Cooling device and annealing equipment

Abstract

The utility model discloses a cooling device and annealing equipment. The cooling device comprises a cooling disc, a machine body provided with a cooling cavity, and an air intake and exhaust system. The machine body comprises a top wall plate located above the cooling cavity, and a boss with an air inlet diffusion cavity is arranged at the position, corresponding to the central area of the cooling disc, of the top wall plate. A top opening of the air inlet diffusion cavity communicates with an air inlet system located on the top face of the top wall plate. At least the central area of the bottom of the air inlet diffusion cavity is provided with a flow baffle; a plurality of air outlet holes are sequentially formed in the bottom of the air inlet diffusion cavity in the circumferential direction of the flow baffle, and the two ends of each air outlet hole communicate with the air inlet diffusion cavity and the cooling cavity correspondingly. According to the application, the air inlet diffusion cavity, the flow baffle and the plurality of air outlets are arranged in the central area of the top of the cooling cavity, so that the airflow field can be optimized, and the problem of low product yield caused by the fact that some peeled wafers fall back on the wafer in the cooling process after the annealing process is solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and particularly relates to a cooling device and an annealing apparatus provided with the cooling device. Background Art

[0002] With the continuous expansion of the domestic semiconductor market scale and the increasingly advanced manufacturing process, annealing processes need to be added before the CuBS (copper interconnect) process and after the copper CMP (chemical mechanical polishing) process for 55nm, 40nm and more advanced process nodes. The principle of the annealing process is to heat the wafer to a certain temperature through a resistance wire to remove the water vapor and other volatile impurities adsorbed on the wafer, and at the same time reduce a part of the copper oxide on the copper surface through hydrogen to ensure good contact between the metal wires in the wafer during processes such as etching and CMP. After the annealing process, the wafer has a relatively high temperature, generally around 260°C, and needs to be transferred to the cooling cavity of the cooling device for sufficient cooling before being transferred back to the wafer transfer cassette.

[0003] For example, please refer to Figure 1 and Figure 2 . The structure of a conventional cooling device generally includes an upper cover 1, an upper chamber lifting mechanism 2, a main body 3, a wafer shell 4, an upper cold plate 6, a lower chamber lifting mechanism 7, a lower cold plate 8, quartz beads 10, an air inlet connector 9 and an exhaust pump 11. Among them, the inside of the main body 3 is hollow, forming a hollow structure with upper and lower cooling chambers; the upper cover 1 is hermetically fitted with the upper end opening of the main body 3 to form a first cooling chamber Q' above, and the upper cold plate 6 is located at the bottom of the first cooling chamber Q', and can be used as a cooling mechanism to cool the wafer 5 located in the first cooling chamber Q'; the lower cold plate 8 is hermetically fitted with the lower end opening of the main body 3 to form a second cooling chamber Q" below, and the lower cold plate 8 is located at the bottom of the second cooling chamber Q", and can be used as a cooling mechanism to cool the wafer 5 located in the second cooling chamber Q"; the upper chamber lifting mechanism 2 and the lower chamber lifting mechanism 7 respectively drive the wafer 5 to descend onto the upper cold plate 6 and the lower cold plate 8 through the wafer shell 4 for cooling; the air inlet connector 9 and the exhaust pump 11 are located at the symmetrical corners of the main body 3, the air inlet connector 9 is used to provide a ventilation air flow to the cooling chamber, and the exhaust pump 11 is used to discharge the gas in the cooling chamber. Specifically, please refer to Figure 3 , Figure 3 For Figure 1 and Figure 2 , the streamline diagram of the air flow velocity field during the ventilation test of any cooling chamber of the cooling device in

[0004] Specifically, please refer to Figure 4, there is a peeling chip 51 with exposed delaminated cross-sections of different layers at the edge of the wafer after the CMP process. After the wafer after the annealing process is cooled in the cooling chamber, there is a phenomenon that the peeling chip 51 peels off and then returns to its original position (that is, the adjacent peeling chips 51 separate from each other and then return to the position before separation), resulting in peeling defects on the wafer. The main reason for this defect is that the air inlet connector 9 in the above cooling chamber structure is located at a corner of the cooling chamber (specifically, refer to the area where the upper right air inlet arrow is located in Figure 2 ). This air inlet method will generate an air velocity field as shown in Figure 3 during the ventilation process of the cooling chamber. In this case of edge-side air inlet, the cooling rate in the area of the wafer near the air inlet side (the part of the wafer edge where the peeling chip 51 exists) is relatively high. Along the air inlet direction, the cooling rate gradually decreases in the diagonal area where the air inlet connector 9 and the exhaust pump 11 are located. In other areas (i.e., the areas on both sides of the diagonal where the air inlet connector 9 and the exhaust pump 11 are located), due to air flow reflux and turbulence, the air flow velocity is the lowest, the cooling rate is the lowest, and the difference from the air inlet side is relatively large. Therefore, the stress generated inside the wafer is relatively large, resulting in the peeling chip 51 at the wafer edge peeling off and then returning to the wafer surface under the action of the air flow field and the internal stress of the wafer. This process leads to the problem of peeling defects on the wafer and results in a low yield of the final product.

[0005] It can be seen that the above cooling device has the following disadvantages: for some wafer products (such as 28HK products), after the CMP process, peeling chips will be generated at the wafer edge; then, when the wafer is cooled by the cooling device after the annealing process, the peeling chip 51 at the wafer edge peels off and then falls back on the wafer, resulting in peeling defects and affecting the product yield.

[0006] Therefore, how to avoid the peeling chip at the wafer edge peeling off and then falling back during the cooling ventilation process, resulting in product defects, is a technical problem that needs to be urgently solved by those skilled in the art. Utility Model Content

[0007] In view of this, the purpose of this application is to provide a cooling device and an annealing equipment. By setting an air inlet diffusion chamber in the central area at the top of the cooling chamber, the air flow field can be optimized, thereby solving the problem that the peeling chips generated during the CMP process of some wafers (such as 28HK products) fall back on the wafers during the cooling process after the annealing process, resulting in a low product yield, and enriching the process application scenarios of the machine.

[0008] To achieve the above purpose, this application provides the following technical solutions:

[0009] A cooling device, comprising:

[0010] A body, inside which a cooling chamber is provided;

[0011] A cold plate, located at the bottom of the cooling chamber, for placing the wafer;

[0012] An intake system for delivering process gas to the cooling chamber;

[0013] An exhaust system for discharging the process gas from the cooling chamber;

[0014] The body includes a top wall plate located at the top of the cooling chamber. A boss is provided at a position corresponding to the central region of the cold plate, and an intake diffuser chamber is provided inside the boss;

[0015] The top opening of the intake diffuser chamber is located on the top surface of the top wall plate to communicate with the intake system; and, the flow cross-sectional area of the intake diffuser chamber is larger than the flow cross-sectional area of the intake delivery channel in the intake system;

[0016] A baffle is provided at least in the central region of the bottom of the intake diffuser chamber; a plurality of air outlet holes are arranged in sequence along the circumferential direction of the baffle at the bottom of the intake diffuser chamber, and both ends of each air outlet hole communicate with the intake diffuser chamber and the cooling chamber respectively;

[0017] The exhaust system is located on the side wall of the cooling chamber.

[0018] Optionally, in the above cooling device, the baffle is a bottom plate closing the bottom end of the intake diffuser chamber; a plurality of the air outlet holes are arranged in sequence along the circumferential direction on the annular side wall of the intake diffuser chamber, and each air outlet hole penetrates the annular side wall in the radial direction;

[0019] And / or,

[0020] The circumferential side edge of the baffle is connected to the annular side wall of the intake diffuser chamber through a bracket to form the air outlet hole.

[0021] Optionally, in the above cooling device, the flow cross-sectional area of the intake diffuser chamber gradually increases along the air outlet direction.

[0022] Optionally, in the above cooling device, a filter element is further included, and the filter element is located at the top of the intake diffuser chamber and covers the flow cross-section of the top air inlet of the intake diffuser chamber.

[0023] Optionally, in the above cooling device, a cross beam is further included;

[0024] The cross beam is located in the cooling chamber, above the cold plate, for controlling the up and down movement of the wafer; and, the cross beam is provided with an avoidance hole, and the projection of the intake diffuser chamber on the cold plate is located within the projection area of the avoidance hole on the cold plate.

[0025] Optionally, in the above cooling device, the cold plate includes a plate body and a support member located at the top of the plate body for placing a wafer:

[0026] A linear groove extending along a linear track is provided on the top surface of the plate body;

[0027] The support member includes a linear support member adapted to the linear groove; the bottom of the linear support member is located in the linear groove; the top of the linear support member protrudes relative to the top surface of the plate body for placing the wafer and forming a line contact with the wafer.

[0028] Optionally, in the above cooling device, a plurality of the linear grooves are provided on the top surface of the plate body for installing a plurality of the linear support members;

[0029] Among the plurality of linear grooves, at least part are annular grooves arranged concentrically with equal-proportionally increasing radii; among the plurality of linear support members, at least part are annular support members adapted to the annular grooves;

[0030] And / or, among the plurality of linear grooves, at least part are unit grooves arranged in sequence circumferentially around the center of the plate body, and the projection of each unit groove on the top surface of the plate body is any one or a combination of a straight line segment, an arc, and a broken line; among the plurality of linear support members, at least part are unit support members adapted to the unit grooves.

[0031] Optionally, in the above cooling device, the support member further includes a cylindrical support member;

[0032] A dot-shaped groove adapted to the cylindrical support member is further provided on the top surface of the plate body;

[0033] The bottom of the cylindrical support member is located in the dot-shaped groove; the top of the cylindrical support member protrudes relative to the top surface of the plate body for placing the wafer and forming a point contact with the wafer.

[0034] Optionally, in the above cooling device, the height range of the top of the support member protruding relative to the top surface of the plate body is 0.15 mm to 0.25 mm.

[0035] Optionally, in the above cooling device, the heat conduction coefficient of the support member is lower than that of the plate body;

[0036] And / or, the wear resistance coefficient of the support member is greater than that of any metal material.

[0037] Optionally, in the above cooling device, the plate body is made of a metal material; at least the top of the support member is made of a sapphire material.

[0038] Optionally, in the above cooling device, the machine body includes a main body part and an upper cover:

[0039] The top groove of the main body part is hermetically connected to the upper cover to form a first cooling chamber, and a first cold plate is arranged at the bottom of the first cooling chamber; the upper cover is the top wall plate of the first cooling chamber and is provided with a first air inlet diffusion chamber; the first air inlet diffusion chamber is communicated with a first air inlet conveying channel, and the first air inlet conveying channel is a first gas pipeline located outside the upper cover or a first gas through hole opened in the upper cover.

[0040] And / or, the bottom groove of the main body part is hermetically connected to a second cold plate to form a second cooling chamber; the main body part includes a partition plate located between the top groove and the bottom groove, the partition plate is the top wall plate of the second cooling chamber and is provided with a second air inlet diffusion chamber; the second air inlet diffusion chamber is communicated with a second air inlet conveying channel, and the second air inlet conveying channel is a second gas pipeline located between the partition plate and the first cold plate or a second gas through hole opened in the partition plate.

[0041] Optionally, in the above cooling device, it further includes:

[0042] A first filter element, located at the top of the first air inlet diffusion chamber and fixedly connected to the upper cover through a first structural member, and the first structural member includes the body shell of the diffuser;

[0043] And / or, a second filter element, located at the top of the second air inlet diffusion chamber and fixedly connected to the partition plate through a second structural member, and the second structural member includes a pressing ring.

[0044] An annealing device is provided with the cooling device described above.

[0045] When the cooling device and the annealing device provided in the present application are working, the airflow with the lowest temperature flows radially outward from the center area of the wafer, so that the cooling efficiency of the wafer gradually decreases from the center area to the circumferential edge area, and the cooling efficiency of the circumferential edge of the crystal is basically the same, and the real-time temperature of the circumferential edge of the crystal is basically the same, and the internal stress of the wafer is small. Although the airflow velocity in the center area of the wafer is large and the cooling efficiency is the highest, the airflow velocity in the edge area of the wafer is basically the same and the cooling efficiency is the same, and the airflow backflow and turbulence phenomena in the edge area of the wafer are very slight or even non-existent. Therefore, not only can the problem of large internal stress of the wafer caused by large differences in airflow velocity and cooling rate at the edge of the wafer be avoided, but also the problem of peeling back and then falling back of the wafer after peeling due to backflow, turbulence and uneven cooling efficiency during the cooling ventilation process at the edge of the wafer can be avoided, which is beneficial to avoiding product defects and improving product yield. Description of the Drawings

[0046] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0047] Figure 1 It is a cross-sectional view of the internal structure of a cooling device.

[0048] Figure 2 It is Figure 1 the structural schematic diagram of the cooling device in

[0049] Figure 3 It is Figure 1 the streamline diagram of the air velocity field when the air in any cooling chamber of the cooling device in

[0050] Figure 4 It is a structural schematic diagram of a wafer peeling generation.

[0051] Figure 5 It is Figure 1 the top view of the cold plate in the cooling device in

[0052] Figure 6 It is Figure 1 the side view of the cold plate in the cooling device in

[0053] Figure 7 It is a cross-sectional view of the internal structure of a cooling device provided by the first specific embodiment of the present application.

[0054] Figure 8 It is Figure 7 the enlarged view of the area where the second intake diffusion chamber is located in

[0055] Figure 9 It is a structural schematic diagram of a second intake delivery channel opened in the partition plate provided by the first specific embodiment of the present application.

[0056] Figure 10 It is the streamline diagram of the air velocity field when the air in any cooling chamber of the cooling device provided by the first specific embodiment of the present application is ventilated.

[0057] Figure 11 It is a structural schematic diagram of the crossbeam in the cooling device provided by the first specific embodiment of the present application.

[0058] Figure 12 It is an exploded view of the cooling device provided by the first specific embodiment of the present application.

[0059] Figure 13 、 Figure 14 、Figure 15 The structure distribution diagrams of the top surface supports of three cold plates provided by the first specific embodiment of the present application are respectively shown.

[0060] Figure 16 The curve graphs of the wafer temperature varying with time under two different conditions where the distance between the wafer and the cold plate is 0.4 mm and 0.2 mm provided by the first specific embodiment of the present application are shown.

[0061] Figure 17 The internal structure sectional view of the cooling device provided by the second specific embodiment of the present application is shown.

[0062] Figure 18 is Figure 17 the bottom view of the rectangular dotted line area in Detailed implementation manners

[0063] In the cooling device and annealing equipment provided by the present application, by arranging an intake diffusion chamber in the central area at the top of the cooling chamber, the air flow field can be optimized, thereby solving the problem that some wafers (such as 28HK products) fall back onto the wafers during the cooling process after annealing, resulting in a low product yield during the CMP process, and enriching the process application scenarios of the machine tool.

[0064] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0065] First specific embodiment

[0066] The first specific embodiment of the present application provides a cooling device, which includes a machine body, a cold plate, an intake system, and an exhaust system. Among them, a cooling chamber is arranged inside the machine body, that is, at least part of the hollow structure inside the machine body constitutes the cooling chamber; the cold plate is located at the bottom of the cooling chamber and is used to place the wafer 5; the intake system is used to deliver process gas to the cooling chamber; the exhaust system is used to discharge the process gas from the cooling chamber.

[0067] Furthermore, the machine body in the cooling device includes a top wall plate located at the top of the cooling chamber. A boss 102 is arranged at a position corresponding to the central area S1 of the cold plate up and down. An intake diffusion chamber is arranged inside the boss 102 (specifically, reference can be made to Figure 7 and Figure 8 the first intake diffusion chamber 101' and the second intake diffusion chamber 101” in

[0068] The top opening of the intake diffuser cavity is located on the top surface of the top wall plate to connect to the intake system; and, the flow-through cross-sectional area of the intake diffuser cavity is larger than that of the intake delivery channel in the intake system;

[0069] A baffle plate 104 is provided at least in the central area of the bottom of the intake diffuser cavity, and a plurality of air outlet holes 111 are arranged in sequence along the circumference of the baffle plate 104 at the bottom of the intake diffuser cavity. Both ends of each air outlet hole 111 communicate with the intake diffuser cavity and the cooling cavity respectively.

[0070] It can be seen that the first specific embodiment of the present application provides the cooling device with at least the following advantages:

[0071] a) In this cooling device, the top wall plate at the top of the cooling cavity can be locally thickened through the boss 102, so that an intake diffuser cavity with a longer axial length can be set to form a more obvious diffusion effect.

[0072] b) In this cooling device, since the flow-through cross-sectional area of the intake diffuser cavity is larger than that of the intake delivery channel in the intake system, when the air flow enters the intake diffuser cavity from the intake delivery channel, due to the sudden increase in the flow-through cross-section, the air flow can be depressurized and diffused in the intake diffuser cavity and then enter the cooling cavity to cool the wafer on the cold plate.

[0073] c) In this cooling device, the baffle plate 104 can block the incoming air flow, thus preventing the incoming air flow from directly blowing on the center of the wafer; moreover, the baffle plate 104 can also disperse the incoming air flow to a certain extent and guide the air flow to diffuse around; further, in this cooling device, by arranging a plurality of air outlet holes 111 along the circumference at the bottom of the intake diffuser cavity, the incoming air flow can be diffused circumferentially, preventing the incoming air flow from directly blowing on the center of the wafer, which is beneficial to reducing the temperature difference between the center and the surrounding area of the wafer, and thus beneficial to reducing or even avoiding the stress at the edge of the wafer. (In the prior art, the cooling rate in the middle of the wafer is greater than that at the edge, resulting in greater stress at the edge of the wafer)

[0074] Please refer to Figure 10 , the above cooling device with the intake diffuser cavity arranged in the central area at the top of the cooling cavity can generate an air flow velocity field as Figure 10 shown during the ventilation of the cooling cavity. It can be seen that in the cooling device provided by the first specific embodiment of the present application, a new intake structure is adopted. Through the intake diffuser cavity and the cooling cavity, a double-layer intake cavity with central area intake at the top as Figure 8 shown can be formed. Compared with Figure 1 and Figure 2For the lateral air intake structure shown in the figure, the air flow with the lowest temperature flows radially outward from the center region of the wafer. As a result, the wafer cooling efficiency gradually decreases from the center region to the peripheral edge region. Moreover, the cooling efficiencies of the circumferential edges of the wafer are basically the same, and the real-time temperatures of the circumferential edges of the wafer are basically the same, with relatively small internal stress in the wafer. Although the air flow velocity in the center region of the wafer is relatively high and the cooling efficiency is the highest, the air flow velocities and cooling efficiencies in the edge region of the wafer are basically the same. Moreover, the air flow recirculation and turbulence phenomena in the edge region of the wafer are very slight or even non-existent. Therefore, not only can the problem of large internal stress in the wafer caused by large differences in air flow velocity and cooling rate difference at the wafer edge be avoided, but also the problem of peeling and then falling back of the wafer edge during the cooling and ventilation process due to recirculation, turbulence, and uneven cooling efficiency can be avoided, which is conducive to avoiding product defects and improving product yield.

[0075] It should be noted here that if the air intake direction at the center of the top of the cooling chamber blows directly vertically downward towards the cold plate, at this time, due to the relatively high temperature of the wafer, if the air intake flow at the center of the top of the cooling chamber directly flows towards the wafer, it will cause more air cooling in the middle region of the wafer than in the outer edge region, resulting in a much higher cooling rate in the middle of the wafer than at the edge. After testing, there is a temperature difference of about 40 degrees between the edge temperature and the center region temperature of the wafer at this time (the temperature of the center region of the wafer is about 150 degrees, and the temperature of the edge of the wafer is about 190 degrees). Therefore, the stress at the edge of the wafer is relatively large, and the peeling of the edge of the wafer during CMP post-annealing has an increased risk of falling off due to the relatively large stress at the edge of the wafer, and the peeling defect of the wafer edge peeling off and then falling back is serious. Therefore, in this application, a baffle 104 is provided at the bottom of the air intake diffusion chamber. The baffle 104 can block the air intake flow and prevent the air intake flow from directly blowing towards the center of the wafer. Moreover, through a plurality of air outlet holes 111 arranged in sequence along the circumference of the air intake diffusion chamber, the air flow in the air intake diffusion chamber can be further depressurized and diffused. The air flow output from the air outlet hole 111 is transported to the circumferential region outside the center region of the cold plate to achieve lateral air outlet. Thus, the air flow can be diffused to the surrounding areas above the wafer, and at the same time, part of the air is also diffused to the center of the wafer, but does not directly irradiate the wafer. This is beneficial to balancing the cooling rates of the middle and edge of the wafer, avoiding the stress problem caused by the cooling rate in the middle of the wafer being much higher than that at the edge due to conventional lateral air intake, and also solving the peeling defect of peeling off and then falling back.

[0076] In some embodiments, such as Figure 7 and Figure 8As shown in the figure, the baffle 104 is specifically the bottom plate that closes the bottom end of the intake diffuser cavity. That is, the circumferential side of the baffle 104 is adapted to the shape and has the same size as the annular side wall of the intake diffuser cavity, so that they are connected to each other to form the closed end of the intake diffuser cavity. Specifically, the baffle 104 and the annular side wall of the intake diffuser cavity can be an integrally formed structure, or a component formed by assembly and sealed connection. In addition, the annular side wall of the intake diffuser cavity is provided with a plurality of air outlet holes 111 arranged in sequence along the circumference. Each air outlet hole 111 penetrates the annular side wall of the intake diffuser cavity in the radial direction. That is, both ends of each air outlet hole are respectively communicated with the intake diffuser cavity and the cooling cavity, so as to send the air flow transported by the intake system into the intake diffuser cavity to the cooling cavity through the air outlet holes 111 located at the bottom annular side wall of the intake diffuser cavity. It can be seen that in this cooling device, by specifically designing the position and arrangement of the air outlet holes 111 provided at the bottom of the intake diffuser cavity, the air flow after pressure reduction and diffusion can be transported through the air outlet holes 111 to the circumferential area outside the central area of the cold plate (that is, the area surrounding the central area of the cold plate and relatively closer to the edge of the cold plate than the central area of the cold plate).

[0077] In some embodiments, as Figure 7 shown in the figure, the cooling cavity in the cooling device includes a first cooling cavity Q' and a second cooling cavity Q", and the intake diffuser cavity includes a first intake diffuser cavity 101' and a second intake diffuser cavity 101". Among them:

[0078] The top wall plate (i.e., the upper cover 1) of the first cooling cavity Q' is provided with a first intake diffuser cavity 101'. The bottom end of the first intake diffuser cavity 101' is a closed structure, and a plurality of air outlet holes 111 arranged in sequence along the circumference are provided through the annular side wall at the bottom of the first intake diffuser cavity 101'. Both ends of each air outlet hole 111 are respectively communicated with the first intake diffuser cavity 101' and the first cooling cavity Q', so as to send the air flow transported by the intake system into the first intake diffuser cavity 101' to the first cooling cavity Q' through the plurality of air outlet holes 111 located at the bottom annular side wall of the first intake diffuser cavity 101'. At this time, the end of each air outlet hole 111 away from the first intake diffuser cavity 101' is also the end communicated with the first cooling cavity Q'.

[0079] The top wall plate of the second cooling chamber Q” (i.e., the partition plate 31) is provided with a second intake air diffusion chamber 101”. The bottom end of the second intake air diffusion chamber 101” is a closed structure, and a plurality of air outlet holes 111 arranged in sequence along the circumferential direction penetrate through the annular side wall at the bottom of the second intake air diffusion chamber 101”. Both ends of each air outlet hole 111 are respectively communicated with the second intake air diffusion chamber 101” and the second cooling chamber Q”. Thus, the air flow conveyed into the second intake air diffusion chamber 101” by the intake air system is sent into the second cooling chamber Q” through the plurality of air outlet holes 111 located on the annular side wall at the bottom of the second intake air diffusion chamber 101”. At this time, one end of each air outlet hole 111 away from the second intake air diffusion chamber 101” is also the end communicated with the second cooling chamber Q”.

[0080] It should be noted that the cooling device with a novel intake air structure provided in the first specific embodiment of the present application can be used in an annealing device. During specific implementation, please refer to Figure 7 , the diameter of the central area of the cold plate is S1, and the radial width of the circumferential area of the cold plate is S2. The specific size ranges of S1 and S2 and the proportional relationship between the two can be specifically adjusted according to actual needs. For example, it can be adjusted according to Figure 10 the test results shown in to obtain the optimal air flow velocity field.

[0081] Please refer to Figure 7 , in some embodiments, the body of the cooling device includes a main body part 3 and an upper cover 1. Among them: the top groove of the main body part 3 is hermetically connected to the upper cover 1 to form a first cooling chamber Q'. A first cold plate 12' is provided at the bottom of the first cooling chamber Q'. The upper cover 1 is the top wall plate of the first cooling chamber Q' and is provided with a first intake air diffusion chamber 101'. The first intake air diffusion chamber 101' is communicated with a first intake air conveying channel 16'. The first intake air conveying channel 16' is a first gas pipeline located outside the upper cover 1 (specifically, please refer to Figure 7 and Figure 11 ), or is a first gas through hole opened in the upper cover 1 (not shown in the figure, and those skilled in the art can design the specific structure according to actual needs). The bottom groove of the main body part 3 is hermetically connected to the second cold plate 12” to form a second cooling chamber Q”. The main body part 3 includes a partition plate 31 located between the top groove and the bottom groove. The partition plate 31 is the top wall plate of the second cooling chamber Q” and is provided with a second intake air diffusion chamber 101”. The second intake air diffusion chamber 101” is communicated with a second intake air conveying channel 16”. The second intake air conveying channel 16” is a second gas pipeline located between the partition plate 31 and the first cold plate 12' (not shown in the figure, and those skilled in the art can design the specific structure according to actual needs), or is a second gas through hole opened in the partition plate 31 (specifically, please refer to Figure 17 ).

[0082] In some embodiments, bosses 102 are respectively provided on the inner side of the top wall plate above each cooling cavity of the cooling device, and the above-mentioned intake diffusion cavities are respectively arranged in the bosses 102 on the inner side of the top wall plate of each cooling cavity. That is: in the first cooling cavity Q', the first intake diffusion cavity 101' located in the central region of the top of the cooling cavity is arranged in the central region of the upper cover 1, within the boss 102 on the inner side (i.e., the lower side) of the upper cover 1, and penetrates the top wall plate in the thickness direction of the top wall plate; in the second cooling cavity Q'', the second intake diffusion cavity 101'' located in the central region of the top of the cooling cavity is arranged in the central region of the partition plate 31, and within the boss 102 on the lower side of the partition plate 31, and penetrates the top wall plate in the thickness direction of the top wall plate. In specific implementation, generally, a plurality of air outlet holes 111 are evenly distributed circumferentially around the boss 102, and the diameter range of each air outlet hole 111 can be 0.8 mm to 1.2 mm, for example, 1 mm. Thus, a plurality of air outlet holes 111 are arranged in sequence along the circumferential direction on the outer side surface of the boss 102. When the air flow enters the first cooling cavity Q' from the first intake diffusion cavity 101' through the air outlet holes 111, or enters the second cooling cavity Q'' from the second intake diffusion cavity 101'' through the air outlet holes 111, a certain uniform flow field can be achieved through the air outlet holes 111 and the air flow pressure can be reduced. It should be noted here that although the air flow direction through the air outlet holes 111 is towards the edge region of the wafer, good cooling efficiency can also be achieved in the central region of the wafer under the action of heat transfer and air flow field. It should be noted here that if the aperture of the air outlet holes 111 is too small, under the condition of the same intake pressure in the cooling cavity, the pressure drop is large, the flow rate is small, and the time required to fill the cooling cavity is long, resulting in low WPH (working efficiency); if the aperture of the air outlet holes 111 is greater than 1.2 mm, the time for the chamber to be filled with gas will be less than the wafer cooling time, which may affect the cooling effect of the cooling device on the wafer.

[0083] In some embodiments, the upper cover 1 is integrally processed from 6061 aluminum alloy, and the density is greatly reduced compared with stainless steel. Since the bottom surface of the upper cover 1, that is, the side surface located at the top of the first cooling cavity Q', is provided with a boss 102, when the first cooling cavity Q' is in a vacuum state, the structural strength of the upper cover 1 near the first intake diffusion cavity 101' can be ensured under one atmospheric pressure. Similarly, since the bottom surface of the partition plate 31, that is, the side surface located at the top of the second cooling cavity Q'', is provided with a boss 102, when the second cooling cavity Q'' is in a vacuum state, the structural strength of the partition plate 31 near the second intake diffusion cavity 101'' can be ensured under one atmospheric pressure.

[0084] In some embodiments, a filter element is further provided at the inlet of the intake diffusion cavity of the cooling device. The filter element is located at the top of the intake diffusion cavity and covers the flow cross-section of the top air inlet of the intake diffusion cavity. Thus, the filter element can filter and disperse the air flow entering the intake diffusion cavity. Specifically, please refer toFigure 8 The filter element includes a first filter element 13' located at the top of the first intake diffuser cavity 101' and a second filter element 13'' located at the top of the second intake diffuser cavity 101''.

[0085] Among them, the first filter element 13' is fixedly connected to the upper cover 1 through a first structural member 14. The first structural member 14 includes the body shell of a diffuser 141 (standard part), that is, the first filter element 13' and the first structural member 14 form a diffuser standard part. Specifically, the first structural member 14 includes a disc-shaped part and a handle-shaped part: the first filter element 13' can be installed inside the bottom surface of the disc-shaped part, and the edge of the disc-shaped part can be fixedly connected to the upper cover 1 through a fastener; the handle-shaped part is located outside the disc-shaped part, that is Figure 7 on the outer side surface of the top in and is fixedly connected to the disc-shaped part. Further, a first groove 103 is provided on the outer side surface of the upper cover 1, that is, the top surface. The first intake diffuser cavity 101' is provided through the bottom surface of the first groove 103. Through the first groove 103, not only can most of the diffuser standard part be accommodated, which is beneficial to reducing the height of the cooling device, but also it is beneficial to play a role in weight reduction and facilitate disassembly and assembly. Moreover, a first sealing ring is provided between the bottom surface of the disc-shaped part of the first structural member 14 and the upper cover 1 to ensure the sealing of this intake position and prevent air leakage.

[0086] In addition, the second filter element 13'' is fixedly connected to the partition plate 31 through a second structural member 15. The second structural member 15 includes a retaining ring. Further, a second groove is provided on the upper side surface of the partition plate 31, that is, the top surface. The second intake diffuser cavity 101'' is provided through the bottom surface of the second groove. Through the second groove, not only can the second structural member 15 and the second filter element 13'' be completely accommodated, which is beneficial to reducing the height of the cooling device, but also it is beneficial to play a role in weight reduction and facilitate disassembly and assembly. Moreover, a second sealing ring is provided between the bottom surface of the second structural member 15 and / or the bottom surface of the second filter element 13'' and the partition plate 31 to ensure the sealing of this intake position and prevent air leakage.

[0087] In specific implementation, both the first filter member 13' and the second filter member 13'' can adopt a filter plate structure sintered with nickel material. Moreover, the first structural member 14 is a stainless steel body, which is welded to the first filter member 13' to form a standard diffuser component; the second structural member 15 adopts a stainless steel pressing ring structure. Among them, the second filter member 13'' is a plate with a structure different from that of a conventional diffuser. The second filter member 13'' is sintered with nickel and welded to the second structural member 15 with a stainless steel pressing ring structure around it, so as to form a sealed bottom surface adapted to the partition plate 31. In addition, both the first filter member 13' and the second filter member 13'' are sintered with nickel, with a sparse density and small flow pressure loss, which can compensate for the pressure loss of the intake air conveying channels (such as the first intake air conveying channel 16' and the second intake air conveying channel 16''), making the intake air pressures in different cooling chambers basically the same, that is, the air flow velocities and air flow pressures at the air outlet holes 111 of the intake air diffuser chamber are basically the same, and finally ensuring that the wafer cooling rates in different cooling chambers are consistent. Figure 10 It is the air flow field of the cooling chamber in the cooling device provided by the present application. It can be seen that there is no backflow in this air flow field, which can blow the peeling generated after the CMP and annealing processes of the wafer away from the wafer in the cooling chamber and will not fall back to the wafer surface like the lateral intake air system, thus avoiding the defect that the peeling falls off and then falls back.

[0088] In some embodiments, the above cooling device is applied to an annealing device, and its main body 3 is an integral structure, which can form a first cooling chamber Q' and a second cooling chamber Q'' arranged up and down through the structures of slotting at the top and slotting at the bottom. At this time, because the internal spaces of the first cooling chamber Q' and the second cooling chamber Q'' are small, and the thickness of the partition plate 31 between the two is relatively thin, when a second air delivery through hole as shown in Figure 9 is formed by laterally perforating in the partition plate 31 as the second intake air conveying channel 16'' for conveying gas into the second intake air diffuser chamber 101'', and at the same time an external first air delivery pipeline is adopted as the first intake air conveying channel 16' for conveying gas into the first intake air diffuser chamber 101', the aperture of the second air delivery through hole is generally about 3 mm, resulting in a large gas resistance and a large flow velocity of the gas entering the second intake air diffuser chamber 101'' through the second intake air conveying channel 16'. Therefore, if there are no multiple air outlet holes 111 for guiding the air flow to flow out laterally, it will not only cause the intake air flow to directly blow vertically downward onto the wafer 5, but also easily cause the intake air flow velocity in the second cooling chamber Q'' to be greater than that in the first cooling chamber Q', resulting in different process results in different cooling chambers. Therefore, the shapes and volumes of the intake air diffuser chambers located at the tops of different cooling chambers in the cooling device are the same, and the apertures of the air outlet holes 11 on the periphery of the intake air diffuser chamber are the same and the air outlet directions are all radial, so as to ensure that the air flows entering the first cooling chamber Q' from the first intake air diffuser chamber 101' and the air flows entering the second cooling chamber Q'' from the second intake air diffuser chamber 101'' are consistent in terms of flow velocity, flow rate, and flow field distribution.

[0089] Please refer to Figure 8 、 Figure 11 and Figure 12 , in some embodiments, a cross beam 17 is respectively arranged in each cooling cavity of the cooling device. Each cross beam 17 is respectively located above the cold plate in the cooling cavity where it is located, and is used to control the up and down movement of the wafer 5 in the cooling cavity; moreover, the cross beam 17 is provided with an avoidance hole 170. In each cooling device, the projection of the intake diffusion cavity on the cold plate is located within the projection area of the avoidance hole 170 on the cold plate. Specifically, as shown in Figure 11 , the middle area of the cross beam 17 is a circular ring structure, and the central hole of this circular ring structure is the avoidance hole 170, which is used to avoid the boss 102 and avoid interference with the intake diffusion cavity. Thus, even if the cross beam 17 is installed at the center position of the cooling cavity, and the intake diffusion cavity is located in the top center area of the cooling cavity, the intake air flow above the cold plate can be avoided through the avoidance hole 170, and the cross beam 17 can be prevented from blocking and disturbing the intake air flow. Specifically, the cross beam 17 can be in a cantilever structure and is made of 6061 aluminum material, so that it can not only meet the strength requirements for the cross beam to support the wafer, but also greatly reduce the weight of the cross beam.

[0090] Please refer to Figure 12 , in some embodiments, the intake connector 9 of the cooling device is located on the side of the main body 3 and is used to connect to the gas source. The first air outlet interface of the intake connector 9 is connected to the diffuser 141 through the first intake conveying channel 16', and then is communicated with the first cooling cavity Q' through the first intake diffusion cavity 101'; moreover, the second air outlet interface of the intake connector 9 is communicated with the second intake diffusion cavity 101” through the second intake conveying channel 16” ( Figure 7 and Figure 12 not shown in Figure 9 ), so as to communicate with the second cooling cavity Q”. This structural design can realize the total intake of the cooling device through the intake connector 9 and ensure that the total intake pressures of the two cooling cavities arranged up and down are consistent.

[0091] During specific implementation, the installation of the intake assembly (including the second filter 13”, the second structural member 15, the sealing ring, and the fastener) located at the top of the second cooling cavity Q” has requirements for the overall assembly sequence of the cooling device, and the second filter 13” needs to be installed preferentially during assembly. The second filter 13” is designed as a plate structure, which can reduce its size in the numerical direction (i.e., Figure 7The space required for the second filter element 13" is determined by the Z direction of the filter element 13, and the bottom surface of the second filter element 13" and / or the second structural member 15 is provided with a sealing ring, which can ensure the circumferential sealing effect of the second filter element 13", so that the gas enters the second cooling chamber Q" through the second filter element 13", avoiding airflow leakage, and also avoiding the second filter element 13" from directly contacting the top wall panel of the second cooling chamber Q" to produce particles that pollute the cooling chamber. The second structural member 15 is designed as a pressure ring structure, which is used to press the second filter element 13", and then fixedly connected to the partition plate 31 with a countersunk screw, avoiding the space requirements of the cylindrical head screw. It should be noted here that the second filter element 13" and the second structural member 15 in the air intake assembly located at the top of the second cooling chamber Q" are separately equipped parts and need to be used in combination on site. In particular, the second structural member 15 generally adopts a pressure ring, which occupies less space and can meet the actual requirement of a smaller installation space at the top of the second cooling chamber Q". The installation space at the top of the first cooling chamber Q' is larger, so the diffuser 141 (standard part) can be directly used in the air intake assembly located at the top of the first cooling chamber Q'. At this time, the first structural component 14 specifically refers to the body shell of the diffuser 141, and the first filter component 13' is the filtering structure built into the diffuser 141.

[0092] In some embodiments, the first cold plate 12' located at the bottom of the first cooling chamber Q' is fixed to the upper side of the partition plate 31 using screws, and an O-ring is provided around the bottom of the cold plate to provide a seal. This design ensures that the air intake of the second cooling chamber Q" located below does not affect the first cold zone chamber Q' located above, and the upper and lower cooling chambers are independent chambers. In addition, the second cold plate 12" is located at the bottom of the second cooling chamber Q" and is fixedly connected to the end face of the annular side wall outside the bottom notch of the main body 3 by screws and sealed by a sealing ring. This structural design facilitates subsequent maintenance. In addition, the first cold plate 12' located in the first cold zone chamber Q' and the second cold plate 12" located in the second cooling chamber Q" are both water-cooled plates, and their plate support structures and water channel distributions are consistent, so that the cooling effect on the wafer is the same when the water flow rate is consistent. In addition, the structural design of the beam 17 in the second cooling chamber Q" and the first cooling chamber Q' maintains the same design principle.

[0093] During the production process, the temperature of the wafer after the annealing process is generally around 260°C. After the wafer is placed in the cooling chamber of the cooling device, if the height of the quartz beads on the water-cooling plate (referred to as the cold plate) is inconsistent, the high-temperature wafer will be deformed due to gravity. The deformed wafer has a situation where the distance between the center area and the water-cooling plate increases. The cooling effect is greatly reduced at the same time, resulting in insufficient cooling of the wafer. When the wafer is transmitted out of the cooling chamber, the temperature is still around 150 degrees. The Cu (copper) on the wafer will react with the oxygen in the air to generate a mixed phase of CuO (copper oxide) and Cu2O (cuprous oxide) on the surface, resulting in reduced conductivity of the wafer and scrapping of the product.

[0094] For example, please refer to Figure 1 and Figure 2 as well as Figure 5 and Figure 6 A cooling chamber structure includes an upper cover 1, an upper chamber lifting mechanism 2, a main body 3, a wafer shell 4, an upper cold plate 6, a lower chamber lifting mechanism 7, a lower cold plate 8, quartz beads 10, an air inlet connecting piece 9, and an exhaust pump 11. Among them, the inside of the main body 3 is hollow and is used to form two upper and lower cooling chambers; the upper cover 1 is hermetically fitted with the upper end opening of the main body 3 to form an upper chamber, and the upper cold plate 6 is located at the bottom of the upper chamber and can be used as a cooling mechanism to cool the wafer 5 located in the upper chamber; the lower cold plate 8 is hermetically fitted with the lower end opening of the main body 3 to form an upper chamber, and the lower cold plate 8 is located at the bottom of the upper chamber and can be used as a cooling mechanism to cool the wafer 5 located in the lower chamber; the upper chamber lifting mechanism 2 and the lower chamber lifting mechanism 7 respectively drive the wafer shell 4 to drive the wafer 5 down to the upper cold plate 6 and the lower cold plate 8 for cooling; seven quartz beads 10 are evenly distributed on the cold plate main bodies of the upper cold plate 6 and the lower cold plate 8 respectively for supporting the wafer 5, and each quartz bead 10 is 0.4 mm higher than the top surface of the cold plate main body; the air inlet connecting piece 9 and the exhaust pump 11 are respectively located at the symmetric corners of the main body 3.

[0095] When the wafer 5 after the annealing process is placed on the upper cold plate 6 or the lower cold plate 8 in the above cooling chamber structure for cooling, because the quartz beads 10 are 0.4 mm away from the top surface of the cold plate main body, there will be an air cushion effect when the wafer 5 falls onto the cold plate, and the wafer 5 will slip and wear the quartz beads 10 when it contacts the quartz beads 10. When the wear degree of the quartz beads 10 is different, because the temperature of the wafer 5 is relatively high, placing it on the quartz beads 10 with different heights will cause the wafer 5 to deform, and the cooling effect on the wafer 5 will be reduced when the cooling time remains unchanged. Therefore, it is necessary to strictly control the height of the seven quartz beads 10 assembled on the water-cooled plate. Otherwise, the wafer 5 will generate copper oxide due to insufficient cooling, ultimately resulting in the scrapping of the wafer product and causing losses.

[0096] It can be seen that the above cooling chamber structure has the following disadvantages: when the wafer is cooled on the cold plate in the chamber, the quartz beads will cause insufficient cooling of the wafer due to inconsistent installation heights or inconsistent heights caused by wear during long-term operation, resulting in the reaction of Cu on the wafer with oxygen in the air to generate CuO and Cu2O after the wafer contacts the atmosphere, thereby scrapping the product and causing losses. Therefore, how to avoid insufficient cooling of the wafer caused by inconsistent heights of the quartz beads is a technical problem that needs to be urgently solved by those skilled in the art.

[0097] Based on this, please refer to Figure 13, each cold plate in the cooling device provided by the present application includes a plate body 121 and a support member located at the top of the plate body 121 for placing the wafer 5. The support member includes a linear support member 122 adapted to the linear groove. Among them: a linear groove extending along a linear trajectory is provided on the top surface of the plate body 121; the bottom of the linear support member 122 is located in the linear groove; the top of the linear support member 122 protrudes relative to the top surface of the plate body 121 for placing the wafer 5 and forms a line contact with the wafer 5. Here, it should be noted that in the cooling process, since the temperature of the wafer is very high, the temperature of the cold plate is very low, and the support member can continuously conduct heat between the cold plate and the wafer. Therefore, when the support member supports the wafer, the height requirement of the support member is very strict. Any reason such as slight wear or assembly error that causes the height of the support member to be inconsistent will have a very large impact on the wafer cooling effect, resulting in excessive wafer deformation and affecting the product yield. Therefore, the present application proposes that in the cooling process, the linear support member 122 is used to support the wafer so that the support member and the wafer are in "line contact", thereby avoiding the support member from wearing and detaching from the wafer and affecting the cooling efficiency. It can be seen that the cooling device provided by the embodiment of the present application adopts a cold plate with a new support structure, which can increase the support area for the wafer and reduce the risk that the height inconsistency caused by the wear of the support frame and other reasons leads to detachment from the wafer and affects the wafer cooling efficiency and deformation amount.

[0098] In some embodiments, a plurality of linear grooves are provided on the top surface of the plate body 121 for installing a plurality of linear support members 122. Among them, at least part of the plurality of linear grooves are annular grooves arranged concentrically and with the radii increasing in equal proportion; at least part of the plurality of linear support members 122 are annular support members 1221 adapted to the annular grooves. For example, please refer to Figures 13 to 15 the cold plate shown in, which abandons the structural design of quartz beads and respectively provides a plurality of annular grooves on the top surface of the cold plate, and each annular groove is respectively installed with an annular support member 1221 adapted thereto.

[0099] Here, it should be noted that the linear support member provided in the embodiment of the present application may be the annular support member 1221, but is not limited to the annular support member. For example, please refer to Figure 15 , a plurality of linear grooves are provided on the top surface of the plate body 121 for installing a plurality of linear support members 122. Among them:

[0100] Among the multiple linear grooves, at least part of them are unit grooves arranged circumferentially in sequence around the center of the disk body. The projection of each unit groove on the top surface of the disk body 121 is any one or a combination of a straight line segment, an arc, and a broken line. Among the multiple linear support members 122, at least part of them are unit support members 1222 adapted to the unit grooves. Thus, the projection of each unit support member 1222 on the top surface of the disk body 121 is any one or a combination of a straight line segment, an arc, and a broken line. Moreover, the extending direction of each unit support member 1222 can be radial, circumferential, or other directions, as long as the multiple unit support members 1222 are arranged circumferentially in sequence around the center of the disk body and can achieve stable support for the wafer 5. In short, the support member in contact with the wafer can be designed as an arc structure, but not limited to the arc structure, as long as it can ensure line contact with the wafer and avoid the influence of unequal heights of the support members on wafer cooling.

[0101] Here, it should be noted that in specific implementation, each support member generally cannot be directly processed using a cold plate because the cold plate is made of a metal material with high heat conduction, which easily causes a high cooling rate at the contact between the wafer and the support member, resulting in wafer jumping. In this application, it is proposed to use a material with a low heat conduction coefficient such as sapphire as the support member to support the wafer, which can ignore the cooling effect caused by the contact between the support member and the wafer. Moreover, the wear resistance of materials such as sapphire is much greater than that of metal materials. It can be seen that the linear support member 122 can achieve a better support effect on the whole wafer, and the contact surface between the linear support member 122 and the wafer is also larger than the point contact between the quartz beads and the wafer. Thus, the problem of wafer deformation caused by the wear of a single quartz bead can be avoided, and the problems of wafer deformation and insufficient cooling effect caused by inconsistent heights of the quartz beads can be effectively avoided.

[0102] Furthermore, as Figure 14 and Figure 15 shown, in some embodiments, the support member on the cold plate for supporting the wafer further includes a columnar support member 123, that is, the quartz beads in the prior art, or other columnar support structures with the same / similar shape as the quartz beads but different materials and heights. Correspondingly, in addition to the above-mentioned linear grooves, the top surface of the disk body 121 is also provided with dot-shaped grooves for installing the columnar support members 123. Among them, the bottom of the columnar support member 123 is located in the dot-shaped groove; the top of the columnar support member 123 protrudes relative to the top surface of the disk body 121 and is used to place the wafer 5 and form a point contact with the wafer 5. Thus, the columnar support member 123 can make up for the support of specific positions in some small areas of the wafer to achieve the best support effect, the best cooling efficiency, and the best anti-deformation effect. Preferably, in some embodiments, the height range of the top of each support member located on the upper surface of the cold plate protruding relative to the top surface of the disk body 121 is 0.15 mm to 0.25 mm, for example, 0.2 mm.

[0103] During the actual production process, the height of the top of the support member from the top surface of the disk body 121 is an important factor affecting the wafer cooling effect. Please refer to Figure 16 , when comparing the distance between the wafer and the top surface of the cold disk body in the original design, which is 0.4 mm, with the distance between the wafer and the top surface of the cold disk body required to be protected in this application, which is 0.2 mm, the cooling effect difference is 54 degrees when cooling for 12 s. Therefore, in order not to increase the wafer cooling duration and avoid the impact on WPH, it is necessary to reduce the distance between the wafer and the top surface of the cold disk body. However, reducing the height of the support member will cause an air cushion effect when the wafer lands on the cold disk, resulting in sliding of the wafer. Therefore, a deflation structure is added to eliminate the air cushion effect between the wafer and the cold disk body 121. Further reducing the height difference between the top of the support member and the top surface of the cold disk body, that is, reducing the height of the support member protruding from the top surface of the disk body 121, can improve the cooling rate. However, due to the processing accuracy of parts or installation problems, the risk of contact between the wafer and the cold disk body will inevitably increase, resulting in problems such as excessive surface metal on the back of the wafer, uneven cooling of the wafer circle, and increased internal stress leading to wafer jumping. Therefore, the height range of the top of the support member protruding from the top surface of the disk body 121 provided in this application, which is 0.15 mm to 0.25 mm (especially 0.2 mm), is the best size after comprehensive consideration.

[0104] Moreover, in some embodiments, the disk body 121 is made of a metal material, and the thermal conductivity coefficients of the support members mounted on its top surface are all lower than the thermal conductivity coefficient of the disk body 121, and / or the wear resistance coefficients of the support members are all greater than any metal material. For example, at least the tops of the support members are made of sapphire material, and preferably each support member is entirely made of sapphire material. It should be noted here that the thermal conductivity coefficient mentioned in this article refers to the amount of heat transferred through a 1-square-meter area in 1 second under stable heat transfer conditions, with a temperature difference of 1 degree K or °C between the two side surfaces of a 1-meter-thick material. The thermal conductivity coefficient is also called the heat conduction coefficient or thermal conductivity, denoted by λ, with the unit of watt per meter degree, that is, W / (m·K), and here K can be replaced by °C. In addition, the wear resistance coefficient mentioned in this article is also called the wear coefficient or abrasion coefficient, which is a quantitative index used to measure the ability of a material to resist surface wear, that is, the wear resistance of the material under specific conditions; the wear resistance coefficient usually represents the mass or volume lost due to wear per unit area per unit time of the material, or is expressed as the wear rate per unit area. The smaller the wear resistance coefficient, the better the wear resistance of the material and the more durable it is.

[0105] It can be seen that the present application provides a cold plate structure with a novel support member, which comprehensively considers the number, layout, wafer support deformation effect, and wafer cooling effect of the support members (including the linear support member 122 and the cylindrical support member 123), so that the cylindrical support member 123 (which can be made of quartz beads) is more evenly distributed on the inner and outer circles of the circumferentially arranged annular support member 1221, better supports the wafer, and can improve the overall wear resistance. When using this cold plate, the wafer can be better supported. Assuming that a certain cylindrical support member 123 is installed incorrectly or worn, due to the existence of a large number of linear support members 122, the deformation of the wafer can be greatly reduced, thereby effectively avoiding the problem of wafer deformation caused by inconsistent support member heights and insufficient cooling effect.

[0106] Second specific embodiment

[0107] The second specific embodiment of the present application provides a cooling device, which is only different from the cooling device provided in the above first specific embodiment in that:

[0108] (1) The circumferential side of the baffle 104 is connected to the annular side wall of the intake diffuser cavity through the bracket 105, and the air outlet holes 111 are formed. For example, please refer to Figure 18 , in this cooling device, an annular gap is formed between the circumferential side of the baffle 104 located at the bottom of the first cooling cavity Q' and the annular side wall of the intake diffuser cavity. A plurality of brackets 105 are arranged at intervals along the circumference of the annular gap, that is, the circumferential side of the baffle 104 is connected to the annular side wall of the intake diffuser cavity through the bracket 105, and the air outlet holes 111 are formed between adjacent brackets 105, so as to form a plurality of air outlet holes 111 arranged in sequence along the circumference of the baffle 104. At this time, the baffle 104 can block and disperse the incoming air flow, avoiding the incoming air flow from directly blowing the center of the wafer.

[0109] (2) The cross-sectional area of the intake diffuser cavity gradually increases along the air outlet direction. At this time, the intake diffuser cavity is a trumpet-shaped air outlet channel structure, which can reduce the pressure and diffuse the air flow from the intake delivery channel and then deliver the air flow to the surface of the wafer in the cooling cavity through the air outlet holes 111. For example, please refer to Figure 17 , in this cooling device, the first intake diffuser cavity 101' located in the central area of the top wall plate (i.e., the upper cover 1) above the first cooling cavity Q' is the trumpet-shaped air outlet channel structure, and the internal air flow direction can be seen from the dotted arrows in Figure 17 , so that it can better diffuse toward the peripheral edge area of the wafer.

[0110] After testing, the streamline diagram of the air flow velocity field during the ventilation test of the first cooling cavity Q' is basically the same as that in Figure 3The simulation results are consistent. During the intake process of the first cooling chamber Q', the gas enters the first intake diffusion chamber 101' located in the central region of the upper cover 1 after passing through the first intake delivery channel and the diffuser 141, and then enters the first cooling chamber Q' through a plurality of air outlet holes 111 and diffuses radially in all directions. There is no gas reflux during this process, and the peeling on the wafer surface can be peeled off during the cooling in the cooling chamber without falling back, thus avoiding product defects caused by the peeling glass on the wafer falling back again.

[0111] In summary, the embodiment of the present application also provides an annealing device, which is provided with the cooling device provided in any of the above embodiments.

[0112] Finally, it should also be noted that in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed.

[0113] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0114] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cooling device, comprising: A body having a cooling chamber disposed therein; A cold plate located at the bottom of the cooling chamber for placing a wafer (5); An intake system for delivering process gas to the cooling chamber; An exhaust system for exhausting the process gas from the cooling chamber; Characterized in that the body includes a top wall plate located at the top of the cooling chamber, and a boss (102) is provided at a position corresponding to the central region of the cold plate, and an intake diffusion chamber is provided in the boss (102); The top opening of the intake diffusion chamber is located on the top surface of the top wall plate to communicate with the intake system; and, the flow cross-sectional area of the intake diffusion chamber is larger than the flow cross-sectional area of the intake delivery channel in the intake system; A baffle plate (104) is provided at least in the central region of the bottom of the intake diffusion chamber; a plurality of air outlet holes (111) are arranged in sequence along the circumferential direction of the baffle plate (104) at the bottom of the intake diffusion chamber, and both ends of each air outlet hole (111) communicate with the intake diffusion chamber and the cooling chamber respectively; The exhaust system is located on the side wall of the cooling chamber.

2. The cooling device according to claim 1, wherein, The baffle plate (104) is a bottom plate closing the bottom end of the intake diffusion chamber; a plurality of the air outlet holes (111) are arranged in sequence along the circumferential direction on the annular side wall of the intake diffusion chamber, and each air outlet hole (111) penetrates the annular side wall in the radial direction; And / or, The circumferential side edge of the baffle plate (104) is connected to the annular side wall of the intake diffusion chamber through a bracket (105) to form the air outlet hole (111).

3. The cooling device according to claim 1, characterized in that, The flow cross-sectional area of the intake diffusion chamber gradually increases along the air outlet direction.

4. The cooling device according to claim 1, characterized in that, It further includes a filter element, and the filter element is located at the top of the intake diffusion chamber and covers the flow cross-section of the top air inlet of the intake diffusion chamber.

5. The cooling device according to any one of claims 1 to 4, characterized in that It further includes a cross beam (17); The cross beam (17) is located in the cooling chamber, above the cold plate, for controlling the up and down movement of the wafer (5); and, the cross beam (17) is provided with an avoidance hole (170), and the projection of the intake diffusion chamber on the cold plate is located within the projection area of the avoidance hole (170) on the cold plate.

6. The cooling device according to any one of claims 1 to 4, wherein the cold plate includes a plate body (121), and a support member located at the top of the plate body (121) for placing the wafer (5), and is characterized in that: A linear groove extending along a linear track is provided on the top surface of the plate body (121); The support member includes a linear support member (122) adapted to the linear groove; the bottom of the linear support member (122) is located in the linear groove; the top of the linear support member (122) protrudes relative to the top surface of the plate body (121) for placing the wafer (5) and forms a line contact with the wafer (5).

7. The cooling device according to claim 6, characterized in that, A plurality of the linear grooves are provided on the top surface of the plate body (121) for installing a plurality of the linear support members (122); wherein: Among the plurality of linear grooves, at least some are annular grooves arranged concentrically and with radii increasing in equal proportion; among the plurality of linear support members (122), at least some are annular support members (1221) adapted to the annular grooves; And / or, among the plurality of linear grooves, at least some are unit grooves arranged in sequence circumferentially around the center of the disk body, and the projection of each unit groove on the top surface of the disk body is any one or a combination of a straight line segment, an arc, and a broken line; among the plurality of linear support members (122), at least some are unit support members (1222) adapted to the unit grooves.

8. The cooling device according to claim 7, characterized in that, The support member further includes a cylindrical support member (123); A dot-shaped groove dominated by the cylindrical support member (123) is further provided on the top surface of the disk body (121); The bottom of the cylindrical support member (123) is located in the dot-shaped groove; the top of the cylindrical support member (123) protrudes relative to the top surface of the disk body (121) for placing a wafer (5) and forming a point contact with the wafer (5).

9. The cooling device according to claim 7, characterized in that, The height by which the top of the support member protrudes relative to the top surface of the disk body (121) ranges from 0.15 mm to 0.25 mm.

10. The cooling device according to claim 6, characterized in that, The heat conduction coefficient of the support member is lower than that of the disk body (121); And / or, the wear resistance coefficient of the support member is greater than that of any metal material.

11. The cooling device according to claim 10, characterized in that, The disk body (121) is made of a metal material; at least the top of the support member is made of sapphire material.

12. The cooling device according to claim 1, characterized in that, The machine body includes a main body part (3) and an upper cover (1): The top groove of the main body part (3) is hermetically connected to the upper cover (1) to form a first cooling chamber (Q'), and a first cold plate (12') is provided at the bottom of the first cooling chamber (Q'); the upper cover (1) is the top wall plate of the first cooling chamber (Q') and is provided with a first air inlet diffusion chamber (101'); the first air inlet diffusion chamber (101') is communicated with a first air inlet conveying channel (16'), and the first air inlet conveying channel (16') is a first air pipe line located outside the upper cover (1) or a first air inlet through hole opened in the upper cover (1); And / or, the bottom groove of the main body part (3) is hermetically connected to a second cold plate (12”) to form a second cooling chamber (Q”); the main body part (3) includes a partition plate (31) located between the top groove and the bottom groove, and the partition plate (31) is the top wall plate of the second cooling chamber (Q”) and is provided with a second air inlet diffusion chamber (101”); the second air inlet diffusion chamber (101”) is communicated with a second air inlet conveying channel (16”), and the second air inlet conveying channel (16”) is a second air pipe line located between the partition plate (31) and the first cold plate (12') or a second air inlet through hole opened in the partition plate (31).

13. The cooling device according to claim 12, characterized in that, It further includes: A first filter member (13'), located at the top of the first air inlet diffusion chamber (101'), and fixedly connected to the upper cover (1) through a first structural member (14), and the first structural member (14) includes the body shell of a diffuser (141); And / or, a second filter element (13"), located at the top of the second intake diffuser chamber (101"), and fixedly connected to the partition plate (31) through a second structural member (15), the second structural member (15) including a compression ring.

14. An annealing device, characterized in that, A cooling device as claimed in any one of claims 1 to 13 is provided.

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