Via hole structure applied to photovoltaic energy storage and automobile electronic controller circuit board
By designing the via structures of the pin zone, the first auxiliary zone and the second auxiliary zone, the heat dissipation and welding problems of high-power electronic devices are solved, and the solder joint strength and overcurrent capability are improved.
Patent Information
- Application Number
- CN202421701749.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-17
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-07-17
AI Technical Summary
In the prior art, the pin heat capacity of high-power electronic devices is large, the through-holes is insufficient, and the heat dissipation is fast. It is difficult to ensure the fullness of the solder joint during wave soldering, resulting in insufficient overcurrent capability.
A via structure is designed, including a pin region, a first auxiliary region and a second auxiliary region, the pin region is placed in the limit region, the auxiliary region shape matches the pin, the pad region surrounds the main via, and increases the amount of tin inrush to improve solder joint strength and heat dissipation efficiency.
It realizes fast and accurate plug-in of high-power electronic device pins, and the solder tightly wraps the pins, enhancing solder joint strength and overcurrent capability, and improving heat dissipation efficiency.
Smart Images
Figure CN223157299U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, and more specifically, to a via structure applied to circuit boards of photovoltaic energy storage and automotive electronic controllers. Background Art
[0002] In the field of new energy photovoltaic energy storage controllers or automotive electronic controllers, due to their high power requirements, high-power electronic devices in the circuit designs of the above fields will generate extremely high temperatures when powered on. Circuit wiring technicians often increase the pad area of the electronic devices for high-power electronic devices to improve the heat dissipation efficiency of the electronic devices, and at the same time, it can also improve the over-current capacity of the electronic devices.
[0003] Most high-power electronic devices use plug-in packaging, and the cross-section of their pins is not a regular circle, but a flat shape with a certain thickness. For the via structure of electronic devices on the above circuit boards, the prior art only designs vias that match the shape and size of the pins of the electronic devices. The defect is that the pins of the electronic devices have a large heat capacity, insufficient soldering on the vias, fast heat dissipation, and there are certain difficulties in the solder joint fullness and via soldering during wave soldering. Summary of the Utility Model
[0004] To solve the above one or more technical problems, the purpose of the utility model is to provide a via structure for the pins of high-power electronic devices applied to circuit boards of new energy photovoltaic energy storage and automotive electronic controllers.
[0005] The technical solution adopted by the utility model to solve the problem is as follows:
[0006] A via structure applied to circuit boards of photovoltaic energy storage and automotive electronic controllers. The circuit board belongs to a double-sided board. The over-current of the electronic devices applicable to the via is greater than 200A. The circuit board is provided with main vias and pad areas. The main vias include a pin area, a first auxiliary area, and a second auxiliary area. The pad area surrounds the main vias;
[0007] The shape and size of the pin area match the cross-sectional shape and size of the pins of the electronic devices. There are two first auxiliary areas, which are symmetrically arranged on the upper and lower sides of the pin area respectively. The second auxiliary area is sequentially set as a left bow area, a limiting area, and a right bow area from left to right. The pin area is placed in the limiting area. The center position of the pin area coincides with the center position of the limiting area. The area of the limiting area is slightly larger than the area of the pin area. The left bow area and the right bow area are symmetrically arranged on the left and right sides of the limiting area respectively.
[0008] As a further improvement of the above technical solution, both the pin area and the limiting area are rectangular in shape. The length of the pin area is greater than 4.7 mm, the width of the pin area is greater than 2 mm, and each corner of the pin area is provided with a rounded chamfer.
[0009] As a further improvement of the above technical solution, the first auxiliary area is bow-shaped. The center of the outer arc of the first auxiliary area coincides with the center of the pin area. The diameter of the outer arc of the first auxiliary area is set to the sum of the width of the pin area and the first parameter, and the setting range of the first parameter is from 1.6 mm to 2 mm.
[0010] As a further improvement of the above technical solution, the length of the limiting area of the second auxiliary area is the same as the length of the pin area. The width of the limiting area of the second auxiliary area is set to the sum of the width of the pin area and the second parameter, and the setting range of the second parameter is from 0.4 mm to 0.6 mm.
[0011] As a further improvement of the above technical solution, the upper ends of the left bow-shaped area and the right bow-shaped area are flush with the upper end of the limiting area, and the lower ends of the left bow-shaped area and the right bow-shaped area are flush with the lower end of the limiting area.
[0012] As a further improvement of the above technical solution, the length from the left end to the right end of the second auxiliary area is set to the sum of the length of the pin area and the third parameter, and the setting range of the third parameter is from 0.8 mm to 1 mm.
[0013] As a further improvement of the above technical solution, the distance from the left end to the right end of the pad area is set in the range of 8 mm to 9.5 mm, and the distance from the upper end to the lower end of the pad area is set in the range of 5 mm to 6.5 mm.
[0014] As a further improvement of the above technical solution, the shape formed by the outer edge of the pad area and the shape formed by the main via hole edge are in a relationship equivalent to scaling based on the main via hole edge with the center of the main via hole as the base point.
[0015] As a further improvement of the above technical solution, a plurality of auxiliary vias are provided in the pad area, and the aperture of the auxiliary vias is from 0.7 mm to 0.8 mm.
[0016] The beneficial effects of the present utility model are as follows: In this technical solution, a pin area, a first auxiliary area, and a second auxiliary area are configured for the main vias of high-power electronic device pins. There are two first auxiliary areas, which are symmetrically arranged on the upper and lower sides of the pin area respectively. The second auxiliary area is sequentially set as a left arcuate area, a limiting area, and a right arcuate area from left to right. The pin area is placed within the limiting area, and the area of the limiting area is slightly larger than that of the pin area. The left arcuate area and the right arcuate area are symmetrically arranged on the left and right sides of the limiting area respectively. Through the above settings of the vias in this technical solution, it can not only ensure that the pins of high-power electronic devices can be quickly and accurately inserted into the vias, but also increase the amount of solder flowing in the vias during the soldering process, enabling the solder to tightly wrap the pins of the electronic devices, increasing the solder joint strength, enhancing the current-carrying capacity, and being beneficial to improving the heat dissipation efficiency of the electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The present utility model will be further explained below in conjunction with the drawings and specific embodiments.
[0018] Figure 1 is a schematic structural diagram of the main via in the present utility model;
[0019] Figure 2 is a schematic structural diagram of the pin area and the first auxiliary area in the present utility model;
[0020] Figure 3 is a schematic structural diagram of the pin area and the second auxiliary area in the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0021] This part will describe the specific embodiments of the present utility model in detail. The preferred embodiments of the present utility model are shown in the drawings. The role of the drawings is to supplement the description in the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but it cannot be understood as a limitation on the protection scope of the present utility model.
[0022] In the description of the present utility model, it should be understood that for the orientation description, such as the upper, lower, front, rear, left, right, etc., the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model.
[0023] In the description of the present utility model, the meaning of "several" is one or more, the meaning of "multiple" is more than two, and understandings such as "greater than", "less than", "exceeding", etc. do not include the corresponding number, while understandings such as "above", "below", "within", etc. include the corresponding number. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.
[0024] In the description of the present utility model, unless otherwise clearly defined, terms such as "arrangement", "installation", "connection", etc. should be understood in a broad sense, and those skilled in the technical field can reasonably determine the specific meanings of the above terms in the present utility model in combination with the specific content of the technical solution.
[0025] Referring to Figures 1 to 3 , this application discloses a via structure applied to a circuit board for photovoltaic energy storage and automotive electronic controllers. The circuit board belongs to a double-sided board, and the via is applicable to electronic devices with an overcurrent greater than 200A. In the first embodiment of the via structure of this application, the circuit board is provided with a main via and a pad area 400, the main via includes a pin area 100, a first auxiliary area 200, and a second auxiliary area 300, and the pad area 400 surrounds the main via;
[0026] The shape and size of the pin area 100 match the cross-sectional shape and size of the pins of the electronic device. There are two first auxiliary areas 200, which are symmetrically arranged on the upper and lower sides of the pin area 100 respectively. The second auxiliary area 300 is sequentially set as a left arcuate area 310, a limiting area 320, and a right arcuate area 330 from left to right. The pin area 100 is placed within the limiting area 320, the central position of the pin area 100 coincides with the central position of the limiting area 320, the area of the limiting area 320 is slightly larger than the area of the pin area 100, and the left arcuate area 310 and the right arcuate area 330 are symmetrically arranged on the left and right sides of the limiting area 320 respectively.
[0027] Specifically, in this embodiment, the pin area 100, the first auxiliary area 200, and the second auxiliary area 300 are configured for the main vias of the high-power electronic device pins. There are two first auxiliary areas 200, which are symmetrically arranged on the upper and lower sides of the pin area 100 respectively. The second auxiliary area 300 is sequentially set as a left arcuate area 310, a limiting area 320, and a right arcuate area 330 from left to right. The pin area 100 is placed within the limiting area 320, and the area of the limiting area 320 is slightly larger than the area of the pin area 100. The left arcuate area 310 and the right arcuate area 330 are symmetrically arranged on the left and right sides of the limiting area 320 respectively. Through the above settings of the vias in this embodiment, it can not only ensure that the pins of the high-power electronic device can be quickly and accurately inserted into the vias, but also increase the amount of solder flowing into the vias during the welding process, enabling the solder to tightly wrap the pins of the electronic device, increasing the solder joint strength, enhancing the current-carrying capacity, and being beneficial to improving the heat dissipation efficiency of the electronic device.
[0028] Further as a preferred embodiment, in this embodiment, both the pin area 100 and the limiting area 320 are rectangular in shape. The length of the pin area 100 is greater than 4.7 mm, the width of the pin area 100 is greater than 2 mm, and each corner of the pin area 100 is provided with a rounded chamfer.
[0029] Further as a preferred embodiment, in this embodiment, the first auxiliary area 200 is arcuate in shape. The center of the outer arc of the first auxiliary area 200 coincides with the center of the pin area 100. The diameter of the outer arc of the first auxiliary area 200 is set as the sum of the width of the pin area 100 and the first parameter. The setting range of the first parameter is from 1.6 mm to 2 mm.
[0030] Further as a preferred embodiment, in this embodiment, the length of the limiting area 320 of the second auxiliary area 300 is the same as the length of the pin area 100. The width of the limiting area 320 of the second auxiliary area 300 is set as the sum of the width of the pin area 100 and the second parameter. The setting range of the second parameter is from 0.4 mm to 0.6 mm.
[0031] Further as a preferred embodiment, in this embodiment, the upper ends of the left arcuate area 310 and the right arcuate area 330 are flush with the upper end of the limiting area 320, and the lower ends of the left arcuate area 310 and the right arcuate area 330 are flush with the lower end of the limiting area 320.
[0032] As a further preferred embodiment, in this embodiment, the length from the left end to the right end of the second auxiliary area 300 is set to be the sum of the length of the pin area 100 and a third parameter, and the third parameter ranges from 0.8 mm to 1 mm.
[0033] As a further preferred embodiment, in this embodiment, the distance from the left end to the right end of the pad area 400 ranges from 8 mm to 9.5 mm, and the distance from the upper end to the lower end of the pad area 400 ranges from 5 mm to 6.5 mm.
[0034] As a further preferred embodiment, in this embodiment, the shape formed by the outer edge of the pad area 400 and the shape formed by the main via hole edge are in a relationship equivalent to scaling based on the main via hole edge with the center of the main via hole as the reference point.
[0035] As a further preferred embodiment, in this embodiment, a plurality of auxiliary vias 410 are provided in the pad area 400, and the aperture of the auxiliary via 410 ranges from 0.7 mm to 0.8 mm. By providing the auxiliary vias 410, the tin amount of the vias and the pad area 400 can be further increased, and the heat dissipation efficiency during the energization of high-power electronic devices can be further improved.
[0036] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.
Claims
1. A via structure applied to a circuit board for photovoltaic energy storage and automotive electronic controllers. The circuit board is a double-sided board, and the overcurrent of the electronic devices applicable to this via is greater than 200A. It is characterized in that: The circuit board is provided with a main via hole and a pad area (400). The main via hole includes a pin area (100), a first auxiliary area (200), and a second auxiliary area (300). The pad area (400) surrounds the main via hole. The shape and size of the pin area (100) match the cross-sectional shape and size of the pins of the electronic device. There are two first auxiliary areas (200), which are symmetrically arranged on the upper and lower sides of the pin area (100) respectively. The second auxiliary area (300) is successively set as a left arcuate area (310), a limiting area (320), and a right arcuate area (330) from left to right. The pin area (100) is placed within the limiting area (320). The central position of the pin area (100) coincides with the central position of the limiting area (320). The area of the limiting area (320) is slightly larger than the area of the pin area (100). The left arcuate area (310) and the right arcuate area (330) are symmetrically arranged on the left and right sides of the limiting area (320) respectively.
2. The via structure applied to the circuit board of photovoltaic energy storage and automotive electronic controller according to claim 1, wherein: Both the pin area (100) and the limiting area (320) are rectangular in shape. The length of the pin area (100) is greater than 4.7 mm, the width of the pin area (100) is greater than 2 mm, and each corner of the pin area (100) is provided with a rounded chamfer.
3. The via structure applied to the circuit board of photovoltaic energy storage and automotive electronic controller according to claim 1, characterized in that: The first auxiliary area (200) is arcuate in shape. The center of the outer arc of the first auxiliary area (200) coincides with the center of the pin area (100). The diameter of the outer arc of the first auxiliary area (200) is set as the sum of the width of the pin area (100) and a first parameter. The setting range of the first parameter is from 1.6 mm to 2 mm.
4. The via structure applied to the circuit board of photovoltaic energy storage and automotive electronic controller according to claim 2, wherein: The length of the limiting area (320) of the second auxiliary area (300) is the same as the length of the pin area (100). The width of the limiting area (320) of the second auxiliary area (300) is set as the sum of the width of the pin area (100) and a second parameter. The setting range of the second parameter is from 0.4 mm to 0.6 mm.
5. The via structure for a photovoltaic energy storage and automotive electronic controller circuit board according to claim 4, characterized in that: The upper ends of the left arcuate area (310) and the right arcuate area (330) are flush with the upper end of the limiting area (320), and the lower ends of the left arcuate area (310) and the right arcuate area (330) are flush with the lower end of the limiting area (320).
6. The via structure applied to the circuit board of photovoltaic energy storage and automotive electronic controller according to claim 5, wherein: The length from the left end to the right end of the second auxiliary area (300) is set as the sum of the length of the pin area (100) and a third parameter. The setting range of the third parameter is from 0.8 mm to 1 mm.
7. The via structure applied to the circuit board of a photovoltaic energy storage and automotive electronic controller according to claim 1, wherein: The distance from the left end to the right end of the pad area (400) is set in the range of 8 mm to 9.5 mm, and the distance from the upper end to the lower end of the pad area (400) is set in the range of 5 mm to 6.5 mm.
8. The via structure applied to the circuit board of photovoltaic energy storage and automotive electronic controller according to claim 7, wherein: The relationship between the shape formed by the outer edge of the pad area (400) and the shape formed by the edge of the main via hole is equivalent to scaling based on the edge of the main via hole with the center of the main via hole as the base point.
9. The via structure applied to the circuit board of photovoltaic energy storage and automotive electronic controller according to claim 8, characterized in that: A plurality of auxiliary vias (410) are provided in the pad region (400), and the aperture of the auxiliary via (410) is 0.7 mm to 0.8 mm.