High-frequency heat dissipation circuit board

Abstract

The utility model belongs to the technical field of circuit boards, in particular to a high-frequency heat dissipation circuit board, which is characterized in that the high-frequency heat dissipation circuit board comprises two circuit board bodies and a heat dissipation device arranged between the two circuit board bodies, the heat dissipation device comprises a shell arranged between the two circuit board bodies, the shell comprises a first board body and a second board body, the first plate body and the second plate body are arranged on the two sides of the shell; the middle plate is arranged between the first plate body and the second plate body, and stirring fans are arranged at the two ends of the middle plate; a first cavity is formed between the first plate body and the middle plate, a second cavity is formed between the second plate body and the middle plate, water is arranged in the first cavity and the second cavity, a circulation hole is formed in the end, away from the water circulation mechanism, of the middle plate, and heat conduction columns are arranged at the ends, facing the middle plate, of the first plate body and the second plate body. The beneficial effects of the utility model are that when the area of the circuit board body is large and the generated heat is large, the good heat dissipation capability is still maintained, and the stable temperature and working state are maintained.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and particularly refers to a high-frequency heat dissipation circuit board. Background Art

[0002] A circuit board, also known as a PCB board, is an important component in electronic devices. It is a circuit board on a non-conductive material used to support and connect electronic components. Circuits are made on a substrate covered with copper foil through printing technology, realizing the electrical connection and physical support between electronic components. Some electromagnetic frequencies used in fields such as automotive anti-collision systems, satellite systems, and radio systems are relatively high, thus becoming high-frequency circuit boards, and their various physical properties, precision, and technical parameter requirements are very high. High-frequency circuit boards also have high requirements for the environment, and temperature changes will also affect their operating precision. High-frequency circuit boards generate a large amount of heat during operation, and some high-frequency circuit boards are equipped with heat dissipation devices to dissipate heat from overheated high-frequency circuit boards.

[0003] However, the heat dissipation effect of traditional circuit board heat dissipation devices is average. Especially when the area of the circuit board body is large, more heat is generated during operation, and the heat dissipation devices on traditional circuit boards cannot dissipate heat effectively, still resulting in too high an operating temperature of the circuit board and affecting the working state of the circuit board. Content of the Utility Model

[0004] The purpose of the utility model is to address the above-mentioned existing technical problems and provide a high-frequency heat dissipation circuit board that can still maintain good heat dissipation ability, stable temperature, and working state when the area of the circuit board body is large and more heat is generated.

[0005] The purpose of the utility model is achieved as follows: A high-frequency heat dissipation circuit board includes two circuit board bodies and a heat dissipation device disposed between the two circuit board bodies. The heat dissipation device includes:

[0006] A housing disposed between the two circuit board bodies. The housing includes a first plate body and a second plate body, and the first plate body and the second plate body are disposed on both sides of the housing;

[0007] An intermediate plate disposed between the first plate body and the second plate body, and stirring fans are provided at both ends of the intermediate plate;

[0008] A water circulation mechanism disposed at one end of the housing, and the water circulation mechanism is inserted into the housing;

[0009] Wherein, a first cavity is formed between the first plate body and the middle plate, a second cavity is formed between the second plate body and the middle plate, water is provided in both the first cavity and the second cavity, a circulation hole is provided at one end of the middle plate away from the water circulation mechanism, and heat conduction columns are provided at one end of the first plate body and the second plate body facing the middle plate.

[0010] The present utility model is further configured as: a plurality of the heat conduction columns are provided, and the heat conduction columns are arranged in an array on the first plate body and the second plate body.

[0011] The present utility model is further configured as: a plurality of the stirring fans are provided, and the plurality of stirring fans are arranged in a staggered manner with the heat conduction columns.

[0012] The present utility model is further configured as: the housing further includes:

[0013] A water inlet, provided on the housing, and the water inlet is communicated with the first cavity;

[0014] A water outlet, provided on the housing, and the water outlet is communicated with the second cavity.

[0015] The present utility model is further configured as: the water circulation mechanism includes:

[0016] A water pump, provided outside the water inlet, and one end of the water pump is communicated with the water inlet;

[0017] A water storage tank, provided outside the housing, one end of the water storage tank is communicated with the water outlet, and the other end is communicated with the water pump.

[0018] The present utility model is further configured as: a clamping protrusion is provided at one end of the circuit board body facing the heat dissipation device, a clamping groove matching with the clamping protrusion is provided on the housing, and the clamping protrusion is clamped with the clamping groove.

[0019] The present utility model is further configured as: a heat generating convex part is provided at one end of the circuit board body facing the heat dissipation device, a concave cavity is provided at one end of the housing facing the circuit board body, the heat generating convex part is installed in the concave cavity, and the outer surface of the heat generating convex part is in contact with the inner wall of the concave cavity.

[0020] By adopting the above technical solutions, the present utility model has at least the following beneficial effects:

[0021] 1. Through the circulation holes provided on the intermediate plate and in cooperation with the water circulation mechanism, water can be circulated between the first cavity and the second cavity. The first plate body and the second plate body are in contact with the circuit board body at both ends of the housing, and the heat generated during the operation of the circuit board body can be transferred into the housing and absorbed by the water in the housing, thus achieving the heat dissipation effect. Through the cooperation of the heat conduction columns and the stirring fans, the conduction and diffusion of heat in the water can be accelerated, thereby improving the heat absorption capacity of the water, and thus maintaining the heat dissipation effect of the circuit board body when the area of the circuit board body is relatively large.

[0022] 2. A plurality of heat conduction columns are provided on the first plate body and the second plate body, which can accelerate the conduction of the heat of the circuit board to the water in the first cavity and the second cavity, improve the speed of heat conduction, and thus improve the heat dissipation capacity of the circuit board body.

[0023] 3. There are multiple stirring fans which are arranged in a staggered manner with the heat conduction columns. The multiple stirring fans can enhance the fluidity of the water in the first cavity and the second cavity, improve the diffusion speed of heat in the water, thereby accelerating the heat absorption capacity of the water, improving the heat dissipation effect of the heat dissipation device on the circuit board body, and ensuring the...

[0024] 4. The heat-generating convex part on the circuit board body is snap-fitted with the concave cavity on the housing, which can increase the contact area between the circuit board body and the housing, thereby improving the heat conduction capacity of the heat dissipation device and enhancing the heat dissipation effect of the heat dissipation device. Description of the Drawings

[0025] Figure 1 is a schematic diagram of the high-frequency heat dissipation circuit board of the present utility model;

[0026] Figure 2 is a schematic diagram of the heat dissipation device of the present utility model;

[0027] Figure 3 is a sectional view of the heat dissipation device of the present utility model;

[0028] Figure 4 is a schematic diagram of the intermediate plate of the present utility model;

[0029] Figure 5 is a schematic diagram of the first plate body of the present utility model;

[0030] Figure 6 is a schematic diagram of the second plate body of the present utility model;

[0031] Figure 7 is a schematic diagram of the circuit board body of the present utility model;

[0032] The reference numerals in the figure are: 1 - circuit board body, 2 - heat dissipation device, 11 - clamping protrusion, 12 - heat generating protrusion, 21 - housing, 22 - first plate body, 23 - second plate body, 24 - intermediate plate, 25 - water circulation mechanism, 26 - first cavity, 27 - second cavity, 28 - water inlet, 29 - water outlet, 221 - heat conducting column, 222 - clamping groove, 223 - concave cavity, 241 - circulation hole, 242 - stirring fan, 251 - water pump, 252 - water storage tank. Specific Embodiment

[0033] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0034] In the description of the present application, it should be noted that the terms used here are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. For the convenience of description, the dimensions of each part shown in the drawings are not drawn according to the actual proportional relationship. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that: similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further described in subsequent drawings.

[0035] Next, the present utility model will be further described with specific embodiments in conjunction with the accompanying drawings. See Figures 1-7 :

[0036] Embodiment 1.

[0037] This embodiment provides a high-frequency heat dissipation circuit board, including two circuit board bodies 1 and a heat dissipation device 2 disposed between the two circuit board bodies 1. The heat dissipation device 2 includes:

[0038] A housing 21 disposed between the two circuit board bodies 1. The housing 21 includes a first plate body 22 and a second plate body 23. The first plate body 22 and the second plate body 23 are disposed on both sides of the housing 21;

[0039] An intermediate plate 24 disposed between the first plate body 22 and the second plate body 23. Stirring fans 242 are provided at both ends of the intermediate plate 24;

[0040] The water circulation mechanism 25 is arranged at one end of the housing 21, and the water circulation mechanism 25 is inserted into the housing 21;

[0041] Wherein, a first cavity 26 is formed between the first plate body 22 and the middle plate 24, a second cavity 27 is formed between the second plate body 23 and the middle plate 24, water is provided in both the first cavity 26 and the second cavity 27, a circulation hole 241 is provided at one end of the middle plate 24 away from the water circulation mechanism 25, and heat conduction columns 221 are provided at one ends of the first plate body 22 and the second plate body 23 facing the middle plate 24.

[0042] As Figures 1-6 shown, the heat dissipation device 2 is arranged between two circuit board bodies 1, the first plate body 22 and the second plate body 23 are arranged on both sides of the housing 21, the two circuit board bodies 1 are respectively in contact with the first plate body 22 and the second plate body 23, the heat generated when the circuit board body 1 works is introduced into the water in the first cavity 26 and the second cavity 27 through the first plate body 22 and the second plate body 23, and through the cooperation of the water circulation device arranged outside the housing 21 and the circulation hole 241 on the middle plate 24, the water enters the first cavity 26 from outside the housing 21, enters and flows into the second cavity 27 through the circulation hole 241, and finally flows out of the housing 21, realizing water circulation. The water circulation absorbs and takes away the heat generated by the circuit board body 1, achieving a good heat dissipation effect.

[0043] Heat conduction columns 221 are provided on the first plate body 22 and the second plate body 23, and the heat conduction columns 221 are arranged in the first cavity 26 and the second cavity 27. The heat conduction columns 221 can improve the heat conduction effect of the housing 21, increase the contact area between the water and the first plate body 22 and the second plate body 23, thereby increasing the heat dissipation area and improving the heat dissipation effect of the heat dissipation device 2, keeping the temperature of the circuit board body 1 stable, and thus ensuring the stability of the operation of the circuit board body 1.

[0044] The heat conduction columns 221, the first plate body 22 and the second plate body 23 are integrally designed. The heat conduction columns 221, the first plate body 22 and the second plate body 23 can be made of materials such as stainless steel. The present utility model is preferably made of aluminum. Aluminum has good heat conductivity and is relatively light in mass, which can effectively reduce the overall mass of the circuit board, facilitate processing and manufacturing. At the same time, the cost of aluminum is relatively low, which can effectively reduce the use cost of the heat dissipation device 2.

[0045] Stirring fans 242 are provided at one end of the middle plate 24 facing the first plate body 22 and at one end of the middle plate 24 facing the second plate body 23. The stirring fans 242 can stir the water in the first cavity 26 and the second cavity 27, thereby accelerating the flow of the water in the first cavity 26 and the second cavity 27, accelerating the diffusion of the heat in the water, improving the absorption efficiency of the heat conducted by the heat conduction columns 221 by the water, improving the heat dissipation effect of the heat dissipation device 2, and thus ensuring the stability of the temperature of the circuit board body 1 during operation.

[0046] Example 2:

[0047] This embodiment provides a high-frequency heat dissipation circuit board. In addition to including the technical solutions of the above embodiment, it also has the following technical features.

[0048] There are multiple heat conduction columns 221, and the heat conduction columns 221 are arranged in an array on the first plate body 22 and the second plate body 23.

[0049] As Figure 3 、 5 shown in FIG. -6, the arrangement of multiple heat conduction columns 221 can accelerate the conduction of the heat of the circuit board to the water in the first cavity 26 and the second cavity 27, improve the speed of heat conduction, and thus improve the heat dissipation capacity of the circuit board body 1.

[0050] There are multiple stirring fans 242, and the multiple stirring fans 242 are arranged in a staggered manner with the heat conduction columns 221.

[0051] As Figures 3-4 shown, the stirring fans 242 are symmetrically arranged at both ends of the middle plate 24 facing the first plate body 22 and the second plate body 23. The stirring fans 242 are arranged in a staggered manner with the heat conduction columns 221, which can prevent the heat conduction columns 221 from restricting the stirring fans 242 and ensure the normal operation of the stirring fans 242.

[0052] The arrangement of multiple stirring fans 242 can further improve the flow rate of the water in the first cavity 26 and the second cavity 27, thereby enhancing the diffusion of the water, enhancing the absorption effect of the water on the conducted heat, improving the heat dissipation effect of the heat dissipation device 2, and ensuring the temperature stability of the large-area circuit board body 1.

[0053] The stirring fan 242 is an existing product, and its power supply wiring method is also a conventional design. The power supply wire can pass through the middle plate 24 for centralized power supply, etc. The power supply wire is a waterproof wire.

[0054] Example 3:

[0055] This embodiment provides a high-frequency heat dissipation circuit board. In addition to including the technical solutions of the above embodiment, it also has the following technical features.

[0056] The housing 21 further includes:

[0057] An inlet 28, which is arranged on the housing 21 and is communicated with the first cavity 26;

[0058] An outlet 29, which is arranged on the housing 21 and is communicated with the second cavity 27.

[0059] As Figures 1-3, as shown in FIGS. 5-6, the water inlet 28 is used to allow water to enter the first cavity 26 from within the water circulation mechanism 25, and the water outlet 29 is used to allow water to enter the water circulation mechanism 25 from within the second cavity 27.

[0060] The water circulation mechanism 25 includes:

[0061] A water pump 251, disposed outside the water inlet 28, with one end of the water pump 251 communicating with the water inlet 28;

[0062] A water storage tank 252, disposed outside the housing 21, with one end of the water storage tank 252 communicating with the water outlet 29 and the other end communicating with the water pump 251.

[0063] As Figures 1-2 shown, the water storage tank 252 is used to store water, ensuring that the water circulation mechanism 25 has sufficient water for water circulation heat dissipation, and when the water is insufficient, water can be directly supplemented through the water storage tank 252, improving the convenience of maintaining the water circulation mechanism 25.

[0064] The water pump 251 can provide pressure for the water, thereby driving the flow and circulation of the water. The water pump 251, the water storage tank 252, the water inlet 28, and the water outlet 29 are connected through water pipes.

[0065] Embodiment 4:

[0066] This embodiment provides a high-frequency heat dissipation circuit board, which, in addition to including the technical solutions of the above embodiments, further has the following technical features.

[0067] One end of the circuit board body 1 facing the heat dissipation device 2 is provided with a clamping protrusion 11, and the housing 21 is provided with a matching clamping groove 222. The clamping protrusion 11 is clamped with the clamping groove 222.

[0068] As Figures 5-7 shown, both the clamping protrusion 11 and the clamping groove 222 are provided with a plurality of them. The clamping protrusion 11 is disposed at the four corners of the circuit board body 1, and the clamping groove 222 is disposed at the four corners of the first side plate and the second side plate. The clamping of the clamping protrusion 11 and the clamping groove 222 can fix the circuit board body 1 to the heat dissipation device 2, improving the stability of the circuit board body 1 and preventing the circuit board body 1 from sliding relative to the heat dissipation device 2 during operation, which may affect the heat dissipation effect.

[0069] One end of the circuit board body 1 facing the heat dissipation device 2 is provided with a heat-generating convex portion 12, and one end of the housing 21 facing the circuit board body 1 is provided with a concave cavity 223. The heat-generating convex portion 12 is installed in the concave cavity 223, and the outer surface of the heat-generating convex portion 12 is in contact with the inner wall of the concave cavity 223.

[0070] As Figures 2-3As shown in Figures 5-7, the heat-generating convex portion 12 is engaged in the concave cavity 223, and the outer surface of the heat-generating portion is in contact with the inner wall of the concave cavity 223. While fixing the circuit board body 1 to the housing 21, the contact area between the housing 21 and the circuit board body 1 is increased, thereby increasing the heat dissipation area and improving the heat dissipation effect of the heat dissipation device 2, ensuring the stability of the operation of the circuit board body 1.

[0071] The concave cavity 223 is provided at one end of the first plate body 22 and the second plate body 23 away from the intermediate plate 24.

[0072] The above embodiments are only the preferred embodiments of the present invention, and do not limit the protection scope of the present invention accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present invention should be covered within the protection scope of the present invention.

Claims

1. A high-frequency heat dissipation circuit board, comprising two circuit board bodies (1) and a heat dissipation device (2) disposed between the two circuit board bodies (1), characterized in that, The heat dissipation device (2) includes: A housing (21) disposed between the two circuit board bodies (1). The housing (21) includes a first plate body (22) and a second plate body (23). The first plate body (22) and the second plate body (23) are disposed on both sides of the housing (21); An intermediate plate (24) disposed between the first plate body (22) and the second plate body (23). Stirring fans (242) are provided at both ends of the intermediate plate (24); A water circulation mechanism (25) disposed at one end of the housing (21). The water circulation mechanism (25) is inserted into the housing (21); Wherein, a first cavity (26) is formed between the first plate body (22) and the intermediate plate (24), a second cavity (27) is formed between the second plate body (23) and the intermediate plate (24). Water is provided in both the first cavity (26) and the second cavity (27). A circulation hole (241) is provided at one end of the intermediate plate (24) away from the water circulation mechanism (25). Heat conducting columns (221) are provided at one end of the first plate body (22) and the second plate body (23) facing the intermediate plate (24).

2. The high-frequency heat dissipation circuit board according to claim 1, wherein There are multiple heat conducting columns (221), and the heat conducting columns (221) are arranged in an array on the first plate body (22) and the second plate body (23).

3. The high-frequency heat dissipation circuit board according to claim 2, wherein There are multiple stirring fans (242), and the multiple stirring fans (242) are arranged in a staggered manner with the heat conducting columns (221).

4. The high-frequency heat dissipation circuit board according to claim 1, wherein The housing (21) further includes: An inlet (28) provided on the housing (21), and the inlet (28) is communicated with the first cavity (26); An outlet (29) provided on the housing (21), and the outlet (29) is communicated with the second cavity (27).

5. The high-frequency heat dissipation circuit board according to claim 4, characterized in that The water circulation mechanism (25) includes: A water pump (251) disposed outside the inlet (28), and one end of the water pump (251) is communicated with the inlet (28); A water storage tank (252) disposed outside the housing (21). One end of the water storage tank (252) is communicated with the outlet (29), and the other end is communicated with the water pump (251).

6. The high-frequency heat dissipation circuit board according to claim 1, wherein A clamping protrusion (11) is provided at one end of the circuit board body (1) facing the heat dissipation device (2). A clamping groove (222) matching with the clamping protrusion is provided on the housing (21), and the clamping protrusion (11) is clamped with the clamping groove (222).

7. The high-frequency heat dissipation circuit board according to claim 6, characterized in that, A heat generating convex portion (12) is provided at one end of the circuit board body (1) facing the heat dissipation device (2). A concave cavity (223) is provided at one end of the housing (21) facing the circuit board body (1). The heat generating convex portion (12) is installed in the concave cavity (223), and the outer surface of the heat generating convex portion (12) is in contact with the inner wall of the concave cavity (223).

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