High-frequency low-noise amplifier structure

Abstract

The utility model relates to the technical field of amplifiers, in particular to a high-frequency low-noise amplifier structure which comprises an amplifier body and a heat dissipation unit, the heat dissipation unit comprises a shell, a copper plate, a plurality of heat dissipation plates, a connecting bin, a frosted plate, a connecting spring and a plurality of heat insulation rings, and the shell is placed above the amplifier body and buckled downwards. The frosted plate moves leftwards in the connecting bin, so that the connecting spring is compressed, the frosted plate is driven to clamp the outer wall of the amplifier body through the property of the connecting spring, the copper plate makes contact with the amplifier body at the moment, and when the amplifier body dissipates heat, the copper plate firstly absorbs the heat to the heat dissipation plate and then exchanges the heat with cold air to complete heat dissipation. The heat emitted by the amplifier main body during high-frequency work is absorbed in the mode, and normal work of the amplifier main body is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of amplifiers, in particular to a high-frequency low-noise amplifier structure. Background Art

[0002] With the development of the electronic circuit industry, a high-frequency low-noise amplifier (LNA) is a special electronic amplifier, whose main characteristics are a relatively low noise figure and a relatively high gain. Such an amplifier is usually used in high-frequency systems, such as radio frequency transceivers, to amplify weak signals and reduce noise, thereby improving the signal-to-noise ratio of the entire system. The design of the LNA aims to minimize its own noise while maintaining high amplification efficiency to ensure signal clarity and reliability. Its applications are very extensive, including but not limited to radio receivers, highly sensitive electronic detection devices, communication systems, and any high-frequency system that needs to amplify weak signals and reduce noise.

[0003] The existing amplifier main body is generally installed very close to the antenna to reduce the loss of signals passing through the transmission line.

[0004] When the existing amplifier main body operates at high frequencies, the signal processing speed is fast, the change rates of current and voltage are high, and more heat will be generated, affecting the normal operation of the amplifier main body. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a high-frequency low-noise amplifier structure, aiming to solve the problem that when the existing amplifier main body operates at high frequencies, the signal processing speed is fast, the change rates of current and voltage are high, and more heat will be generated, affecting the normal operation of the amplifier main body.

[0006] To achieve the above object, the present utility model provides a high-frequency low-noise amplifier structure, including an amplifier main body and a heat dissipation unit. The heat dissipation unit includes a housing, a copper plate, a plurality of heat dissipation plates, a connection chamber, a frosted plate, a connection spring, and a plurality of heat insulation rings. The heat dissipation unit is disposed above the amplifier main body. The housing is detachably connected to the amplifier main body and is located above the amplifier main body. The copper plate is in contact with the amplifier main body and is located above the amplifier main body, and the copper plate is slidably engaged with the housing. The connection chamber is communicated with the housing and is located on the outer side wall of the housing. The frosted plate is slidably connected to the connection chamber and is located on the inner side wall of the connection chamber. One end of the connection spring is fixedly connected to the connection chamber and is located on the inner side wall of the connection chamber. The other end of the connection spring is fixedly connected to the frosted plate and is located on one side of the frosted plate. A plurality of the heat dissipation plates are fixedly connected to the copper plate and are respectively located above the copper plate. The housing has a plurality of mounting holes, and the plurality of mounting holes are respectively adapted to the corresponding heat insulation rings. The plurality of heat insulation rings are fixedly connected to the housing and are located on the inner side wall of the mounting holes, and the plurality of heat insulation rings are respectively slidably engaged with the corresponding heat dissipation plates.

[0007] Wherein, the heat dissipation unit further includes a fixing rod and a limiting tube. The fixing rod is fixedly connected to the copper plate and is located above the copper plate. The limiting tube is fixedly connected to the housing and is located on the inner top wall of the housing, and the limiting tube is slidably engaged with the fixing rod.

[0008] Wherein, the heat dissipation unit further includes a conical cap and a four-corner frame. The conical cap is fixedly connected to the fixing rod and is located above the fixing rod. The four-corner frame is fixedly connected to the housing and is located below the housing, and the four-corner frame is adapted to the amplifier main body.

[0009] Wherein, the heat dissipation unit further includes an arc-shaped block and a telescopic rod. The arc-shaped block is fixedly connected to the frosted plate and is located below the frosted plate. The telescopic rod is fixedly connected to the connection chamber and is located on the inner side wall of the connection chamber. The output end of the telescopic rod is fixedly connected to the frosted plate and is located on one side of the frosted plate.

[0010] Wherein, the heat dissipation unit further includes a fixing plate and a plurality of semi-circular rods. The fixing plate is fixedly connected to the connection chamber and is located on the outer side wall of the connection chamber. The plurality of semi-circular rods are respectively fixedly connected to the corresponding fixing plates and are respectively located on the outer side walls of the fixing plates.

[0011] A high-frequency low-noise amplifier structure of the present utility model places the housing above the amplifier main body and snaps it downwards. The frosted plate moves leftward in the connection bin, causing the connection spring to be compressed. The property of the connection spring is utilized to drive the frosted plate to clamp the outer wall of the amplifier main body. At this time, the copper plate contacts the amplifier main body. When the amplifier main body dissipates heat, the copper plate first absorbs the heat onto the heat sink plate, and then exchanges heat with cold air to complete heat dissipation. In this way, the heat dissipated when the amplifier main body operates at high frequency is absorbed, ensuring the normal operation of the amplifier main body. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art.

[0013] Figure 1 is a schematic structural diagram of the high-frequency low-noise amplifier structure of the present utility model.

[0014] Figure 2 is a top view of the high-frequency low-noise amplifier structure of the present utility model.

[0015] Figure 3 is a front view of the high-frequency low-noise amplifier structure of the present utility model.

[0016] Figure 4 is of the present utility model Figure 2 sectional view taken along line A-A.

[0017] 101 - amplifier main body, 102 - housing, 103 - copper plate, 104 - heat sink plate, 105 - connection bin, 106 - frosted plate, 107 - connection spring, 108 - heat insulation ring, 109 - fixing rod, 110 - limiting tube, 111 - conical cap, 112 - four-corner frame, 113 - arc-shaped block, 114 - telescopic rod, 115 - fixing plate, 116 semi-circular rod, 117 - mounting hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] Please refer to Figures 1 to 4 , wherein, Figure 1 is a schematic structural diagram of the high-frequency low-noise amplifier structure of the present utility model, Figure 2 is a top view of the high-frequency low-noise amplifier structure of the present utility model, Figure 3 is a front view of the high-frequency low-noise amplifier structure of the present utility model, Figure 4 is of the present utility model Figure 2 sectional view taken along line A-A.

[0019] The utility model provides a high-frequency low-noise amplifier structure, which includes an amplifier main body 101 and a heat dissipation unit. The heat dissipation unit includes a housing 102, a copper plate 103, a plurality of heat dissipation plates 104, a connection bin 105, a frosted plate 106, a connection spring 107, a plurality of heat insulation rings 108, a fixing rod 109, a limiting tube 110, a conical cap 111, a four-corner frame 112, an arc-shaped block 113, a telescopic rod 114, a fixing plate 115 and a plurality of semi-circular rods 116. The housing 102 has a plurality of mounting holes 117.

[0020] The heat dissipation unit is arranged above the amplifier main body 101. The housing 102 is detachably connected to the amplifier main body 101 and is located above the amplifier main body 101. The copper plate 103 is in contact with the amplifier main body 101 and is located above the amplifier main body 101. Moreover, the copper plate 103 is slidably matched with the housing 102. The connection bin 105 is communicated with the housing 102 and is located on the outer side wall of the housing 102. The frosted plate 106 is slidably connected to the connection bin 105 and is located on the inner side wall of the connection bin 105. One end of the connection spring 107 is fixedly connected to the connection bin 105 and is located on the inner side wall of the connection bin 105. The other end of the connection spring 107 is fixedly connected to the frosted plate 106 and is located on one side of the frosted plate 106. A plurality of the heat dissipation plates 104 are all fixedly connected to the copper plate 103 and are respectively located above the copper plate 103. The housing 102 has a plurality of mounting holes 117. A plurality of the mounting holes 117 are all adapted to the corresponding heat insulation rings 108. A plurality of the heat insulation rings 108 are all fixedly connected to the housing 102 and are located on the inner side wall of the mounting holes 117. Moreover, a plurality of the heat insulation rings 108 are all slidably matched with the corresponding heat dissipation plates 104.

[0021] In this embodiment, the housing 102 is placed above the amplifier main body 101 and buckled downwards. The frosted plate 106 moves leftwards in the connection bin 105, causing the connection spring 107 to be compressed. The property of the connection spring 107 is utilized to drive the frosted plate 106 to clamp the outer wall of the amplifier main body 101. At this time, the copper plate 103 is in contact with the amplifier main body 101. When the amplifier main body 101 dissipates heat, the copper plate 103 first absorbs the heat onto the heat dissipation plates 104, and then exchanges heat with cold air to complete heat dissipation. By such a way, the heat dissipated when the amplifier main body 101 operates at high frequency is absorbed, ensuring the normal operation of the amplifier main body 101.

[0022] Further, the fixing rod 109 is fixedly connected to the copper plate 103 and is located above the copper plate 103. The limiting tube 110 is fixedly connected to the outer shell 102 and is located on the inner top wall of the outer shell 102, and the limiting tube 110 is slidably engaged with the fixing rod 109.

[0023] In this embodiment, the fixing rod 109 assists the copper plate 103 to move, so that it can better contact the amplifier main body 101. The limiting tube 110 can limit the moving distance of the copper plate 103 to prevent the amplifier main body 101 from not being able to contact the copper plate 103.

[0024] Further, the conical cap 111 is fixedly connected to the fixing rod 109 and is located above the fixing rod 109. The four-corner frame 112 is fixedly connected to the outer shell 102 and is located below the outer shell 102, and the four-corner frame 112 is adapted to the amplifier main body 101.

[0025] In this embodiment, the conical cap 111 limits the moving distance of the fixing rod 109 in the limiting tube 110 to prevent the copper plate 103 from detaching from the outer shell 102, reducing the workload of the installer. The four-corner frame 112 assists the outer shell 102 to be inserted into the amplifier main body 101.

[0026] Further, the arc-shaped block 113 is fixedly connected to the grinding plate 106 and is located below the grinding plate 106. The telescopic rod 114 is fixedly connected to the connection bin 105 and is located on the inner side wall of the connection bin 105. The output end of the telescopic rod 114 is fixedly connected to the grinding plate 106 and is located on one side of the grinding plate 106.

[0027] In this embodiment, the arc-shaped block 113 can assist the grinding plate 106 to move to the left, preventing the grinding plate 106 from getting stuck, ensuring the installation efficiency and quality of the outer shell 102. The telescopic rod 114 supports the grinding plate 106 to ensure the normal operation of the connecting spring 107.

[0028] Further, the fixing plate 115 is fixedly connected to the connection bin 105 and is located on the outer side wall of the connection bin 105. A plurality of semi-circular rods 116 are fixedly connected to the corresponding fixing plates 115 and are respectively located on the outer side walls of the fixing plates 115.

[0029] In this embodiment, the fixing plate 115 and the semi-circular rods 116 are used to increase the surface friction of the connection bin 105 and reduce the occurrence of hand slipping.

[0030] The above-disclosed is only a preferred embodiment of the present application, and it cannot be used to limit the scope of rights of the present application. Those of ordinary skill in the art can understand all or part of the processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present application still fall within the scope covered by the present application.

Claims

1. A high-frequency low-noise amplifier structure, characterized in that it includes an amplifier main body and a heat dissipation unit, and the heat dissipation unit is arranged above the amplifier main body; the heat dissipation unit includes a housing, a copper plate, a plurality of heat dissipation plates, a connection bin, a frosted plate, a connection spring and a plurality of heat insulation rings. The housing is detachably connected to the amplifier main body and is located above the amplifier main body. The copper plate is in contact with the amplifier main body and is located above the amplifier main body, and the copper plate is slidably matched with the housing. The connection bin is communicated with the housing and is located on the outer side wall of the housing. The frosted plate is slidably connected to the connection bin and is located on the inner side wall of the connection bin. One end of the connection spring is fixedly connected to the connection bin and is located on the inner side wall of the connection bin. The other end of the connection spring is fixedly connected to the frosted plate and is located on one side of the frosted plate. A plurality of the heat dissipation plates are all fixedly connected to the copper plate and are respectively located above the copper plate. The housing has a plurality of mounting holes, and the plurality of mounting holes are all adapted to the corresponding heat insulation rings. The plurality of heat insulation rings are all fixedly connected to the housing and are located on the inner side wall of the mounting holes, and the plurality of heat insulation rings are all slidably matched with the corresponding heat dissipation plates.

2. The high-frequency low-noise amplifier structure according to claim 1, characterized in that the heat dissipation unit further includes a fixing rod and a limiting tube. The fixing rod is fixedly connected to the copper plate and is located above the copper plate. The limiting tube is fixedly connected to the housing and is located on the inner top wall of the housing, and the limiting tube is slidably matched with the fixing rod.

3. The high-frequency low-noise amplifier structure according to claim 2, characterized in that the heat dissipation unit further includes a conical cap and a four-corner frame. The conical cap is fixedly connected to the fixing rod and is located above the fixing rod. The four-corner frame is fixedly connected to the housing and is located below the housing, and the four-corner frame is adapted to the amplifier main body.

4. The high-frequency low-noise amplifier structure according to claim 3, characterized in that the heat dissipation unit further includes an arc-shaped block and a telescopic rod. The arc-shaped block is fixedly connected to the frosted plate and is located below the frosted plate. The telescopic rod is fixedly connected to the connection bin and is located on the inner side wall of the connection bin. The output end of the telescopic rod is fixedly connected to the frosted plate and is located on one side of the frosted plate.

5. The high-frequency low-noise amplifier structure according to claim 4, characterized in that the heat dissipation unit further includes a fixing plate and a plurality of semi-circular rods. The fixing plate is fixedly connected to the connection bin and is located on the outer side wall of the connection bin. The plurality of semi-circular rods are all fixedly connected to the corresponding fixing plates and are respectively located on the outer side walls of the fixing plates.

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