Terminal device

Abstract

The utility model discloses terminal equipment, and belongs to the technical field of terminals. The terminal equipment comprises a rotating shaft part, a first plane part, a second plane part, a first heat conduction layer and a second heat conduction layer. The fourth heat conduction part in the second heat conduction layer is located on the side, away from the first heat conduction part, of the to-be-cooled assembly, and at least part of the fifth heat conduction part can extend to the side close to the first heat conduction part, so that the fourth heat conduction part is matched with the fifth heat conduction part; and heat generated by the side, deviating from the first heat conduction part, of the to-be-cooled assembly in the working process is guided into the side close to the first heat conduction part. In addition, heat conducted to the side close to the first heat conduction part can be conducted into the second plane component through the first heat conduction layer. Therefore, after the heat generated by the device in the first plane component is transferred to the second plane component through the first heat conduction layer, the working temperature of the first plane component can be effectively reduced, so that the reliability of the terminal equipment is improved.

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to a terminal device. Background Art

[0002] With the development of communication technology, foldable display devices have gradually been favored by many users. They can not only bring better visual impact to users, but also meet users' needs for portability.

[0003] At present, a display device equipped with a foldable display screen generally includes: a rotating shaft component and a first plane component and a second plane component connected by the rotating shaft component. Under the action of the rotating shaft component, the first plane component and the second plane component can generate relative rotation, thereby driving the foldable display screen in the display device to switch between a folded state and an unfolded state.

[0004] Among them, the first planar component in the foldable display device usually has a main board, and the main board will generate a lot of heat when working, which will cause the working temperature of the first planar component in the foldable display device to be high, and thus cause the reliability of the foldable display device to be low. Utility Model Content

[0005] The embodiment of the present application provides a terminal device, which can solve the problem of low reliability of the folding display device in the prior art. The technical solution is as follows:

[0006] In one aspect, a terminal device is provided, comprising: a rotating shaft component, a first plane component, a second plane component, a first heat-conducting layer, and a second heat-conducting layer;

[0007] The rotating shaft component is located between the first plane component and the second plane component, and the first plane component and the second plane component are both rotatably connected to the rotating shaft component, and the first plane component has a component to be cooled;

[0008] The first heat-conducting layer comprises: a first heat-conducting portion distributed in the first plane component, a second heat-conducting portion distributed in the second plane component, and a third heat-conducting portion distributed in the shaft component, the third heat-conducting portion is respectively connected to the first heat-conducting portion and the second heat-conducting portion, and the first heat-conducting portion can cover the component to be cooled;

[0009] The second heat-conducting layer includes: a fourth heat-conducting portion and a fifth heat-conducting portion connected to each other, the fourth heat-conducting portion is located on a side of the heat-dissipating component away from the first heat-conducting portion, and at least a portion of the fifth heat-conducting portion can extend to a side close to the first heat-conducting portion.

[0010] Optionally, the fifth heat-conducting part includes: a first sub-part and a second sub-part. The second sub-part is arranged in parallel with the fourth heat-conducting part, and the second sub-part is distributed on one side close to the first heat-conducting part. The first sub-part is respectively connected to the fourth heat-conducting part and the second sub-part.

[0011] Optionally, the first planar component further has a first functional component arranged adjacent to the component to be cooled. The first functional component and the component to be cooled are arranged in a direction parallel to the extending direction of the first heat-conducting part, and the first heat-conducting part can further cover the first functional component;

[0012] Wherein, the first sub-part is located between the component to be cooled and the first functional component.

[0013] Optionally, the second sub-part is located between the first functional component and the first heat-conducting part.

[0014] Optionally, the second sub-part is located between the component to be cooled and the first heat-conducting part.

[0015] Optionally, the second sub-part is in contact with one side of the component to be cooled facing the first heat-conducting part.

[0016] Optionally, the first sub-part is in contact with the component to be cooled, and / or the first sub-part is in contact with the first functional component.

[0017] Optionally, the fourth heat-conducting part is in contact with one side of the component to be cooled facing away from the first heat-conducting part, and / or the second sub-part is in contact with the first heat-conducting part.

[0018] Optionally, the heat conductivity coefficient of the second heat-conducting layer is greater than that of the first heat-conducting layer.

[0019] Optionally, the thickness of the second heat-conducting layer ranges from 0.05 mm to 0.2 mm.

[0020] The beneficial effects brought by the technical solution provided by the embodiments of the present application at least include:

[0021] Since the fourth heat conduction part in the second heat conduction layer can be located on the side of the component to be cooled away from the first heat conduction part, and at least part of the fifth heat conduction part can extend to the side close to the first heat conduction part, therefore, through the cooperation of the fourth heat conduction part and the fifth heat conduction part in the second heat conduction layer, the heat generated on the side of the component to be cooled away from the first heat conduction part during operation can be conducted to the side close to the first heat conduction part. In addition, the heat conducted to the side close to the first heat conduction part can be conducted into the second planar component through the first heat conduction layer. In this way, after the heat generated by the devices in the first planar component is transferred to the second planar component through the first heat conduction layer, the operating temperature of the first planar component can be effectively reduced, thereby improving the reliability of the terminal device. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0023] Figure 1 is a schematic structural diagram of a terminal device provided by an embodiment of the present application;

[0024] Figure 2 is a schematic structural diagram of another terminal device provided by an embodiment of the present application;

[0025] Figure 3 is a schematic structural diagram of yet another terminal device provided by an embodiment of the present application;

[0026] Figure 4 is a schematic structural diagram of still another terminal device provided by an embodiment of the present application;

[0027] Figure 5 is a schematic structural diagram of a terminal device provided by another embodiment of the present application. Detailed Embodiments

[0028] To make the purpose, technical solutions and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail in conjunction with the drawings.

[0029] Please refer to Figure 1 , Figure 1 is a schematic structural diagram of a terminal device provided by an embodiment of the present application. This terminal device can be a folding mobile phone, a folding tablet computer, a notebook computer, etc. When the terminal device is a folding mobile phone, the folding mobile phone can be a small-sized folding mobile phone or a large-sized folding mobile phone. The embodiments of the present application do not limit this.

[0030] The terminal device 000 may include: a rotating shaft component 100, a first planar component 200, a second planar component 300, a first heat-conducting layer 400, and a fifth heat-conducting layer 500.

[0031] The rotating shaft component 100 in the terminal device 000 may be located between the first planar component 200 and the second planar component 300, and both the first planar component 200 and the second planar component 300 may be rotatably connected to the rotating shaft component 100. Here, under the action of the rotating shaft component 100, relative rotation can occur between the first planar component 200 and the second planar component 300, and thus the terminal device 000 can be driven to switch between a folded state and an unfolded state.

[0032] Among them, the first planar component 200 in the terminal device 000 may have a component to be heat-dissipated 201. For example, the component to be heat-dissipated 201 may be a control component (i.e., the main board), or may be other components with a relatively high working temperature. The embodiments of the present application do not limit this.

[0033] The first heat-conducting layer 400 in the terminal device 000 may include: a first heat-conducting portion 401 distributed in the first planar component 200, a second heat-conducting portion 402 distributed in the second planar component 200, and a third heat-conducting portion 403 distributed in the rotating shaft component 100. Here, the third heat-conducting portion 403 may be respectively connected to the first heat-conducting portion 401 and the second heat-conducting portion 402. Among them, the first heat-conducting portion 401 can cover the component to be heat-dissipated 201.

[0034] In this way, during the operation of the component to be heat-dissipated 201 in the first planar component 200, the heat generated on the side of the component to be heat-dissipated 201 facing the first heat-conducting portion 401 can be sequentially introduced into the second planar component 300 through the first heat-conducting portion 401, the third heat-conducting portion 403, and the second heat-conducting portion 402.

[0035] The second heat-conducting layer 500 in the terminal device 000 may include: a fourth heat-conducting portion 501 and a fifth heat-conducting portion 502 that are connected. Among them, the fourth heat-conducting portion 501 may be located on the side of the component to be heat-dissipated 201 facing away from the first heat-conducting portion 401 in the first heat-conducting layer 400, and at least a part of the fifth heat-conducting portion 502 can extend to the side close to the first heat-conducting portion 401.

[0036] It should be noted that during the operation of the component 201 to be cooled in the first planar component 200, the temperature on the side of the component 201 to be cooled away from the first heat conduction part 401 is usually higher. Since the fourth heat conduction part 501 in the second heat conduction layer 500 can be located on the side of the component 201 to be cooled away from the first heat conduction part 401, and at least part of the fifth heat conduction part 502 can extend to the side close to the first heat conduction part 401, therefore, through the combined action of the fourth heat conduction part 501 and the fifth heat conduction part 502 in the second heat conduction layer 500, the heat generated on the side of the component 201 to be cooled away from the first heat conduction part 401 during operation can be conducted to the side close to the first heat conduction part 401. In addition, the heat conducted to the side close to the first heat conduction part 401 can be successively conducted into the second planar component 300 through the first heat conduction part 401, the third heat conduction part 403, and the second heat conduction part 402.

[0037] It should be noted that in the terminal device 000, the operating temperature of the devices installed in the first planar component 200 is usually higher than that of the devices installed in the second planar component 200. For example, a main board for controlling the terminal device is installed in the first planar component 200, and a battery for supplying power to the terminal device is installed in the second planar component 200, and the operating temperature of the main board is usually higher than that of the battery. Therefore, the overall operating temperature of the first planar component 200 is higher than that of the second planar component 300. In this way, after the heat generated by the devices in the first planar component 200 is transferred to the second planar component 300 through the first heat conduction layer 400, the operating temperature of the first planar component 200 can be effectively reduced.

[0038] In summary, a terminal device provided by an embodiment of the present application includes: a rotating shaft component, a first planar component, a second planar component, a first heat conduction layer, and a second heat conduction layer. Since the fourth heat conduction part in the second heat conduction layer can be located on the side of the component to be cooled away from the first heat conduction part, and at least part of the fifth heat conduction part can extend to the side close to the first heat conduction part, therefore, through the combined action of the fourth heat conduction part and the fifth heat conduction part in the second heat conduction layer, the heat generated on the side of the component to be cooled away from the first heat conduction part during operation can be conducted to the side close to the first heat conduction part. In addition, the heat conducted to the side close to the first heat conduction part can be conducted into the second planar component through the first heat conduction layer. In this way, after the heat generated by the devices in the first planar component is transferred to the second planar component through the first heat conduction layer, the operating temperature of the first planar component can be effectively reduced, thereby improving the reliability of the terminal device.

[0039] In the embodiment of the present application, please refer to Figure 2 , Figure 2It is a schematic structural diagram of another terminal device provided by an embodiment of the present application. The fifth heat conduction part 502 in the second heat conduction layer 500 may include: a first sub-part 502a and a second sub-part 502b. Here, the second sub-part 502b in the fifth heat conduction part 502 may be arranged in parallel with the fourth heat conduction part 501 in the second heat conduction layer 500, and the second sub-part 502b may be distributed on one side close to the fourth heat conduction part 501.

[0040] Among them, the first sub-part 502a may be respectively connected to the fourth heat conduction part 501 and the second sub-part 502b. That is, one side of the first sub-part 502a may be connected to the fourth heat conduction part 501, and the other side of the first sub-part 502a may be connected to the second sub-part 502b. In this way, the second sub-part 502b and the fourth heat conduction part 501 may be connected through the first sub-part 502a.

[0041] In this case, during the operation of the component 201 to be cooled in the first planar component 200, through the cooperative action of the fourth heat conduction part 501, the first sub-part 502a, and the second sub-part 502b, the heat generated on the side of the component 201 to be cooled away from the first heat conduction part 401 during operation can be sequentially introduced to the side close to the first heat conduction part 401 through the fourth heat conduction part 501, the first sub-part 502a, and the second sub-part 502b. In addition, the heat introduced to the side close to the first heat conduction part 401 can be sequentially introduced into the second planar component 300 through the first heat conduction part 401, the third heat conduction part 403, and the second heat conduction part 402. In this way, after transferring the heat generated by the component 201 to be cooled in the first planar component 200 to the second planar component 300 through the first heat conduction layer 400, the operating temperature of the first planar component 200 can be effectively reduced.

[0042] In the present application, please refer to Figure 2 , the value range of the thickness d1 of the second heat conduction layer 500 may be: 0.05 mm to 0.2 mm.

[0043] In an embodiment of the present application, as Figure 2 shown, the first planar component 200 in the terminal device 000 further has a first functional component 202 disposed adjacent to the component 201 to be cooled. For example, the first functional component 202 may be a battery with a small volume. Among them, the first functional component 202 and the component 201 to be cooled may be arranged in the extending direction parallel to the first heat conduction part 401 in the first conductive layer 400, and the first heat conduction part 401 can also cover the first functional component 202. In a possible implementation manner, the first functional component 202 may be closer to the rotating shaft component 100 relative to the component 201 to be cooled.

[0044] The first sub-portion 502a of the fifth heat conducting part 502 may be located between the component 201 to be cooled and the first functional component 202. Here, the first sub-portion 502a may contact the component 201 to be cooled and / or the first sub-portion 502a may contact the first functional component 202.

[0045] It should be noted that during the operation of the first functional component 202 in the first planar member 200, the temperature of the side of the first functional component 202 away from the first heat conducting portion 401 is usually lower. Therefore, it is not necessary to introduce the heat generated during the operation of the side of the first functional component 202 away from the first heat conducting portion 401 to the side close to the first heat conducting portion 401.

[0046] In the embodiment of the present application, the second sub-portion 502b of the fifth heat-conducting portion 502 may be located between the first functional component 202 and the first heat-conducting portion 401, and / or, the second sub-portion 502b may be located between the component to be cooled 201 and the first heat-conducting portion 401. Therefore, the embodiment of the present application will be schematically described by taking the following three cases as examples:

[0047] The first case, such as Figure 2 As shown, the second sub-portion 502b in the fifth heat-conducting portion 502 can be located between the first functional component 202 and the first heat-conducting portion 401. In this case, during the operation of the component 201 to be cooled in the first planar component 200, the heat generated by the side of the component 201 to be cooled away from the first heat-conducting portion 401 during the operation can be introduced into the area between the first functional component 202 and the first heat-conducting portion 401 through the cooperation of the fourth heat-conducting portion 501, the first sub-portion 502a and the second sub-portion 502b. Since the temperature of the area between the first functional component 202 and the first heat-conducting portion 401 is usually low, the area between the first functional component 202 and the first heat-conducting portion 401 can dissipate the heat.

[0048] In addition, the heat introduced into the area between the first functional component 202 and the first heat-conducting portion 401 can be introduced into the second planar component 300 through the first heat-conducting portion 401, the third heat-conducting portion 403 and the second heat-conducting portion 402 in sequence. In this way, after the heat generated by the component to be cooled 201 in the first planar component 200 is transferred to the second planar component 300 through the first heat-conducting layer 400, the operating temperature of the first planar component 200 can be effectively reduced.

[0049] For the second case, please refer to Figure 3 , Figure 3It is a schematic structural diagram of another terminal device provided by an embodiment of the present application. The second sub - part 502b can be located between the component to be cooled 201 and the first heat - conducting part 401. Among them, the second sub - part 502b can be in contact with the side of the component to be cooled 201 facing the first heat - conducting part 401.

[0050] In this case, during the operation of the component to be cooled 201 in the first planar component 200, through the cooperative action of the fourth heat - conducting part 501, the first sub - part 502a, and the second sub - part 502b, the heat generated on the side of the component to be cooled 201 facing away from the first heat - conducting part 401 during operation can be introduced into the area between the component to be cooled 201 and the first heat - conducting part 401. Since the temperature of the area between the component to be cooled 201 and the first heat - conducting part 401 is usually lower. Therefore, the area between the component to be cooled 201 and the first heat - conducting part 401 can dissipate these heats.

[0051] In addition, the heat introduced into the area between the component to be cooled 201 and the first heat - conducting part 401 can be successively introduced into the second planar component 300 through the first heat - conducting part 401, the third heat - conducting part 403, and the second heat - conducting part 402. In this way, after the heat generated by the component to be cooled 201 in the first planar component 200 is transferred to the second planar component 300 through the first heat - conducting layer 400, the working temperature of the first planar component 200 can be effectively reduced.

[0052] For the third case, please refer to Figure 4 , Figure 4 It is a schematic structural diagram of yet another terminal device provided by an embodiment of the present application. The second sub - part 502b in the fifth heat - conducting part 502 can be located between the first functional component 202 and the first heat - conducting part 401, and the second sub - part 502b can be located between the component to be cooled 201 and the first heat - conducting part 401.

[0053] In this case, during the operation of the component to be cooled 201 in the first planar component 200, through the cooperative action of the fourth heat - conducting part 501, the first sub - part 502a, and the second sub - part 502b, not only can the heat generated on the side of the component to be cooled 201 facing away from the first heat - conducting part 401 during operation be introduced into the area between the component to be cooled 201 and the first heat - conducting part 401, but also the heat generated on the side of the component to be cooled 201 facing away from the first heat - conducting part 401 during operation can be introduced into the area between the first functional component 202 and the first heat - conducting part 401. Therefore, not only can the area between the component to be cooled 201 and the first heat - conducting part 401 dissipate these heats, but also the area between the first functional component 202 and the first heat - conducting part 401 can dissipate these heats.

[0054] In addition, the heat introduced into the area between the first functional component 202 and the first heat conducting part 401 and the heat introduced into the area between the component 201 to be cooled and the first heat conducting part 401 can be sequentially introduced into the second planar component 300 through the first heat conducting part 401, the third heat conducting part 403, and the second heat conducting part 402. In this way, after the heat generated by the component 201 to be cooled in the first planar component 200 is transferred to the second planar component 300 through the first heat conducting layer 400, the operating temperature of the first planar component 200 can be effectively reduced.

[0055] In the embodiment of the present application, the fourth heat conducting part 501 in the second heat conducting layer 500 can be in contact with the side of the component 201 to be cooled facing away from the first heat conducting part 401, and / or, the second sub-part 502b in the fifth heat conducting part 502 can be in contact with the first heat conducting part 401.

[0056] In the embodiment of the present application, the thermal conductivity of the second heat conducting layer 500 can be greater than the thermal conductivity of the first heat conducting layer 400.

[0057] It should be noted that the first heat conducting layer 400 can be distributed not only in the first planar component 200 and the second planar component 300, but also in the rotating shaft component 100. Since the terminal device 000 needs to switch between the unfolded state and the folded state, when selecting the material for preparing the first heat conducting layer 400, the anti-bending performance and electrical conductivity of the material need to be comprehensively considered.

[0058] The second heat conducting layer 500 in the terminal device 000 can be distributed only in the first planar part 200. When the terminal device 000 switches between the unfolded state and the folded state, it will not affect the distribution of the second heat conducting layer 500 in the terminal device 000. Therefore, when selecting the material for preparing the second heat conducting layer 500, the anti-bending performance of the material does not need to be considered, and a material with a higher thermal conductivity can be selected for preparation.

[0059] In the present application, as Figure 4 shown, the terminal device 000 may further include: a third heat conducting layer 600, a fourth heat conducting layer 700, and a fifth heat conducting layer 800.

[0060] The third heat conducting layer 600 in the terminal device 000 can be located on the side of the first heat conducting layer 400 facing away from the first planar component 200, the rotating shaft component 100, and the second planar component 300, and can cover the first planar component 200 and the second planar component 300. Here, through the third heat conducting layer 600, the heat generated by the first planar component 200 during operation can be better introduced into the second planar component 300.

[0061] The fourth heat-conducting layer 700 in the terminal device 000 can be located on the side of the first planar component 200 facing away from the first heat-conducting portion 401 in the first heat-conducting layer 400, and the fourth heat-conducting layer 700 can cover the first planar component 200. Here, through the fourth heat-conducting layer 700, the heat generated on the side of the first planar component 200 facing away from the first heat-conducting portion 401 during operation can be dissipated.

[0062] The fifth heat-conducting layer 800 in the terminal device 000 can be located on the side of the second planar component 300 facing away from the second heat-conducting portion 402 in the first heat-conducting layer 400, and the fifth heat-conducting layer 800 can cover the second planar component 300. Here, through the fifth heat-conducting layer 800, the heat generated on the side of the second planar component 300 facing away from the second heat-conducting portion 402 during operation can be dissipated.

[0063] In the embodiment of the present application, as Figure 4 shown, the second planar component 300 can have a second functional component 301. For example, the second functional component 301 can be a relatively large battery.

[0064] In the embodiment of the present application, please refer to Figure 5 , Figure 5 which is a schematic structural diagram of a terminal device provided in another embodiment of the present application. The terminal device 000 may further include: a first display screen 900, a second display screen 1000, and a protection cover plate 1100.

[0065] The first display screen 900 in the terminal device 000 can be located on the side of the third heat-conducting layer 600 facing away from the first heat-conducting layer 400. Here, when the terminal device 000 is a folding mobile phone, the first display screen 900 can be a foldable display screen, which can be used as the main display screen of the terminal device 000.

[0066] The second display screen 1000 in the terminal device 000 can be located on the side of the fourth heat-conducting layer 700 facing away from the first heat-conducting layer 400. Here, when the terminal device 000 is a folding mobile phone, the second display screen 1000 can be a non-foldable display screen, which can be used as the secondary display screen of the terminal device 000.

[0067] The protection cover plate 1100 in the terminal device 000 can be located on the side of the fifth heat-conducting layer 800 facing away from the first heat-conducting layer 400. Here, through the protection cover plate 1100, the second planar component 300 in the terminal device 000 can be protected.

[0068] In summary, a terminal device provided by an embodiment of the present application includes: a rotating shaft component, a first planar component, a second planar component, a first heat conduction layer, and a second heat conduction layer. Since the fourth heat conduction portion in the second heat conduction layer can be located on the side of the component to be cooled away from the first heat conduction portion, and at least part of the fifth heat conduction portion can extend to the side close to the first heat conduction portion, therefore, through the cooperation of the fourth heat conduction portion and the fifth heat conduction portion in the second heat conduction layer, the heat generated on the side of the component to be cooled away from the first heat conduction portion during operation can be introduced to the side close to the first heat conduction portion. In addition, the heat introduced to the side close to the first heat conduction portion can be introduced into the second planar component through the first heat conduction layer. In this way, after the heat generated by the devices in the first planar component is transferred to the second planar component through the first heat conduction layer, the working temperature of the first planar component can be effectively reduced, thereby improving the reliability of the terminal device.

[0069] In the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless otherwise clearly defined.

[0070] The above are only optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A terminal device, characterized in that, include: A rotating shaft component (100), a first plane component (200), a second plane component (300), a first heat-conducting layer (400) and a second heat-conducting layer (500); The rotating shaft component (100) is located between the first plane component (200) and the second plane component (300), and the first plane component (200) and the second plane component (300) are both rotatably connected to the rotating shaft component (100), and the first plane component (200) has a component to be cooled (201); The first heat-conducting layer (400) comprises: a first heat-conducting portion (401) distributed in the first plane component (200), a second heat-conducting portion (402) distributed in the second plane component (300), and a third heat-conducting portion (403) distributed in the rotating shaft component (100), wherein the third heat-conducting portion (403) is respectively connected to the first heat-conducting portion (401) and the second heat-conducting portion (402), and the first heat-conducting portion (401) can cover the component to be cooled (201); The second heat-conducting layer (500) comprises: a fourth heat-conducting portion (501) and a fifth heat-conducting portion (502) connected to each other, the fourth heat-conducting portion (501) being located on a side of the heat-dissipating component (201) facing away from the first heat-conducting portion (401), and at least a portion of the fifth heat-conducting portion (502) being able to extend to a side close to the first heat-conducting portion (401).

2. The terminal device according to claim 1, wherein The fifth heat conducting portion (502) comprises: a first sub-portion (502a) and a second sub-portion (502b), wherein the second sub-portion (502b) is arranged in parallel with the fourth heat conducting portion (501), and the second sub-portion (502b) is distributed on a side close to the first heat conducting portion (401), and the first sub-portion (502a) is connected to the fourth heat conducting portion (501) and the second sub-portion (502b) respectively.

3. The terminal device according to claim 2, wherein The first planar component (200) further comprises a first functional component (202) arranged adjacent to the component to be cooled (201), the first functional component (202) and the component to be cooled (201) being arranged in a direction parallel to the extension direction of the first heat conducting portion (401), and the first heat conducting portion (401) can also cover the first functional component (202); Wherein, the first sub-portion (502a) is located between the component to be cooled (201) and the first functional component (202).

4. The terminal device according to claim 3, wherein The second sub-portion (502b) is located between the first functional component (202) and the first heat conducting portion (401).

5. The terminal device according to claim 3, characterized in that The second sub-portion (502b) is located between the component to be cooled (201) and the first heat-conducting portion (401).

6. The terminal device according to claim 5, wherein The second sub-portion (502b) contacts a side of the component to be cooled (201) that faces the first heat conducting portion (401).

7. The terminal device according to claim 3, wherein The first sub-portion (502a) is in contact with the component to be cooled (201), and / or the first sub-portion (502a) is in contact with the first functional component (202).

8. The terminal device according to any one of claims 2 to 7, characterized in that, The fourth heat-conducting part (501) contacts the side of the component to be cooled (201) facing away from the first heat-conducting part (401), and / or the second sub-part (502b) contacts the first heat-conducting part (401).

9. The terminal device according to any one of claims 1 to 7, characterized in that, The heat conductivity coefficient of the second heat-conducting layer (500) is greater than that of the first heat-conducting layer (400).

10. The terminal device according to any one of claims 1 to 7, characterized in that The thickness of the second heat-conducting layer (500) ranges from 0.05 mm to 0.2 mm.

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