DLP module air cooling mechanism

Abstract

The utility model provides a DLP module air cooling mechanism, which comprises a mounting rack, a DLP board card, heat conduction silica gel, a heat dissipation plate and a heat dissipation fan which are arranged in sequence, one side of the heat dissipation plate facing the DLP board card is provided with heat conduction bulges, the heat conduction bulges are in one-to-one correspondence with chips on the DLP board card, and the heat conduction silica gel is arranged on the mounting rack. The heat-conducting silica gel is arranged between the heat-conducting protrusions and the chip, heat-dissipating protrusions are distributed on the side, facing the heat-dissipating fan, of the heat-dissipating plate, the heat-dissipating protrusions are arranged in a matrix mode and form a plurality of air channels which are communicated with one another, and an air inlet of the heat-dissipating fan faces the heat-dissipating plate. According to the DLP module, the heat conduction silica gel, the heat dissipation plate and the heat dissipation fan are arranged, and the heat conduction protrusions are arranged on the heat dissipation plate, so that heat generated by a chip on the DLP board card can be effectively conducted to the heat dissipation plate, then the heat is taken away through the heat dissipation fan, and therefore effective heat dissipation of the DLP module is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of display, in particular to an air-cooling mechanism for a DLP module. Background Art

[0002] In the existing DLP (Digital Light Processing) module, a large amount of heat is generated during the operation of its internal chips. If the heat is not dissipated in time, it will cause the chip temperature to be too high, affecting its normal operation or even damaging it. Therefore, how to effectively dissipate the heat of the DLP module is an important issue. Currently, the common heat dissipation methods mainly include air-cooling and water-cooling. Among them, air-cooling is widely used because of its simple structure and low cost. However, the existing air-cooling mechanism still needs to be improved in terms of heat dissipation effect.

[0003] Therefore, it is necessary to design an air-cooling mechanism for a DLP module to solve the above problems. Summary of the Utility Model

[0004] The purpose of the utility model is to provide an air-cooling mechanism for a DLP module with good heat dissipation effect and convenient installation.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: an air-cooling mechanism for a DLP module, which includes an installation frame, a DLP board, a thermal conductive silicone, a heat dissipation board and a heat dissipation fan arranged in sequence. The side of the heat dissipation board facing the DLP board is provided with thermal conductive protrusions, and the thermal conductive protrusions correspond to the chips on the DLP board one by one. The thermal conductive silicone is arranged between the thermal conductive protrusions and the chips. The side of the heat dissipation board facing the heat dissipation fan is covered with heat dissipation protrusions. The heat dissipation protrusions are arranged in a matrix and form a plurality of interconnected air ducts. The air inlet of the heat dissipation fan faces the heat dissipation board.

[0006] As a further improved technical scheme of the utility model, the installation frame includes a bottom plate and side plates arranged above both ends of the bottom plate. The DLP board is arranged above the bottom plate, and a plurality of connecting columns are arranged between the DLP board and the bottom plate.

[0007] As a further improved technical scheme of the utility model, heat dissipation openings are opened at positions on the bottom plate corresponding to the chip positions of the DLP board.

[0008] As a further improved technical scheme of the utility model, the heat dissipation protrusions are rectangular or square protrusions, and the aspect ratio of the length to the width of the heat dissipation protrusions is (1-2):1.

[0009] As a further improved technical scheme of the utility model, the ratio of the width of the air duct to the size of the heat dissipation protrusions on both sides of the air duct in its width direction is 1:(1-2).

[0010] As a further improved technical solution of the present utility model, the ratio of the height of the heat dissipation protrusion to the width of the air duct is (1-3):1.

[0011] As a further improved technical solution of the present utility model, the material of the heat dissipation plate is brass.

[0012] As a further improved technical solution of the present utility model, the area of the air inlet of the heat dissipation fan is smaller than the area of the heat dissipation plate.

[0013] As a further improved technical solution of the present utility model, the edge of the heat dissipation plate is connected to the DLP board by a plurality of tower spring screws.

[0014] As can be seen from the above technical solutions, the air-cooling mechanism of the DLP module of the present utility model can effectively conduct the heat generated by the chip on the DLP board to the heat dissipation plate by setting the thermal conductive silicone, the heat dissipation plate and the heat dissipation fan, and by setting the heat conduction protrusions on the heat dissipation plate, and then take away the heat through the heat dissipation fan, so as to realize the effective heat dissipation of the DLP module; the heat conduction protrusions not only greatly increase the heat dissipation area, but also the multiple mutually connected air ducts formed between the heat conduction protrusions cooperate with the heat dissipation fan to take away the heat in time, which not only improves the heat dissipation efficiency, but also has high practicability due to its simple structure, low cost and easy implementation. Description of the Drawings

[0015] Figure 1 Is a perspective view of the air-cooling mechanism of the DLP module according to an embodiment of the present utility model.

[0016] Figure 2 Is Figure 1 The side view of the air-cooling mechanism of the DLP module in

[0017] Figure 3 Is Figure 2 The perspective view of the heat dissipation plate in

[0018] Figure 4 Is Figure 3 The bottom view of the heat dissipation plate in Detailed Embodiments

[0019] In order to make the purpose, technical solutions and advantages of the present utility model clearer, the present utility model will be described in detail below with reference to the drawings and specific embodiments.

[0020] Please refer Figure 1 And Figure 2 As shown, the present utility model provides an air-cooling mechanism for a DLP module, which includes a mounting bracket 10, a DLP board 20, a thermal conductive silicone 50, a heat dissipation plate 31 and a heat dissipation fan 40 arranged in sequence.

[0021] The mounting bracket 10 includes a bottom plate 11 and side plates 12 provided above both ends of the bottom plate 11. The DLP board 20 is disposed above the bottom plate 11. A plurality of connecting columns 22 are provided between the DLP board 20 and the bottom plate 11. The DLP board 20 is fixed to the bottom plate 11 through the connecting columns 22, and a certain distance can be formed between the DLP board 20 and the bottom plate 11 while fixing, which helps the DLP board 20 to dissipate heat downward. A heat dissipation opening 111 is formed at a position on the bottom plate 11 corresponding to the chip position of the DLP board 20, further avoiding heat accumulation between the DLP board 20 and the bottom plate 11.

[0022] Please refer Figure 3 and Figure 4 As shown, the heat dissipation plate 31 includes a plate-shaped main body 311, heat conduction protrusions 313 provided on one side of the plate-shaped main body 311 facing the DLP board 20, and heat dissipation protrusions 312 provided on one side of the plate-shaped main body 311 facing the heat dissipation fan 40. The heat conduction protrusions 313 correspond one-to-one with the chips on the DLP board 20, and heat conduction silicone 50 is provided between the heat conduction protrusions 313 and the chips.

[0023] The heat dissipation protrusions 312 are arranged in a matrix and form a plurality of interconnected air ducts. The air inlet of the heat dissipation fan 40 faces the heat dissipation plate 31, and the area of the air inlet of the heat dissipation fan 40 is smaller than the area of the heat dissipation plate 31. The heat dissipation protrusions 312 are rectangular or square protrusions, and the aspect ratio of the length to the width of the heat dissipation protrusions 312 is (1-2):1. The width of the air duct and the ratio of the dimensions of the heat dissipation protrusions 312 on both sides of it in its width direction is 1:(1-2). The ratio of the height of the heat dissipation protrusions 312 to the width of the air duct is (1-3):1. With the above settings, the heat dissipation protrusions 312 greatly increase the surface area of the heat dissipation plate 31, thereby enhancing surface heat dissipation; further, when the heat dissipation fan 40 is started, the air ducts arranged vertically and horizontally on the heat dissipation plate 31 force the air flow to pass through each side of each heat dissipation protrusion 312, quickly taking away the heat on the surface of the heat dissipation plate 31, preventing heat accumulation, keeping the chips of the DLP board 20 at a lower working temperature, and increasing its stability and service life. The material of the heat dissipation plate 31 is brass, further enhancing heat dissipation. The edge of the heat dissipation plate 31 is connected to the DLP board 20 through a plurality of tower spring screws 32.

[0024] Spatial relative position terms such as "upper" and "lower" used in this article are for the purpose of facilitating description of the relationship between one feature and another as shown in the drawings. It can be understood that according to the different placement positions of the product, the spatial relative position terms can be intended to include different orientations other than the orientations shown in the figures, and should not be construed as a limitation on the claims.

[0025] In addition, the above embodiments are only used to illustrate the present utility model and do not limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art. Although this specification has described the present utility model in detail with reference to the above embodiments, those of ordinary skill in the art should understand that those skilled in the art can still modify or make equivalent substitutions to the present utility model. All technical solutions and their improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.

Claims

1. An air-cooling mechanism for a DLP module, characterized in that: It includes a mounting bracket, a DLP board, a thermal silicone pad, a heat sink and a cooling fan arranged in sequence. A heat conducting protrusion is provided on one side of the heat sink facing the DLP board, and the heat conducting protrusions correspond one by one to the chips on the DLP board. The thermal silicone pad is arranged between the heat conducting protrusion and the chip. The side of the heat sink facing the cooling fan is covered with heat dissipating protrusions. The heat dissipating protrusions are arranged in a matrix and form a plurality of interconnected air ducts. The air inlet of the cooling fan faces the heat sink.

2. The air-cooling mechanism of the DLP module according to claim 1, characterized in that: The mounting bracket includes a bottom plate and side plates arranged above both ends of the bottom plate. The DLP board is arranged above the bottom plate, and a plurality of connecting columns are arranged between the DLP board and the bottom plate.

3. The air-cooling mechanism of the DLP module according to claim 2, characterized in that: A heat dissipation opening is provided at a position on the bottom plate corresponding to the position of the chip of the DLP board.

4. The air-cooling mechanism of the DLP module according to claim 1, characterized in that: The heat dissipating protrusions are rectangular or square protrusions, and the aspect ratio of the length to the width of the heat dissipating protrusions is (1-2):

1.

5. The air-cooling mechanism of the DLP module according to claim 1, characterized in that: The width of the air duct and the dimension ratio of the heat dissipating protrusions on both sides of the air duct in its width direction is 1:(1-2).

6. The air-cooling mechanism of the DLP module according to claim 1, wherein: The ratio of the height of the heat dissipating protrusion to the width of the air duct is (1-3):

1.

7. The air-cooling mechanism of the DLP module according to claim 1, characterized in that: The material of the heat sink is brass.

8. The air-cooling mechanism of the DLP module according to claim 1, wherein: The area of the air inlet of the cooling fan is smaller than the area of the heat sink.

9. The air-cooling mechanism of the DLP module according to claim 1, characterized in that: The edge of the heat sink is connected to the DLP board through a plurality of tower spring screws.

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