Silicon wafer packaging and banding equipment

Abstract

The utility model discloses a silicon wafer packaging band device, which belongs to the technical field of silicon wafer packaging band, and comprises a conveying line for conveying silicon wafers; the carrying part is arranged at the tail end of the conveying line so as to carry the silicon wafers; the belt binding part is located in a carrying area of the carrying part, the belt binding part comprises a belt binding carrying table, a driving motor, a belt binding track and a belt binding structure, silicon wafers to be packaged are arranged on the belt binding carrying table, the driving motor sends a belt binding to the belt binding track, and the belt binding structure is arranged on the belt binding track. The binding belt in the binding belt track winds the silicon wafer on the binding belt carrying table by a circle, and the binding belt structure shrinks the binding belt in the binding belt track and packages the silicon wafer on the binding belt carrying table. According to the utility model, the stable packaging and banding of the silicon wafer are realized, compared with the traditional plastic packaging operation, the packaging efficiency of the silicon wafer can be effectively improved, the energy consumption of the packaging of the silicon wafer is reduced, and the regulation is more convenient in the actual operation.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer packaging straps, and particularly relates to a silicon wafer packaging strap device. Background Art

[0002] Silicon crystal photovoltaic technology is the most widely used photovoltaic technology at present. Its battery uses silicon as the main material and is made of single crystal silicon or polycrystalline silicon. Silicon crystal photovoltaic has the advantages of high efficiency, stability, and reliability, but its production cost is high. Thin-film solar cells mainly use materials such as amorphous silicon, copper indium gallium selenide, and organic materials, and have the characteristics of light weight, low production cost, and strong flexibility, but their efficiency is relatively lower than that of silicon crystal photovoltaics. Polycrystalline photovoltaics uses microcrystals of high-purity silicon and can be comparable to ordinary silicon crystal batteries, but its manufacturing process is more advanced than silicon crystal photovoltaic technology. Silicon ingots belong to a commonly used silicon crystal.

[0003] After slicing the silicon ingot, silicon wafers are formed. During the production and processing of silicon wafers, auxiliary materials need to be placed on their surfaces. After the processing is completed, the silicon wafers need to be packaged. The existing packaging method is to package the silicon wafers by plastic sealing. However, the plastic sealing method has problems such as high energy consumption and difficulty in environmental regulation, which are inconvenient in actual operation. Moreover, the plastic sealing operation has a low packaging efficiency for silicon wafers, affecting the subsequent processing efficiency of silicon wafers. Summary of the Utility Model

[0004] The utility model overcomes the deficiencies of the prior art and provides a silicon wafer packaging strap device to solve the problems existing in the prior art.

[0005] To achieve the above object, the technical solution adopted by the utility model is: a silicon wafer packaging strap device, including

[0006] A conveyor line that conveys the silicon wafers;

[0007] A handling part arranged at the end of the conveyor line to handle the silicon wafers;

[0008] A strapping part located within the handling area of the handling part. The strapping part includes a strapping carrier table, a driving motor, a strapping track, and a strapping structure. The silicon wafers to be packaged are placed on the strapping carrier table. The driving motor feeds the strap into the strapping track. The strap in the strapping track winds around the silicon wafers on the strapping carrier table for one week. The strapping structure contracts the strap in the strapping track and packages the silicon wafers on the strapping carrier table.

[0009] In a preferred embodiment of the utility model, a strapping groove is provided on the strapping carrier table, and the strapping groove hollowes out the silicon wafers on the strapping carrier table.

[0010] In a preferred embodiment of the present utility model, the belt portion further includes a dislocation structure, which dislocates the belt track and the belt, so that the belt is exposed from the belt track. The dislocation structure includes a dislocation motor and a dislocation cam. The dislocation cam is fixedly connected to the belt track, and the dislocation motor drives the dislocation cam to rotate to drive the movement of the belt track.

[0011] In a preferred embodiment of the present utility model, an opening is provided on one side of the belt track. When the belt track moves, the belt is dislocated from the opening and the belt track.

[0012] In a preferred embodiment of the present utility model, the belt structure includes a belt motor and a belt cam group. The belt motor drives the belt cam group to rotate to process the belt.

[0013] In a preferred embodiment of the present utility model, the belt cam group includes a contraction pressing cam, a cutting pressing cam, a cutting lifting cam, a sealing pressing cam, and a sealing lifting cam. The contraction pressing cam presses the end of the belt, and the cutting pressing cam cooperates with the cutting lifting cam to cut the belt. The sealing pressing cam cooperates with the sealing lifting cam to seal the cut belt.

[0014] In a preferred embodiment of the present utility model, a cutting block is provided on the cutting lifting cam to cut the belt, and a heating sealing block is provided on the sealing lifting cam to seal the cut belt.

[0015] In a preferred embodiment of the present utility model, the belt track is an annular track and surrounds the belt carrier.

[0016] In a preferred embodiment of the present utility model, the silicon wafer packaging belt device further includes a blanking portion, which blanks the silicon wafer after the belt is applied.

[0017] The present utility model solves the defects existing in the background technology and has the following beneficial effects:

[0018] The silicon wafer packaging belt device of the present utility model realizes the stable packaging of the silicon wafer with a belt. Compared with the traditional plastic sealing operation, it can effectively improve the packaging efficiency of the silicon wafer, reduce the energy consumption of the silicon wafer packaging, and is more convenient to adjust in actual operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The following further illustrates the present utility model in conjunction with the drawings and embodiments;

[0020] Figure 1 It is a schematic diagram of the overall structure of a preferred embodiment of the present utility model;

[0021] Figure 2 Schematic diagram of the belt portion of the preferred embodiment of the present utility model;

[0022] Figure 3 Front view of the belt portion of the preferred embodiment of the present utility model;

[0023] Figure 4 Schematic diagram of the belt structure of the preferred embodiment of the present utility model;

[0024] Figure 5 is Figure 4 exploded view of;

[0025] Figure 6 Schematic diagram of the dislocation structure of the preferred embodiment of the present utility model;

[0026] In the figure: 10, conveyor line; 20, handling part; 30, belt part; 31, belt carrier; 311, belt groove; 32, drive motor; 33, belt track; 34, belt structure; 341, belt motor; 342, belt cam group; 3421, contraction pressing cam; 3422, cutting pressing cam; 3423, cutting lifting cam; 3424, sealing pressing cam; 3425, sealing lifting cam; 35, dislocation structure; 351, dislocation motor; 352, dislocation cam; 40, blanking part. Specific implementation manners

[0027] The present utility model will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present utility model and be able to implement it, but the embodiments given are not intended to limit the present utility model.

[0028] This embodiment provides a silicon wafer packaging belt device, which realizes stable packaging and belting of silicon wafers. Compared with traditional plastic sealing operations, it can effectively improve the packaging efficiency of silicon wafers, reduce the energy consumption of silicon wafer packaging, and is more convenient to adjust in actual operation.

[0029] As Figure 1 shown, the silicon wafer packaging belt device of this embodiment includes a conveyor line 10, a handling part 20, a belt part 30 and a blanking part 40. The conveyor line 10 conveys the silicon wafers, and the handling part 20 transports the silicon wafers to the belt part 30 for belting operation. After the belting is completed, the blanking part 40 can blank the belted silicon wafers.

[0030] Combined with Figures 2 to 6As shown, the belt part 30 of this embodiment is located within the handling area of the handling part 20. The belt part 30 includes a belt carrier 31, a driving motor 32, a belt track 33, and a belt structure 34. Silicon wafers to be packaged are arranged on the belt carrier 31. The driving motor 32 feeds the belt into the belt track 33. The belt within the belt track 33 winds around the silicon wafers on the belt carrier 31 for one week. The belt structure 34 contracts the belt within the belt track 33 and packages the silicon wafers on the belt carrier 31. Place the silicon wafers on the belt carrier 31, and drive the belt by the driving motor 32 to make the belt surround within the belt track 33. At this time, the belt surrounds the silicon wafers for one circle, and then the belt structure 34 contracts the belt to wind the belt around the silicon wafers. The belt track 33 of this embodiment is an annular track and surrounds the belt carrier 31.

[0031] In this embodiment, the belt part 30 further includes a dislocation structure 35, a frame, and a unwind rack. The dislocation structure 35 dislocates the belt track 33 and the belt, so that the belt exposes from within the belt track 33. The dislocation structure 35 includes a dislocation motor 351 and a dislocation cam 352. The dislocation cam 352 is fixedly connected to the belt track 33. The dislocation motor 351 drives the dislocation cam 352 to rotate to drive the belt track 33 to move. The dislocation structure 35 realizes the dislocation of the belt track 33 and the belt, so that the belt exposes from within the belt track 33 for subsequent shrinkage processing of the belt. The frame can stably install each part of the structure, and the unwind rack can unwind the belt to realize the stable feeding of the belt.

[0032] Furthermore, a belt groove 311 is provided on the belt carrier 31. The belt groove 311 hollowes out the silicon wafers on the belt carrier 31 to facilitate the shrinkage of the belt for packaging the silicon wafers. An opening is provided on one side of the belt track 33. When the belt track 33 moves, the belt is dislocated from the opening and the belt track 33. Under the action of the dislocation structure 35, the belt track 33 moves, and the belt moves out from within the belt track 33. At this time, the belt is in the position to be shrunk and waits to be wound up to realize the packaging processing of the silicon wafers.

[0033] Combined Figure 4 with Figure 5 As shown, the belt structure 34 of this embodiment includes a belt motor 341 and a belt cam group 342. The belt motor 341 drives the belt cam group 342 to rotate to process the belt. The belt motor 341 of this embodiment drives the belt cam group 342 to rotate to realize the cutting and sealing processing of the belt.

[0034] In this embodiment, the belt cam group 342 includes a shrinkage pressing cam 3421, a cutting pressing cam 3422, a cutting lifting cam 3423, a sealing pressing cam 3424, and a sealing lifting cam 3425. The shrinkage pressing cam 3421 presses the end of the belt. The cutting pressing cam 3422 cooperates with the cutting lifting cam 3423 to cut the belt. The sealing pressing cam 3424 cooperates with the sealing lifting cam 3425 to seal the cut belt. Before the belt shrinks, the end of the belt is pressed by the shrinkage pressing cam 3421, and then the driving motor 32 reverses to tighten the belt. After the tightening is completed, under the cooperation of the cutting pressing cam 3422 and the cutting lifting cam 3423, the belt is cut. The cut belt is sealed under the cooperation of the sealing pressing cam 3424 and the sealing lifting cam 3425, that is, the packaging process of the silicon wafer is completed.

[0035] Specifically, a cutting block is provided on the cutting lifting cam 3423 to cut the belt, and a heating sealing block is provided on the sealing lifting cam 3425 to seal the cut belt.

[0036] In actual use of the silicon wafer packaging belt device of this embodiment, the conveyor line 10 conveys the silicon wafers, and the handling part 20 transports the silicon wafers to the belt part 30 for belt operation. Under the action of the driving motor 32, the belt moves along the belt track 33 direction until the silicon wafer is surrounded in a circle. Then the belt track 33 moves under the dislocation structure 35 to push out the belt. At this time, shrinking the belt can achieve the packaging of the silicon wafer. The shrinkage pressing cam 3421 is used to press the end of the belt, and then the driving motor 32 reverses to drive the starting end of the belt to shrink and package the silicon wafer. After the belt shrinkage is completed, the belt is cut and sealed, and the packaged silicon wafers are unloaded under the action of the unloading part 40.

[0037] Obviously, the above embodiments are only examples clearly described and not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of the creative utility model.

Claims

1. A silicon wafer packaging banding device, characterized in that, including a conveyor line (10) for conveying silicon wafers; a handling unit (20) disposed at the end of the conveyor line (10) for handling silicon wafers; a banding unit (30) located within the handling area of the handling unit (20). The banding unit (30) includes a banding carrier (31), a drive motor (32), a banding track (33), and a banding structure (34). Silicon wafers to be packaged are placed on the banding carrier (31). The drive motor (32) feeds the banding into the banding track (33). The banding within the banding track (33) winds around the silicon wafers on the banding carrier (31) for one week. The banding structure (34) contracts the banding within the banding track (33) and packages the silicon wafers on the banding carrier (31).

2. The silicon wafer packaging banding device according to claim 1, characterized in that, A banding groove (311) is provided on the banding carrier (31), and the banding groove (311) hollowes out the silicon wafers on the banding carrier (31).

3. The silicon wafer packaging belt device according to claim 1, characterized in that, The banding unit (30) further includes a misalignment structure (35) that misaligns the banding track (33) and the banding, causing the banding to expose from the banding track (33). The misalignment structure (35) includes a misalignment motor (351) and a misalignment cam (352). The misalignment cam (352) is fixedly connected to the banding track (33), and the misalignment motor (351) drives the misalignment cam (352) to rotate to drive the movement of the banding track (33).

4. The silicon wafer packaging banding device according to claim 3, characterized in that, An opening is provided on one side of the banding track (33). When the banding track (33) moves, the banding is misaligned with the banding track (33) through the opening.

5. A silicon wafer packaging banding device according to claim 1, characterized in that, The banding structure (34) includes a banding motor (341) and a banding cam group (342). The banding motor (341) drives the banding cam group (342) to rotate for processing the banding.

6. The silicon wafer packaging banding device according to claim 5, characterized in that, The banding cam group (342) includes a contraction and compression cam (3421), a cutting and compression cam (3422), a cutting and lifting cam (3423), a sealing and compression cam (3424), and a sealing and lifting cam (3425). The contraction and compression cam (3421) compresses the end of the banding. The cutting and compression cam (3422) and the cutting and lifting cam (3423) cooperate to cut the banding. The sealing and compression cam (3424) and the sealing and lifting cam (3425) cooperate to seal the cut banding.

7. A silicon wafer packaging banding device according to claim 6, characterized in that, A cutting block is provided on the cutting and lifting cam (3423) to cut the banding, and a heating and sealing block is provided on the sealing and lifting cam (3425) to seal the cut banding.

8. A silicon wafer packaging banding device according to claim 1, characterized in that, The banding track (33) is an annular track and surrounds the banding carrier (31).

9. The silicon wafer packaging banding device according to claim 1, characterized in that, The silicon wafer banding device further includes a blanking unit (40) for blanking the banded silicon wafers.

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