Circuit board structure for efficiently testing power supply network

Abstract

The utility model discloses a circuit board structure for efficiently testing a power supply network, which comprises a test unit arranged around an element on a circuit board, the test unit comprises a power supply test point, a ground test point and a silk-screen identification area, and the power supply test point and the ground test point are arranged in the horizontal direction or the vertical direction; the silk-screen identification area comprises a first silk-screen ring and a second silk-screen ring, the first silk-screen ring is connected with the second silk-screen ring, the first silk-screen ring surrounds the periphery of the power supply test point, and the second silk-screen ring surrounds the periphery of the ground test point. According to the utility model, the power supply test point and the ground test point are packaged in one test unit and are matched with the clear silk-screen identification area, so that the positions of the power supply test point and the ground test point are adjacent, the test path is optimized through a horizontal or vertical layout mode, the moving and repositioning requirements in the test process are reduced, and the test efficiency is improved. The test steps are simplified, the test can be carried out quickly, the test error rate is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, and more specifically, to a circuit board structure for efficiently testing a power network. Background Art

[0002] A printed circuit board (PCB), also known as a printed wiring board, is an important part of the physical support and signal transmission of electronic products.

[0003] In circuit board design, key components need to have test points preset on the circuit board. The purpose is to test whether the components on the circuit board meet the specifications and solderability. Generally, the pads used for soldering surface-mounted components are not allowed to also serve as detection points, and dedicated test pads must be preset separately to ensure solder joint detection and production debugging.

[0004] Ground testing is an important part of circuit board testing. It involves measuring the impedance values between various points on the circuit board and the ground, including the power supply to ground impedance. The power supply to ground impedance is evaluated by measuring the resistance value between the power supply and the ground to assess the performance and safety of the power supply.

[0005] However, existing power supply test points and ground test points are usually preset on the circuit board as independent test elements. However, due to the layout habits of designers or limitations such as circuit board size and component layout, the power supply test points and ground test points are designed to be far apart. The scattered layout not only increases the length of the test path but may also affect the accuracy of the test results due to factors such as signal attenuation and interference. Summary of the Utility Model

[0006] In order to overcome the problem that existing power supply test points and ground test points are usually preset on the circuit board as independent test elements, and the distance between the power supply test points and the ground test points is far, which not only increases the length of the test path but may also affect the accuracy of the test results due to factors such as signal attenuation and interference, the utility model provides a circuit board structure for efficiently testing a power network.

[0007] The technical solution of the utility model is as follows:

[0008] A circuit board structure for efficiently testing a power network includes a test unit disposed around components on the circuit board. The test unit includes:

[0009] A power supply test point and a ground test point, and the power supply test point and the ground test point are arranged horizontally or vertically.

[0010] Silk-screen marking area, the silk-screen marking area includes a first silk-screen circle and a second silk-screen circle, the first silk-screen circle and the second silk-screen circle are connected, the first silk-screen circle encloses the periphery of the power test point, and the second silk-screen circle encloses the periphery of the ground test point.

[0011] For the present utility model according to the above solution, the first silk-screen circle is provided with a positive pole mark along the arrangement direction of the test unit, and the positive pole mark is provided at one end of the first silk-screen circle away from the ground test point.

[0012] For the present utility model according to the above solution, the second silk-screen circle is provided with a ground mark along the arrangement direction of the test unit, and the ground mark is provided at one end of the second silk-screen circle away from the power test point.

[0013] For the present utility model according to the above solution, a voltage value label is provided on the side of the silk-screen marking area.

[0014] For the present utility model according to the above solution, the power test point includes a power test pad, and a solder mask is provided around the power test pad.

[0015] For the present utility model according to the above solution, the ground test point includes a ground test pad, and a solder mask is provided around the ground test pad.

[0016] For the present utility model according to the above solution, the diameter of the power test pad is not less than 0.4 mm, and the diameter of the ground test pad is not less than 0.4 mm.

[0017] For the present utility model according to the above solution, the distance between the power test pad and the ground test pad is not less than 1.27 mm.

[0018] For the present utility model according to the above solution, the distance between the power test pad and the components on the circuit board is not less than 1 mm, and the distance between the ground test pad and the components on the circuit board is not less than 1 mm.

[0019] For the present utility model according to the above solution, the width of the silk-screen marking area is 2 mm.

[0020] For the present utility model according to the above solution, its beneficial effects are as follows. By encapsulating the power test point and the ground test point in a test unit and equipping it with a clear silk-screen marking area, the two test points of the power test point and the ground test point are adjacent in position. Also, the test path is optimized through horizontal or vertical layout methods, reducing the need for movement and repositioning during the test process, simplifying the test steps, enabling rapid testing, while reducing the test error rate and improving production efficiency. Description of the Drawings

[0021] Figure 1Schematic diagram of the structure of the present utility model;

[0022] Figure 2 Schematic diagram of the structure of the test unit of the present utility model.

[0023] In the figure, each reference numeral is as follows:

[0024] 100, circuit board; 10, power test point; 11, power test pad; 20, ground test point; 21, ground test pad; 30, silk screen marking area; 31, first silk screen circle; 32, second silk screen circle; 33, positive pole marking; 34, ground marking; 35, voltage value reference numeral. Detailed implementation manner

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0026] It should be noted that the terms "including" and "having" in the description and claims of the present utility model and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include steps or units not listed, or may optionally further include other steps or units inherent to these processes, methods, products or devices. Terms such as "arranged" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. The orientations or positions indicated by terms such as "upper", "lower", "left", "right", "front", "rear", "bottom" are based on the orientations or positions shown in the drawings, and are only for the convenience of description and cannot be understood as a limitation to the technical solution of the present application.

[0027] It should be noted that existing power test points and ground test points are usually preset on the circuit board as independent test elements respectively. However, due to the layout habits of designers or limited by factors such as the circuit board size and component layout, the power test points and ground test points are designed to be far apart. The scattered layout not only increases the length of the test path, but also may affect the accuracy of the test results due to factors such as signal attenuation and interference.

[0028] From the perspective of production debugging, the scattered test point layout also poses challenges to fault troubleshooting. When there are performance problems with the circuit board, technicians need to test each test point one by one to locate the fault source. If the distance between the test points is far, it not only increases the test steps and difficulty, but also may lead to misdiagnosis or missed detection due to the inconsistency of the test path.

[0029] As shown Figure 1 - Figure 2 in the figure, this embodiment provides a circuit board structure for efficiently testing a power network. By encapsulating a power test point 10 and a ground test point 20 in a test unit and providing a clear silk-screen identification area 30, the two test points, i.e., the power test point 10 and the ground test point 20, are not only adjacent in position but also optimize the test path through a horizontal or vertical layout, reducing the need for movement and repositioning during the test, simplifying the test steps, enabling quick power testing, reducing the test error rate, and improving production efficiency.

[0030] Specifically, the circuit board structure for efficiently testing a power network includes test units disposed around components on the circuit board 100. The test unit includes a power test point 10, a ground test point 20, and a silk-screen identification area 30. The power test point 10 and the ground test point 20 are arranged in a horizontal direction or a vertical direction; the silk-screen identification area 30 includes a first silk-screen circle 31 and a second silk-screen circle 32. The first silk-screen circle 31 and the second silk-screen circle 32 are connected. The first silk-screen circle 31 encloses the periphery of the power test point 10, and the second silk-screen circle 32 encloses the periphery of the ground test point 20.

[0031] The connection of the first silk-screen circle 31 and the second silk-screen circle 32 not only forms a visual unity and coherence but also clearly defines the position ranges of the power test point 10 and the ground test point 20, enabling testers to quickly and accurately locate the test points by visual inspection without relying on complex drawings or complex measuring tools, thus greatly reducing the test error rate.

[0032] In one embodiment, a positive-pole identification 33 is provided on the first silk-screen circle 31 along the arrangement direction of the test unit. The positive-pole identification 33 is disposed at one end of the first silk-screen circle 31 away from the ground test point 20, effectively avoiding mismeasurement or missing measurement caused by confusion during the test, enabling engineers to quickly identify the power test point 10 during testing or maintenance, greatly reducing operation errors caused by confusion, and significantly improving the test accuracy.

[0033] A ground identification 34 is provided on the second silk-screen circle 32 along the arrangement direction of the test unit. The ground identification 34 is disposed at one end of the second silk-screen circle 32 away from the power test point 10, enabling engineers to quickly identify the ground test point 20 during testing or maintenance, greatly reducing operation errors caused by confusion.

[0034] There is a voltage value reference number 35 on the side of the screen printing identification area 30. Using the voltage value reference number 35 to replace the traditional reference number enables the tester to quickly identify the voltage network represented by the test point without relying on external documents, effectively and quickly determine the networks represented by two test points, and improve the efficiency of design and testing. The innovation of introducing the voltage value reference number 35 as the test point identification provides a standard for voltage testing in different design projects.

[0035] In one embodiment, the power supply test point 10 includes a power supply test pad 11, and there is solder mask around the power supply test pad 11, effectively preventing short circuits and mis-welding during the soldering process, enhancing the electrical safety of the circuit board 100 and the reliability of testing. The ground test point 20 includes a ground test pad 21, and there is solder mask around the ground test pad 21, effectively preventing short circuits and mis-welding during the soldering process, enhancing the electrical safety of the circuit board 100 and the reliability of testing.

[0036] The diameter of the power supply test pad 11 is not less than 0.4 mm, and the diameter of the ground test pad 21 is not less than 0.4 mm. The diameters of both the power supply test pad 11 and the ground test pad 21 are 39 mil. The standardization of the power supply test pad 11 and the ground test pad 21 enables the test probe to easily and stably contact the pads without the need to frequently replace or adjust the probe, thus greatly improving the test efficiency.

[0037] The distance between the power supply test pad 11 and the ground test pad 21 is not less than 1.27 mm, avoiding mis-contact during testing and ensuring the accuracy of testing. The distances between the power supply test point 10 and the ground test point 20 and the edge of the circuit board 100 are greater than 5 mm, providing sufficient space for the positioning and operation of the test equipment, further enhancing the test speed. The power supply test point 10 and the ground test point 20 cannot be covered by solder mask or text ink. The power supply test pad 11 and the ground test pad 21 are made of a metal with a relatively soft texture, easy to penetrate, and not easily oxidized, and are plated with solder, enabling the test probe to easily penetrate the oxide layer and form a good electrical connection with the pad, reducing the risk of poor contact and ensuring the accuracy of testing. Or to ensure reliable grounding and extend the service life of the probe.

[0038] The power supply test point 10 and the ground test point 20 need to be placed more than 3.2 mm outside the circular ring of the positioning hole, and precise positioning is carried out using non-metallized holes, and the positioning hole error is controlled within ±0.05 mm, ensuring that the test equipment can accurately align with the test points during the testing process, reducing test errors, and improving the reliability of testing.

[0039] The distance between the power test pad 11 and the components on the circuit board 100 is not less than 1 mm, and the distance between the ground test pad 21 and the components on the circuit board 100 is not less than 1 mm. This ensures that there is sufficient space between the power test pad 11, the ground test pad 21 and any components (such as resistors, capacitors, IC chips, etc.) on the circuit board 100. It can prevent unnecessary interference or damage to the components during the test due to the contact of the test probe or the current change on the circuit board 100.

[0040] The width of the silk screen marking area 30 is 2 mm, which avoids the test points being too close to the components on the circuit board 100.

[0041] It should be understood that those of ordinary skill in the art can make improvements or transformations according to the above description, and all such improvements and transformations shall fall within the protection scope of the appended claims of the present utility model.

[0042] The above has made an exemplary description of the patent of the present utility model in conjunction with the accompanying drawings. Obviously, the implementation of the patent of the present utility model is not limited by the above methods. As long as various improvements are made by adopting the method concept and technical solution of the patent of the present utility model, or the concept and technical solution of the patent of the present utility model are directly applied to other occasions without improvement, they are all within the protection scope of the present utility model.

Claims

1. A circuit board structure for efficiently testing a power network, characterized in that, It includes test units arranged around components on a circuit board, and the test units include: A power test point and a ground test point, and the power test point and the ground test point are arranged horizontally or vertically. A silk screen marking area, which includes a first silk screen circle and a second silk screen circle. The first silk screen circle and the second silk screen circle are connected. The first silk screen circle encloses the periphery of the power test point, and the second silk screen circle encloses the periphery of the ground test point.

2. The circuit board structure for efficiently testing a power supply network according to claim 1, characterized in that, The first silk screen circle is provided with a positive pole marking along the arrangement direction of the test unit, and the positive pole marking is arranged at one end of the first silk screen circle far from the ground test point.

3. The circuit board structure for efficiently testing a power network according to claim 1 or 2, characterized in that, The second silk screen circle is provided with a ground marking along the arrangement direction of the test unit, and the ground marking is arranged at one end of the second silk screen circle far from the power test point.

4. The circuit board structure for efficiently testing a power supply network according to claim 3, characterized in that, A voltage value reference numeral is arranged on the side of the silk screen marking area.

5. The circuit board structure for efficiently testing a power supply network according to claim 1, characterized in that, The power test point includes a power test pad, and solder mask is arranged around the power test pad.

6. The circuit board structure for efficiently testing a power supply network according to claim 5, characterized in that, The ground test point includes a ground test pad, and solder mask is arranged around the ground test pad.

7. The circuit board structure for efficiently testing a power supply network according to claim 6, characterized in that, The diameter of the power test pad is not less than 0.4 mm, and the diameter of the ground test pad is not less than 0.4 mm.

8. The circuit board structure for efficiently testing a power network according to claim 6 or 7, characterized in that, The distance between the power test pad and the ground test pad is not less than 1.27 mm.

9. The circuit board structure for efficiently testing a power network according to claim 8, wherein The distance between the power test pad and the components on the circuit board is not less than 1 mm, and the distance between the ground test pad and the components on the circuit board is not less than 1 mm.

10. The circuit board structure for efficiently testing a power supply network according to claim 1, characterized in that, The width of the silk screen marking area is 2 mm.

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