Flexible circuit board and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, and discloses a flexible circuit board and electronic equipment, the flexible circuit board comprises a first connecting part used for being connected with a control panel, and the first connecting part comprises a first substrate, a first bonding pad, a wire and a first packaging layer; the first bonding pad is fixed on the first substrate, the first end of the wire is connected with the first bonding pad, and the first packaging layer is used for packaging the first bonding pad and the first end of the wire on the first substrate; the first packaging layer is provided with a first through hole, one part of the first bonding pad is exposed out of the first through hole, and at least one part of the joint of the first bonding pad and the wire is located between the first substrate and the first packaging layer. The flexible circuit board and the electronic equipment provided by the utility model have relatively good waterproof performance and relatively low cost.

Description

Technical Field

[0001] The present application relates to the technical field of electronic devices, and particularly relates to a flexible circuit board and an electronic device. Background Art

[0002] A flexible printed circuit board (FPC) is a printed circuit board made of polyimide or polyester film as a substrate. Because of its advantages such as being thin, light, flexible, and having a high degree of bending freedom, it is widely used in the field of electronic devices.

[0003] When an electronic device is used in environments such as high temperature, high humidity, and rainy days for a long time, due to reasons such as the outgoing ends of the FPC pads and the outgoing ends under the keys being easily corroded, failures such as the power on / off key and volume keys of the mobile phone malfunctioning often occur.

[0004] In the related art, for the FPC, generally, a waterproof sealant or waterproof film is added under the pads and keys to avoid corrosion, but this method will increase the manufacturing cost. Utility Model Content

[0005] In view of this, the present application provides a flexible circuit board and an electronic device, which have good waterproof performance and low cost.

[0006] Specifically, the following technical solutions are included:

[0007] In the first aspect of the present application, a flexible circuit board is provided. The flexible circuit board includes a first connection portion for connecting to a control board. The first connection portion includes a first substrate, a first pad, a wire, and a first encapsulation layer;

[0008] The first pad is fixed on the first substrate. The first end of the wire is connected to the first pad. The first encapsulation layer is used to encapsulate the first pad and the first end of the wire on the first substrate;

[0009] A first through hole is formed in the first encapsulation layer. A part of the first pad is exposed from the first through hole. At least a part of the connection portion between the first pad and the wire is located between the first substrate and the first encapsulation layer.

[0010] Optionally, the orthographic projection of the connection portion between the first pad and the wire on a set projection plane is located outside the orthographic projection of the first through hole on the set projection plane. The set projection plane is parallel to the plate surface of the first pad.

[0011] Optionally, the first pad includes a first part exposed from the first through hole and a second part covered by the first encapsulation layer, and the first part and the second part are connected.

[0012] Optionally, the distance between the edge of the second part away from the first through hole and the first through hole is 0.1 - 0.4 mm.

[0013] Optionally, the distance between the edge of the second part away from the first through hole and the first through hole is 0.2 mm.

[0014] Optionally, the first connecting portion further includes a first conductor, the first conductor is located on the side of the second part away from the first through hole and is connected to the second part, the wire is connected to the first conductor, and a part of the wire overlaps with the first conductor in the thickness direction of the first pad.

[0015] Optionally, the area of the orthographic projection of the first conductor on a set projection plane is larger than the area of the orthographic projection of the overlapping part of the wire and the first conductor on the set projection plane, and the set projection plane is parallel to the plate surface of the first pad.

[0016] Optionally, from the bottom end to the top end of the first conductor, the cross-sectional area of the first conductor gradually decreases, the bottom end of the first conductor is the end connected to the side surface of the second part, and the end area of the bottom end is smaller than the side area of the second part, and the bottom end and the top end of the first conductor are opposite to each other.

[0017] Optionally, the number of the first pads is multiple, the multiple first pads are respectively arranged on opposite sides of the central axis of the first substrate, the central axis is parallel to the plate surface of the first substrate, and the first conductor on each first pad is located on the side of the first pad close to the central axis.

[0018] Optionally, the flexible circuit board further includes a second connecting portion for connecting to a function button, the second connecting portion includes a second substrate, a second encapsulation layer, and at least two second pads;

[0019] The at least two second pads are fixed on the second substrate at intervals, and every two second pads correspond to one function button, the second end of the wire is respectively connected to the at least two second pads, and the second encapsulation layer is used to encapsulate the at least two second pads and the second end of the wire on the second substrate;

[0020] A plurality of second through holes are formed in the second encapsulation layer, each second pad is exposed through a second through hole, and the two second pads corresponding to the same function button are respectively exposed through different second through holes.

[0021] Optionally, the first substrate and the second substrate are connected on the same layer; and / or,

[0022] the first pad, the second pad and the wire are disposed on the same layer; and / or,

[0023] the first encapsulation layer and the second encapsulation layer are connected on the same layer.

[0024] Optionally, the second connecting portion further includes a second conductor, the second conductor is connected to the second pad, the second end of the wire is connected to the second conductor, and a part of the wire overlaps with the second conductor in the thickness direction of the second pad.

[0025] The second aspect of the present application provides an electronic device, and the electronic device includes the flexible circuit board described above.

[0026] The beneficial effects of the technical solutions provided by the embodiments of the present application at least include:

[0027] For the flexible circuit board and the electronic device provided by the embodiments of the present application, the first encapsulation layer encapsulates the first pad and the wire on the first substrate, and a first through hole is formed in the first encapsulation layer. Among them, the part of the first pad for connecting with the wire is covered by the first encapsulation layer, and the part not used for connecting with the wire is exposed from the first through hole. Therefore, while facilitating welding with electronic components, the first encapsulation layer can at least partially block moisture, thereby avoiding corrosion and disconnection at the connection between the first pad and the wire, reducing the risk of disconnection, and improving the service life of the flexible circuit board. Moreover, the flexible circuit board provided by the embodiments of the present application adjusts the position of the first through hole or the positions of the first pad and the wire, and does not additionally add other waterproof or sealing components. Compared with the flexible circuit board in the related art, the structure is simpler and the cost is lower. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0029] Figure 1 Shows a cross-sectional view of the first connecting portion provided by the embodiment of the present application;

[0030] Figure 2 Shows a schematic structural diagram of a flexible circuit board provided by the embodiment of the present application;

[0031] Figure 3 For Figure 2Enlarged view of location A

[0032] Figure 4 The schematic structural diagram of another flexible circuit board provided by an embodiment of the present application is shown;

[0033] Figure 5 is Figure 4 Enlarged view of location B Description of the drawings:

[0035] 1. First connection part; 11. First substrate; 12. First pad; 121. First part; 122. Second part; 123. First conductor; 1231. Bottom end; 1232. Top end; 13. Conductive wire; 14. First encapsulation layer; 141. First through hole; 15. Reinforcing plate; 16. Adhesive layer;

[0036] 2. Second connection part; 21. Second substrate; 22. Second encapsulation layer; 221. Second through hole; 23. Second pad; 24. Second conductor.

[0037] Through the above-mentioned drawings, the specific embodiments of the present application have been shown, and more detailed descriptions will be given later. These drawings and textual descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed implementation manners

[0038] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application. To make the technical solutions and advantages of the present application clearer, the flexible circuit board, electronic device, etc. will be described in detail below in conjunction with the drawings.

[0039] A flexible printed circuit board is a printed circuit board made of polyimide or polyester film as the substrate. Because of its advantages such as being thin, flexible, and having a high degree of bending freedom, it is widely used in the field of electronic devices. When an electronic device is used in environments such as high temperature, high humidity, and rainy days for a long time, due to reasons such as the outgoing wire ends of the FPC pads and the outgoing wire ends under the keys being prone to corrosion, faults such as the power on / off key and volume key of the mobile phone malfunctioning often occur.

[0040] In the related art, for the FPC, waterproof sealant or waterproof film is generally added under the pads and keys to avoid corrosion, but this method will increase the manufacturing cost.

[0041] The present application provides a flexible circuit board, as Figure 1 andFigure 2 As shown, the flexible circuit board includes a first connecting portion 1 for connecting to a control board (e.g., a main board), and the first connecting portion 1 may include a first substrate 11, a first solder pad 12, a wire 13, and a first packaging layer 14; the first solder pad 12 is fixed on the first substrate 11, and the first end of the wire 13 is connected to the first solder pad 12, and the first packaging layer 14 is used to package the first solder pad 12 and the first end of the wire 13 on the first substrate 11; a first through hole 141 is provided on the first packaging layer 14, a portion of the first solder pad 12 is exposed in the first through hole 141, and at least a portion of the connection between the first solder pad 12 and the wire 13 is located between the first substrate 11 and the first packaging layer 14.

[0042] In the flexible circuit board provided in the embodiment of the present application, the first packaging layer 14 packages the first pad 12 and the wire 13 on the first substrate 11, and a first through hole 141 is provided on the first packaging layer 14, wherein the portion of the first pad 12 used for connecting to the wire is covered by the first packaging layer, and the portion not used for connecting to the wire is exposed to the first through hole 141, so that it is convenient to weld with electronic components, and the first packaging layer 14 can at least partially block moisture, thereby avoiding corrosion and wire breakage at the connection between the first pad 12 and the wire 13, reducing the risk of wire breakage and improving the service life of the flexible circuit board; and, the flexible circuit board provided in the embodiment of the present application is obtained by adjusting the opening position of the first through hole 141 or the setting position of the first pad 12 and the wire 13, without adding other waterproof or sealing components (such as waterproof sealant and waterproof film in the related art), and is simpler in structure and lower in cost than the flexible circuit board in the related art.

[0043] It should be noted that the pads in the flexible circuit board are generally metal pads (such as copper pads), and the components are electrically connected through wiring (wire 13 in this application). When there is liquid on the wiring or metal pads, electrochemical corrosion will occur, resulting in wiring breakage or pad corrosion.

[0044] In some embodiments, Figure 1 As shown, the first connecting portion 1 may further include a reinforcing plate 15 and an adhesive layer 16. The reinforcing plate 15 is attached to the side of the first substrate 11 away from the first solder pad 12 to reinforce the first substrate 11; the adhesive layer 16 is located between the first solder pad 12 and the first packaging layer 14 to achieve an adhesive connection between the first packaging layer 14 and the first solder pad 12.

[0045] Optionally, the first encapsulation layer 14 may be a cover film.

[0046] Optionally, the orthographic projection of the connection between the first pad 12 and the wire 13 on the set projection plane is located outside the orthographic projection of the first through hole 141 on the set projection plane, and the set projection plane is parallel to the disk surface of the first pad 12. That is, the connection between the first pad 12 and the wire 13 is located between the first encapsulation layer 14 and the substrate and is completely covered by the first encapsulation layer 14, which can prevent this place from being eroded by moisture.

[0047] Optionally, the first pad 12 includes a first portion 121 exposed from the first through hole 141 and a second portion 122 covered by the first encapsulation layer 14, and the first portion 121 and the second portion 122 are connected. Among them, the first portion 121 of the first pad 12 is used for welding connection with an electronic component, the second portion 122 is connected to the wire 13, and the second portion 122 is covered by the first encapsulation layer 14, which can at least partially block moisture from entering the connection between the first pad 12 and the wire 13, thereby avoiding problems such as pad erosion and wire 13 breakage.

[0048] Optionally, the distance between the edge of the second portion 122 away from the first through hole 141 and the first through hole 141 is 0.1 - 0.4 mm.

[0049] Optionally, the distance between the edge of the second portion 122 away from the first through hole 141 and the first through hole 141 is 0.2 mm. Those skilled in the art can select and adjust the distance between the edge of the second portion 122 away from the first through hole 141 and the first through hole 141 according to actual needs.

[0050] In the related art, the outgoing end of the pad in the FPC is welded to the trace through a conductive end face, and the connection area is small. When the electronic device is used in environments such as high temperature, high humidity, and rainy days for a long time, the connection point between the pad and the trace is easily corroded, and problems such as the failure of the power on / off key and volume key of the mobile phone often occur.

[0051] In some embodiments of the present application, as Figure 2 and Figure 3 shown, the first connection portion 1 may further include a first conductor 123. The first conductor 123 is located on the side of the second portion 122 away from the first through hole 141 and is connected to the second portion 122. The wire 13 is connected to the first conductor 123, and a part of the wire 13 overlaps with the first conductor 123 in the thickness direction of the first pad 12.

[0052] In the flexible circuit board provided by the embodiment of the present application, a part of the wire 13 overlaps with the first conductor 123, and the contact area between the wire 13 and the first conductor 123 is relatively large. The first conductor 123 can realize the electrical connection between the first pad 12 and the wire 13, which is equivalent to increasing the connection area between the wire 13 and the first pad 12. Compared with the solution in the related art where the pad and the trace are welded at the end face, the connection area is increased. When affected by moisture erosion, the wire 13 is less likely to break, further increasing the service life of the flexible circuit board.

[0053] Optionally, the area of the orthographic projection of the first conductor 123 on the set projection plane is larger than the area of the orthographic projection of the overlapping part of the wire 13 and the first conductor 123 on the set projection plane. The set projection plane is parallel to the disk surface of the first pad 12. The size of the first conductor 123 is relatively large, so that the wire 13 can be completely welded on the first conductor 123, and the processing difficulty is low. Moreover, the first conductor 123 itself has an electrical conduction function and will also undergo chemical corrosion when affected by moisture erosion. Therefore, the size of the first conductor 123 is designed to be larger. In a short time, the amount of corrosion has a relatively small impact compared to the main body, and the performance of the flexible circuit board will not be affected immediately after corrosion, which is equivalent to increasing the service life of the flexible circuit board.

[0054] Optionally, as Figure 3 shown, from the bottom end 1231 to the top end 1232 of the first conductor 123, the cross-sectional area of the first conductor 123 gradually decreases. The bottom end 1231 of the first conductor 123 is the end connected to the side surface of the second part 122, and the end area of the bottom end 1231 is smaller than the side area of the second part 122. The bottom end 1231 and the top end 1232 of the first conductor 123 are opposite to each other.

[0055] As Figure 3 shown, the first conductor 123 is located on the side of the first pad 12 away from the first through hole 141. The farther away from the first through hole 141, the lower the possibility of water vapor erosion. On the contrary, the closer to the first through hole 141, the higher the possibility of water vapor erosion. Therefore, the cross-sectional area of the first conductor 123 gradually becomes smaller from the bottom end 1231 to the top end 1232, that is, the cross-sectional area of the first conductor 123 on the side closer to the first through hole 141 is larger. After being affected by water vapor erosion, it is less likely to affect the performance of the flexible circuit board. Moreover, the cross-sectional area of the first conductor 123 on the side away from the first through hole 141 is smaller, which can also reduce the overall area of the first conductor 123 and can reduce the cost.

[0056] Optionally, as Figure 2As shown, the number of the first pads 12 is multiple, and the multiple first pads 12 are respectively arranged on opposite sides of the central axis of the first substrate 11. The central axis is parallel to the plate surface of the first substrate 11, and the first conductors 123 on each first pad 12 are located on the side of the first pad 12 close to the central axis. That is, the connection points of the first conductors 123 on each first pad 12 and the wire 13 are concentrated on both sides of the central axis, which is not only convenient for wiring, but also the position is far from the first through hole 141, and can avoid the wire 13 from being eroded by water vapor to the greatest extent.

[0057] In some embodiments of the present application, as Figure 2 shown, the flexible circuit board may further include a second connection portion 2 for connecting to a function button. The second connection portion 2 may include a second substrate 21, a second encapsulation layer 22, and at least two second pads 23; the at least two second pads 23 are fixedly arranged on the second substrate 21 at intervals, and each two second pads 23 correspond to a function button. The second end of the wire 13 is respectively connected to the at least two second pads 23, and the second encapsulation layer 22 is used to encapsulate the at least two second pads 23 and the second end of the wire 13 on the second substrate 21; a plurality of second through holes 221 are formed in the second encapsulation layer 22, each second pad 23 is exposed from a second through hole 221, and the two second pads 23 corresponding to the same function button are respectively exposed from different second through holes 221.

[0058] An electronic device generally realizes operations such as power on / off and volume adjustment through function buttons on the housing. The second connection portion 2 in the flexible circuit board provided by the embodiments of the present application can be connected to the function buttons. The second connection portion 2 and the first connection portion 1 are electrically connected through the wire 13, and the first connection portion 1 can be connected to a control board (such as a main board). The user can operate the electronic device through the function buttons; moreover, the two second pads 23 corresponding to the same function button on the second substrate 21 are arranged at intervals and are respectively exposed from different second through holes 221, and the two second through holes 221 are also arranged at intervals. A part of the second encapsulation layer 22 is located between the two second through holes 221. The second encapsulation layer 22 can lift the function button, so that the distance between the function button and the second substrate 21 is increased. Furthermore, more connection glue can be filled here, increasing the stability of the function button, and moisture is not easily invaded under the function button, and corrosion of the second pads 23 and the wire 13 can also be avoided.

[0059] Optionally, the first substrate 11 and the second substrate 21 are connected on the same layer; and / or, the first pad 12, the second pad 23 and the wire 13 are disposed on the same layer; and / or, the first encapsulation layer 14 and the second encapsulation layer 22 are connected on the same layer. That is, the first substrate 11 and the second substrate 21 may be an integrally formed structure, or two parts of the same substrate; the first encapsulation layer 14 and the second encapsulation layer 22 may be an integrally formed structure, or two parts of the same encapsulation layer.

[0060] Optionally, as Figure 4 and Figure 5 shown, the second connection portion 2 further includes a second conductor 24. The second conductor 24 is connected to the second pad 23. The second end of the wire 13 is connected to the second conductor 24, and a part of the wire 13 overlaps with the second conductor 24 in the thickness direction of the second pad 23.

[0061] A part of the wire 13 overlaps with the second conductor 24, that is, the contact area between the wire 13 and the second conductor 24 is relatively large. The second conductor 24 can realize the electrical connection between the second pad 23 and the wire 13, which is equivalent to increasing the connection area between the wire 13 and the second pad 23. Compared with the solution in the related art where the pad and the trace are welded at the end face, the connection area is increased. When being eroded by moisture, the wire 13 is less likely to break, further increasing the service life of the flexible circuit board.

[0062] The present application further provides an electronic device, and the electronic device includes the above flexible circuit board.

[0063] In the electronic device provided by the embodiment of the present application, the first encapsulation layer 14 encapsulates the first pad 12 and the wire 13 on the first substrate 11, and a first through hole 141 is formed in the first encapsulation layer 14. A part of the first pad 12 is exposed from the first through hole 141. While facilitating the welding with the electronic component, the connection portion between the first pad 12 and the wire 13 is covered by the first encapsulation layer 14, which can at least partially block the moisture, thereby avoiding the corrosion and disconnection of the connection portion between the first pad 12 and the wire 13, reducing the disconnection risk, and improving the service life of the flexible circuit board; moreover, the flexible circuit board provided by the embodiment of the present application adjusts the position of the first through hole 141 or the positions of the first pad 12 and the wire 13, without adding other components additionally. Compared with the flexible circuit board structure in the related art, it is simpler and has a lower cost.

[0064] Moreover, due to adopting the above flexible circuit board, the probability of the function keys of the electronic device malfunctioning is greatly reduced, improving the user experience.

[0065] In this application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless otherwise specifically defined.

[0066] Other embodiments of the present application will be readily apparent to those skilled in the art upon consideration of the specification and practice of the utility model disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include known common knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and examples are to be considered exemplary only.

[0067] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope.

Claims

1. A flexible circuit board, characterized in that, The flexible circuit board includes a first connection portion (1) for connecting to a control board. The first connection portion (1) includes a first substrate (11), a first pad (12), a wire (13), and a first encapsulation layer (14). The first pad (12) is fixed on the first substrate (11). The first end of the wire (13) is connected to the first pad (12). The first encapsulation layer (14) is used to encapsulate the first pad (12) and the first end of the wire (13) on the first substrate (11). A first through hole (141) is formed in the first encapsulation layer (14). A part of the first pad (12) is exposed from the first through hole (141). At least a part of the connection portion between the first pad (12) and the wire (13) is located between the first substrate (11) and the first encapsulation layer (14).

2. The flexible circuit board according to claim 1, wherein, The orthographic projection of the connection portion between the first pad (12) and the wire (13) on a set projection plane is located outside the orthographic projection of the first through hole (141) on the set projection plane. The set projection plane is parallel to the disk surface of the first pad (12).

3. The flexible circuit board according to claim 1, wherein, The first pad (12) includes a first part (121) exposed from the first through hole (141) and a second part (122) covered by the first encapsulation layer (14). The first part (121) and the second part (122) are connected to each other.

4. The flexible circuit board according to claim 3, characterized in that, The distance between the edge of the second part (122) far from the first through hole (141) and the first through hole (141) is 0.1 - 0.4 mm.

5. The flexible circuit board according to claim 4, wherein, The distance between the edge of the second part (122) far from the first through hole (141) and the first through hole (141) is 0.2 mm.

6. The flexible circuit board according to claim 3, wherein The first connection portion (1) further includes a first conductor (123). The first conductor (123) is located on the side of the second part (122) far from the first through hole (141) and is connected to the second part (122). The wire (13) is connected to the first conductor (123), and a part of the wire (13) is stacked with the first conductor (123) in the thickness direction of the first pad (12).

7. The flexible circuit board according to claim 6, characterized in that The area of the orthographic projection of the first conductor (123) on a set projection plane is larger than the area of the orthographic projection of the stacked part of the wire (13) and the first conductor (123) on the set projection plane. The set projection plane is parallel to the disk surface of the first pad (12).

8. The flexible circuit board according to claim 6, characterized in that, From the bottom end (1231) to the top end (1232) of the first conductor (123), the cross-sectional area of the first conductor (123) gradually decreases. The bottom end (1231) of the first conductor (123) is the end connected to the side surface of the second part (122), and the end area of the bottom end (1231) is smaller than the side area of the second part (122). The bottom end (1231) and the top end (1232) of the first conductor (123) are opposite to each other.

9. The flexible circuit board according to claim 6, wherein The number of the first pads (12) is plural, and the plural first pads (12) are respectively arranged on opposite sides of the central axis of the first substrate (11). The central axis is parallel to the plate surface of the first substrate (11), and the first conductors (123) on each of the first pads (12) are located on the side of the first pad (12) close to the central axis.

10. The flexible circuit board according to claim 1, characterized in that, The flexible circuit board further includes a second connecting portion (2) for connecting with a function key. The second connecting portion (2) includes a second substrate (21), a second encapsulation layer (22), and at least two second pads (23); The at least two second pads (23) are fixedly arranged on the second substrate (21) at intervals, and every two of the second pads (23) correspond to one function key. The second ends of the wires (13) are respectively connected to the at least two second pads (23), and the second encapsulation layer (22) is used for encapsulating the at least two second pads (23) and the second ends of the wires (13) on the second substrate (21); A plurality of second through holes (221) are formed in the second encapsulation layer (22), each of the second pads (23) is exposed from one of the second through holes (221), and the two second pads (23) corresponding to the same function key are respectively exposed from different second through holes (221).

11. The flexible circuit board according to claim 10, wherein The first substrate (11) and the second substrate (21) are connected in the same layer; and / or, The first pads (12), the second pads (23), and the wires (13) are arranged in the same layer; and / or, The first encapsulation layer (14) and the second encapsulation layer (22) are connected in the same layer.

12. The flexible circuit board according to claim 10, wherein The second connecting portion (2) further includes a second conductor (24). The second conductor (24) is connected to the second pad (23), the second end of the wire (13) is connected to the second conductor (24), and a part of the wire (13) overlaps with the second conductor (24) in the thickness direction of the second pad (23).

13. An electronic device, characterized in that, The electronic device includes the flexible circuit board according to any one of claims 1 to 12.

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