, and the gear can drive the internal gear ring to rotate.

8. The single-wafer cup electroplating apparatus according to claim 7, wherein The hot plate is provided with an arc-shaped groove, and the rotating member is provided with a guiding member. The guiding member is located in the arc-shaped groove and can make the rotating member rotate relatively.

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