Exhaust pipeline device and semiconductor process equipment

Abstract

The utility model discloses an exhaust pipeline device and semiconductor process equipment, and the device comprises an exhaust pipe which is used for conveying tail gas exhausted by the semiconductor process equipment to tail gas treatment equipment; the insulating cover body is arranged outside the exhaust pipe in a covering manner, and a closed cavity is formed between the inner wall of the cover body and the outer wall of the exhaust pipe; the pressure detection module is used for detecting the air pressure in the cavity; and the negative pressure device is used for enabling the interior of the cavity to be in a pre-negative pressure state before the semiconductor process equipment starts to work. The leakage state of the exhaust pipe can be monitored in real time, tail gas is prevented from diffusing to the surrounding environment due to leakage of the exhaust pipe, and the insulativity of the exhaust pipe can be guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to an exhaust pipeline device and a semiconductor process equipment. Background Art

[0002] The exhaust pipeline of the existing ion implanter usually uses a Teflon corrugated pipe to connect with the tail gas treatment equipment, playing the role of exhausting gas and insulation. After being regularly replaced and cleaned for many times, and being corroded by the tail gas discharged in the pipeline, the Teflon corrugated pipe may be damaged, resulting in the leakage of process residual gas. Moreover, once the Teflon corrugated pipe is damaged, the discharged tail gas will contact with the water molecules in the air and react to generate attachments. After the accumulation of these attachments, it will not only cause pipeline blockage, but also affect the insulation of the exhaust pipeline itself. Although the Teflon corrugated pipe is leak-tested before use, if the Teflon corrugated pipe leaks during the operation of the machine, it cannot be detected. Content of the Utility Model

[0003] The purpose of the utility model is to overcome the above-mentioned defects existing in the prior art, and provide an exhaust pipeline device and a semiconductor process equipment.

[0004] To achieve the above purpose, the technical solution of the utility model is as follows:

[0005] The utility model provides an exhaust pipeline device, including:

[0006] An exhaust pipe for conveying the tail gas discharged from the semiconductor process equipment to the tail gas treatment equipment;

[0007] An insulating cover body covering the outside of the exhaust pipe, and a closed cavity is formed between the inner wall of the cover body and the outer wall of the exhaust pipe;

[0008] A pressure detection module for detecting the air pressure in the cavity;

[0009] A negative pressure device for making the cavity in a pre-negative pressure state before the semiconductor process equipment starts to work.

[0010] Further, the cover body includes a hard cover body, and there is a gap greater than zero between the inner wall of the hard cover body and the outer wall of the exhaust pipe.

[0011] Further, the hard cover body includes a hard pipe or a hard capsule body with both ends open, both ends of the hard pipe or the hard capsule body are closely connected to both ends of the exhaust pipe, and both ends of the exhaust pipe are closely connected to the semiconductor process equipment and the tail gas treatment equipment respectively.

[0012] Furthermore, the cover includes a soft cover, and there is a gap greater than zero between the inner wall of the soft cover and the outer wall of the exhaust pipe, or the soft cover has ductility or deformability.

[0013] Furthermore, the soft cover includes a hose or a soft capsule body with both ends open. Both ends of the hose or the soft capsule body are in close contact with both ends of the exhaust pipe, and both ends of the exhaust pipe are in close contact with the semiconductor process equipment and the tail gas treatment equipment respectively.

[0014] Furthermore, the cavity is connected to the inlet end of the negative pressure device through an insulating delivery pipe provided on the cover. The negative pressure device is used to apply a vacuum pressure to the cavity before the semiconductor process equipment starts working, and the outlet end of the negative pressure device is connected to a helium leak detection module.

[0015] Furthermore, the pressure detection module is provided on the pipe wall of the delivery pipe.

[0016] Furthermore, the negative pressure device includes a vacuum pump, and / or the pressure detection module includes a vacuum gauge, and / or the helium leak detection module includes a helium leak detector.

[0017] Furthermore, the exhaust pipe includes an insulating Teflon corrugated pipe. Both ends of the Teflon corrugated pipe are detachably and closely connected to the tail gas discharge end of the semiconductor process equipment and the tail gas input end of the tail gas treatment equipment respectively, and / or the cover and the delivery pipe are made of compressive and corrosion-resistant materials, or the inner wall surfaces of the cover and the delivery pipe have corrosion-resistant layers. Both ends of the cover are detachably and closely connected to both ends of the exhaust pipe through the provided openings, and both ends of the delivery pipe are detachably and closely connected to the cover and the inlet end of the negative pressure device respectively.

[0018] The present utility model also provides a semiconductor process equipment, including the above exhaust pipe line device. The exhaust pipe line device is used to detect the leakage condition of the exhaust pipe connected between the semiconductor process equipment and the tail gas treatment equipment in real time during the working process of the semiconductor process equipment, and when the exhaust pipe leaks, the tail gas leaked from the exhaust pipe is restricted in the cavity between the cover and the exhaust pipe to be isolated from the atmosphere through the cover disposed outside the exhaust pipe.

[0019] As can be seen from the above technical solution, in the present utility model, an insulating cover is provided outside the exhaust pipe, a sealed cavity is formed between the inner wall of the cover and the outer wall of the exhaust pipe, and before the semiconductor process equipment starts to work, the cavity is pre-in a negative pressure state. During the working process of the semiconductor process equipment, once the exhaust pipe leaks, the set pressure detection module can detect the change in the vacuum environment in the cavity, so as to realize real-time monitoring of the leakage condition of the exhaust pipe. Moreover, even if the exhaust pipe leaks, the exhaust gas leaked from the exhaust pipe can be restricted in the cavity through the cover and will not diffuse into the surrounding environment, thus avoiding environmental alarms caused by leakage. In addition, the exhaust pipe is always in the vacuum environment inside the cover. Even if it is damaged, it will not cause the exhaust gas discharged to react with the water molecules in the air to generate attachments, resulting in blockage of the exhaust pipe and deterioration of the insulation of the exhaust pipe, triggering the consequence of equipment interlock. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 FIG. 6 is a schematic structural diagram of the exhaust pipe layout of an existing ion implantation machine.

[0021] Figures 2 - 4 FIG. 10 is a schematic structural diagram of an exhaust pipe device according to a preferred embodiment of the present utility model.

[0022] Figures 5 - 6 FIG. 14 is a schematic diagram of the pressure change state in the cavity according to a preferred embodiment of the present utility model, where (a) is the pre-negative pressure state and (b) is the leakage state in the figure.

[0023] Figure 7 FIG. 18 is a schematic structural diagram of an exhaust pipe device according to a preferred embodiment of the present utility model on a semiconductor process equipment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art in the field to which the present utility model belongs. The words such as "including" used herein mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0025] Reference Figure 1。In the existing ion implantation machine tool 1, a Teflon bellows 2 is usually used as the exhaust pipe connecting the exhaust end of the ion implantation machine tool 1 and the exhaust gas input end of the exhaust gas treatment equipment 3, which plays the role of exhausting and insulating (the ion implantation machine tool 1 is usually in a high-voltage state during operation, so insulation is required when connecting to the exhaust gas treatment equipment 3 as an external auxiliary facility).

[0026] During the actual use of the Teflon bellows 2, it needs to be replaced and cleaned regularly. However, with the increase in the cumulative number of cleanings and being corroded by the corrosive substances in the exhaust gas, the Teflon bellows 2 may be damaged, resulting in the problem that the process residual gas in the Teflon bellows 2 directly leaks into the environment, and triggering an alarm of the combustible gas and toxic gas detection and alarm system (GDS) at the environmental point of the ion implantation machine tool 1.

[0027] Moreover, after using the Teflon bellows 2 for one cycle, there will be attachments remaining inside. These attachments will not only corrode the inner wall of the Teflon bellows 2, but also if the Teflon bellows 2 is damaged, the exhaust gas will come into contact with the water molecules in the air and react to generate more attachments, which will not only cause blockage of the exhaust pipe, but also affect the insulation of the exhaust pipe itself, and in severe cases, it will cause discharge due to the insulation failure of the ion implantation machine tool 1.

[0028] The current preventive measure is only to detect the leakage of the Teflon bellows 2 before use. However, if the Teflon bellows 2 leaks during the operation of the ion implantation machine tool 1, it cannot be detected, so there are still potential safety hazards.

[0029] In view of the above problems, the present utility model provides an exhaust pipe device, including:

[0030] An exhaust pipe for transporting the exhaust gas discharged from the semiconductor process equipment to the exhaust gas treatment equipment;

[0031] An insulating cover body is sleeved outside the exhaust pipe, and a sealed cavity is formed between the inner wall of the cover body and the outer wall of the exhaust pipe;

[0032] A pressure detection module for detecting the air pressure in the cavity;

[0033] A negative pressure device for making the cavity in a pre-negative pressure state before the semiconductor process equipment starts to work.

[0034] The present utility model also provides a semiconductor process equipment provided with the above exhaust pipe device.

[0035] The utility model forms a sealed cavity between the inner wall of the cover body and the outer wall of the exhaust pipe by covering the outside of the exhaust pipe with an insulating cover body, and makes the cavity in a negative pressure state (pre-negative pressure state) in advance before the semiconductor process equipment starts to work. During the working process of the semiconductor process equipment, once the exhaust pipe leaks, the change in the vacuum environment in the cavity can be detected by using the set pressure detection module, so as to realize the real-time monitoring of the leakage condition of the exhaust pipe.

[0036] Moreover, even if the exhaust pipe leaks, the exhaust gas leaked from the exhaust pipe can be restricted in the cavity by the cover body and will not diffuse into the surrounding environment, thus avoiding the environmental alarm caused by leakage.

[0037] In addition, the exhaust pipe is always in the vacuum environment in the cover body. Even if it is damaged, it will not cause the exhaust gas discharged to react with the water molecules in the air to generate attachments, resulting in the blockage of the exhaust pipe and the deterioration of the insulation of the exhaust pipe, triggering the equipment interlock.

[0038] Therefore, the utility model effectively solves the above-mentioned deficiencies existing in the prior art.

[0039] The following further details the specific implementation manners of the utility model in conjunction with the accompanying drawings.

[0040] Refer to Figure 2 and Figure 7 . An exhaust pipe device 10 of the utility model is connected between a semiconductor process equipment 1 and an exhaust gas treatment equipment 3 which is an external accessory of the semiconductor process equipment 1. The exhaust pipe device 10 includes an exhaust pipe 11, an insulating cover body 12, a negative pressure device 18 and a pressure detection module 17.

[0041] Among them, one end of the exhaust pipe 11 is hermetically connected to the port of the exhaust gas discharge end of the semiconductor process equipment 1, and the other end of the exhaust pipe 11 is hermetically connected to the port of the exhaust gas input end of the exhaust gas treatment equipment 3. The exhaust pipe 11 serves as an exhaust pipe path to convey the exhaust gas discharged from the exhaust gas discharge end of the semiconductor process equipment 1 to the exhaust gas input end of the exhaust gas treatment equipment 3 and enter the exhaust gas treatment equipment 3 for environmental protection treatment.

[0042] The cover body 12 covers the outside of the exhaust pipe 11. The cover body 12 has two open ends, and the cover body 12 is hermetically connected to the outside of both ends of the exhaust pipe 11 respectively, so as to form a sealed cavity 15 between the inner wall of the cover body 12 and the outer wall of the exhaust pipe 11. That is, the cover body 12 needs to completely surround the exhaust pipe 11 exposed between the semiconductor process equipment 1 and the exhaust gas treatment equipment 3.

[0043] In some embodiments, an insulating delivery pipe 16 is connected between the housing 12 and the negative pressure device 18. One end of the insulating delivery pipe 16 is sealingly connected to the housing 12 and communicates with the cavity 15 inside the housing 12. The other end of the insulating delivery pipe 16 is sealingly connected to the port 181 at the inlet end of the negative pressure device 18, so that the cavity 15 is communicated with the negative pressure device 18 through the delivery pipe 16. The negative pressure device 18 is used to pre-apply a vacuum pressure to the cavity 15 before the semiconductor process equipment 1 starts to work, that is, to pre-vacuum the cavity 15 through the negative pressure device 18, so that the cavity 15 is in a pre-negative pressure state in a vacuum environment.

[0044] The pressure detection module 17 is provided on the pipe wall of the delivery pipe 16. Therefore, the air pressure in the cavity 15 can be detected in real time through the connection formed between the delivery pipe 16 and the cavity 15. The so-called real-time detection of the air pressure in the cavity 15 includes performing regular detection of the air pressure in the cavity 15 at a certain frequency during the preparation stage before the semiconductor process equipment 1 starts to work, and during the entire working process from the start to the end of the semiconductor process equipment 1, or performing irregular detection at irregular frequencies according to the process rhythm.

[0045] The connection between the exhaust pipe 11 and the semiconductor process equipment 1 and the tail gas treatment equipment 3, the connection between the housing 12 and the exhaust pipe 11, and the connection between the delivery pipe 16 and the housing 12 and the negative pressure device 18 can adopt any other applicable connection methods other than the above connection methods, and the present utility model is not limited thereto.

[0046] Reference Figure 2 In some embodiments, the housing 12 includes a hard housing 13. Moreover, there is a gap greater than zero between the inner wall of the hard housing 13 and the outer wall of the exhaust pipe 11 to form a cavity 15 with a certain natural shape and volume.

[0047] In some embodiments, the hard housing 13 is made of a hard material and is not easily deformed. For example, the material for making the hard housing 13 may include a hard thick-walled metal material such as stainless steel, or may also include a plastic material resistant to atmospheric pressure such as nylon and polytetrafluoroethylene.

[0048] In some embodiments, the hard housing 13 includes a hard pipe 131; the inner diameter of the hard pipe 131 is greater than the outer diameter of the exhaust pipe 11, and the length of the hard pipe 131 is adapted to the length of the exhaust pipe 11.

[0049] In some embodiments, exhaust pipe connectors 111 are respectively provided at both ends of the exhaust pipe 11. The exhaust pipe 11 forms a detachable sealed connection with the port at the tail gas discharge end of the semiconductor process equipment 1 and the port at the tail gas input end of the tail gas treatment equipment 3 respectively through the exhaust pipe connectors 111 provided at both ends.

[0050] In some embodiments, hard pipe joints 1311 are respectively provided at both ends of the hard pipe 131. The hard pipe 131 is sleeved on the outer sides of the exhaust pipe joints 111 at the corresponding ends through the hard pipe joints 1311 provided at both ends, forming a detachable sealed connection with both ends of the exhaust pipe 11 respectively. Thus, while facilitating the replacement of the exhaust pipe 11 and the mutual loading and unloading between the exhaust pipe 11 and the hard pipe 131, a good sealing effect is achieved.

[0051] In some embodiments, delivery pipe joints 161 are respectively provided at both ends of the delivery pipe 16. A hard pipe interface 1312 is provided on the pipe wall of the hard pipe 131. The delivery pipe 16 forms a detachable sealed connection with the hard pipe interface 1312 and the port 181 at the inlet end of the negative pressure device 18 respectively through the delivery pipe joints 161 provided at both ends.

[0052] Reference Figure 3 . In some embodiments, the cover 12 includes a hard cover 13, and the hard cover 13 includes a hard capsule body 132 with openings at both ends. The hollow hard capsule body 132 forms a container shape bulging towards the middle. Specifically, the shape of the hard capsule body 132 includes an oval shape (as Figure 3 shown), a circular shape, a polygonal shape, or a special-shaped shape, etc., which are applicable container shapes with a hollow interior, and satisfy that there is a gap greater than zero between the inner wall of the hard capsule body 132 and the outer wall of the exhaust pipe 11, so as to form a sealed cavity 15 between the inner wall of the hard capsule body 132 and the outer wall of the exhaust pipe 11 when the hard capsule body 132 is sleeved (covered) on the exhaust pipe 11.

[0053] In some embodiments, exhaust pipe joints 111 are respectively provided at both ends of the exhaust pipe 11. The exhaust pipe 11 forms a detachable sealed connection with the port at the exhaust gas discharge end of the semiconductor process equipment 1 and the port at the exhaust gas input end of the exhaust gas treatment equipment 3 respectively through the exhaust pipe joints 111 provided at both ends. The length of the hard capsule body 132 is adapted to the length of the exhaust pipe 11, and hard capsule body joints 1321 are respectively provided at both open ends of the hard capsule body 132. The hard capsule body 132 is sleeved on the outer sides of the corresponding exhaust pipe joints 111 through the hard capsule body joints 1321 provided at both ends, forming a detachable sealed connection with both ends of the exhaust pipe 11 respectively. Thus, while facilitating the replacement of the exhaust pipe 11 and the mutual loading and unloading between the exhaust pipe 11 and the hard capsule body 132, a good sealing effect is achieved.

[0054] In some embodiments, delivery pipe joints 161 are respectively provided at both ends of the delivery pipe 16. A hard capsule body interface 1322 is provided on the capsule wall of the hard capsule body 132. The delivery pipe 16 forms a detachable sealed connection with the hard capsule body interface 1322 and the port 181 at the inlet end of the negative pressure device 18 respectively through the delivery pipe joints 161 provided at both ends.

[0055] The hard cover 13 is sleeved on the exhaust pipe 11, which can also protect the exhaust pipe 11 and prevent the exhaust pipe 11 from directly rubbing against surrounding facilities.

[0056] Refer again to Figure 2 . In some embodiments, the cover 12 includes a soft cover 14. And in the natural state, there is a gap greater than zero between the inner wall of the soft cover 14 and the outer wall of the exhaust pipe 11 to form a cavity 15 with a certain natural shape and volume.

[0057] In some embodiments, the soft cover 14 is made of deformable materials. For example, the materials for making the soft cover 14 may include soft materials with elastic deformation characteristics such as rubber, such as latex, Oxford cloth, etc. It may also include thin-walled hard materials, such as thin-walled stainless steel, thin-walled Teflon, etc., which can deform under pressure.

[0058] In some embodiments, the soft cover 14 includes a hose 141; the inner diameter of the hose 141 is greater than the outer diameter of the exhaust pipe 11, and the length of the hose 141 is adapted to the length of the exhaust pipe 11. Exhaust pipe joints 111 are respectively provided at both ends of the exhaust pipe 11. The exhaust pipe 11 forms a detachable sealed connection with the port of the exhaust gas discharge end of the semiconductor process equipment 1 and the port of the exhaust gas input end of the exhaust gas treatment equipment 3 through the exhaust pipe joints 111 provided at both ends. Hose joints 1411 are respectively provided at both ends of the hose 141. The hose 141 is sleeved on the outside of the corresponding exhaust pipe joint 111 through the hose joints 1411 provided at both ends to form a detachable sealed connection with both ends of the exhaust pipe 11, thereby facilitating the replacement of the exhaust pipe 11 and the mutual loading and unloading between the exhaust pipe 11 and the hose 141 while achieving a good sealing effect.

[0059] In some embodiments, delivery pipe joints 161 are respectively provided at both ends of the delivery pipe 16, and a hose interface 1412 is provided on the pipe wall of the hose 141. The delivery pipe 16 forms a detachable sealed connection with the hose interface 1412 and the port 181 of the inlet end of the negative pressure device 18 through the delivery pipe joints 161 provided at both ends.

[0060] Refer again to Figure 3 . In some embodiments, the cover 12 includes a soft cover 14, and the soft cover 14 includes a soft sac 142 with openings at both ends. The hollow soft sac 142 forms a container shape bulging towards the middle. Specifically, in the natural state, the shape of the soft sac 142 includes an oval (such as Figure 3a suitable container shape with a hollow interior, such as shown, circular, polygonal, or irregular, and satisfying that there is a gap greater than zero between the inner wall of the soft bladder 142 and the outer wall of the exhaust pipe 11, so as to form a sealed cavity 15 between the inner wall of the soft bladder 142 and the outer wall of the exhaust pipe 11 when the soft bladder 142 is sleeved (covered) on the exhaust pipe 11.

[0061] In some embodiments, when the pressure in the cavity 15 changes, the soft bladder 142 may have a certain deformability or ductility.

[0062] In some embodiments, exhaust pipe connectors 111 are respectively provided at both ends of the exhaust pipe 11. The exhaust pipe 11 forms a detachable sealed connection with the port of the tail gas emission end of the semiconductor process equipment 1 and the port of the tail gas input end of the tail gas treatment equipment 3 respectively through the exhaust pipe connectors 111 provided at both ends. The length of the soft bladder 142 is adapted to the length of the exhaust pipe 11. Soft bladder connectors 1421 are respectively provided at both open ends of the soft bladder 142. The soft bladder 142 is sleeved on the outside of the corresponding exhaust pipe connector 111 at both ends through the soft bladder connectors 1421 provided at both ends, and forms a detachable sealed connection with both ends of the exhaust pipe 11 respectively, so as to achieve a good sealing effect while facilitating the replacement of the exhaust pipe 11 and the mutual loading and unloading between the exhaust pipe 11 and the soft bladder 142.

[0063] In some embodiments, delivery pipe connectors 161 are respectively provided at both ends of the delivery pipe 16. A soft bladder interface 1422 is provided on the bladder wall of the soft bladder 142. The delivery pipe 16 forms a detachable sealed connection with the soft bladder interface 1422 and the port 181 of the inlet end of the negative pressure device 18 respectively through the delivery pipe connectors 161 provided at both ends.

[0064] Reference Figure 4 . In some embodiments, the cover 12 includes a soft cover 14, and the soft cover 14 includes a soft bladder 142 with both ends open. The hollow soft bladder 142 forms a generally flat bag-shaped container. Specifically, in the natural state, the soft bladder 142 at least partially adheres to the outer wall of the exhaust pipe 11, that is, there may be a certain gap between at least part of the inner wall of the soft bladder 142 and the outer wall of the exhaust pipe 11, or at least part of the inner wall of the soft bladder 142 and the outer wall of the exhaust pipe 11 may also be in contact with each other.

[0065] The soft capsule 142 exhibits a certain degree of deformability or ductility when the pressure in the cavity 15 changes. For example, when a vacuum is drawn into the cavity 15, the soft capsule 142 may deform toward the exhaust pipe 11 or the wall material may elastically contract, causing the soft capsule 142 to adhere to the outer wall of the exhaust pipe 11. When the cavity 15 is inflated (for example, when exhaust gas leaking from a damaged exhaust pipe 11 enters the cavity 15), the soft capsule 142 may deform away from the exhaust pipe 11 or the wall material may elastically stretch, causing the inner wall of the soft capsule 142 to be at least partially separated from the outer wall of the exhaust pipe 11 by the gas.

[0066] In some embodiments, the preformed planar shape of the bag-shaped soft capsule 142 includes an elliptical, circular, polygonal, or irregular shape, and its internal volume expands when inflated (similar to a foldable vacuum storage bag). Using the deformable or ductile soft capsule 142 as the cover 12 over the exhaust pipe 11 helps reduce space usage.

[0067] In some embodiments, exhaust pipe joints 111 are provided at both ends of the exhaust pipe 11. The exhaust pipe 11 forms a detachable sealed connection with the exhaust gas discharge port of the semiconductor process equipment 1 and the exhaust gas input port of the exhaust gas treatment equipment 3 through the exhaust pipe joints 111 provided at both ends. The length of the bag-shaped soft capsule 142 is not less than the length of the exhaust pipe 11. The opening of the soft capsule 142 is provided with soft capsule joints 1421 at both ends. The soft capsule 142 is sleeved on the outer side of the exhaust pipe joints 111 at the corresponding ends through the soft capsule joints 1421 provided at both ends, forming a detachable sealed connection with both ends of the exhaust pipe 11, thereby facilitating the replacement of the exhaust pipe 11 and the mutual assembly and disassembly of the exhaust pipe 11 and the soft capsule 142, while achieving a good sealing effect.

[0068] In some embodiments, a delivery tube joint 161 is provided at both ends of the delivery tube 16, and a soft capsule interface 1422 is provided on the capsule wall of the soft capsule 142. The delivery tube 16 forms a detachable sealed connection with the soft capsule interface 1422 and the port 181 at the inlet end of the negative pressure device 18 through the delivery tube joint 161 provided at both ends.

[0069] refer to Figure 5 Combined with reference Figure 2 , Figure 5 The figure shows the effect of the state change of the soft cover body 14 when the pressure in the cavity 15 changes when the cover body 12 is a soft cover body 14 and a hose 141. Figure 5 (a) shows the state of the hose 141 when the cavity 15 is pre-negatively pressurized (i.e., pre-evacuated). Figure 5(b) shows the state of the hose 141 when the exhaust pipe 11 leaks. Before the semiconductor process equipment 1 starts working, when the cavity 15 is evacuated by the negative pressure device 18 to make the inside of the cavity 15 in a pre-negative pressure state, the hose 141 will undergo an overall deformation towards the exhaust pipe 11, as shown in Figure 5 Figure (a). If the hose 141 still has a certain ductility, most of the tube walls of the hose 141 except the ends may also fit against the outer wall of the exhaust pipe 11 under the action of the vacuum pressure. If the exhaust pipe 11 is damaged, the exhaust gas flowing through the damaged part will overflow from the damaged part into the cavity 15. At this time, the pressure inside the cavity 15 will change accordingly and will be immediately detected by the pressure detection module 17. As the gas in the cavity 15 increases, the hose 141 will gradually undergo an overall recovery away from the exhaust pipe 11, as shown in Figure 5 Figure (b). If the gas in the cavity 15 continues to increase, theoretically the hose 141 will also undergo a certain expansion deformation. However, by starting the negative pressure device 18 to timely extract the gas in the cavity 15, this situation can be avoided, thereby protecting the hose 141. The situation when the soft cover 14 is the soft bladder 142 is similar to the situation when the soft cover 14 is the hose 141. Please refer to the above description for understanding.

[0070] Reference Figure 6 , which shows the state change effect of the soft cover 14 when the pressure inside the cavity 15 changes when the cover 12 is the soft cover 14 and is the bag-shaped soft bladder 142. Taking the soft cover 14 as a bag-shaped soft bladder 142 with a certain deformability (the length of this soft bladder 142 generally needs to be greater than the length of the exhaust pipe 11 to provide the necessary margin for the soft bladder 142 to undergo contraction deformation) as an example, among them, Figure 6 Figure (a) shows the state of the bag-shaped soft bladder 142 when the inside of the cavity 15 is in a pre-negative pressure state (i.e., pre-evacuated), Figure 6 Figure (b) shows the state of the soft bladder 142 when the exhaust pipe 11 leaks. Before the semiconductor process equipment 1 starts working, when the cavity 15 is evacuated by the negative pressure device 18 to make the inside of the cavity 15 in a pre-negative pressure state, the bag-shaped soft bladder 142 with a certain deformability will gradually undergo an irregular deformation towards the exhaust pipe 11 in order to conform to the action of the pressure. Due to the deformability of the soft bladder 142, the soft bladder 142 will try to attach to the exhaust pipe 11 through the deformation that occurs and may produce a morphology similar to wrinkles, as shown in Figure 6As shown in (a). If the bag-shaped soft capsule 142 has a certain ductility, most of the tube wall of the hose 141 will be relatively smoothly attached to the outer wall of the exhaust pipe 11 through elastic adjustment under the action of vacuum pressure (that is, it is less likely to produce a morphology similar to wrinkles). If the exhaust pipe 11 is damaged, the exhaust gas flowing through the damaged part will overflow from the damaged part into the cavity 15. At this time, the pressure in the cavity 15 will change accordingly and will be immediately detected by the pressure detection module 17. As the gas in the cavity 15 increases, the bag-shaped soft capsule 142 will expand and deform away from the exhaust pipe 11 to accommodate more gas, such as Figure 6 As shown in (b). However, the gas in the cavity 15 can be timely pumped out by starting the negative pressure device 18 to avoid overloading deformation of the bag-shaped soft capsule 142, thereby protecting the bag-shaped soft capsule 142.

[0071] It can be understood that when the cover 12 is a hard cover 13, when the pressure in the cavity 15 changes, for example, when the cavity 15 is pre-evacuated or when the leaked exhaust gas enters the cavity 15 due to the damage of the exhaust pipe 11, the hard cover 13 will not deform (or will not have an obvious deformation that can be visually observed). Please refer to Figure 2 and Figure 3 for understanding.

[0072] Refer to Figures 2 - 4 . In some embodiments, the negative pressure device 18 is further configured to immediately start vacuum pumping when the pressure detection module 17 detects a certain change in the pressure in the cavity 15, indicating that the exhaust pipe 11 has a leak, so as to timely pump out the leaked exhaust gas that enters the cavity 15 to the exhaust gas treatment device 3, and avoid the exhaust gas staying in the cavity 15 for a long time and corroding the outer wall of the exhaust pipe 11 and the cover 12.

[0073] In some embodiments, the port 182 at the outlet end of the negative pressure device 18 is connected to the helium leak detection module. During the operation of the semiconductor process equipment 1, the cavity 15 is periodically or aperiodically pumped by the negative pressure device 18, and the helium leak detection module is used to detect whether there is leaked exhaust gas in the cavity 15 to monitor the sealing performance of the cover 12 in real time.

[0074] In some embodiments, the helium leak detection module includes a helium leak detector.

[0075] In some embodiments, the negative pressure device 18 includes a vacuum pump. The delivery pipe 16 forms a detachable sealed connection with the port at the inlet end of the vacuum pump through the provided delivery pipe joint 161.

[0076] In some embodiments, the pressure detection module 17 includes a vacuum gauge. By installing a vacuum gauge on the delivery pipe 16, the vacuum environment inside the cavity of the housing 12 is monitored in real time. If the exhaust pipe 11 leaks, the vacuum reading in the cavity 15 detected by the vacuum gauge will change accordingly, so that the leakage state of the exhaust pipe 11 can be monitored in real time.

[0077] In some embodiments, the housing 12 and the delivery pipe 16 are made of compressive and corrosion-resistant materials. Even if the exhaust pipe 11 leaks, the harmful special gases contained in the leaked exhaust gas will not diffuse into the environment, avoiding environmental alarms caused by leakage. Moreover, the exhaust pipe 11 is in the sealed vacuum environment of the housing 12. Even if it is damaged, the exhaust gas cannot contact and react with the water molecules in the air to generate adherent products, so that the exhaust pipe 11 will not be blocked, and further the insulation performance of the exhaust pipe 11 will not deteriorate to trigger equipment interlock.

[0078] In some embodiments, the inner wall surfaces of the housing 12 and the delivery pipe 16 have corrosion-resistant layers.

[0079] In some embodiments, the exhaust pipe 11 includes an insulating Teflon bellows exhaust pipe 11. The Teflon bellows exhaust pipe 11 is detachably and sealingly connected to the port of the exhaust gas discharge end of the semiconductor process equipment 1 and the port of the exhaust gas input end of the exhaust gas treatment equipment 3 respectively through the exhaust pipe connectors 111 provided at both ends. The Teflon bellows exhaust pipe 11 can be bent and deformed to a certain extent inside the housing 12.

[0080] In some embodiments, the housing can also be an insulating Teflon bellows housing, which is sleeved on the Teflon bellows exhaust pipe 11 and can bend and deform together with the Teflon bellows exhaust pipe 11.

[0081] Reference Figure 7 And in combination with reference Figures 2 - 4 . A semiconductor process equipment 1 of the present utility model includes the exhaust pipe line device 10 of the present utility model described above. Figure 7 Exemplarily shows the structure when the housing 12 of the exhaust pipe line device 10 is a hard pipe 131 (or a flexible pipe 141), but is not limited thereto. In the process, the exhaust gas discharged from the semiconductor process equipment 1 is discharged to the exhaust gas treatment equipment 3 for treatment through the exhaust pipe 11 provided in the exhaust pipe line device 10.

[0082] Among them, the exhaust pipe device 10 is used to detect the leakage condition of the exhaust pipe 11 connected between the semiconductor process equipment 1 and the tail gas treatment equipment 3 in real time during the operation of the semiconductor process equipment 1, and when the exhaust pipe 11 leaks, through the housing 12 covering the outside of the exhaust pipe 11, the tail gas leaked from the exhaust pipe 11 is restricted in the cavity 15 between the housing 12 and the exhaust pipe 11 and isolated from the atmosphere.

[0083] In some embodiments, the semiconductor process equipment 1 includes an ion implantation device, a thin film deposition device, an etching processing device, etc.

[0084] The utility model is particularly suitable for enhancing the insulation performance when the ion implantation device is connected to the tail gas treatment equipment 3 as an external accessory facility.

[0085] In summary, the utility model forms a sealed cavity 15 between the inner wall of the housing 12 and the outer wall of the exhaust pipe 11 by covering the outside of the exhaust pipe 11 with an insulating housing 12, and by making the inside of the cavity 15 in a negative pressure state in advance before the semiconductor process equipment 1 starts to work. During the operation of the semiconductor process equipment 1, once the exhaust pipe 11 leaks, the change in the vacuum environment inside the cavity 15 can be detected by using the set pressure detection module 17, so as to realize the real-time monitoring of the leakage condition of the exhaust pipe 11. Moreover, even if the exhaust pipe 11 leaks, the tail gas leaked from the exhaust pipe 11 can be restricted in the cavity 15 through the housing 12 and will not diffuse into the surrounding environment, thus avoiding the environmental alarm caused by the leakage. In addition, the exhaust pipe 11 is always in the vacuum environment inside the housing 12. Even if it is damaged, it will not cause the tail gas discharged to react with the water molecules in the air to generate attachments, resulting in the blockage of the exhaust pipe 11, and thus the insulation performance of the exhaust pipe 11 deteriorates and triggers the equipment interlock.

[0086] Although the embodiments of the utility model have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are all within the scope and spirit of the utility model described in the claims. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. An exhaust pipe line device, characterized in that, Comprising: An exhaust pipe for conveying the exhaust gas discharged from a semiconductor process equipment to an exhaust gas treatment equipment; An insulating cover body covering the outside of the exhaust pipe, and forming a sealed cavity between the inner wall of the cover body and the outer wall of the exhaust pipe; A pressure detection module for detecting the air pressure in the cavity; A negative pressure device for making the cavity in a pre-negative pressure state before the semiconductor process equipment starts to work.

2. The exhaust pipe line device according to claim 1, characterized in that, The cover body includes a hard cover body, and there is a gap greater than zero between the inner wall of the hard cover body and the outer wall of the exhaust pipe.

3. The exhaust pipe line device according to claim 2, characterized in that The hard cover body includes a hard pipe or a hard capsule body with both ends open. Both ends of the hard pipe or the hard capsule body are closely connected to both ends of the exhaust pipe, and both ends of the exhaust pipe are respectively closely connected to the semiconductor process equipment and the exhaust gas treatment equipment.

4. The exhaust pipe line device according to claim 1, characterized in that, The cover body includes a soft cover body, and there is a gap greater than zero between the inner wall of the soft cover body and the outer wall of the exhaust pipe, or the soft cover body has ductility or deformability.

5. The exhaust pipe line device according to claim 4, characterized in that The soft cover body includes a soft pipe or a soft capsule body with both ends open. Both ends of the soft pipe or the soft capsule body are closely connected to both ends of the exhaust pipe, and both ends of the exhaust pipe are respectively closely connected to the semiconductor process equipment and the exhaust gas treatment equipment.

6. The exhaust pipe line device according to claim 1, characterized in that, The cavity is communicated with the inlet end of the negative pressure device through an insulating delivery pipe provided on the cover body. The negative pressure device is used to apply a vacuum pressure to the cavity before the semiconductor process equipment starts to work, and the outlet end of the negative pressure device is connected to a helium leak detection module.

7. The exhaust pipe line device according to claim 6, characterized in that, The pressure detection module is provided on the pipe wall of the delivery pipe.

8. The exhaust pipe line device according to claim 7, characterized in that, The negative pressure device includes a vacuum pump, and / or, the pressure detection module includes a vacuum gauge, and / or, the helium leak detection module includes a helium leak detector.

9. The exhaust pipe line device according to claim 6, wherein, The exhaust pipe includes an insulating Teflon corrugated pipe. Both ends of the Teflon corrugated pipe are respectively detachably and closely connected to the exhaust gas discharge end of the semiconductor process equipment and the exhaust gas input end of the exhaust gas treatment equipment, and / or, the cover body and the delivery pipe are made of a compression-resistant and corrosion-resistant material, or the inner walls of the cover body and the delivery pipe have corrosion-resistant layers. Both ends of the cover body are respectively detachably and closely connected to both ends of the exhaust pipe through the provided openings, and both ends of the delivery pipe are respectively detachably and closely connected to the cover body and the inlet end of the negative pressure device.

10. A semiconductor process equipment, comprising the exhaust pipe line device according to any one of claims 1-9. The exhaust pipe line device is used to detect the leakage condition of the exhaust pipe connected between the semiconductor process equipment and the exhaust gas treatment equipment in real time during the working process of the semiconductor process equipment, and when the exhaust pipe leaks, the exhaust gas leaked from the exhaust pipe is restricted in the cavity between the cover body and the exhaust pipe and isolated from the atmosphere through the cover body covering the outside of the exhaust pipe.

Images