Electronic device

Abstract

The utility model discloses electronic equipment. The electronic equipment comprises a circuit board group; the battery comprises a battery cell; the protection plate is positioned on one side of the battery cell; a part of the protection circuit is arranged on the protection plate, the protection circuit is electrically connected with the battery cell, and the part, located outside the protection plate, of the protection circuit comprises at least one integrated chip; the protection circuit and the circuit board group are electrically connected with the flexible circuit board; when the number of the integrated chip is one, the integrated chip is arranged on the flexible circuit board or the circuit board group; when the number of the integrated chips is multiple, the multiple integrated chips are arranged on at least one of the flexible circuit board and the circuit board group.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to an electronic device. Background Art

[0002] There are two parameters related to the capacity of a mobile phone battery. One is the energy density of the battery cell, and the other is the volume of the cell.

[0003] Currently, the improvement of the energy density of lithium cobalt oxide and graphite batteries used in mobile phones has entered a plateau, and the improvement of the energy density of the battery cells is relatively limited. At the same time, the installation space reserved for the battery inside the mobile phone is also limited. In this way, the "durability" of the battery has become a pain point in the entire industry. Utility Model Content

[0004] The purpose of the embodiments of this application is to provide an electronic device that can effectively solve or improve the technical problem of the "durability" of the battery of the electronic device.

[0005] The embodiments of this application provide an electronic device, including: a circuit board group; a battery, the battery including: a battery cell; a protection board located on one side of the battery cell; a protection circuit, a part of the protection circuit is provided on the protection board, the protection circuit is electrically connected to the battery cell, and the part of the protection circuit located outside the protection board includes at least one integrated chip; a flexible circuit board, both the protection circuit and the circuit board group are electrically connected to the flexible circuit board; when the number of integrated chips is one, the integrated chip is provided on the flexible circuit board or the circuit board group; when the number of integrated chips is multiple, multiple integrated chips are provided on at least one of the flexible circuit board and the circuit board group.

[0006] In the embodiments of this application, the electronic device includes a circuit board group and a battery. The battery includes a battery cell, a protection board, a protection circuit, and a flexible circuit board. The battery cell is electrically connected to the protection circuit, the flexible circuit board is electrically connected to the protection circuit, and the flexible circuit is electrically connected to the circuit board group. That is, the battery cell is electrically connected to the circuit board group through the protection circuit and the flexible circuit board.

[0007] A part of the protection circuit is provided on the protection board, and the part of the protection circuit located outside the protection board includes at least one integrated chip. That is, another part of the protection circuit is not provided on the protection board, and the part of the protection circuit not provided on the protection board includes at least one integrated chip.

[0008] Among them, when the number of integrated chips is one, the integrated chip is provided on the flexible circuit board or the circuit board group. That is, when the number of integrated chips is one, the integrated chip is provided on the flexible circuit board, or the integrated chip is provided on the circuit board group.

[0009] Among them, when the number of integrated chips is multiple, the multiple integrated chips are disposed on at least one of the flexible circuit board and the circuit board group. That is, when the number of integrated chips is multiple, all the multiple integrated chips are disposed on the flexible circuit board, or all the multiple integrated chips are disposed on the circuit board group, or a part of the multiple integrated chips is disposed on the flexible circuit board and another part of the multiple integrated chips is disposed on the circuit board group.

[0010] That is to say, at least one of the flexible circuit board and the circuit board group serves as the mounting carrier for the integrated chips of the protection circuit and has the function of mounting and fixing at least one integrated chip. In other words, the position of the device that affects the battery length stacking dimension (such as the integrated chip) is adjusted. That is, the position of the larger-sized integrated chip in the protection circuit is adjusted so that at least one integrated chip is not on the main charging circuit of the protection circuit, and at least one integrated chip is placed on at least one of the flexible circuit board and the circuit board group. In this way, without changing the external dimensions of the battery, the overall matching dimension of the protection board and the protection circuit can be reduced, a larger mounting space can be released for the battery cell, the size of the battery cell can be increased accordingly, and the effective capacity space of the battery can be effectively improved.

[0011] In addition, at least one integrated chip is disposed on at least one of the flexible circuit board and the circuit board group. That is, the integrated chip is not on the main charging circuit of the protection circuit, so the influence on the impedance is relatively small. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 FIG. shows a schematic diagram of a first part of the structure of the battery provided by the first embodiment of the present application;

[0013] Figure 2 FIG. shows a schematic diagram of a second part of the structure of the battery provided by the first embodiment of the present application;

[0014] Figure 3 FIG. shows a schematic diagram of the structure of the protection circuit provided by the first embodiment of the present application;

[0015] Figure 4 FIG. shows a schematic diagram of the structure of the protection board and the protection circuit provided by the first embodiment of the present application;

[0016] Figure 5 FIG. shows a partial schematic diagram of the structure of the battery provided by the second embodiment of the present application;

[0017] Figure 6 FIG. shows a partial schematic diagram of the structure of the electronic device provided by the first embodiment of the present application;

[0018] Figure 7 FIG. shows a partial schematic diagram of the structure of the battery provided by the third embodiment of the present application;

[0019] Figure 8 It shows a partial structural schematic diagram of the electronic device provided by the second embodiment of the present application;

[0020] Figure 9 It shows a partial structural schematic diagram of the electronic device provided by the third embodiment of the present application;

[0021] Figure 10 It shows a structural schematic diagram of the protection circuit provided by the second embodiment of the present application;

[0022] Figure 11 It shows a first partial structural schematic diagram of the electronic device provided by the fourth embodiment of the present application;

[0023] Figure 12 It shows a second partial structural schematic diagram of the electronic device provided by the fourth embodiment of the present application.

[0024] Wherein, Figures 1 to 12 The corresponding relationship between the reference numerals and the component names is as follows:

[0025] 10 Electronic device, 100 Circuit board group, 110 Avoidance space, 120 Main board, 130 Sub-board, 200 Battery, 210 Battery cell, 220 Protection board, 230 Protection circuit, 232 Integrated chip, 234 Transistor, 236 Sampling resistor, 238 Nickel sheet, 240 Flexible circuit board, 242 Flexible sub-board, 250 Edge seal, 252 Groove. Detailed implementation manners

[0026] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0027] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such terms can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually of the same type, and the number of objects is not limited. For example, the first object can be one or multiple. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0028] Next, in conjunction with the attached Figures 1 to 12 The electronic device 10 provided by the embodiment of the present application.

[0029] As Figure 1 , Figure 2 , Figure 5 , Figure 7 , Figure 8 , Figure 9 , Figure 11 and Figure 12 As shown, in some embodiments of the present application, an electronic device 10 is provided, including: a circuit board group 100; a battery 200, the battery 200 including: a battery cell 210; a protection board 220 located on one side of the battery cell 210; a protection circuit 230, a part of the protection circuit 230 is provided on the protection board 220, the protection circuit 230 is electrically connected to the battery cell 210, and the part of the protection circuit 230 located outside the protection board 220 includes at least one integrated chip 232; a flexible circuit board 240, both the protection circuit 230 and the circuit board group 100 are electrically connected to the flexible circuit board 240; when the number of integrated chips 232 is one, the integrated chip 232 is provided on the flexible circuit board 240 or the circuit board group 100; when the number of integrated chips 232 is multiple, multiple integrated chips 232 are provided on at least one of the flexible circuit board 240 and the circuit board group 100.

[0030] In the embodiments of the present application, the electronic device 10 includes a circuit board group 100 and a battery 200. The battery 200 includes a battery cell 210, a protection board 220, a protection circuit 230, and a flexible circuit board 240. The battery cell 210 is electrically connected to the protection circuit 230, the flexible circuit board 240 is electrically connected to the protection circuit 230, and the flexible circuit is electrically connected to the circuit board group 100. That is, the battery cell 210 is electrically connected to the circuit board group 100 through the protection circuit 230 and the flexible circuit board 240.

[0031] A part of the protection circuit 230 is provided on the protection board 220, and the part of the protection circuit 230 located outside the protection board 220 includes at least one integrated chip 232. That is, another part of the protection circuit 230 is not provided on the protection board 220, and the part of the protection circuit 230 not provided on the protection board 220 includes at least one integrated chip 232.

[0032] Wherein, when the number of integrated chips 232 is one, the integrated chip 232 is provided on the flexible circuit board 240 or the circuit board group 100. That is, when the number of integrated chips 232 is one, the integrated chip 232 is provided on the flexible circuit board 240, or the integrated chip 232 is provided on the circuit board group 100.

[0033] Among them, when the number of integrated chips 232 is multiple, the multiple integrated chips 232 are disposed on at least one of the flexible circuit board 240 and the circuit board group 100. That is to say, when the number of integrated chips 232 is multiple, the multiple integrated chips 232 are all disposed on the flexible circuit board 240, or the multiple integrated chips 232 are all disposed on the circuit board group 100, or a part of the multiple integrated chips 232 are disposed on the flexible circuit board 240 and another part of the multiple integrated chips 232 are disposed on the circuit board group 100.

[0034] That is to say, at least one of the flexible circuit board 240 and the circuit board group 100 serves as an installation carrier for the integrated chips 232 of the protection circuit 230, and has the function of installing and fixing at least one integrated chip 232. In other words, the position of the device that affects the length stacking dimension of the battery 200 (such as the integrated chip 232) is adjusted, that is, the position of the larger-sized integrated chip 232 in the protection circuit 230 is adjusted, so that at least one integrated chip 232 is not on the main charging circuit of the protection circuit 230, but at least one integrated chip 232 is placed on at least one of the flexible circuit board 240 and the circuit board group 100. In this way, without changing the external dimensions of the battery 200, the overall matching dimension of the protection board 220 and the protection circuit 230 can be reduced, releasing more installation space for the battery cell 210, so that the size of the battery cell 210 can be increased accordingly, and the effective capacity space of the battery 200 can be effectively improved.

[0035] In addition, at least one integrated chip 232 is disposed on at least one of the flexible circuit board 240 and the circuit board group 100, that is, the integrated chip 232 is not on the main charging circuit of the protection circuit 230, so that the influence on the impedance is small.

[0036] It can be understood that because the protection board 220 is placed vertically, the dimension of the integrated chip 232 in the Y direction is higher than that of other devices, occupying more length space of the battery 200. If the integrated chip 232 is removed, the corresponding extra occupied space can be used for lengthening the battery cell 210.

[0037] Optionally, in the related art, the protection circuit is all disposed on the protection board, and the protection board needs to be double-sidedly arranged. In the present application, at least one integrated chip 232 is disposed on at least one of the flexible circuit board 240 and the circuit board group 100. Therefore, the protection board 220 can be single-sidedly arranged, so that the matching dimension of the protection circuit 230 and the protection board 220 can be further reduced, providing more installation space for the battery cell 210.

[0038] Optionally, the protection board 220 of the present application can be double-sidedly arranged. Compared with the related art where the integrated chip of the protection circuit is placed on the protection board, this setting can reduce the matching size of the protection circuit 230 and the protection board 220, providing a larger installation space for the battery cell 210.

[0039] Among them, as Figure 3 shown, the three integrated chips 232 placed on the flexible circuit board 240 ( Figure 3 the three integrated chips 232 in the dashed box in

[0040] are not in the main circuit of the protection circuit 230, having a relatively small impact on the impedance. The devices outside the dashed box are placed on the protection board 220. Figure 4

[0040]

[0041] As Figure 5 shown, after moving at least one integrated chip 232 of the protection circuit 230 away from the protection board 220 (the capacitors, resistors and other devices around the integrated chip 232 can be moved away together with the integrated chip 232 or not), the protection board 220 can cancel the double-sided arrangement and be adjusted to a single-sided arrangement. The device height of the transistor 234 of the protection circuit 230 is about 0.1 mm. The transistor 234 avoids the placement position of the nickel sheet 238, and the height of the transistor 234 is lower than that of the nickel sheet 238. After adjusting the placement position of the integrated chip 232, 1 mm of size can be released to the battery cell 210 to increase the length. Figure 5 The dashed line in

[0042] Optionally, the electronic device 10 can be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also known as an AR (Augmented Reality) device), a virtual reality device (also known as a VR (Virtual Reality) device), and a handheld game console, etc.

[0043] In some embodiments, as Figure 1 , Figure 2 , Figure 5 , Figure 7 , Figure 8 , Figure 9 , Figure 11 and Figure 12 shown, the flexible circuit board 240 includes a plurality of flexible sub-boards 242, and each flexible sub-board 242 is electrically connected to the protection circuit 230 and the circuit board group 100.

[0044] In the embodiments of the present application, the structure of the flexible circuit board 240 is further defined.

[0045] Specifically, the flexible circuit board 240 includes a plurality of flexible sub-boards 242, and any one of the plurality of flexible sub-boards 242 is electrically connected to the protection circuit 230 and the circuit board group 100.

[0046] Among them, the number of the flexible sub-boards 242 can be set according to the specific actual requirements of the electronic device 10. For example, the number of the flexible sub-boards 242 includes two, three, four, etc., which are not listed one by one here.

[0047] In some other embodiments, the number of the flexible sub-boards 242 is one.

[0048] In some embodiments, as Figure 7 shown, when a plurality of integrated chips 232 are provided on the flexible circuit board 240, the plurality of integrated chips 232 are located on the same flexible sub-board 242.

[0049] In this embodiment, the mating structure of the plurality of integrated chips 232 and the flexible circuit board 240 is further defined.

[0050] Specifically, when the number of the integrated chips 232 is multiple and the plurality of integrated chips 232 are provided on the flexible circuit board 240, the plurality of integrated chips 232 are located on the same flexible sub-board 242. That is to say, the flexible circuit board 240 includes a plurality of flexible sub-boards 242, and a plurality of integrated chips 232 are provided on one of the plurality of flexible sub-boards 242, and no integrated chips 232 are provided on the remaining flexible sub-boards 242.

[0051] In some embodiments, as Figure 1 and Figure 5 shown, when a plurality of integrated chips 232 are provided on the flexible circuit board 240, at least one integrated chip 232 is provided on each flexible sub-board 242.

[0052] In this embodiment, the mating structure of the plurality of integrated chips 232 and the flexible circuit board 240 is further defined.

[0053] Specifically, when the number of the integrated chips 232 is multiple and the plurality of integrated chips 232 are provided on the flexible circuit board 240, at least one integrated chip 232 is provided on any one of the plurality of flexible sub-boards 242. That is, at least one integrated chip 232 is provided on each flexible sub-board 242.

[0054] In some embodiments, as Figure 6As shown, when the integrated chip 232 is disposed on the flexible circuit board 240, the circuit board group 100 is provided with an avoidance space 110, and the integrated chip 232 is located at the avoidance space 110.

[0055] In this embodiment, the mating structure of the integrated chip 232, the flexible circuit board 240, and the circuit board group 100 is further defined.

[0056] Specifically, when the integrated chip 232 is disposed on the flexible circuit board 240, the circuit board group 100 is provided with an avoidance space 110, and the integrated chip 232 is located at the avoidance space 110. That is to say, the avoidance space 110 is used to accommodate the integrated chip 232, so as to increase the capacity of the battery 200 while avoiding interference between the integrated chip 232 and the circuit board group 100.

[0057] It can be understood that after the integrated chip 232 is disposed on the flexible circuit board 240 and the battery 200 is snapped into the electronic device 10, the part of the circuit board group 100 opposite to the integrated chip 232 on the flexible circuit board 240 is provided with an avoidance space 110. The avoidance space 110 provides space for the integrated chip 232 in the Z direction (i.e., the thickness direction of the electronic device 10) of the electronic device 10, so that the integrated chip 232 can be inserted into the avoidance space 110. Wherein, the Z direction is perpendicular to the X direction and the Z direction is perpendicular to the Y direction.

[0058] In some embodiments, as Figure 8 、 Figure 9 and Figure 11 shown, the circuit board group 100 includes a main board 120 and a sub-board 130; when a plurality of integrated chips 232 are disposed on the circuit board group 100, all of the plurality of integrated chips 232 are disposed on the main board 120, or a plurality of integrated chips 232 are disposed on the sub-board 130, or a part of the plurality of integrated chips 232 are disposed on the main board 120 and another part of the plurality of integrated chips 232 are disposed on the sub-board 130.

[0059] In this embodiment, the mating structure of the plurality of integrated chips 232 and the circuit board group 100 is further defined.

[0060] The circuit board group 100 includes a main board 120 and a sub-board 130.

[0061] When a plurality of integrated chips 232 are disposed on the circuit board group 100, all of the plurality of integrated chips 232 are disposed on the main board 120.

[0062] Or, when a plurality of integrated chips 232 are disposed on the circuit board group 100, all of the plurality of integrated chips 232 are disposed on the sub-board 130.

[0063] Alternatively, when multiple integrated chips 232 are provided on the circuit board group 100, a part of the multiple integrated chips 232 is provided on the main board 120, and another part of the multiple integrated chips 232 is provided on the auxiliary board 130.

[0064] That is to say, the structure of the circuit board group 100 is reasonably utilized, making the circuit board group 100 serve as the installation carrier for the multiple integrated chips 232. Through the wiring connection between the flexible circuit board 240 of the battery 200 and the circuit board group 100, a charging / discharging and protection circuit is formed.

[0065] Among them, Figure 8 a plurality of the integrated chips 232 are provided on the main board 120.

[0066] Among them, Figure 9 a plurality of the integrated chips 232 are provided on the auxiliary board 130.

[0067] Among them, Figure 11 a plurality of the integrated chips 232 are provided on the main board 120.

[0068] Figure 8 、 Figure 9 、 Figure 11 and Figure 12 the dotted lines in indicate the current flow paths.

[0069] In some embodiments, the circuit board group 100 includes a main board 120 and an auxiliary board 130; when multiple integrated chips 232 are provided on the flexible circuit board 240 and the circuit board group 100, a part of the multiple integrated chips 232 is provided on the flexible circuit board 240, and another part of the multiple integrated chips 232 is provided on the main board 120 or the auxiliary board 130.

[0070] In this embodiment, the cooperation structure of the multiple integrated chips 232, the flexible circuit board 240, and the circuit board group 100 is further defined.

[0071] When multiple integrated chips 232 are provided on the flexible circuit board 240 and the circuit board group 100, a part of the multiple integrated chips 232 is provided on the flexible circuit board 240, and another part of the multiple integrated chips 232 is provided on the main board 120 or the auxiliary board 130. That is, when multiple integrated chips 232 are provided on the flexible circuit board 240 and the circuit board group 100, a part of the multiple integrated chips 232 is provided on the flexible circuit board 240, and another part of the multiple integrated chips 232 is provided on the main board 120. Or, when multiple integrated chips 232 are provided on the flexible circuit board 240 and the circuit board group 100, a part of the multiple integrated chips 232 is provided on the flexible circuit board 240, and another part of the multiple integrated chips 232 is provided on the auxiliary board 130.

[0072] That is to say, the structures of the flexible circuit board 240 and the circuit board group 100 are reasonably utilized, such that the flexible circuit board 240 and the circuit board group 100 serve as the mounting carriers for the multiple integrated chips 232. Through the routing connections of the flexible circuit board 240 and the circuit board group 100 of the battery 200, a charging / discharging and protection circuit is formed.

[0073] In some embodiments, the circuit board group 100 includes a main board 120 and an auxiliary board 130; when multiple integrated chips 232 are provided on the flexible circuit board 240 and the circuit board group 100, any one of the flexible circuit board 240, the main board 120, and the auxiliary board 130 is provided with at least one integrated chip 232.

[0074] In this embodiment, the cooperation structure of the multiple integrated chips 232, the flexible circuit board 240, and the circuit board group 100 is further defined.

[0075] When multiple integrated chips 232 are provided on the flexible circuit board 240 and the circuit board group 100, any one of the flexible circuit board 240, the main board 120, and the auxiliary board 130 is provided with at least one integrated chip 232. That is, the flexible circuit board 240 is provided with at least one integrated chip 232, the main board 120 is provided with at least one integrated chip 232, and the auxiliary board 130 is provided with at least one integrated chip 232.

[0076] That is to say, the structures of the flexible circuit board 240 and the circuit board group 100 are reasonably utilized, such that the flexible circuit board 240 and the circuit board group 100 serve as the mounting carriers for the multiple integrated chips 232. Through the routing connections of the flexible circuit board 240 and the circuit board group 100 of the battery 200, a charging / discharging and protection circuit is formed.

[0077] In some embodiments, such as Figure 1 , Figure 5 , Figure 7 , Figure 8 ,Figure 9 , Figure 11 and Figure 12 As shown in Figure 12 , the battery 200 further includes a sealing edge 250, which is connected to one side of the battery cell 210. The sealing edge 250 is provided with a groove 252, and the protection board 220 is arranged in the groove 252.

[0078] In this embodiment, the structure of the battery 200 is further defined such that the battery 200 further includes a sealing edge 250, which is connected to one side of the battery cell 210. The sealing edge 250 is provided with a groove 252, and the protection board 220 is arranged in the groove 252. In this way, it is beneficial to reduce the matching size of the sealing edge 250 and the protection board 220, and a larger installation space can be released for the battery cell 210, so that the size of the battery cell 210 can be increased accordingly, and the effective capacity space of the battery 200 can be effectively improved.

[0079] It can be understood that the protection circuit 230 on the protection board 220 is electrically connected to the battery cell 210, and the protection board 220 functions to protect the battery cell 210. When the battery 200 is working, if the current and / or voltage applied to the battery cell 210 exceed the preset range, the protection circuit 230 of the protection board 220 will be triggered to protect the battery cell 210.

[0080] In some embodiments, as Figure 3 and Figure 10 shown, the number of battery cells 210 is multiple, and the multiple battery cells 210 are located on the same side of the protection board 220.

[0081] In this embodiment, the number and arrangement position of the battery cells 210 are further defined.

[0082] Specifically, the number of battery cells 210 is multiple, and the multiple battery cells 210 are located on the same side of the protection board 220.

[0083] In some embodiments, as Figure 3 and Figure 10 shown, the protection circuit 230 arranged on the protection board 220 includes at least one transistor 234 and at least one sampling resistor 236.

[0084] In this embodiment, the matching structure of the protection circuit 230 and the protection board 220 is further defined.

[0085] Among them, the protection circuit 230 arranged on the protection board 220 includes at least one transistor 234 and at least one sampling resistor 236.

[0086] Optionally, in the present application, the position of the device (such as the integrated chip 232) that affects the length stacking size is adjusted, and it is ensured that the adjusted device (such as the integrated chip 232) is not in the main charging circuit, and the adjustment will not cause an obvious deterioration effect on the impedance.

[0087] Optionally, as shown in Figure 1 , Figure 2 , Figure 5 and Figure 7 , a part of the protection circuit 230 is disposed on the protection board 220, and the placement positions of the devices affecting the length stacking (such as the integrated chip 232, so that the integrated chip 232 is not in the main charging circuit) are adjusted to avoid the length direction of the battery cell 210.

[0088] Optionally, as shown in Figure 8 , Figure 9 , Figure 11 and Figure 12 , devices such as the transistor 234 and the capacitors and resistors around the transistor 234 are placed on the protection board 220, and the normal setting of the transistor 234 is in the off state to meet the single-cell protection requirements. The integrated chip 232 and the capacitors and resistors around the integrated chip 232 are placed on the main board 120 or the secondary board 130 of the whole machine. The double-sided component layout of the protection board 220 in the present application is cancelled and adjusted to a single-sided component layout.

[0089] The corresponding integrated chip 232 is placed on the main board 120 or the secondary board 130, and is connected by routing with the flexible circuit board 240 of the battery 200 to form a charging / discharging and protection circuit.

[0090] As shown in Figure 10 , the devices in the dashed box are placed on the main board 120 or the secondary board 130, and the devices outside the dashed box are placed on the protection board 220. The integrated chip 232 placed on the main board 120 or the secondary board 130 is connected to the connector of the battery 200 by routing, and is connected to the protection circuit 230 on the protection board 220 through the pads of the flexible circuit board 240 to perform routing connection of the transistor 234 and the sampling resistor 236. The route is relatively long, but since the integrated chip 232 is not in the charging circuit, it will not cause a deteriorating effect on the impedance.

[0091] In the present application, the protection circuit 230 is split, and the integrated chip 232 affecting the length stacking is moved from the protection board 220 to the circuit board group 100 or the flexible circuit board 240 of the battery 200, releasing the length dimension to the battery cell 210 and increasing the effective capacity space.

[0092] The transistor 234 of the protection circuit 230 is placed on the protection board 220, and the integrated chip 232 of the protection circuit 230 is placed on the circuit board group 100 or the flexible circuit board 240 of the battery 200, both of which can play a protection function for the battery 200, and have a positive improvement for the storage, transportation, assembly and various safety regulations certifications of the battery 200 single cell.

[0093] Optionally, the number of the integrated chips 232 is one.

[0094] Optionally, the number of integrated chips 232 of the protection circuit 230 is multiple. For example, the number of integrated chips 232 is four, with two integrated chips 232 placed on the main board 120 and two integrated chips 232 placed on the secondary board 130. For example, the number of integrated chips 232 is three, with one integrated chip 232 placed on the flexible circuit board 240 of the battery 200 and two integrated chips 232 placed on the main board 120. For example, the number of integrated chips 232 is three, with one integrated chip 232 placed on the flexible circuit board 240 of the battery 200 and two integrated chips 232 placed on the secondary board 130.

[0095] In the description of this specification, the descriptions with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0096] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, Comprising: A set of circuit boards; A battery, the battery comprising: A battery cell; A protection board located on one side of the battery cell; A protection circuit, a part of the protection circuit is disposed on the protection board, the protection circuit is electrically connected to the battery cell, and a part of the protection circuit located outside the protection board includes at least one integrated chip; A flexible circuit board, both the protection circuit and the set of circuit boards are electrically connected to the flexible circuit board; When the number of the integrated chips is one, the integrated chip is disposed on the flexible circuit board or the set of circuit boards; When the number of the integrated chips is multiple, multiple integrated chips are disposed on at least one of the flexible circuit board and the set of circuit boards.

2. The electronic device according to claim 1, wherein The flexible circuit board includes a plurality of flexible sub-boards, and each flexible sub-board is electrically connected to the protection circuit and the set of circuit boards.

3. The electronic device according to claim 2, wherein When multiple integrated chips are disposed on the flexible circuit board, the multiple integrated chips are located on the same flexible sub-board.

4. The electronic device according to claim 2, wherein When multiple integrated chips are disposed on the flexible circuit board, at least one integrated chip is disposed on each flexible sub-board.

5. The electronic device according to claim 1, wherein When the integrated chip is disposed on the flexible circuit board, the set of circuit boards is provided with an avoidance space, and the integrated chip is located at the avoidance space.

6. The electronic device according to claim 1, wherein The set of circuit boards includes a main board and a secondary board; When multiple integrated chips are disposed on the set of circuit boards, multiple integrated chips are all disposed on the main board, or multiple integrated chips are disposed on the secondary board, or a part of the multiple integrated chips are disposed on the main board and another part of the multiple integrated chips are disposed on the secondary board.

7. The electronic device according to claim 1, wherein The set of circuit boards includes a main board and a secondary board; When multiple integrated chips are disposed on the flexible circuit board and the set of circuit boards, a part of the multiple integrated chips are disposed on the flexible circuit board, and another part of the multiple integrated chips are disposed on the main board or the secondary board.

8. The electronic device according to claim 1, wherein The set of circuit boards includes a main board and a secondary board; When multiple integrated chips are disposed on the flexible circuit board and the set of circuit boards, at least one integrated chip is disposed on any one of the flexible circuit board, the main board and the secondary board.

9. The electronic device according to any one of claims 1 to 8, characterized in that, The battery further includes a sealing edge, the sealing edge is connected to one side of the battery cell, the sealing edge is provided with a groove, and the protection board is disposed in the groove.

10. The electronic device according to any one of claims 1 to 8, characterized in that, The number of the battery cells is multiple, and the multiple battery cells are located on the same side of the protection board.

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