Shielding device and electronic equipment
Through the elastic point structure design of the shielding cover and the heat dissipation module, the shielding problem of DRAM electromagnetic radiation of laptop computers is solved, and low-cost, space-saving electromagnetic noise shielding and heat dissipation are achieved, improving the stability of the shielding cover and the radiation noise leakage effect.
Patent Information
- Application Number
- CN202422024440.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-20
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-08-20
AI Technical Summary
When the prior art suppresses electromagnetic radiation from laptop DRAM, it is difficult to balance the needs of cost, space, heat dissipation and manufacturability. Conventional methods have problems such as high cost, large space occupancy, affect heat dissipation and increase manufacturing difficulty.
The shield cover design is adopted. There is a vertical surface around the shield cover. The lower edge of the vertical surface is in contact with the motherboard, and it is connected to the grooves of the heat dissipation module through the elastic point structure to achieve a zero-gap connection between the shield cover and the heat dissipation module, and the overall grounding is more complete and radiation noise is reduced.
Low-cost and space-saving electromagnetic noise shielding is achieved, which improves heat dissipation efficiency, reduces production costs, and does not require additional clips or washers, which enhances the stability of the shield cover and the release effect of radiated noise.
Smart Images
Figure CN223157498U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of electromagnetic radiation shielding for electronic components, and particularly to a shielding device and an electronic device. Background Art
[0002] With the continuous upgrading of DRAM (Dynamic Random Access Memory) in laptops, it has high frequency, fast speed, large electromagnetic radiation, high power consumption, and increasingly strong electromagnetic noise. The requirements for suppressing radiation and heat dissipation are getting higher and higher. This poses a huge challenge to the radio frequency, electromagnetic compatibility, and heat dissipation design of laptops. In design, they often conflict and restrict each other, and it is necessary to balance various factors such as cost, space, performance, heat dissipation, manufacturability, and input-output ratio.
[0003] Currently, in order to reduce electromagnetic radiation, the conventional solutions are as follows. First, by attaching wave-absorbing materials to the main radiation sources of the circuit to absorb electromagnetic radiation, thereby reducing electromagnetic radiation. However, the disadvantages of this solution are high cost, poor manufacturability, and unfavorable heat dissipation. Second, a shielding cover is used. The shielding cover is clamped at the edges by two symmetric clips on the main board. The disadvantages of this solution are that the clips occupy a large space and are inconvenient to assemble. The shielding cover needs to be accurately clamped on each pair of clips to achieve a partial shielding effect, which requires high material and process requirements for the shielding cover and requires that the shielding cover cannot be slightly deformed. Third, by routing the high-radiation signal lines to the inner layer to suppress electromagnetic radiation. The disadvantages of this solution are high cost and the need to increase the number of board layers.
[0004] In summary, although the current solutions can solve the electromagnetic noise of DRAM, the current solutions often have one problem while trying to solve another, and it is difficult to balance various requirements: 1. High cost consumption; 2. The clips or gaskets occupy the space of the main board, affecting the electronic components and layout wiring; 3. The attached parts increase the design load of the main board; 4. The added value of the production line manufacturing industry is relatively high; 5. The heat dissipation requirements are affected by the constraints of the auxiliary material materials. Therefore, it is necessary to improve the current shielding device for electromagnetic radiation. Utility Model Content
[0005] The present disclosure provides a shielding device and an electronic device to at least solve one of the technical problems existing in the prior art.
[0006] According to a first aspect of the present disclosure, a shielding device is provided, including a shielding cover. The four peripheral edges of the shielding cover have vertical surfaces, and the lower edges of these vertical surfaces are used to contact the main board. At least one outwardly convex elastic point structure is provided on one of the vertical surfaces, and the elastic point structure is used to abut against a groove opened on a heat dissipation module.
[0007] In an implementable embodiment, the elastic point structure is a spring piece or a convex structure.
[0008] In an implementable embodiment, the bullet point structure is in interference contact with the groove of the heat dissipation module, and the interference amount is 0.1 to 0.3 mm.
[0009] In an implementable embodiment, there are a plurality of the grooves, and the plurality of grooves are arranged at intervals along the length direction of the heat dissipation module, and each groove abuts against the bullet point structure therein.
[0010] In an implementable embodiment, when there are a plurality of the bullet point structures in one groove, the distance L between adjacent bullet point structures is 0≤L<λ / 20, where λ = c / v, c is the speed of light, and v is the operating frequency of the shielded component.
[0011] In an implementable embodiment, a curled edge is formed by folding the lower end of the vertical surface upward, and the lower edge of the curled edge is used to contact the main board.
[0012] In an implementable embodiment, the lower edge of the vertical surface has a downward pressing force on the main board, so that the vertical surface is in interference contact with the main board.
[0013] In an implementable embodiment, mounting holes are further formed on the shielding cover, and the mounting holes are used for detachable connection with the heat dissipation module and the main board.
[0014] In an implementable embodiment, positioning holes are further formed on the shielding cover, and positioning posts adapted to the positioning holes are provided at corresponding positions of the heat dissipation module.
[0015] According to a second aspect of the present disclosure, the present disclosure provides an electronic device, including a main board, a heat dissipation module, and a shielded component, and further including the shielding device in any one of the above embodiments; at least one groove is formed on the heat dissipation module, the shielding cover of the shielding device covers the shielded component, and the bullet point structure abuts against the groove; the lower edge of the vertical surface of the shielding cover is in contact with the main board.
[0016] Compared with the prior art, the advantages of the present application are as follows: 1) For the shielding device of the present application, by providing a shielding cover with vertical surfaces around it, when the vertical surface of the shielding cover is inserted into the groove of the heat dissipation module, the entire groove surface and the vertical surface of the shielding cover are overlapped by the bullet point structure, achieving zero clearance between the shielding cover and the heat dissipation module, thereby solving the radiation noise of the shielded component covered by the shielding cover. 2) Since the lower edge of the vertical surface of the shielding cover of the present application is in contact with the main board, the overall grounding is more complete, which is more conducive to the discharge and shielding of the radiation noise generated by the shielded component. 3) Compared with the traditional shielding cover, the shielding cover of the present application has more advantages in terms of grounding. Since the shielding cover can be overlapped with the main board and the heat dissipation module at the same time, the overall grounding is more complete, which is more conducive to the discharge and shielding of the radiation noise. 4) The shielding cover of the present application is more convenient to assemble on the production line, does not require a special station for setting the shielding cover, and saves production costs.
[0017] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] By referring to the drawings and reading the following detailed description, the above and other objects, features, and advantages of the exemplary embodiments of the present disclosure will become readily understandable. In the drawings, several embodiments of the present disclosure are shown in an exemplary rather than restrictive manner, wherein:
[0019] In the drawings, the same or corresponding reference numerals denote the same or corresponding parts.
[0020] Figure 1 The structural schematic of the shielding device according to the embodiment of the present disclosure is shown; Figure 1 ;
[0021] Figure 2 The structural schematic of the shielding device according to the embodiment of the present disclosure is shown; Figure 2 ;
[0022] Figure 3 The structural schematic of the shielding device according to the embodiment of the present disclosure assembled to the main board and the heat dissipation module is shown; Figure 1 ;
[0023] Figure 4 The structural schematic of the shielding device according to the embodiment of the present disclosure assembled to the main board and the heat dissipation module is shown; Figure 2 ;
[0024] Figure 5 The structural schematic diagram of the shielding device assembled to the main board and the heat dissipation module in another case according to the embodiment of the present disclosure is shown;
[0025] Figure 6 The sectional view of the shielding device according to the embodiment of the present disclosure assembled to the main board and the heat dissipation module is shown;
[0026] Figure 7 The structural schematic of the shielding device according to the embodiment of the present disclosure assembled to the main board and the heat dissipation module is shown; Figure 3 ;
[0027] Figure 8 The curve graph of the relationship between the electromagnetic noise dB and the frequency of the existing solution and the present application according to the embodiment of the present disclosure is shown.
[0028] Description of the reference numerals in the drawings: 1 - shielding cover, 2 - main board, 3 - heat dissipation module, 4 - shielded component, 11 - vertical surface, 12 - elastic point structure, 13 - mounting hole, 14 - locking ear, 15 - positioning hole, 31 - groove, 32 - screw blind hole, 33 - positioning post, 111 - curled edge, 112 - avoidance opening. Detailed implementation mode
[0029] To make the objectives, features, and advantages of the present disclosure more obvious and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present disclosure.
[0030] According to an embodiment of the present disclosure, the present utility model provides a shielding device. As Figures 1 - 7 shown, the shielding device includes a shielding cover 1. The four peripheral edges of the shielding cover 1 all have vertical surfaces 11. The lower edges of these vertical surfaces 11 are used to contact the main board 2. At least one outwardly protruding elastic point structure 12 is provided on one of the vertical surfaces 11. The elastic point structure 12 is used to abut against a groove 31 opened on the heat dissipation module 3.
[0031] For example, one or more grooves 31 can be opened on the heat dissipation module 3. The number of grooves 31 can be opened according to the structural strength of the heat dissipation module 3. When the vertical surface 11 of the shielding cover 1 is inserted into the groove 31 of the heat dissipation module 3, the entire groove surface and the vertical surface 11 of the shielding cover 1 are lapped by the elastic point structure 12, achieving zero clearance between the shielding cover 2 and the heat dissipation module 3, which greatly reduces the electromagnetic noise radiated from the gap between the shielding cover and the heat dissipation module and the electromagnetic noise of the shielded component coupled to the heat dissipation module by the shielding cover.
[0032] For example, as Figure 7 shown, when there are multiple grooves 31, the multiple grooves 31 are arranged at intervals along the length direction of the heat dissipation module 3, and each groove 31 abuts against the elastic point structure 12 therein. Correspondingly, in order to abut the elastic point structure 12 on the vertical surface against the groove, a plurality of avoidance openings 112 for inserting into the groove 31 are also opened on the vertical surface 11 provided with the elastic point structure 12.
[0033] For example, at least one elastic point structure 12 is provided in the groove 31. Preferably, a plurality of elastic point structures 12 are provided in each groove; when there are multiple elastic point structures 12 in a groove 31, the distance L between adjacent elastic point structures is 0 ≤ L < λ / 20, where λ = c / v, c is the speed of light, and v is the operating frequency of the shielded component.
[0034] Of course, it can also be that there is one groove 31, which is opened along the length direction of the heat dissipation module 3. Correspondingly, an outwardly protruding elastic point structure 12 is provided on the vertical surface 11 of the shielding cover. The elastic point structure 12 is opened along the length direction of the vertical surface 11, and the elastic point structure 12 is used to abut against the groove 31 opened on the heat dissipation module.
[0035] For example, the material of the shielding cover 1 is not limited to materials such as stainless steel and cupronickel. Since no clamping is required and the assembly is more convenient, the choice of the material of the shielding cover 1 will be broader. Currently, aluminum has obvious advantages in terms of heat dissipation, price, weight, and plasticity. Therefore, the material of the shielding cover 1 is preferably aluminum.
[0036] In the shielding device of the present application, by providing the shielding cover 1, a vertical surface 11 is provided around the shielding cover. The lower edge of the vertical surface 11 contacts the main board 2. A bullet point structure 12 is formed on one of the vertical surfaces 11. Thus, when the vertical surface 11 of the shielding cover 1 is inserted into the groove 31 of the heat dissipation module, the entire groove surface and the vertical surface 11 of the shielding cover are overlapped by using the bullet point structure 12, achieving zero clearance between the shielding cover 1 and the heat dissipation module 3, thereby solving the radiation noise of the shielded component 4 covered by the shielding cover 1; and the lower edge of the vertical surface 11 contacts the main board 2, making the overall grounding more complete, which is more conducive to the discharge and shielding of the radiation noise generated by the shielded component 4. That is, compared with the traditional shielding cover, the shielding cover 1 of the present application has more advantages in terms of grounding. Since the shielding cover 1 can be overlapped with both the main board 2 and the heat dissipation module 3 at the same time, the overall grounding is more complete, which is more conducive to the discharge and shielding of the radiation noise.
[0037] The shielding cover 1 of the present application is more convenient to assemble on the production line. There is no need to specifically set up a station for the shielding cover, saving production costs.
[0038] The present application utilizes the combined innovative design of the shielding cover 1 and the heat dissipation module 3, breaking through the convention. Starting from changing the material of the shielding cover 1 from stainless steel to aluminum, it enables the shielding cover 1 to have a heat dissipation function and solves the heat dissipation problem; at the same time, the shielding cover 1 and the heat dissipation module 3 are set with zero clearance, achieving noise reduction without the need for auxiliary materials such as clips, washers, and wave-absorbing materials. Therefore, the advantages of the present application are obvious: First, the shielding cover 1 is no longer limited to stainless steel material and can be replaced by aluminum, resulting in lower cost consumption; Second, there is no need to use clips and washers to occupy the space of the main board 2, saving the space of the main board and increasing the installation space for other components; Third, there is no need to use main board attachment accessories; Fourth, using the shielding device of the present application results in a lower MVA (Manufacturing Value Added) of the production line; Fifth, compared with the existing clip fixation, the shielding cover of the present application uses screw locking, making the shielding cover of the present application highly stable and not easily falling off; Sixth, it can solve the heat dissipation and noise reduction problems at the same time and is expected to become the key technology in the industry to solve the noise and heat dissipation of shielded components (such as DRAM dynamic random access memory).
[0039] In one embodiment, as Figure 6As shown, the bullet point structure 12 is in interference contact with the groove 31 of the heat dissipation module, and the interference amount is 0.1 - 0.3 mm. The so-called interference amount refers to the distance that the outer convex surface of the bullet point structure moves forward when the bullet point structure abuts against the groove surface of the groove 31 and deforms compared to its free state. This setting method is to enable the bullet point structure to firmly contact the groove surface of the groove.
[0040] For example, the bullet point structure 12 is a spring piece or a convex structure. As Figures 1 - 2 shown, the bullet point structure 12 is a spring piece, and the spring piece is an outwardly convex arc-shaped structure. The formation and processing of the spring piece and the convex structure are simpler and more convenient. Of course, other shaped structures can also be used as long as they can abut against the groove.
[0041] In one embodiment, as Figures 3 - 4 、 Figure 6 shown, a curled edge 111 is formed by folding the lower end of the vertical surface 11 upward, and the lower edge of the curled edge 111 is used to contact the main board 2. By setting the curled edge 111 on the vertical surface 11 of the shielding cover of the present application, it can prevent scratching the main board 2 when contacting the main board 2. And after curling the vertical surface 11 of the shielding cover 1, the edge is flatter and can fit better with the main board 2, thus facilitating the release and shielding of radiation noise.
[0042] Furthermore, the lower edge of the vertical surface 11 has a downward pressing force on the main board 2, so that the vertical surface 11 is in interference contact with the main board 2. For example, the interference amount between the lower edge of the vertical surface 11 and the main board 2 is 0 - 0.2 mm.
[0043] For example, the main board area in contact with the lower edge of the vertical surface 11 of the shielding cover 1 can be selectively subjected to bare copper treatment, that is, the material of the main board area in contact with the lower edge of the vertical surface 11 of the shielding cover 1 can be bare copper, so as to achieve the purpose of grounding.
[0044] It can also be that when the shielding cover 1 is connected to the heat dissipation module 3, when one of the vertical surfaces 11 of the shielding cover 1 is close to the edge of the main board 2, the lower edge of this vertical surface can be extended below the main board and be flush with the lower edge of the main board. As Figure 5 shown, the curled edge of the vertical surface near the edge of the main board is generally flush with the main board 2.
[0045] In one embodiment, mounting holes 13 are also formed on the shielding cover 1, and the mounting holes 13 are used for detachably connecting the heat dissipation module 3 and the main board 2. As Figures 1 - 2 shown, there are 4 spaced lock ears 14 provided on the edge of the shielding cover 1, two of the lock ears 14 are located at both ends of the vertical surface 11 where the bullet point structure 12 is located, and the remaining lock ears 14 are provided on the other side edges of the shielding cover. Mounting holes 13 are opened on these lock ears. From Figures 3 - 4It can be seen that these mounting holes 13 are connected to the main board 2 and the heat dissipation module 3 by screws. Two of the mounting holes 13 share the positions of two screw holes on the main board, without adding extra screw holes. Two screw blind holes 32 can be milled by CNC or cast on the heat dissipation module 3. As Figure 7 shown, these two screw blind holes 32 are threadedly connected to the mounting holes 13, thereby assembling the shielding cover 1 on the heat dissipation module 3 and the main board 2.
[0046] In this application, the shielding cover 1 is attached to the main board 2 and the heat dissipation module 3 by screws. Screw attachment is not easy to fall off and is more reliable. It can conveniently control the distance between the shielding cover 1 and the main board 2, and no additional clips are required to fix and ground the shielding cover 1, saving production costs.
[0047] In one embodiment, as Figure 2 、 Figure 7 shown, positioning holes 15 are also formed on the shielding cover 1, and positioning posts 33 adapted to the positioning holes are provided at corresponding positions on the heat dissipation module 3. Two positioning posts 33 can be milled by CNC (numerical control milling machine) or cast. The positioning posts 33 of the heat dissipation module 3 pass through the positioning holes 15 of the shielding cover to position the shielding cover 1 during assembly.
[0048] According to the second aspect of the present disclosure, this application provides an electronic device, including a main board 2, a heat dissipation module 3, and a component to be shielded 4, and further including the shielding device in any of the above embodiments; at least one groove 31 is formed on the heat dissipation module 3, the shielding cover 1 of the shielding device covers the component to be shielded 4 and the spring point structure 12 abuts against the groove 31; the lower edge of the vertical surface 11 of the shielding cover touches the main board 2.
[0049] For example, the component to be shielded 4 can be a DRAM (Dynamic Random Access Memory). The shielding cover 1 covers the DRAM, covering the traces between the DDR particles (i.e., memory chips) and the CPU and the DDR body itself, weakening the energy of the DRAM data signal radiating outward; and reducing the electromagnetic interference of the Dram DQ (data bus) signal coupled to the heat dissipation module 3. Therefore, when the shielding device in this application is used to cover the component to be shielded 4 and assembled with the heat dissipation module 3 and the main board 2, it can not only greatly reduce the electromagnetic interference problem of the component to be shielded 4, but also take heat dissipation into account.
[0050] Taking the electronic device as a laptop computer as an example, when the shielding device covers the DRAM and is assembled to the main board and the heat dissipation module, the existing shielding solutions using shielding covers and clips are respectively tested with a visual electromagnetic scanner during operation. The results are as Figure 8 and Table 1-2 shown. Figure 8 (a) represents the curve graph of the electromagnetic noise dB and the frequency in the existing solution, whereFigure 8 (a) The data corresponding to labels 1-6 are shown in Table 1. Figure 8 (b) shows the curve graph of the relationship between electromagnetic noise dB and frequency in the solution of this application, where Figure 8 (b) The data corresponding to labels 1-6 are shown in Table 2.
[0051] Table 1 Relationship between electromagnetic noise and frequency in the current existing solution
[0052]
[0053] Table 2 Relationship between electromagnetic noise and frequency in this application
[0054]
[0055] From Figure 8 and the above Tables 1-2, it can be seen that after the shielding device of this application is assembled into the electronic device, the electromagnetic noise of the shielded component can be greatly reduced.
[0056] It should be understood that the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of these features. In the description of this disclosure, "a plurality" means two or more unless otherwise specifically defined.
[0057] The description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this disclosure. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0058] The orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of this application.
[0059] Unless otherwise clearly defined and limited, the terms "arranged" and "connected" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0060] As described above, it is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claimed rights.
Claims
1. A shielding device, comprising a shielding cover, and the four peripheral edges of the shielding cover have vertical surfaces, characterized in that: The lower edges of these vertical surfaces are used to contact the main board, and at least one outwardly protruding elastic point structure is provided on one of the vertical surfaces, and the elastic point structure is used to abut against a groove formed in the heat dissipation module.
2. The shielding device according to claim 1, wherein: The elastic point structure is a shrapnel or convex hull structure.
3. The shielding device according to claim 2, wherein: The elastic point structure is in interference contact with the groove of the heat dissipation module, and the interference amount is 0.1-0.3 mm.
4. The shielding device according to claim 1, characterized in that: A plurality of the grooves are provided, and the plurality of grooves are arranged at intervals along the length direction of the heat dissipation module, and each groove abuts against the elastic point structure therein.
5. The shielding device according to claim 4, characterized in that: When there are a plurality of the elastic point structures in one groove, the distance L between adjacent elastic point structures is 0≤L<λ / 20, where λ = c / v, c is the speed of light, and v is the operating frequency of the shielded component.
6. The shielding device according to claim 1, wherein: The lower end of the vertical surface is folded upward to form a curled edge, and the lower edge of the curled edge is used to contact the main board.
7. The shielding device according to claim 6, wherein: The lower edge of the vertical surface has a downward pressing force on the main board, so that the vertical surface is in interference contact with the main board.
8. The shielding device according to any one of claims 1-7, characterized in that: Mounting holes are further formed on the shielding cover, and the mounting holes are used for detachable connection with the heat dissipation module and the main board.
9. The shielding device according to any one of claims 1-7, characterized in that: Positioning holes are further formed on the shielding cover, and positioning posts adapted to the positioning holes are provided at corresponding positions of the heat dissipation module.
10. An electronic device, comprising a main board, a heat dissipation module and a shielded component, characterized in that: It further includes the shielding device according to any one of claims 1-9; at least one groove is formed in the heat dissipation module, the shielding cover of the shielding device covers the shielded component and the elastic point structure abuts against the groove; the lower edge of the vertical surface of the shielding cover is in contact with the main board.