DOB power supply substrate fixed installation structure and LED lamp thereof

By using an L-shaped bracket in LED lamps, the problem of insufficient installation space and heat dissipation performance is solved, the aesthetics and heat dissipation properties are improved, and the service life of the power supply is extended.

CN223153508UActive Publication Date: 2025-07-25LEPING SHENGYA LIGHTING CO LTD
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Patent Information

Application Number
CN202422530986.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-21
Publication Date
2025-07-25
Estimated Expiration
2034-10-21

AI Technical Summary

Technical Problem

When installing the DOB power substrate, existing LED lamps have problems that occupy installation space affects the aesthetics or lack of heat dissipation performance.

Method used

The L-shaped bracket is used to install the DOB power substrate in the cavity in the heat dissipation shell, so that it is in direct contact with the heat dissipation shell, combined with thermally conductive grease to ensure good contact, and is fixed by screws to achieve accurate positioning and convenient installation.

Benefits of technology

It improves the aesthetics of the lamp and the heat dissipation performance of the power supply, and extends the service life of the power supply.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of lighting lamps, in particular to a DOB power supply substrate fixing and mounting structure and an LED lamp thereof. The module comprises a heat dissipation shell, a DOB power supply substrate and an L-shaped support, the heat dissipation shell is provided with a cavity, and a fixing column is pre-arranged in the cavity; a groove-shaped hole is formed in the DOB power supply substrate; and the L-shaped bracket is connected to the groove-shaped hole and the fixed column respectively, so that the DOB power supply substrate is in direct contact with the heat dissipation shell. According to the fixing and installing structure of the DOB power source substrate, the DOB power source substrate is installed in the cavity in the heat dissipation shell through the L-shaped support, it can be guaranteed that the DOB power source substrate makes direct contact with the heat dissipation shell, the attractiveness of a lamp is guaranteed, the heat dissipation performance of a power source can be improved, and the service life of the power source is prolonged.
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Description

Technical Field

[0001] The utility model relates to the technical field of lighting fixtures, in particular to a fixed installation structure of a DOB power supply substrate and an LED lamp. Background Art

[0002] When installing a substrate containing a DOB power supply in an existing LED lamp, generally the following two methods are adopted:

[0003] (1). Installing columns on the outer surface of the heat dissipation housing, so that the power supply is in plane contact with the heat dissipation housing to achieve a good heat dissipation effect, but it will occupy a large installation space and affect the aesthetics of the lamp;

[0004] (2). Directly installing the power supply on the installation column in the inner cavity of the lamp heat dissipation housing, so that the power supply is in a suspended state. As shown in Figure 1 , it will reduce the installation space of the lamp and be more aesthetic, but this installation method will seriously reduce the heat dissipation performance of the power supply, easily cause the power supply temperature to be too high, thereby reducing the service life of the power supply and affecting the quality of the product. Content of the Utility Model

[0005] The utility model aims to at least improve one of the technical problems existing in the prior art. For this purpose, the utility model provides a fixed installation structure of a DOB power supply substrate and an LED lamp.

[0006] According to a DOB power supply substrate fixed installation structure of the first aspect embodiment of the utility model, including:

[0007] A heat dissipation housing, the heat dissipation housing has a cavity, and fixing columns are preset in the cavity;

[0008] A DOB power supply substrate, a slot-shaped hole is opened on the DOB power supply substrate;

[0009] An L-shaped bracket, which is respectively connected to the slot-shaped hole and the fixing column, so that the DOB power supply substrate is in direct contact with the heat dissipation housing.

[0010] According to the DOB power supply substrate fixed installation structure of the embodiment of the utility model, by arranging the L-shaped bracket to install the DOB power supply substrate in the cavity of the heat dissipation housing, and ensuring that the DOB power supply substrate is in direct contact with the heat dissipation housing, not only the aesthetics of the lamp is guaranteed, but also the heat dissipation of the power supply can be improved and the service life of the power supply can be increased.

[0011] In a possible implementation of the first aspect, the L-shaped bracket has a first branch and a second branch. A through hole is provided on the surface of the first branch, and a screw passes through the through hole to be fixedly connected to the fixing column, thereby realizing the convenient and firm installation and fixation of the DOB power supply substrate, the L-shaped bracket, and the heat dissipation housing. A convex block is provided at the end of the second branch, and the convex block is clamped with the slot-shaped hole, which can realize the precise positioning of the DOB power supply substrate and the L-shaped bracket.

[0012] In a possible implementation of the first aspect, a notch is provided on the outer periphery of the circumferential side of the DOB power supply substrate for avoiding the fixing column to realize the convenient positioning of the DOB power supply substrate and the heat dissipation housing.

[0013] In a possible implementation of the first aspect, the notch is in a semi-circular shape, which provides a larger layout area for the DOB power supply substrate when ensuring the avoidance of the fixing column.

[0014] In a possible implementation of the first aspect, a heat-conducting silicone grease is coated on the back surface of the DOB power supply substrate to ensure that it can be in full contact with the heat dissipation housing.

[0015] In a possible implementation of the first aspect, the first branch and the second branch are composed of two straight plates perpendicular to each other.

[0016] In a possible implementation of the first aspect, the first branch and the second branch are composed of a straight plate and an arc-shaped plate. A through hole is provided on the straight plate, and the arc-shaped plate is connected to the slot-shaped hole.

[0017] An LED lamp according to an embodiment of the second aspect of the present invention, wherein the lamp includes the DOB power supply substrate fixed installation structure as described above.

[0018] The additional aspects and advantages of the present invention will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 It is a schematic diagram of the existing DOB power supply substrate fixed installation structure;

[0021] Figure 2It is an exploded schematic diagram before the installation of the DOB power supply board fixing and installation structure according to the embodiment of the present utility model;

[0022] Figure 3 It is Figure 2 An enlarged schematic diagram of part A;

[0023] Figure 4 It is a schematic diagram after the installation of the DOB power supply board fixing and installation structure according to the embodiment of the present utility model;

[0024] Figure 5 It is Figure 4 An enlarged schematic diagram of part B.

[0025] Reference numerals:

[0026] Heat dissipation housing 1, cavity 10, fixing column 11;

[0027] DOB power supply board 2, notch 20, slot-shaped hole 21;

[0028] L-shaped bracket 3, first branch 31, second branch 32, through hole 310, protruding block 320. Detailed implementation manners

[0029] The embodiments of the present utility model will be described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the specification of the present utility model herein are only for the purpose of describing specific implementation manners and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0032] In the description and claims of this application and the accompanying drawings, the terms "first", "second", "third", etc. are used to distinguish different objects and are not used to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a series of steps or units are included, or optionally, steps or units not listed are also included, or optionally, other steps or units inherent to these processes, methods, products or devices are also included.

[0033] Only the parts relevant to the present application are shown in the drawings, not all of the content. Before discussing the exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts depict the operations (or steps) as sequential processes, many of the operations can be performed in parallel, concurrently, or simultaneously. In addition, the order of the operations can be rearranged. The process can be terminated when its operations are completed, but it can also have additional steps not included in the drawings. The process can correspond to a method, function, procedure, subroutine, subprogram, etc.

[0034] The terms "component", "module", "system", "unit", etc. used in this specification are used to denote computer-related entities, hardware, firmware, combinations of hardware and software, software, or software in execution. For example, a unit can be, but is not limited to, a process running on a processor, a processor, an object, an executable file, an execution thread, a program, and / or distributed between two or more computers. In addition, these units can be executed from various computer-readable media storing various data structures. A unit can communicate, for example, through signals with other systems via local and / or remote processes according to signals having one or more data packets (e.g., data from a second unit interacting with a local system, a distributed system, and / or a network. For example, the Internet interacting with other systems through signals).

[0035] Embodiment 1

[0036] Refer to Figures 2 to 5 As shown, this embodiment provides a fixed mounting structure for a DOB power supply substrate, which includes:

[0037] A heat dissipation housing 1, the heat dissipation housing 1 having a cavity 10, and fixing columns 11 being preset in the cavity 10;

[0038] A DOB power supply substrate 2, a slot-shaped hole 21 being formed on the DOB power supply substrate 2;

[0039] An L-shaped bracket 3, being respectively connected to the slot-shaped hole 21 and the fixing column 11, so that the DOB power supply substrate 2 is in direct contact with the heat dissipation housing 1.

[0040] According to the fixed mounting structure of the DOB power supply substrate of the embodiment of the present utility model, by arranging the L-shaped bracket 3 to install the DOB power supply substrate 2 in the cavity 10 of the heat dissipation housing 1 and ensuring that the DOB power supply substrate 2 is in direct contact with the heat dissipation housing 1, not only the aesthetics of the lamp is guaranteed, but also the heat dissipation of the power supply can be improved, and the service life of the power supply can be increased.

[0041] It should be noted that the cavity 10 is generally rectangular in shape. Chamfering is performed at the corners of the heat dissipation housing 1 inside the cavity. The four fixing posts are respectively and symmetrically arranged on both sides of the heat dissipation housing 1, facilitating more stable installation.

[0042] It should be noted that the L-shaped bracket 3 has a first branch 31 and a second branch 32. A through hole 310 is provided on the surface of the first branch 31. A screw passes through the through hole 310 and is fixedly connected to the fixing post 11, simultaneously realizing the convenient and firm installation and fixation of the DOB power supply substrate, the L-shaped bracket, and the heat dissipation housing. A raised block 320 is provided at the end of the second branch 32. The raised block 320 is snap-fitted with the slot-shaped hole 21. By adopting a concave-convex insertion structure, the precise positioning of the DOB power supply substrate and the L-shaped bracket can be realized.

[0043] Furthermore, the L-shaped bracket 3 can be either a rigid plastic or a metal alloy.

[0044] In this embodiment, the second branch 32 is parallel to the fixing post 11, and the length of the second branch 32 is slightly longer than that of the fixing post 11, facilitating the reduction of the installation height of the DOB power supply substrate 2, enabling the DOB power supply substrate 2 to be in direct contact with the heat dissipation housing 1, and increasing the heat dissipation performance.

[0045] It should be noted that a notch 20 is provided around the periphery of the DOB power supply substrate 2 for avoiding the fixing post 11 and realizing the convenient positioning of the DOB power supply substrate and the heat dissipation housing.

[0046] It should be noted that the notch 20 is semicircular in shape, providing a larger layout area for the DOB power supply substrate while ensuring the avoidance of the fixing post 11.

[0047] It is worth mentioning that the notch 20 can also be arc-shaped or rectangular, not limited to semicircular, to meet the requirements of different application scenarios.

[0048] It should be noted that a heat-conducting silicone grease is applied to the back of the DOB power supply substrate 2 to ensure its full contact with the heat dissipation housing 1.

[0049] It should be noted that the first branch 31 and the second branch 32 are composed of two mutually perpendicular straight plates, which can be integrally formed by pressing or spliced together, with convenient material selection and high cost performance.

[0050] It should be noted that the first branch 31 and the second branch 32 are composed of a straight plate and an arc-shaped plate. A through hole 310 is provided on the straight plate, and the arc-shaped plate is connected to the slot-shaped hole 21.

[0051] Embodiment 2

[0052] On the basis of Embodiment 1, the following deformations are made in this embodiment to provide a fixed installation structure for a DOB power supply substrate, which includes:

[0053] A heat dissipation housing 1, the heat dissipation housing 1 having a cavity 10, and fixing columns 11 being preset in the cavity 10;

[0054] A DOB power supply substrate 2, connection through holes being formed on the DOB power supply substrate 2, and the connection through holes being used to replace the slot-shaped holes 21 in Embodiment 1;

[0055] A Z-shaped bracket 3, which is respectively connected to the connection through holes and the fixing columns 11 by screws, so that the DOB power supply substrate 2 is in direct contact with the heat dissipation housing 1.

[0056] It should be noted that in this embodiment, the connection methods of the Z-shaped bracket 3 with the connection through holes and the fixing columns 11 both adopt screw fixation.

[0057] Embodiment 3

[0058] This embodiment provides an LED lamp, wherein the lamp includes the above-mentioned fixed installation structure for a DOB power supply substrate.

[0059] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the utility model.

[0060] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0061] Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all embodiments. The mention of "embodiments" in this context means that the specific features, structures, or characteristics described in connection with the embodiments may be included in at least one embodiment of the present application. The phrase may not necessarily refer to the same embodiment at various positions in the specification, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art can explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.

[0062] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A fixed installation structure for a DOB power supply substrate, characterized in that, Comprising: A heat dissipation housing (1), the heat dissipation housing (1) having a cavity (10), and fixing posts (11) being preset in the cavity (10); A DOB power supply substrate (2), a slot-shaped hole (21) being formed in the DOB power supply substrate (2); An L-shaped bracket (3), which is respectively connected to the slot-shaped hole (21) and the fixing post (11), so that the DOB power supply substrate (2) is in direct contact with the heat dissipation housing (1).

2. The DOB power supply substrate fixing and mounting structure according to claim 1, characterized in that, The L-shaped bracket (3) has a first branch (31) and a second branch (32), a through hole (310) being formed on the surface of the first branch (31), and a raised block (320) being provided at the end of the second branch (32), the raised block (320) being snap-connected to the slot-shaped hole (21).

3. The DOB power supply substrate fixing and installation structure according to claim 1, characterized in that, A notch (20) is provided on the peripheral side of the DOB power supply substrate (2).

4. The DOB power supply board fixing and mounting structure according to claim 3, wherein, The notch (20) is semicircular in shape.

5. The DOB power supply substrate fixed mounting structure according to claim 3, characterized in that, A heat conductive silicone grease is coated on the back surface of the DOB power supply substrate (2).

6. The DOB power supply board fixing and mounting structure according to claim 2, characterized in that, The first branch (31) and the second branch (32) are composed of two mutually perpendicular straight plates.

7. The DOB power supply board fixing and installation structure according to claim 2, characterized in that The first branch (31) and the second branch (32) are composed of a straight plate and an arc-shaped plate, a through hole (310) being formed in the straight plate, and the arc-shaped plate being connected to the slot-shaped hole (21).

8. An LED lamp, characterized in that, The lamp comprises the DOB power supply substrate fixed installation structure according to any one of claims 1 to 7.