Miniaturized camera module and electronic equipment with miniaturized camera module

Abstract

The utility model provides a miniaturized camera module and an electronic device with the miniaturized camera module, the miniaturized camera module comprises a lens assembly and a circuit board, the lens assembly is fixed on the circuit board, and the lens assembly is located at the front end of a chip photosensitive path; the circuit board is provided with a front face and a back face, the front face of the circuit board faces the lens assembly, and the chip is attached to the back face of the circuit board in an inverted mode.

Description

Technical Field

[0001] The utility model relates to the technical field of camera modules, in particular to a miniaturized camera module and an electronic device with the miniaturized camera module. Background Art

[0002] With the popularization of smart home devices, the application of miniaturized camera modules in smart home devices is becoming more and more extensive. First of all, space limitation is an important factor. Smart home devices usually need to be designed to be compact, beautiful and not occupy too much space. The miniaturized camera module helps to reduce the cost of the device. A smaller size usually means less material usage and a simpler manufacturing process, which can significantly reduce the cost for large-scale production of smart home devices, thus making the product more competitive in the market. For mobile smart home devices, such as movable intelligent robots, the miniaturized camera module can reduce the weight of the device and improve its mobility flexibility and energy efficiency.

[0003] Such as Figure 1 And Figure 2 is a projection module of the prior art, which includes a lens, a lens holder circuit board and a chip disposed above the circuit board. In the existing COB wirebond (i.e., wire bonding in chip direct packaging) method, the chip is located above the circuit board, and the overall height dimension of the camera module in the Z direction cannot be effectively reduced; in addition, due to the existence of the non-imaging area of the chip in the existing COB wirebond method, the XY direction dimension of the module cannot be effectively reduced. That is to say, in the existing COB wirebond technology, basically the chip is located above the circuit board, which cannot meet the requirements of a small-size camera module. The installation space inside the whole machine in smart home devices is small, and there is an urgent need for miniaturization of the camera module. Summary of the Invention

[0004] One main advantage of the utility model is to provide a miniaturized camera module and an electronic device with the miniaturized camera module, wherein the miniaturized camera module adopts a flip-chip scheme with the chip located below the circuit board, which can effectively reduce the overall height of the camera module and achieve the purpose of miniaturizing the camera module.

[0005] Another advantage of the utility model is to provide a miniaturized camera module and an electronic device with the miniaturized camera module, wherein the miniaturized camera module adopts a flip-chip scheme with the chip located below the circuit board, which can effectively reduce the space required for wire bonding and reduce the inner wall size of the lens holder, and achieve the purpose of miniaturizing the camera module.

[0006] Another advantage of the present utility model lies in providing a miniaturized camera module and an electronic device with the miniaturized camera module. In the miniaturized camera module, a chip flip-chip scheme is adopted, and circuit board pads can be arranged within the non-imaging surface area of the chip. Windows are opened at positions on the circuit board corresponding to the chip pads, which can effectively reduce the size of the module in the X and Y directions.

[0007] Another advantage of the present utility model lies in providing a miniaturized camera module and an electronic device with the miniaturized camera module. In the miniaturized camera module, a chip flip-chip scheme is adopted, and the connection between the chip pads and the circuit board pads is completed by using gold wire bonding. The gold wire arc height can be controlled below 70um, which can further reduce the overall height of the module.

[0008] According to one aspect of the present utility model, a miniaturized camera module of the present utility model capable of achieving the foregoing and other objects and advantages includes:

[0009] A lens assembly;

[0010] A circuit board, wherein the lens assembly is fixed on the circuit board, and the lens assembly is located at the front end of the photosensitive path of the chip; and

[0011] A chip, the circuit board has a front side and a back side, the front side of the circuit board faces the lens assembly, and the chip is attached to the back side of the circuit board in a flip-chip manner.

[0012] According to an embodiment of the present utility model, the circuit board is provided with a light-transmitting window, wherein the light-transmitting window penetrates through the front side and the back side of the circuit board. The chip includes an imaging area and a non-imaging area surrounding the imaging area. The imaging area of the chip corresponds to the light-transmitting window of the circuit board, and the non-imaging area of the chip corresponds to the back side of the circuit board.

[0013] According to an embodiment of the present utility model, the circuit board includes a circuit board main body and at least one circuit board pad arranged on the circuit board main body. The at least one circuit board pad is arranged on the front side of the circuit board main body, and the circuit board main body is electrically connected to the chip main body of the chip through the circuit board pad.

[0014] According to an embodiment of the present utility model, the chip further includes at least one chip pad, wherein the chip pad is arranged on the chip main body of the chip and corresponds to the circuit board pad of the circuit board.

[0015] According to an embodiment of the present utility model, the miniaturized camera module further includes at least one metal pin, wherein the metal pin connects the circuit board pad of the circuit board and the chip pad of the chip, and conductively connects the chip body of the chip and the circuit board body of the circuit board.

[0016] According to an embodiment of the present utility model, the circuit board is further provided with at least one pad through-hole, wherein the pad through-hole penetrates through the front surface and the back surface of the circuit board, the pad through-hole of the circuit board corresponds to the chip pad of the chip, and the at least one metal pin passes through the pad through-hole of the circuit board from the chip pad of the chip and is connected to the circuit board pad of the circuit board.

[0017] According to an embodiment of the present utility model, the projection of the circuit board pad of the circuit board along the incident light axis direction is located in the non-imaging area of the chip, and the circuit board pad of the circuit board is located between the pad through-hole and the light-transmitting window.

[0018] According to an embodiment of the present utility model, the circuit board pad includes a plurality of circuit board solder joints, the chip pad includes a plurality of chip solder joints, wherein the circuit board solder joints correspond to the chip solder joints, and the metal pin includes a plurality of gold wires, wherein the gold wires pass through the pad through-hole of the circuit board from the chip solder joints and are connected to the circuit board solder joints of the circuit board.

[0019] According to an embodiment of the present utility model, the gold wire includes a first connection end, a second connection end, and a gold wire connection section integrally extending from the first connection end to the second connection end, wherein the first connection end of the gold wire is connected to the chip solder joint of the chip, the second connection end is connected to the circuit board solder joint of the circuit board, and the gold wire connection section of the gold wire penetrates through the pad through-hole.

[0020] On the other hand of the present application, the present application further provides an electronic device, including:

[0021] A device host; and

[0022] At least one miniaturized camera module as described in any one of the above, wherein the miniaturized camera module is mounted on the device host.

[0023] Through the understanding of the subsequent description and the drawings, the further objects and advantages of the present utility model will be fully reflected.

[0024] These and other objects, features, and advantages of the present utility model are fully reflected through the following detailed description and the drawings. Description of the Drawings

[0025] The technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. In the drawings, unless otherwise specified, the same reference numerals are used to denote the same components. Among them:

[0026] Figure 1 is a schematic structural diagram of a camera module of the prior art.

[0027] Figure 2 is a schematic structural diagram of the chip and circuit board of the camera module of the prior art.

[0028] Figure 3 is a schematic structural diagram of a miniaturized camera module according to the first preferred embodiment of the present utility model.

[0029] Figure 4 is a schematic structural diagram of the chip and circuit board of the miniaturized camera module according to the first preferred embodiment of the present utility model.

[0030] Figure 5A and Figure 5B is an assembly schematic diagram of the chip assembly of the miniaturized camera module according to the first preferred embodiment of the present utility model.

[0031] Figure 6 is a schematic structural diagram of the chip and circuit board of the miniaturized camera module according to the first preferred embodiment of the present utility model. Detailed implementation manners

[0032] It should be noted that the embodiments shown in the drawings are only examples for specifically and vividly explaining and illustrating the concept of the present invention. In terms of size and structure, they are not necessarily drawn to scale and do not constitute a limitation to the concept of the present invention.

[0033] In this specification, the orientation terms such as up, down, left, right, front, back, front side, back side, top, bottom, etc. mentioned or possibly mentioned are defined with respect to the structures shown in the respective drawings. They are relative concepts and may therefore change accordingly depending on their different positions and usage states. Therefore, these or other orientation terms should not be construed as restrictive terms.

[0034] It can be understood that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of this element can be multiple. The term "a" cannot be construed as a limitation on the number.

[0035] Referring to the accompanying drawings of the specification of this application Figures 3 to 6As shown, a miniaturized camera module according to a first preferred embodiment of the present application is illustrated in the following description. The miniaturized camera module includes a lens assembly 10, a circuit board 20, and a chip 30 disposed on the circuit board 20, wherein the lens assembly 10 is fixed to the circuit board 20, and the lens assembly 10 is located at the front end of the light-sensitive path of the chip 30, and incident light reaches the chip 30 after passing through the lens assembly 10.

[0036] The circuit board 20 has a front surface 210 and a back surface 220 disposed back-to-back with the front surface 210, wherein the front surface 210 of the circuit board 20 faces the position where the lens assembly 10 is located. The chip 30 is attached to the back surface 220 of the circuit board 20 in a flip-chip manner.

[0037] Specifically, the circuit board 20 is provided with a light-transmitting window 230, wherein the light-transmitting window 230 penetrates through the front surface 210 and the back surface 220 of the circuit board 20, and incident light reaches the chip 30 through the light-transmitting window 230 of the circuit board 20.

[0038] The chip 30 includes an imaging area 310 and a non-imaging area 320 surrounding the periphery of the imaging area 310, wherein the imaging area 310 of the chip 30 can convert the optical signal of the incident light into a corresponding electrical signal, and the non-imaging area 320 surrounds the periphery of the imaging area 310 for fixing the chip 30 and arranging electronic components.

[0039] The imaging area 310 of the chip 30 corresponds to the light-transmitting window 230 of the circuit board 20, and the non-imaging area 320 of the chip 30 corresponds to the back surface 220 of the circuit board 20.

[0040] As shown in the figure, in this preferred embodiment of the present application, the chip 30 is fixed below the circuit board 20 in a flip-chip manner, wherein the light-transmitting window 230 of the circuit board 20 corresponds to the imaging area 310 of the chip 30.

[0041] It is worth mentioning that in the prior art, the overall height (Z-axis direction) dimension of the camera module is the sum of the total heights of the circuit board, the chip, and the lens TTL (Total Track Length), while the overall height dimension of the miniaturized camera module in this preferred embodiment of the present application is the TTL of the chip 30 and the lens assembly 10, that is, the thickness of the circuit board 20 is included in the TTL of the lens assembly 10. Therefore, in this preferred embodiment of the present application, the size of the miniaturized camera module in the height direction can be reduced by fixing the chip 30 in a flip-chip manner.

[0042] The lens assembly 10 includes a lens 11 and a lens holder 12, wherein the lens holder 12 is fixed to the circuit board 20, and the lens 11 is disposed in the lens holder 12. The lens 11 is supported by the lens holder 12 at the front end of the photosensitive path of the chip 30.

[0043] The chip 30 includes a chip main body 31 and a chip base 32, wherein the chip base 32 is disposed at the bottom of the chip main body 31 and is fixedly connected to the circuit board 20. The chip base 32 is used to support the chip main body 31.

[0044] The circuit board 20 includes a circuit board main body 21 and at least one circuit board pad 22 disposed on the circuit board main body 21. The at least one circuit board pad 22 is disposed on the front surface 210 of the circuit board main body 21, and the circuit board main body 21 is electrically connected to the chip main body 31 of the chip 30 through the circuit board pad 22. The chip 30 further includes at least one chip pad 33, wherein the chip pad 33 is disposed on the chip main body 31 of the chip 30 and corresponds to the circuit board pad 22 of the circuit board 20.

[0045] The miniaturized camera module further includes at least one metal pin 40, wherein the metal pin 40 connects the circuit board pad 22 of the circuit board 20 and the chip pad 33 of the chip 30, and conductively connects the chip main body 31 of the chip 30 and the circuit board main body 21 of the circuit board 20.

[0046] Since the chip 30 is flip-chip mounted on the back surface 220 of the circuit board 20, the circuit board 20 is further provided with at least one pad through-hole 240, which penetrates through the front surface 210 and the back surface 220 of the circuit board 20. The pad through-hole 240 of the circuit board 20 corresponds to the chip pad 33 of the chip 30, and the at least one metal pin 40 passes through the pad through-hole 240 of the circuit board 20 from the chip pad 33 of the chip 30 and is connected to the circuit board pad 22 of the circuit board 20.

[0047] Such as Figure 2Shown are the chip and circuit board of an imaging module in the prior art, where the chip is attached to the upper surface of the circuit board. The pads of the chip and the pads of the circuit board are connected by gold wires. The pads of the circuit board are located outside the non-imaging area of the chip, while the pads of the chip are located in the non-imaging area of the chip. It can be understood that the pads of the circuit board are limited by the size of the chip and can only be arranged outside the chip, which makes it impossible to further reduce the size of the circuit board of the imaging module in the XY direction, that is, it is difficult to further break through the size of the imaging module in the XY direction.

[0048] Figure 4 This is a schematic diagram of the chip 30 of this preferred embodiment of the present application being disposed at the corresponding position of the circuit board 20. The projection of the circuit board pads 22 of the circuit board 20 along the incident optical axis direction is located in the non-imaging area 320 of the chip 30, and the circuit board pads 22 of the circuit board 20 are located between the pad through-holes 240 and the light-transmitting windows 230. In other words, in this preferred embodiment of the present application, the circuit board pads 22 are located inside the chip pads 32, which can reduce the size of the circuit board 20 in the XY direction and is beneficial to the miniaturization of the imaging module.

[0049] The circuit board pads 22 include a plurality of circuit board solder joints 221, and the chip pads 32 include a plurality of chip solder joints 321. Among them, the circuit board solder joints 221 correspond to the chip solder joints 321 one by one, and the circuit board solder joints 221 and the chip solder joints 321 are connected by the metal pins 40.

[0050] The metal pins 40 include a plurality of gold wires 41. Among them, the gold wires 41 connect the circuit board solder joints 221 and the chip solder joints 321. The gold wires 41 pass through the pad through-holes 240 of the circuit board 20 from the chip solder joints 321 and are connected to the circuit board solder joints 221 of the circuit board 20.

[0051] As Figure 5A and Figure 5B shown, the gold wire 41 includes a first connection end 411, a second connection end 412, and a gold wire connection section 413 integrally extending from the first connection end 411 to the second connection end 412. Among them, the first connection end 411 of the gold wire 41 is connected to the chip solder joint 321 of the chip 30, the second connection end 412 is connected to the circuit board solder joint 221 of the circuit board 20, and the gold wire connection section 413 of the gold wire 41 passes through the pad through-hole 240 and is arc-shaped.

[0052] In this preferred embodiment of the present application, since the gold wire connection segment 413 of the gold wire 41 penetrates through the pad through groove 240, at least part of the height of the gold wire connection segment 413 of the gold wire 41 coincides with the height of the circuit board 20. Therefore, in this preferred embodiment of the present application, the imaging module adopts the chip flip-chip method, and uses the gold wire 41 to connect the chip solder joint 321 of the chip 30 and the circuit board solder joint 221 of the circuit board 20, which can further reduce the overall height of the module. As an example, in a specific example of the present application, the arc height of the gold wire 41 is less than or equal to 70um.

[0053] Compared with the imaging module of the prior art, in this preferred embodiment of the present application, the miniaturized imaging module is based on the chip flip-chip technical solution and uses a circuit board, a chip, and a lens with the same thickness as the prior art. Therefore, the miniaturized imaging module based on the chip flip-chip method can achieve miniaturization in the Z direction.

[0054] In a specific example of the present application, compared with the imaging module of the prior art, the miniaturized imaging module of this preferred embodiment of the present application can reduce the required size of the metal pins 40, which can meet the miniaturization requirements of the imaging module.

[0055] According to another aspect of the present application, the present application further provides an electronic device, where the electronic device may include, but is not limited to, a sweeping robot, a smart door lock, a monitor, an AR device, a VR device, a smart wearable device, and other types of electronic devices.

[0056] The electronic device includes a device host (not shown in the figure) and at least one miniaturized imaging module disposed on the device host, where the miniaturized imaging module is mounted on the device host.

[0057] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the drawings are only examples and do not limit the present invention. The object of the present invention has been fully and effectively achieved. The function and structural principle of the present invention have been shown and described in the embodiments. Without departing from the principle, the embodiments of the present invention can have any deformation or modification.

[0058] The technical scope of the present invention is not limited to the content described above. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical idea of the present invention, and these deformations and modifications all fall within the protection scope of the present invention.

Claims

1. A miniaturized camera module, characterized in that, Comprising: A lens assembly; A circuit board, wherein the lens assembly is fixed on the circuit board, and the lens assembly is located at the front end of the photosensitive path of the chip; And A chip, the circuit board has a front side and a back side, the front side of the circuit board faces the lens assembly, and the chip is attached to the back side of the circuit board in a flip-chip manner.

2. The miniaturized imaging module according to claim 1, wherein the circuit board is provided with a light-transmitting window, wherein the light-transmitting window penetrates through the front side and the back side of the circuit board, the chip includes an imaging area and a non-imaging area surrounding the imaging area, the imaging area of the chip corresponds to the light-transmitting window of the circuit board, and the non-imaging area of the chip corresponds to the back side of the circuit board.

3. The miniaturized imaging module according to claim 2, wherein the circuit board includes a circuit board main body and at least one circuit board pad provided on the circuit board main body, wherein the at least one circuit board pad is provided on the front side of the circuit board main body, and the circuit board main body is electrically connected to the chip main body of the chip through the circuit board pad.

4. The miniaturized imaging module according to claim 3, wherein the chip further includes at least one chip pad, wherein the chip pad is provided on the chip main body of the chip and corresponds to the circuit board pad of the circuit board.

5. The miniaturized imaging module according to claim 4, further comprising at least one metal pin, wherein the metal pin connects the circuit board pad of the circuit board and the chip pad of the chip, and conductively connects the chip main body of the chip and the circuit board main body of the circuit board.

6. The miniaturized imaging module according to claim 5, wherein the circuit board is further provided with at least one pad through-hole, wherein the pad through-hole penetrates through the front side and the back side of the circuit board, the pad through-hole of the circuit board corresponds to the chip pad of the chip, and the at least one metal pin passes through the pad through-hole of the circuit board from the chip pad and is connected to the circuit board pad of the circuit board.

7. The miniaturized imaging module according to claim 6, wherein the projection of the circuit board pad of the circuit board along the incident optical axis direction is located in the non-imaging area of the chip, and the circuit board pad of the circuit board is located between the pad through-hole and the light-transmitting window.

8. The miniaturized imaging module according to claim 7, wherein the circuit board pad includes a plurality of circuit board solder joints, the chip pad includes a plurality of chip solder joints, wherein the circuit board solder joints correspond to the chip solder joints, and the metal pin includes a plurality of gold wires, wherein the gold wires pass through the pad through-hole of the circuit board from the chip solder joints and are connected to the circuit board solder joints of the circuit board.

9. The miniaturized camera module according to claim 8, wherein the gold wire includes a first connection end, a second connection end, and a gold wire connection section integrally extending from the first connection end to the second connection end, wherein the first connection end of the gold wire is connected to the chip solder joint of the chip, the second connection end is connected to the circuit board solder joint of the circuit board, and the gold wire connection section of the gold wire penetrates through the pad through hole.

10. An electronic device, characterized in that, Comprising: A device host; And At least one miniaturized camera module according to any one of claims 1 to 9, wherein the miniaturized camera module is mounted on the device host.

Images