Maintenance-free intelligent low-voltage reactive power compensation device

Abstract

The utility model belongs to the technical field of electrical equipment, and particularly relates to a maintenance-free intelligent low-voltage reactive power compensation device which comprises a machine body and a control panel, the control panel is obliquely installed on the top surface of the machine body, an installation groove is formed in the middle of the upper surface of the machine body, and a semiconductor chilling plate is installed at the bottom of an inner cavity of the installation groove. The semiconductor chilling plates are distributed at equal intervals, the refrigeration faces of the semiconductor chilling plates face downwards and penetrate through the cavity wall of the top of the machine body, lower cooling fins are pasted on the surfaces of the refrigeration faces of the semiconductor chilling plates, exhaust fans are arranged on the surfaces of the lower cooling fins, and a gas collecting hood is installed at the top of an inner cavity of the machine body. The gas collecting hood is arranged on the lower radiating fins and the exhaust fan in a covering manner; according to the maintenance-free intelligent low-voltage reactive power compensation device, the semiconductor chilling plate is used for releasing cooling capacity, the air outlet pipe head on the exhaust pipe is arranged at the position, where the heating amount is large, in the machine body, cold air is directly sprayed to the heating position through the air outlet pipe head, and the heat dissipation effect of the maintenance-free intelligent low-voltage reactive power compensation device can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electrical equipment, in particular to a maintenance-free intelligent low-voltage reactive power compensation device. Background Technique

[0002] The installation of a low-voltage reactive power compensation device can improve the power factor of the power grid, reduce the losses of power supply transformers and transmission lines, improve the power supply efficiency, and improve the power supply environment. The reactive power compensation device plays an indispensable and very important role in the power supply system. A reasonable selection of the compensation device can minimize the losses of the network and improve the power grid quality.

[0003] At present, the invention patent with the publication number of CN116316169A discloses a low-voltage reactive power compensation device. Each capacitor is externally wrapped with an oil storage sleeve. When the capacitor bulges, it will squeeze the expansion oil inside the oil storage sleeve, thereby indirectly disconnecting the faulty capacitor from the circuit without the need for staff to go to the scene in person. Therefore, it is beneficial to improve the safety performance of this device. To solve the problem in the prior art that when a capacitor bulges in the compensation cabinet, the faulty capacitor should be withdrawn from operation in time, and then a new capacitor should be purchased for replacement. However, every time a capacitor fails and needs to be replaced, staff need to go to the scene in person, then remove the wires connected to the faulty capacitor, and finally connect the new capacitor to the circuit. The above process takes a certain amount of time and there may be a situation where the replacement is not timely. For example, when the staff fails to arrive at the scene in time, the faulty capacitor will be continuously connected to the circuit, which is very dangerous.

[0004] In order to ensure safety during use, the existing low-voltage reactive power compensation device needs to enclose the housing during operation. The low-voltage reactive power compensation device has a large power during operation and is cooled by a radiator fan, which will result in poor heat dissipation effect during operation of the low-voltage reactive power compensation device, thus affecting the stability during operation of the low-voltage reactive power compensation device. To solve the above problems, a maintenance-free intelligent low-voltage reactive power compensation device is proposed in this application. Content of the Utility Model

[0005] (I) Purpose of the Utility Model

[0006] To solve the technical problems in the background technique, the utility model proposes a maintenance-free intelligent low-voltage reactive power compensation device, which uses a semiconductor refrigeration chip to release cold air, and sets the air outlet head on the exhaust pipe at the position with a large heat generation amount in the machine body, and directly sprays the cold air on the heat-generating place through the air outlet head, which can improve the heat dissipation effect of the maintenance-free intelligent low-voltage reactive power compensation device to solve the problems proposed in the background technique.

[0007] (II) Technical Solution

[0008] To solve the above technical problems, the present utility model provides a maintenance-free intelligent low-voltage reactive power compensation device, including a machine body and a control panel. The control panel is obliquely installed on the top surface of the machine body. An installation groove is opened in the middle of the upper surface of the machine body. A semiconductor refrigerating sheet is installed at the bottom of the inner cavity of the installation groove. The semiconductor refrigerating sheets are distributed at equal intervals. The refrigerating surface of the semiconductor refrigerating sheet faces downward, and the refrigerating surface of the semiconductor refrigerating sheet penetrates through the top cavity wall of the machine body;

[0009] A lower heat sink is pasted on the refrigerating surface of the semiconductor refrigerating sheet. An exhaust fan is arranged on the surface of the lower heat sink. An air collecting hood is installed at the top of the inner cavity of the machine body. The air collecting hood covers the lower heat sink and the exhaust fan;

[0010] The bottom of the air collecting hood is conductively connected to an exhaust pipe.

[0011] Preferably, the exhaust pipes are symmetrically distributed. An air outlet head is conductively connected to the surface of the exhaust pipe. The air outlet heads are distributed at equal intervals from top to bottom.

[0012] Preferably, a heat insulation baffle is arranged in the middle of the inner cavity of the installation groove. Corresponding grooves are respectively penetrated through the positions on the surface of the heat insulation baffle corresponding to the semiconductor refrigerating sheets, and the corresponding grooves are inserted with the semiconductor refrigerating sheets.

[0013] Preferably, an upper heat sink is pasted on the heating surface of the semiconductor refrigerating sheet. An upper heat dissipation fan is installed on the upper heat sink.

[0014] Preferably, embedding grooves are respectively opened on the surfaces of the upper heat sink and the lower heat sink. The upper heat dissipation fan and the exhaust fan are respectively embedded and installed in the embedding grooves.

[0015] Preferably, support columns are arranged on both side surfaces of the machine body. Insulating protection plates are fixed on the support columns through bolts.

[0016] Preferably, heat dissipation through holes are respectively penetrated through the surfaces of the insulating protection plates.

[0017] The above technical solution of the present utility model has the following beneficial technical effects:

[0018] 1. In the present utility model, when the semiconductor refrigerating sheet works, it releases cold air on the lower surface. The cold air is transferred to the lower heat sink by radiation. The exhaust fan can accelerate the heat transfer on the lower heat sink to the air. The cold air in the air collecting hood is discharged through the exhaust pipe. The air outlet heads on the exhaust pipe are arranged at the positions with large heat generation in the machine body, and the cold air can be directly sprayed on the heat generating place through the air outlet heads, which can improve the heat dissipation effect of the maintenance-free intelligent low-voltage reactive power compensation device.

[0019] 2. In the present utility model, the insulating protection plates are installed on both side surfaces of the machine body through support columns. The insulating protection plates can play a role in protection and insulation to improve the safety of the maintenance-free intelligent low-voltage reactive power compensation device during operation. Moreover, heat dissipation through holes are provided on the surfaces of the insulating protection plates to ensure the heat dissipation effect of the machine body. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of the overall structure of the maintenance-free intelligent low-voltage reactive power compensation device of the present utility model;

[0021] Figure 2 is a schematic cross-sectional structure diagram of the maintenance-free intelligent low-voltage reactive power compensation device of the present utility model;

[0022] Figure 3 is a schematic diagram of the exhaust structure of the maintenance-free intelligent low-voltage reactive power compensation device of the present utility model;

[0023] Figure 4 is a schematic exploded structure diagram of the maintenance-free intelligent low-voltage reactive power compensation device of the present utility model.

[0024] REFERENCE SIGNS:

[0025] 1. Machine body; 2. Control panel; 3. Installation groove; 4. Semiconductor refrigeration sheet; 5. Heat insulation baffle; 6. Upper heat sink; 7. Upper cooling fan; 8. Air collecting hood; 9. Lower heat sink; 10. Exhaust fan; 11. Exhaust pipe; 12. Air outlet pipe head; 13. Embedded groove; 14. Support column; 15. Insulating protection plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] To make the objectives, technical solutions, and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with the specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are exemplary and are not intended to limit the scope of the present utility model. In addition, in the following descriptions, the descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present utility model.

[0027] As Figures 1-4 shown, the maintenance-free intelligent low-voltage reactive power compensation device proposed by the present utility model includes a machine body 1 and a control panel 2. The control panel 2 is obliquely installed on the top surface of the machine body 1. An installation groove 3 is provided in the middle of the upper surface of the machine body 1. A semiconductor refrigeration sheet 4 is installed at the bottom of the inner cavity of the installation groove 3. The semiconductor refrigeration sheets 4 are distributed at equal intervals. The refrigerating surface of the semiconductor refrigeration sheet 4 faces downward, and the refrigerating surface of the semiconductor refrigeration sheet 4 penetrates through the top cavity wall of the machine body 1;

[0028] The cooling surface of the semiconductor refrigeration sheet 4 is pasted with a lower heat sink 9, an exhaust fan 10 is arranged on the surface of the lower heat sink 9, a gas collecting hood 8 is installed at the top of the inner cavity of the machine body 1, and the gas collecting hood 8 covers the lower heat sink 9 and the exhaust fan 10;

[0029] The bottom of the gas collecting hood 8 is conductively connected with an exhaust pipe 11. The exhaust pipes 11 are symmetrically distributed. The surface of the exhaust pipe 11 is conductively connected with an air outlet pipe head 12, and the air outlet pipe heads 12 are equidistantly distributed from top to bottom.

[0030] It should be noted that when the semiconductor refrigeration sheet 4 works, it releases cold on the lower surface. The cold is transferred to the lower heat sink 9 by radiation. The exhaust fan 10 can accelerate the heat transfer on the lower heat sink 9 to the air. The cold air in the gas collecting hood 8 is discharged through the exhaust pipe 11. The air outlet pipe heads 12 on the exhaust pipe 11 are arranged at the positions with large heat generation in the machine body 1, and the cold air can be directly sprayed on the heat generating place through the air outlet pipe heads 12, which can improve the heat dissipation effect of the maintenance-free intelligent low-voltage reactive power compensation device.

[0031] In this embodiment, as Figure 3 and Figure 4 shown, a heat insulation baffle 5 is arranged in the middle of the inner cavity of the installation groove 3. Corresponding grooves are respectively formed through the surface of the heat insulation baffle 5 at positions corresponding to the semiconductor refrigeration sheet 4, and the corresponding grooves are inserted into the semiconductor refrigeration sheet 4. The heating surface of the semiconductor refrigeration sheet 4 is pasted with an upper heat sink 6, and an upper heat dissipation fan 7 is installed on the upper heat sink 6.

[0032] It should be noted that the heat insulation baffle 5 can block the cooling surface and the heating surface of the semiconductor refrigeration sheet 4, reduce the mutual interference between the heating and cooling surfaces of the semiconductor refrigeration sheet 4. By matching the upper heat sink 6 with the upper heat dissipation fan 7, the rapid heat dissipation of the heating surface of the semiconductor refrigeration sheet 4 can be realized, so as to improve the operation stability of the semiconductor refrigeration sheet 4.

[0033] In this embodiment, as Figure 3 and Figure 4 shown, embedding grooves 13 are respectively formed on the surfaces of the upper heat sink 6 and the lower heat sink 9, and the upper heat dissipation fan 7 and the exhaust fan 10 are respectively embedded and installed in the embedding grooves 13.

[0034] It should be noted that the upper heat dissipation fan 7 and the exhaust fan 10 can be respectively installed through the embedding grooves 13, which can improve the installation stability of the upper heat dissipation fan 7 and the exhaust fan 10.

[0035] In this embodiment, as Figure 1 and Figure 4 shown, support columns 14 are arranged on both side surfaces of the machine body 1, insulating protection plates 15 are fixed on the support columns 14 through bolts, and heat dissipation through holes are respectively formed through the surfaces of the insulating protection plates 15.

[0036] It should be noted that the insulating protection plates 15 are installed on both side surfaces of the body 1 through the support columns 14. The insulating protection plates 15 can play a role in protection and insulation, so as to improve the safety of the maintenance-free intelligent low-voltage reactive power compensation device during operation. Moreover, heat dissipation through holes are formed on the surfaces of the insulating protection plates 15 to ensure the heat dissipation effect of the body 1.

[0037] The working principle and usage process of the present utility model are as follows: When the semiconductor refrigeration sheet 4 is working, it releases cold on the lower surface. The cold is transferred to the lower heat sink 9 by radiation. The exhaust fan 10 can accelerate the transfer of the heat on the lower heat sink 9 to the air. The cold air in the air collecting hood 8 is discharged through the exhaust pipe 11. The air outlet head 12 on the exhaust pipe 11 is arranged at the position with a large heat generation in the body 1, and the cold air can be directly sprayed on the heat generating part through the air outlet head 12, which can improve the heat dissipation effect of the maintenance-free intelligent low-voltage reactive power compensation device. The heat insulation baffle 5 can block the refrigerating surface and the heating surface of the semiconductor refrigeration sheet 4, and can reduce the mutual interference between the heating and refrigerating surfaces of the semiconductor refrigeration sheet 4. By matching the upper heat sink 6 with the upper radiator fan 7, the rapid heat dissipation of the heating surface of the semiconductor refrigeration sheet 4 can be realized, so as to improve the operation stability of the semiconductor refrigeration sheet 4. The insulating protection plates 15 are installed on both side surfaces of the body 1 through the support columns 14. The insulating protection plates 15 can play a role in protection and insulation, so as to improve the safety of the maintenance-free intelligent low-voltage reactive power compensation device during operation. Moreover, heat dissipation through holes are formed on the surfaces of the insulating protection plates 15 to ensure the heat dissipation effect of the body 1.

[0038] It should be understood that the above specific embodiments of the present utility model are only used for exemplary illustration or explanation of the principle of the present utility model, and do not constitute a limitation to the present utility model. Therefore, any modifications, equivalent replacements, improvements, etc. made without departing from the spirit and scope of the present utility model shall be included within the protection scope of the present utility model. In addition, the appended claims of the present utility model are intended to cover all changes and modifications falling within the scope and boundary of the appended claims or equivalent forms of such scope and boundary.

Claims

1. Maintenance-free intelligent low-voltage reactive power compensation device, comprising a body (1) and a control panel (2), the control panel (2) is obliquely installed on the top surface of the body (1), characterized in that, In the middle of the upper surface of the body (1), an installation groove (3) is provided. At the bottom of the inner cavity of the installation groove (3), a semiconductor refrigeration sheet (4) is installed. The semiconductor refrigeration sheets (4) are distributed at equal intervals. The refrigerating surface of the semiconductor refrigeration sheet (4) faces downward, and the refrigerating surface of the semiconductor refrigeration sheet (4) penetrates through the top cavity wall of the body (1). A lower heat sink (9) is pasted on the refrigerating surface of the semiconductor refrigeration sheet (4). An exhaust fan (10) is provided on the surface of the lower heat sink (9). A gas collecting hood (8) is installed at the top of the inner cavity of the body (1). The gas collecting hood (8) covers the lower heat sink (9) and the exhaust fan (10). The bottom of the gas collecting hood (8) is conductively connected to an exhaust pipe (11).

2. The maintenance-free intelligent low-voltage reactive power compensation device according to claim 1, characterized in that, The exhaust pipes (11) are symmetrically distributed. An air outlet pipe head (12) is conductively connected to the surface of the exhaust pipe (11). The air outlet pipe heads (12) are distributed at equal intervals from top to bottom.

3. The maintenance-free intelligent low-voltage reactive power compensation device according to claim 2, characterized in that, In the middle of the inner cavity of the installation groove (3), a heat insulation baffle (5) is provided. Corresponding grooves are respectively formed through the surface of the heat insulation baffle (5) at positions corresponding to the semiconductor refrigeration sheets (4), and the corresponding grooves are inserted into the semiconductor refrigeration sheets (4).

4. The maintenance-free intelligent low-voltage reactive power compensation device according to claim 3, wherein An upper heat sink (6) is pasted on the heating surface of the semiconductor refrigeration sheet (4). An upper heat dissipation fan (7) is installed on the upper heat sink (6).

5. The maintenance-free intelligent low-voltage reactive power compensation device according to claim 4, characterized in that, Embedded grooves (13) are respectively formed on the surfaces of the upper heat sink (6) and the lower heat sink (9). The upper heat dissipation fan (7) and the exhaust fan (10) are respectively embedded and installed in the embedded grooves (13).

6. The maintenance-free intelligent low-voltage reactive power compensation device according to claim 1, characterized in that, Support columns (14) are provided on both side surfaces of the body (1). Insulating protection plates (15) are fixed on the support columns (14) by bolts.

7. The maintenance-free intelligent low-voltage reactive power compensation device according to claim 6, wherein, Heat dissipation through holes are respectively formed through the surfaces of the insulating protection plates (15).

Images