Organic silicon heat-conducting pouring sealant filling mechanism

Abstract

The utility model discloses an organic silicon heat-conducting pouring sealant filling mechanism, and relates to the technical field of organic silicon heat-conducting pouring sealant filling. The device comprises a filling machine body, an anti-dripping piece is fixedly arranged on one side of the filling machine body, and the anti-dripping piece comprises a rotating rod, a collecting box, a supporting rod and a rotating shaft; the rotating rod is movably arranged at the bottom of the filling machine body, the supporting rod is rotationally connected to one side of the filling machine body, the collecting box is fixedly connected to one end of the supporting rod, the rotating shaft is fixedly installed in the collecting box, and the rotating rod is rotationally connected with the rotating shaft. According to the device, through combined use of the rotating rod, the collecting box and the rotating shaft, collecting of redundant glue liquid can be completed, the moving track of the collecting box is further limited through the supporting rod, the collecting box cannot deviate, recycling of redundant glue is completed through the collecting piece, and the requirements of a user are met.

Description

Technical Field

[0001] The utility model relates to the technical field of organic silicon heat-conducting potting glue filling, in particular to an organic silicon heat-conducting potting glue filling mechanism. Background Art

[0002] Organic silicone thermal potting compound is a composite material based on organic silicone. Combining the excellent properties of organic silicone with its thermal conductivity, it is widely used in electronics, communications, aerospace, and other fields. Organic thermal potting compound filling mechanisms, also known as thermal potting compound dispensing machines or thermal silicone dispensing machines, are used to automatically mix and dispense organic thermal potting compound into designated locations. Organic silicone thermal potting compound is used to improve a product's thermal conductivity, insulation, and waterproof and dustproof properties.

[0003] When the silicone thermal conductive potting glue is filled, excess colloid will remain inside the filling port. When the conveyor belt switches the filling barrel, the excess colloid will drip onto the workbench or the outside of the filling barrel under the action of gravity, affecting the appearance. At the same time, the colloid will solidify quickly after dripping. The solidified colloid becomes hard and will hinder the rotation of the conveyor belt. The colloid dripping onto the conveyor belt will cause the outer surface of the conveyor belt to be uneven, causing the filling barrel to be unstable when placed on it, affecting the subsequent normal filling. Therefore, we propose a new type of silicone thermal conductive potting glue filling mechanism to solve the above problems. Utility Model Content

[0004] In response to the deficiencies in the prior art, the utility model provides a filling mechanism for a thermally conductive silicone potting glue, which solves the problem that when the filling of the thermally conductive silicone potting glue is completed, excess colloid will remain inside the filling port. When the conveyor belt switches the filling barrel, the excess colloid will drip onto the workbench or the outside of the filling barrel under the action of gravity, affecting the appearance. At the same time, the colloid will quickly solidify after dripping, and the solidified colloid will become hard, which will hinder the rotation of the conveyor belt. The colloid dripping onto the conveyor belt will cause the outer surface of the conveyor belt to be uneven, resulting in instability when the filling barrel is placed on it, affecting the subsequent normal filling.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a silicone thermal conductive potting glue filling mechanism includes a filling body, a drip-proof member is fixedly provided on one side of the filling body, and the drip-proof member includes a rotating rod, a collecting box, a supporting rod and a rotating shaft;

[0006] The rotating rod is movably arranged at the bottom of the filling body, the support rod is rotatably connected to one side of the filling body, the collecting box is fixedly connected to one end of the support rod, the rotating shaft is fixedly installed inside the collecting box, and the rotating rod is rotatably connected to the rotating shaft.

[0007] Preferably, a fixing block is fixedly installed at the bottom of the filling machine body, and the support rod is rotatably connected to the outer surface of the fixing block.

[0008] Preferably, fixing bolts are threadedly connected to both ends of the rotating shaft, and the fixing bolts fixedly connect the support rod to both sides of the collection box.

[0009] Preferably, a support block is fixedly installed at the bottom of the filling machine body, and the rotating rod is rotatably connected to the inside of the support block.

[0010] Preferably, an extension block is threadedly connected to the end of the rotating rod, a push rod is threadedly connected to the end of the extension block, and a rotating block is fixedly connected to the ends of the rotating rod and the push rod.

[0011] Preferably, a baffle is fixedly installed at the end of the collection box.

[0012] Preferably, a collection member is arranged inside the collection box, and the collection member includes a guiding strip, a constant temperature plate and a collection pipe; a constant temperature plate is fixedly installed inside the collection box, multiple groups of guiding strips are symmetrically fixedly installed on the top of the constant temperature plate, and a collection pipe is fixedly installed at the bottom of the collection box.

[0013] The utility model discloses a silicone thermal conductive potting adhesive filling mechanism, and the beneficial effects thereof are as follows: through the combined use of the rotating rod, the collection box and the rotating shaft, the device can collect the excess glue, the movement track of the collection box is further limited by the support rod so that it will not deviate, and the excess colloid is recovered through the collection member, meeting the needs of users. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model, and those of ordinary skill in the art can also obtain other drawings without creative efforts based on these drawings.

[0015] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0016] Figure 2 It is a schematic diagram of the anti-dripping member of the present utility model;

[0017] Figure 3 It is a schematic diagram of the actual use of the rotating rod of the present utility model;

[0018] Figure 4 It is a schematic diagram of the collection member of the present utility model.

[0019] In the figure: 1. Filling machine body; 2. Anti-drip part; 201. Rotating rod; 202. Collecting box; 203. Support rod; 204. Rotating shaft; 205. Fixed block; 206. Fixing bolt; 207. Support block; 208. Rotating block; 209. Extension block; 210. Push rod; 211. Baffle; 3. Collecting part; 301. Guide strip; 302. Constant temperature plate; 303. Collecting tube. DETAILED DESCRIPTION

[0020] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0021] The embodiment of the present application provides a filling mechanism for organic silicone thermal conductive potting glue, which solves the problem that when the filling of organic silicone thermal conductive potting glue is completed, excess colloid will remain inside the filling port. When the conveyor belt switches the filling barrel, the excess colloid will drip onto the workbench or the outside of the filling barrel under the action of gravity, affecting the appearance. At the same time, the colloid will quickly solidify after dripping, and the solidified colloid will become hard, which will hinder the rotation of the conveyor belt. The colloid dripping onto the conveyor belt will cause the outer surface of the conveyor belt to be uneven, resulting in instability when the filling barrel is placed on it, affecting the subsequent normal filling.

[0022] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0023] The embodiment of the utility model discloses a filling mechanism for organic silicon heat-conducting potting glue.

[0024] According to the attached Figures 1-4 As shown, it includes a filling machine body 1, and an anti-drip component 2 is fixedly provided on one side of the filling machine body 1. The anti-drip component 2 includes a rotating rod 201, a collecting box 202, a support rod 203 and a rotating shaft 204;

[0025] When the device is in use, the filling body 1 fills downwards, and the support block 207 at the bottom of the filling body 1 also moves downwards synchronously. A shaft is fixed inside the support block 207, and the rotating block 208 at the end of the rotating rod 201 rotates on its outer surface. At the same time, the rotation of the rotating rod 201 drives the push rod 210 to rotate together. The rotating block 208 at the end of the push rod 210 rotates on the outer surface of the rotating shaft 204, pushing the collection box 202 away from the bottom of the filling body 1 so that it does not affect the normal filling of the filling body 1. The position of the collection box 202 is further restricted by the support rod 203 provided on one side of the filling body 1, enabling it to move only in a specified manner and not to separate from the filling body 1. After filling is completed, the filling body 1 moves upwards, and the rotating rod 201 moves upwards synchronously. Through the rotation of the push rod 210 and the rotating block 208, the collection box 202 is pulled back to the bottom of the filling body 1. The excess glue of the filling body 1 can directly fall into the collection box 202, and after being guided by the guiding strip 301, it enters the collection pipe 303 to be collected and recycled uniformly, finally completing the collection work of the excess glue.

[0026] The rotating rod 201 is movably arranged at the bottom of the filling body 1. The support rod 203 is rotatably connected to one side of the filling body 1. The collection box 202 is fixedly connected to one end of the support rod 203. The rotating shaft 204 is fixedly installed inside the collection box 202, and the rotating rod 201 is rotatably connected to the rotating shaft 204.

[0027] A fixed block 205 is fixedly installed at the bottom of the filling body 1, and the support rod 203 is rotatably connected to the outer surface of the fixed block 205.

[0028] Fixing bolts 206 are threadedly connected to both ends of the rotating shaft 204. The fixing bolts 206 fixedly connect the support rod 203 to both sides of the collection box 202. By fixing the support rod 203 to both sides of the collection box 202 with the fixing bolts 206, the collection box 202 can only move along a preset trajectory without deviation.

[0029] A support block 207 is fixedly installed at the bottom of the filling body 1, and the rotating rod 201 is rotatably connected inside the support block 207.

[0030] An extension block 209 is threadedly connected to the end of the rotating rod 201, and a push rod 210 is threadedly connected to the end of the extension block 209. Rotating blocks 208 are fixedly connected to the ends of the rotating rod 201 and the push rod 210. Through the rotating block 208, the rotating rod 201 and the push rod 210 can rotate between the support block 207 and the rotating shaft 204, enabling the entire anti-dripping member 2 to be pushed for necessary movement, collecting excess colloid while not affecting filling.

[0031] A baffle plate 211 is fixedly installed at the end of the collection box 202, and a collection member 3 is arranged inside the collection box 202. The collection member 3 includes a guide strip 301, a thermostatic plate 302, and a collection tube 303. The thermostatic plate 302 is fixedly installed inside the collection box 202, multiple groups of guide strips 301 are symmetrically and fixedly installed on the top of the thermostatic plate 302, and the collection tube 303 is fixedly installed at the bottom of the collection box 202. By setting the thermostatic plate 302, the colloid falling into the collection box 202 will not become dry and hard and difficult to collect. By setting the baffle plate 211, the excess colloid will not slide out of the collection box 202 under the action of inertia.

[0032] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicone thermal conductive potting adhesive filling mechanism, comprising a filling machine body (1), characterized in that, On one side of the filling machine body (1), a dripping prevention member (2) is fixedly arranged. The dripping prevention member (2) includes a rotating rod (201), a collection box (202), a support rod (203), and a rotating shaft (204). The rotating rod (201) is movably arranged at the bottom of the filling machine body (1). The support rod (203) is rotatably connected to one side of the filling machine body (1). The collection box (202) is fixedly connected to one end of the support rod (203). The rotating shaft (204) is fixedly installed inside the collection box (202), and the rotating rod (201) is rotatably connected to the rotating shaft (204).

2. The filling mechanism for an organosilicon heat-conducting potting adhesive according to claim 1, characterized in that: A fixed block (205) is fixedly installed at the bottom of the filling machine body (1), and the support rod (203) is rotatably connected to the outer surface of the fixed block (205).

3. The filling mechanism of the silicone thermal conductive potting adhesive according to claim 1, wherein: Fixing bolts (206) are threadedly connected to both ends of the rotating shaft (204), and the fixing bolts (206) fixedly connect the support rod (203) to both sides of the collection box (202).

4. The filling mechanism of an organosilicon thermal conductive potting adhesive according to claim 1, characterized in that: A support block (207) is fixedly installed at the bottom of the filling machine body (1), and the rotating rod (201) is rotatably connected inside the support block (207).

5. The filling mechanism of the silicone thermal conductive potting adhesive according to claim 1, characterized in that: An extension block (209) is threadedly connected to the end of the rotating rod (201), a push rod (210) is threadedly connected to the end of the extension block (209), and a rotating block (208) is fixedly connected to the ends of the rotating rod (201) and the push rod (210).

6. The filling mechanism of the silicone thermal conductive potting adhesive according to claim 1, wherein: A baffle (211) is fixedly installed at the end of the collection box (202).

7. An organosilicon thermal conductive potting adhesive filling mechanism according to claim 1, characterized in that: A collection member (3) is arranged inside the collection box (202). The collection member (3) includes a guiding strip (301), a thermostatic plate (302), and a collection pipe (303). The thermostatic plate (302) is fixedly installed inside the collection box (202). Multiple groups of guiding strips (301) are symmetrically fixedly installed on the top of the thermostatic plate (302), and the collection pipe (303) is fixedly installed at the bottom of the collection box (202).

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