Small-spacing mini LED lamp panel etching structure
By setting the sheep horn structure at the corners of the PAD bits of the miniLED lamp board, the PAD spacing and edges are solved, and the PAD spacing and higher manufacturing accuracy is achieved, and the welding reliability is improved. It is suitable for miniaturization and high-density applications.
Patent Information
- Application Number
- CN202422402694.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-09-30
AI Technical Summary
The PAD spacing of existing miniLED lamp panels is difficult to reach 50±15um or less, and the PAD edges are obviously arc-shaped after etching, which affects welding reliability and high-density applications.
The sheep horn structure is set on the two corners of the PAD position. By blocking the exchange of some potions during the etching process, a smaller welding PAD spacing is formed, and the edges and corners are approached by a right-angle triangle. The sheep horn structure is adopted to improve processing convenience and etching uniformity.
It achieves smaller welding PAD spacing and higher manufacturing accuracy, improves the reliability of welding PAD and adapts to the needs of miniaturization and high-density applications.
Smart Images
Figure CN223157293U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of miniLED lamp boards, and in particular to an etching structure of a small-pitch miniLED lamp board. Background Art
[0002] The miniLED light board has requirements for the GAP (spacing) between PADs on the lamp surface, which is generally required to be 60±15um. As the light-emitting chips of the miniLED lamp surface become smaller and smaller, the GAP spacing needs to be 50±15um, or even 45±15um. This requires not only better dry film and etching capabilities, but also special design of the lamp surface PAD. The edges of the existing lamp surface PAD are right angles. After etching, the corners of the PAD are obviously arc-shaped, and it is difficult to reduce the spacing from 60±15um to 50±15um. Utility Model Content
[0003] The utility model aims to provide a small-pitch miniLED lamp board etching structure with a simple structure and suitable for small-volume light-emitting chips.
[0004] A small-pitch miniLED lamp board etching structure includes a substrate, a copper layer is provided on the substrate, a solder mask is provided on the copper layer, a solder mask window is opened on the solder mask layer to expose the copper layer, the copper layer between the two side grooves on the solder mask window constitutes a PAD position, and the two corners of the PAD position are provided with a horn structure.
[0005] In the above scheme, there are spacing requirements for the PAD position on the copper layer of this part of the solder mask window. A ram's horn structure is set on the two corners of the PAD position, which will block part of the solution exchange during the etching process, so that the formed welding PAD spacing can be made smaller, so as to adapt to smaller light-emitting chips. In addition, the ram's horn structure can protect the corners of the PAD position, so that the etched welding PAD corners are close to a right angle state, avoiding the obvious arc shape of the welding PAD corners after etching, thereby improving the reliability of the welding PAD.
[0006] Furthermore, the ram's horn structure is a right triangle, and the ram's horn structure includes a long right-angled side, a short right-angled side and a hypotenuse connected end to end.
[0007] In the above scheme, the right-angled triangle horn structure is convenient for processing, and the long right-angled side and the segment right-angled side are respectively integrated with the horizontal and vertical sides of the PAD corners. Such a horn structure can ensure that the corners of the welded PAD after etching are close to a right angle state, avoiding the rounded corners caused by etching. The right-angle edge design makes the welding point tighter, which helps to achieve higher manufacturing precision in high-resolution and high-density application scenarios.
[0008] Further, the length of the long right-angled side is 2 mil.
[0009] In the above solution, 2 mil is approximately 50.8 micrometers. The design of the 2-mil long right-angled side helps to better control the exchange and flow rate of the etching solution during the etching process, thereby achieving a more uniform etching effect. This reduces the defects caused by uneven etching and ensures that the corners of the welding PAD approach a right-angled state.
[0010] Further, the length of the short right-angled side is 0.3 mil.
[0011] In the above solution, 0.3 mil is approximately 7.62 micrometers. It forms a horn structure with the 2-mil long right-angled side, making the corners of the welding PAD approach a right-angled state after etching and avoiding the rounded corners caused by etching.
[0012] Further, the thickness of the copper layer is 17 ± 3 um.
[0013] In the above solution, in order to ensure that the finished surface copper of the miniLED lamp board is ≥ 10 um and to ensure that the spacing between the welding PADs after etching meets the requirements, the thickness of the copper layer after electroplating is set to 17 ± 3 um.
[0014] Further, a dry film is covered on the PAD position.
[0015] In the above solution, the dry film covered on the copper layer PAD position is cured by exposure. The dry film on other positions that do not require copper is not exposed. After the unexposed dry film is developed, the copper layer at the positions that do not require copper is etched. Due to the horn structure, the corners of the welding PAD approach a right-angled state after etching.
[0016] Further, the spacing between the welding PADs formed by etching two PAD positions with the horn structure is smaller than the spacing between the welding PADs formed by etching PAD positions without the horn structure.
[0017] In the above solution, the horn structure is used to reduce the spacing between the welding PADs, improving the overall performance of the LED lamp board and enabling the product to better meet the market's demand for miniaturized, high-density, and high-performance products.
[0018] The utility model has a small pitch miniLED lamp board etching structure with a simple structure and is suitable for small-volume light-emitting chips. There are spacing requirements for the PAD position on the copper layer of the solder mask window. A ram horn structure is set on the two corners of the PAD position, which will block part of the solution exchange during the etching process, so that the formed welding PAD spacing can be made smaller, so as to adapt to smaller light-emitting chips, and the ram horn structure can protect the corners of the PAD position, so that the etched welding PAD corners are close to a right angle state, avoiding the obvious arc shape of the welding PAD corners after etching, and improving the reliability of the welding PAD. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is a design diagram of the etching structure of a small-pitch miniLED light board according to an embodiment.
[0020] Figure 2 This is a design diagram of the PAD position and horn structure of an embodiment.
[0021] Figure 3 FIG. 4 is a schematic diagram of the dry film position according to an embodiment of the present invention.
[0022] Figure 4 Schematic diagram of a welding PAD formed by etching a PAD without a horn structure according to an embodiment.
[0023] Figure 5 Schematic diagram of a welding PAD formed by etching a PAD with a horn structure according to an embodiment.
[0024] Explanation of the accompanying drawings: 1. Copper layer; 2. Through groove; 3. PAD position; 4. Claw structure; 41. Short right-angle side; 42. Long right-angle side; 43. Beveled edge; 5. Dry film; 6. Welding PAD. DETAILED DESCRIPTION
[0025] The etching structure of a small-pitch miniLED lamp board of the utility model will be further described in detail below in conjunction with specific embodiments and drawings.
[0026] like Figures 1 to 5As shown, in a preferred embodiment, a small-pitch miniLED lamp board etching structure of the utility model includes a substrate, a copper layer 1 is provided on the substrate, a solder mask is provided on the copper layer 1, a solder mask window is opened on the solder mask to expose the copper layer 1, the copper layer 1 between the through grooves 2 on both sides of the solder mask window constitutes a PAD position 3, and a horn structure 4 is provided at two corners of the PAD position 3. There are spacing requirements for the PAD position 3 on the copper layer 1 in the solder mask window, and the horn structure 4 is provided at the two corners of the PAD position 3. During the etching process, part of the liquid medicine exchange is blocked, so that the spacing of the formed welding PAD6 can be made smaller, so as to adapt to a smaller light-emitting chip, and the horn structure 4 can protect the corners of the PAD position 3, so that the etched welding PAD6 corners approach a right angle state, avoiding the obvious arc shape of the welding PAD6 corners after etching, and improving the reliability of the welding PAD6.
[0027] like Figure 1 and Figure 2 As shown, in some embodiments, the horn structure 4 is in a right-angled triangle, and the horn structure 4 includes a long right-angled side 42, a short right-angled side 41 and a hypotenuse 43 connected end to end. The right-angled triangle horn structure 4 is easy to process, and the long right-angled side 42 and the segment right-angled side are respectively integrated with the horizontal side and the vertical side of the corner of the PAD position 3. Such a horn structure 4 can ensure that the corners of the welded PAD 6 after etching are close to a right angle state, avoiding the rounded corners caused by etching, and the right-angle edge design makes the welding point more compact, which helps to achieve higher manufacturing accuracy in high-resolution and high-density application scenarios.
[0028] like Figure 1 and Figure 2 As shown, in some embodiments, the length of the long right-angle side 42 is 2 mil. 2 mil is about 50.8 microns. The design of the long right-angle side 42 of 2 mil helps the horn structure 4 to better control the exchange and flow rate of the solution during the etching process, thereby achieving a more uniform etching effect, which reduces the defects caused by uneven etching and ensures that the corners of the welding PAD 6 are close to a right angle state.
[0029] like Figure 1 and Figure 2 As shown, in some embodiments, the length of the short right-angle side 41 is 0.3 mil, which is about 7.62 microns, and the long right-angle side 42 of 2 mil, which is about 50.8 microns, forms a horn structure 4, so that the corners of the welded PAD 6 after etching are close to a right angle state, avoiding the rounded corners caused by etching.
[0030] like Figure 1 and Figure 2As shown, in some embodiments, the thickness of the copper layer 1 is 17 ± 3 um. To ensure that the finished surface copper of the mini LED lamp board is ≥ 10 um and to ensure that the spacing between the soldering PADs 6 after etching meets the requirements, the thickness of the copper layer 1 after electroplating is set to 17 ± 3 um.
[0031] As Figure 3 shown, in some embodiments, a dry film 5 is covered on the PAD 3. The dry film 5 covered on the PAD 3 of the copper layer 1 is cured by exposure. The dry film 5 at other positions where copper is not required is not exposed. After the unexposed dry film 5 is developed, the copper layer 1 at the positions where copper is not required is etched. Due to the horn structure 4, the corners of the soldering PAD 6 approach a right-angled state after etching.
[0032] As Figure 4 and Figure 5 shown, the spacing between the soldering PADs 6 formed by etching two PADs 3 provided with the horn structure 4 is smaller than the spacing between the soldering PADs 6 formed by etching the PADs 3 without the horn structure 4. By means of the horn structure 4, the reduction of the spacing of the soldering PAD 6 is realized, improving the overall performance of the LED lamp board and enabling the product to better meet the market requirements for miniaturized, high-density, and high-performance products. Figure 4 The spacing between the two soldering PADs 6 in Figure 5 is 61.2 um, and
[0033] For the working principle and process of the etching structure of a small-pitch mini LED lamp board of the present utility model, a copper layer 1 is provided on a substrate, a solder mask layer is provided on the copper layer 1, a solder mask window exposing the copper layer 1 is opened on the solder mask layer, the copper layer 1 between the two through slots 2 on the solder mask window constitutes the PAD 3, and the two corners of the PAD 3 are provided with a horn structure 4 in the shape of a right-angled triangle. The dry film 5 is covered on the PAD 3 and cured by exposure. The dry film 5 at other positions where copper is not required is not exposed. After the unexposed dry film 5 is developed, the copper layer 1 at the positions where copper is not required is etched. Due to the horn structure 4, the corners of the soldering PAD 6 approach a right-angled state after etching. Finally, the exposed dry film 5 is removed.
[0034] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.
[0035] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more, unless otherwise specifically defined.
[0036] In the present utility model, unless otherwise clearly specified and defined, terms such as "installed", "connected", "joined", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0037] Although the description of the present utility model is made in conjunction with the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications and variations based on the above content. Therefore, all such substitutions, improvements and variations are included within the spirit and scope of the appended claims.
Claims
1. A small-pitch mini-LED lamp board etching structure, characterized in that, It includes a substrate, on which a copper layer (1) is provided. An anti-solder layer is provided on the copper layer (1), and an anti-solder window exposing the copper layer (1) is formed on the anti-solder layer. The copper layer (1) between the two side grooves (2) on the anti-solder window constitutes a PAD position (3), and a ram's horn structure (4) is provided at two corners of the PAD position (3).
2. The etching structure of the small-pitch miniLED light board according to claim 1, wherein The ram's horn structure (4) is in the shape of a right triangle, and the ram's horn structure (4) includes a long right-angled side (42), a short right-angled side (41) and a hypotenuse (43) connected end to end.
3. The etching structure of the small-pitch mini-LED light board according to claim 2, wherein, The length of the long right-angled side (42) is 2 mil.
4. The etched structure of the small-pitch mini-LED light board according to claim 3, characterized in that, The length of the short right-angled side (41) is 0.3 mil.
5. The etching structure of the small-pitch mini-LED light board according to claim 1, wherein The thickness of the copper layer (1) is 17 ± 3 um.
6. The etching structure of the small-pitch mini-LED light board according to claim 1, wherein A dry film (5) is covered on the PAD position (3).
7. The etched structure of the small-pitch mini-LED light board according to claim 1, wherein The distance between the solder pads (6) etched from two PAD positions (3) provided with the ram's horn structure (4) is smaller than the distance between the solder pads (6) etched from the PAD positions (3) without the ram's horn structure (4).