Boat of furnace tube equipment

Abstract

The utility model provides a wafer boat of furnace tube equipment, belongs to the technical field of wafer boat production, and solves the technical problem that larger particles generated by friction between a wafer and a wafer support pin fall on a next wafer. The wafer boat comprises a supporting frame and a plurality of layers of supporting assemblies located in the supporting frame, each layer of supporting assembly is composed of a plurality of wafer supporting pins, a supporting part is arranged at one end of each wafer supporting pin, a baffle used for blocking particles is arranged on the periphery of each supporting part, and the height of each baffle is smaller than that of each supporting part. And the top of the baffle is an inclined surface which inclines towards one side of the supporting part and extends downwards. The wafer boat provided by the utility model can block larger particles and prevent the larger particles from drifting to other places along with air flow, thereby effectively ensuring the yield of the next wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production, and more specifically, it relates to a boat of a furnace tube device. Background Art

[0002] When the furnace tube machine transfers the wafer in the FOUP (Front Opening Unified Pod) to the boat, it is necessary to first place the FOUP on the FIMS port (a standard specified by Applied Materials, called the front opening interface mechanical standard), and then open the door of the FOUP to start the transfer. The Wafer Transfer Robot will grab the wafer in the FOUP, move it to the boat in the loading area, and then place it on the Boat Pin (wafer support pin). As Figure 1 shown, the Wafer11 will be relatively stationary with respect to the Boat Pin21. However, during the processing, the mechanical friction between the Wafer11 and the Boat Pin21 will generate particles that will fall onto the next wafer11, as Figure 2 shown, thus affecting the quality. Summary of the Utility Model

[0003] The technical problem to be solved by the utility model is in view of the above deficiencies of the prior art. The purpose of the utility model is to provide a boat of a furnace tube device, which can block larger particles, prevent the larger particles from drifting to other places with the air flow, and effectively ensure the yield of the next wafer.

[0004] The technical solution of the utility model is: a boat of a furnace tube device, which includes a support frame and several layers of support components located inside the support frame. Each layer of the support components is composed of several wafer support pins. One end of the wafer support pin is provided with a support portion, and a baffle for blocking particles is provided on the outer periphery of the support portion. The height of the baffle is less than the height of the support portion, and the top of the baffle is an inclined surface that extends obliquely downward towards the support portion.

[0005] As a further improvement, an inner groove is provided at the connection between the lowest point of the top of the baffle and the support portion.

[0006] Further, the inner groove is an arc-shaped groove extending downward from the lowest point of the baffle.

[0007] Further, the depth of the inner groove is 0.3 mm to 0.7 mm.

[0008] Further, the inclination angle of the inclined surface is 20° to 45°.

[0009] Furthermore, the baffle extends along the side away from the support portion, and the width of the baffle is 2.5 mm to 3.5 mm.

[0010] Furthermore, the baffle covers the lower part of the outer side wall of the support portion, and the shape of the outer side wall of the baffle is the same as the shape of the outer side wall of the support portion.

[0011] Furthermore, the outer side wall of the baffle includes an arc surface and two flat surfaces, and the two flat surfaces are connected to and tangent to both ends of the arc surface.

[0012] Furthermore, the support frame includes a plurality of support columns, and a plurality of layers of the support assemblies are arranged inside the plurality of support columns from top to bottom.

[0013] Furthermore, the number of the support columns is not less than two, the support columns are evenly distributed, and at least one wafer support pin in each layer of the support assemblies is connected to the support column.

[0014] Compared with the prior art, the advantages of the present utility model are as follows:

[0015] 1. For the susceptor of the present utility model, by arranging a baffle around the outer periphery of the support portion, the baffle does not contact the wafer and surrounds the outer periphery of the contact position between the wafer and the support portion. When friction occurs between the wafer and the support portion, the generated larger particles will fall onto the baffle. The baffle can block the larger particles and prevent them from falling onto the next wafer, effectively ensuring the yield of the next wafer.

[0016] 2. For the susceptor of the present utility model, since the top surface of the baffle has a certain inclination angle, it can prevent larger particles from drifting to other places along with the air flow, and the larger particles falling on the baffle can slide along the inclined surface of the baffle into the inner groove and be stored in the inner groove. The particles in the groove can be cleaned regularly, thereby reducing the equipment maintenance cost and improving the work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a top view structural schematic diagram of the traditional technology;

[0018] Figure 2 is a schematic diagram of the particle distribution of the next wafer in the traditional technology;

[0019] Figure 3 is a top view structural schematic diagram of the present utility model;

[0020] Figure 4 is a three-dimensional structural schematic diagram of the wafer support pin of the present utility model;

[0021] Figure 5 is a front view cross-sectional view of the wafer support pin of the present utility model;

[0022] Figure 6 This is the front view structural schematic diagram of the wafer support pin in the present utility model;

[0023] Figure 7 This is the top view structural schematic diagram of the wafer support pin in the present utility model;

[0024] Figure 8 This is the left view structural schematic diagram of the wafer support pin in the present utility model;

[0025] Figure 9 This is the particle distribution schematic diagram of the next wafer during the application of the present utility model;

[0026] Figure 10 This is the front view structural schematic diagram during the application of the present utility model.

[0027] Wherein:

[0028] 11 - wafer, 13 - larger particles, 14 - smaller particles;

[0029] 21 - wafer support pin, 22 - support portion, 23 - baffle, 24 - inner groove, 25 - inclined surface, 231 - arc surface, 232 - flat surface;

[0030] 31 - support column. Detailed implementation manner

[0031] The following further describes the present utility model with reference to the specific embodiments in the accompanying drawings.

[0032] During the wafer production and processing, when there is slight mechanical friction between the wafer 11 and the wafer support pin 21, a majority of larger particles 13 and a minority of smaller particles 14 are generated and float onto the next wafer 11, as Figure 2 shown. Generally, a minority of the smaller particles 14 will be affected by the airflow and float throughout the wafer 11, but the impact on the quality of the wafer 11 is relatively small and can be ignored; while a majority of the larger particles 13 will be affected by the airflow and gravity and fall at the position corresponding to the next wafer 11 and the wafer support pin 21, which has a greater impact on the quality of the wafer 11. The present utility model is a susceptor of a furnace tube device proposed to reduce the larger particles 13 on the next wafer 11.

[0033] As Figures 3 - 10As shown in the figure, the susceptor of the present utility model includes a support frame and several layers of support components located within the support frame. Each layer of support components is composed of several wafer support pins 21. One end of each wafer support pin 21 is provided with a support portion 22. The top of the support portion 22 is a planar structure. By using a plane to contact the wafer 11, the contact area is relatively large, making the wafer support more stable. A baffle 23 for blocking particles is provided on the outer periphery of the support portion 22. The height of the baffle 23 is less than the height of the support portion 22. The top of the baffle 23 is an inclined surface 25 that extends obliquely downward towards the support portion 22. The baffle 23 can be formed in various ways. For example, it is obtained by modifying the outer edge of the top of the wafer support pin 21, that is, reducing a part of the material of the outer edge of the support portion 22 to form a step.

[0034] For the susceptor of the present utility model, by providing the baffle 23 on the outer periphery of the support portion 22, the baffle 23 does not contact the wafer 11 and surrounds the outer periphery of the contact position between the wafer 11 and the support portion 22. When friction occurs between the wafer 11 and the support portion 22, the larger particles 13 generated will fall onto the baffle 23. The baffle 23 can block the larger particles 13 and prevent the larger particles 13 from falling onto the next wafer 11, effectively ensuring the yield of the next wafer 11. Further, the top of the baffle 23 is an inclined surface 25 that extends obliquely downward towards the support portion 22, which can play a role in guiding the larger particles 13, causing them to converge at the connection between the lowest point of the top of the baffle 23 and the support portion 22, facilitating cleaning. Since the top surface of the baffle 23 has a certain inclination angle, the height of the baffle 23 can be made as large as possible, as long as it satisfies that the maximum height of the baffle 23 is less than the height of the support portion 22 and the baffle 23 does not contact the wafer 11. In this way, the distance between the wafer 11 and the highest point of the baffle 23 is reduced, and the larger particles 13 are not easily passed through this distance, preventing the larger particles 13 from drifting to other places along with the air flow.

[0035] Further, an inner groove 24 is provided at the connection between the lowest point of the top of the baffle 23 and the support portion 22 for storing the larger particles 13.

[0036] By providing the inner groove 24, the larger particles 13 that fall on the baffle 23 can slide along the inclined surface of the baffle 23 into the inner groove 24 and be stored in the inner groove 24. When a certain number of accumulated particles is reached, the equipment is maintained regularly, and the cleaning and maintenance are very convenient, thereby reducing the equipment maintenance cost and improving the work efficiency.

[0037] Specifically, the inner groove 24 is an arc-shaped groove that extends downward from the lowest point of the baffle 23. The structure of the arc-shaped groove can prevent the larger particles 13 from accumulating in the corner and is more convenient for cleaning.

[0038] Preferably, the depth of the inner groove 24 is 0.3 mm to 0.7 mm. If the inner groove 24 is too deep, it is easy to accumulate too many particles and difficult to clean. If the inner groove 24 is too shallow, it stores fewer particles and the cleaning frequency increases. Therefore, the depth of the inner groove 24 should be reasonably controlled to store a certain amount of particles and facilitate cleaning.

[0039] Furthermore, the depth of the inner groove 24 is further selected as 0.5 mm, which further facilitates cleaning while storing a certain amount of particles.

[0040] Preferably, the inclination angle of the inclined surface 25 is 20° to 45°. By reasonably controlling the inclination angle of the inclined surface 25, while ensuring smooth sliding of the particles, the strength of the wafer support pin 21 can be maintained, and the connection between the baffle 23 and the support portion 22 will not be too thin.

[0041] Furthermore, the inclination angle of the inclined surface 25 is further selected as 30°, which further maintains the strength of the wafer support pin 21 while ensuring smooth sliding of the particles.

[0042] Preferably, the baffle 23 extends along the side away from the support portion 22, which is convenient for the processing of the baffle 23, and the width of the baffle 23 is 2.5 mm to 3.5 mm. By reasonably controlling the width of the baffle 23, it is ensured that the support portion 22 has sufficient support area to support the wafer 11.

[0043] As Figure 5 shown, the width of the baffle 23 is further selected as 3 mm. The width of the baffle 23 is much smaller than the width L of the wafer support pin 21, further optimizing the width of the baffle 23 to ensure that the support portion 22 has sufficient support area to support the wafer 11.

[0044] Preferably, the baffle 23, the support portion 22, and the wafer support pin 21 can be an integral structure to ensure its structural strength.

[0045] As Figure 7 shown, the baffle 23 covers the lower part of the outer wall of the support portion 22, and the shape of the outer wall of the baffle 23 is the same as the shape of the outer wall of the support portion 22. In the way that the baffle 23 completely covers the support portion 22, no matter from which direction the larger particles 13 fall, the baffle 23 can catch them, further reducing the problem of particle dropping.

[0046] Furthermore, the outer wall of the baffle 23 includes an arc surface 231 and two flat surfaces 232. The two flat surfaces 232 are connected to and tangent to the two ends of the arc surface 231. The structure of the baffle 23 with an arc-shaped end face, on the one hand, avoids the problem of accidentally scratching the hand during cleaning, and on the other hand, can play a good role in guiding the air flow.

[0047] As Figure 10As shown, the support frame includes a plurality of support columns 31. The support columns 31 play a role in supporting the entire susceptor. A plurality of layers of support components are arranged inside the plurality of support columns 31 from top to bottom in a uniformly distributed and spaced manner to ensure smooth flow of air between adjacent wafers 11.

[0048] Preferably, the number of support columns 31 is not less than two and the support columns 31 are evenly distributed. At least one wafer support pin 21 in each layer of support components is connected to the support column 31. In other embodiments, two wafer support pins 21 in each layer of support components can be connected to the support column 31, so that the support for the wafer 11 is more stable.

[0049] For the susceptor of a furnace tube device provided by the present utility model, when friction occurs between the wafer 11 and the support portion 22, the generated larger particles will fall onto the baffle 23. The baffle 23 can block the larger particles to prevent them from falling onto the next wafer. Moreover, the top surface of the baffle 23 has a certain inclination angle to prevent the larger particles from drifting to other places with the airflow. There is no particle matter drifting between the upper and lower adjacent wafers, effectively ensuring the yield of the next wafer.

[0050] The above is only the preferred embodiment of the present utility model. It should be noted that for those skilled in the art, without departing from the structure of the present utility model, several deformations and improvements can be made, which will not affect the implementation effect of the present utility model and the practicability of the patent.

Claims

1. A susceptor for a furnace tube device, comprising a support frame and a plurality of layers of support components located within the support frame. Each layer of the support components is composed of a plurality of wafer support pins (21), and is characterized in that, A supporting portion (22) is provided at one end of the wafer supporting pin (21); the top of the supporting portion (22) is a planar structure, and the planar structure is used to contact the wafer; a baffle (23) for blocking particles is provided on the periphery of the supporting portion (22); the height of the baffle (23) is smaller than the height of the supporting portion (22), and the top of the baffle (23) is an inclined surface (25) extending downwardly and obliquely toward one side of the supporting portion (22).

2. The susceptor of a furnace tube device according to claim 1, characterized in that, An inner groove (24) is provided at the connection between the lowest point of the top of the baffle (23) and the support portion (22).

3. The susceptor of a furnace tube device according to claim 2, wherein, The inner groove (24) is an arc-shaped groove extending downward from the lowest point of the baffle (23).

4. The susceptor of a furnace tube device according to claim 2, wherein, The depth of the inner groove (24) is 0.3 mm to 0.7 mm.

5. The susceptor of a furnace tube device according to claim 1, wherein, The inclination angle of the inclined surface (25) is 20° to 45°.

6. The susceptor of a furnace tube device according to claim 1, wherein The baffle (23) extends along a side away from the supporting portion (22), and the width of the baffle (23) is 2.5 mm to 3.5 mm.

7. The susceptor of a furnace tube device according to claim 1, wherein The baffle plate (23) is coated on the lower part of the outer wall of the support portion (22), and the shape of the outer wall of the baffle plate (23) is the same as the shape of the outer wall of the support portion (22).

8. The susceptor of a furnace tube device according to claim 7, wherein, The outer side wall of the baffle (23) comprises an arcuate surface (231) and two planes (232), and the two planes (232) are connected to two ends of the arcuate surface (231) and are tangent to each other.

9. The susceptor of a furnace tube device according to any one of claims 1-8, characterized in that, The support frame comprises a plurality of support columns (31), and a plurality of layers of support components are arranged on the inner sides of the plurality of support columns (31) from top to bottom.

10. The susceptor of a furnace tube device according to claim 9, characterized in that, The number of the support columns (31) is not less than two, the support columns (31) are evenly distributed, and at least one wafer support pin (21) in each layer of the support assembly is connected to the support column (31).

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