Plasma etching rinse tank

Abstract

The utility model discloses a plasma etching rinse tank, which relates to the technical field of plasma etching, and comprises a tank body, a rotating frame is arranged on the inner side of the tank body, a pressing plate is arranged on the upper side of the rotating frame, wafer clamping grooves are arranged on the rotating frame and the pressing plate, a driving motor is arranged at one end of the rotating frame, and a driving motor is arranged at the other end of the rotating frame. A limiting sliding groove is formed in the inner side face of the groove body, a sliding rod is arranged in the limiting sliding groove, lead screws are arranged at the two ends of the sliding rod in a penetrating mode, a servo motor is arranged at one end of each lead screw, and a cleaning nozzle is arranged on the lower side face of the sliding rod. Through the arrangement of the rotating frame, the pressing plate, the driving motor, the sliding rod, the lead screw, the cleaning spray head, the limiting sliding groove and the servo motor, a wafer is fixed to the rotating frame and is pressed and fixed through the pressing plate, the driving motor can drive the rotating frame and the wafer to rotate, the servo motor drives the lead screw to rotate, and the wafer is cleaned through the sliding rod. Therefore, the sliding rod moves along the limiting sliding groove, the cleaning nozzle on the lower side of the sliding rod can spray out the cleaning liquid, the rotating wafer is quickly cleaned, and the cleaning efficiency of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of plasma etching, in particular to a plasma etching cleaning tank. Background Technique

[0002] A plasma etcher, also known as a plasma etching machine, a plasma planar etching machine, a plasma etcher, a plasma surface treatment instrument, a plasma cleaning system, etc. Plasma etching is the most common form of etching. Its principle is that the gas exposed to the electron region forms a plasma, and the resulting ionized gas and the gas composed of released high-energy electrons form plasma or ions. When the ionized gas atoms are accelerated by the electric field, they will release enough force to tightly bond with the surface repulsion force of the material or etch the surface. The wafers after plasma etching need to be cleaned in a cleaning tank to ensure the cleanliness of the wafers, and thus ensure the production quality of the wafers.

[0003] When the existing cleaning tank for plasma etching is in use, the wafers are mostly immersed in the cleaning tank, and the wafers cannot be rotated and rinsed, so that the cleaning efficiency of the wafers cannot be improved. Content of the Utility Model

[0004] The technical problem to be solved by the utility model is to overcome the existing defects and provide a plasma etching cleaning tank. By setting a rotating frame, a pressing plate, a driving motor, a sliding rod, a lead screw, a cleaning nozzle, a limiting chute and a servo motor, the wafers are fixed on the rotating frame and are tightly fixed by the pressing plate. The driving motor can drive the rotating frame and the wafers to rotate. The servo motor drives the lead screw to rotate, so that the sliding rod moves along the limiting chute. The cleaning nozzle on the lower side of the sliding rod can spray out the cleaning liquid, and then quickly clean the rotating wafers, improving the cleaning efficiency of the wafers, and effectively solving the problems in the background technique.

[0005] To achieve the above object, the utility model provides the following technical solution: A plasma etching cleaning tank, including a tank body, a rotating frame is arranged inside the tank body, a pressing plate is arranged on the upper side of the rotating frame, wafer clamping grooves are arranged on both the rotating frame and the pressing plate, a driving motor is arranged at one end of the rotating frame, a limiting chute is arranged on the inner side surface of the tank body, a sliding rod is arranged in the limiting chute, lead screws are arranged through both ends of the sliding rod, a servo motor is arranged at one end of the lead screw, a cleaning nozzle is arranged on the lower side surface of the sliding rod, an electromagnet is arranged on the upper outer side surface of the tank body, a tank cover is arranged on the upper side of the tank body, a steel plate is arranged at the side of the tank cover corresponding to the position of the electromagnet, and a sealing gasket is arranged on the upper side surface of the tank body.

[0006] Further, an observation window is arranged at the center of the tank cover, and a conveying pipe is arranged on the upper side of the sliding rod.

[0007] Further, the slot cover is connected to the slot body through the electromagnet and the steel plate, and the output end of the drive motor is connected to the rotating frame through bolts.

[0008] Further, the sliding rod is connected to the slot body through the lead screw, the cleaning nozzle is connected to the sliding rod through a thread, and the delivery pipe is connected to the sliding rod through a pipe clamp.

[0009] Further, the electromagnet is connected to the slot body through bolts, the steel plate is welded to the slot cover, and the slot cover is adhesively bonded to the observation window.

[0010] Further, the pressing plate is connected to the rotating frame through bolts, and both ends of the rotating frame are connected to the slot body through bearings.

[0011] Further, the housing of the servo motor is connected to the slot body through bolts.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] 1. Through the rotating frame, pressing plate, drive motor, sliding rod, lead screw, cleaning nozzle, limiting chute and servo motor provided in the present utility model, the wafer is fixed on the rotating frame and firmly fixed by the pressing plate. The drive motor can drive the rotating frame and the wafer to rotate. The servo motor drives the lead screw to rotate, so that the sliding rod moves along the limiting chute. The cleaning nozzle on the lower side of the sliding rod can spray out the cleaning liquid, thereby quickly cleaning the rotating wafer and improving the cleaning efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic structural diagram of the present utility model;

[0015] Figure 2 is a schematic structural diagram of the sliding rod in the present utility model;

[0016] Figure 3 is a schematic structural diagram of the rotating frame in the present utility model.

[0017] In the figure: 1, slot body; 2, slot cover; 3, observation window; 4, electromagnet; 5, gasket; 6, drive motor; 7, steel plate; 8, limiting chute; 9, sliding rod; 10, delivery pipe; 11, cleaning nozzle; 12, servo motor; 13, lead screw; 14, rotating frame; 15, wafer slot; 16, pressing plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0019] Please refer to Figures 1-3 , this embodiment provides a technical solution: a plasma etching and cleaning tank, including a tank body 1, a rotating frame 14 is arranged inside the tank body 1, a pressing plate 16 is arranged above the rotating frame 14, and wafer clamping grooves 15 are arranged on both the rotating frame 14 and the pressing plate 16. A driving motor 6 is arranged at one end of the rotating frame 14. A limiting sliding groove 8 is arranged on the inner side surface of the tank body 1, a sliding rod 9 is arranged in the limiting sliding groove 8, screw rods 13 are arranged through both ends of the sliding rod 9, a servo motor 12 is arranged at one end of the screw rod 13, a cleaning spray head 11 is arranged on the lower side surface of the sliding rod 9, an electromagnet 4 is arranged on the upper part of the outer side surface of the tank body 1, a tank cover 2 is arranged above the tank body 1, a steel plate 7 is arranged at the side of the tank cover 2 corresponding to the position of the electromagnet 4, and a sealing gasket 5 is arranged on the upper side surface of the tank body 1.

[0020] As Figures 1-3 shown, the steel plate 7 can be adsorbed on the electromagnet 4 to make the tank cover 2 tightly cover the tank body 1. The sealing gasket 5 can improve the sealing performance between the tank cover 2 and the tank body 1 to ensure the quality of wafer cleaning. When the sliding rod 9 moves, the cleaning spray head 11 can effectively rinse the wafers on the rotating frame 14 to improve the cleaning efficiency. The driving motor 6 drives the rotating frame 14 to rotate, so that the wafers are effectively cleaned during rotation, and at the same time, the wafers can be rotated for dehydration and air drying after the cleaning is completed, improving the cleaning efficiency of the wafers.

[0021] An observation window 3 is arranged at the center of the tank cover 2, and a delivery pipe 10 is arranged above the sliding rod 9.

[0022] As Figures 1-3 shown, the cleaning process of the wafers inside the tank body 1 can be observed through the observation window 3.

[0023] The tank cover 2 and the tank body 1 are connected by the electromagnet 4 and the steel plate 7, and the output end of the driving motor 6 and the rotating frame 14 are connected by bolts.

[0024] As Figure 1 shown, the driving motor 6 can provide power for the rotation of the rotating frame 14 to make the rotating frame 14 rotate quickly, improving the cleaning efficiency of the cleaning spray head 11 for the wafers.

[0025] The sliding rod 9 and the tank body 1 are connected by the screw rod 13, the cleaning spray head 11 and the sliding rod 9 are connected by threads, and the delivery pipe 10 and the sliding rod 9 are connected by pipe clamps.

[0026] like Figures 1-2 As shown, the sliding rod 9 moves along the limiting sliding groove 8, so that the cleaning nozzle 11 on the lower side of the sliding rod 9 can effectively clean the wafer.

[0027] The electromagnet 4 is connected to the tank body 1 by bolts, the steel plate 7 is welded to the tank cover 2, and the tank cover 2 is glued to the observation window 3.

[0028] The pressing plate 16 is connected to the rotating frame 14 through bolts, and both ends of the rotating frame 14 are connected to the tank body 1 through bearings.

[0029] like Figure 1 and Figure 3 As shown, the pressing plate 16 is fixed to the rotating frame 14 by bolts, so that the wafer can be effectively clamped and fixed on the rotating frame 14, thereby enabling the wafer to be effectively cleaned when the rotating frame 14 rotates.

[0030] The housing of the servo motor 12 is connected to the tank body 1 by bolts.

[0031] The working principle of a plasma etching cleaning tank provided by the utility model is as follows: Figures 1-3 As shown, during cleaning, the clamping plate 16 is first removed from the rotating frame 14, and then the wafer is clamped into the wafer clamping slot 15, and finally the clamping plate 16 is fixed on the rotating frame 14, and then the slot cover 2 is covered on the slot body 1. The steel plate 7 can be effectively adsorbed and fixed by the electromagnet 4, so that the slot cover 2 and the slot body 1 are firmly connected. The sealing gasket 5 can improve the tightness between the slot cover 2 and the slot body 1 to ensure the cleaning quality. The driving motor 6 drives the rotating frame 14 to rotate rapidly, and the servo motor 12 drives the screw rod 13 to rotate, so that the sliding rod 9 moves along the limiting slide groove 8, and then the cleaning nozzle 11 on the lower side of the sliding rod 9 rinses the wafer. After the rinsing is completed, the wafer that continues to rotate on the rotating frame 14 can be subjected to rotary dehydration treatment, thereby accelerating the drying efficiency of the wafer.

[0032] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A plasma etching and cleaning tank, comprising a tank body (1), characterized in that: Inside the tank body (1), a rotating frame (14) is provided. On the upper side of the rotating frame (14), a pressing plate (16) is provided. Wafer card slots (15) are provided on both the rotating frame (14) and the pressing plate (16). One end of the rotating frame (14) is provided with a driving motor (6). On the inner side surface of the tank body (1), a limiting sliding groove (8) is provided. Inside the limiting sliding groove (8), a sliding rod (9) is provided. Threaded rods (13) are inserted through both ends of the sliding rod (9). One end of the threaded rod (13) is provided with a servo motor (12). On the lower side surface of the sliding rod (9), a cleaning spray head (11) is provided. On the upper part of the outer side surface of the tank body (1), an electromagnet (4) is provided. On the upper side of the tank body (1), a tank cover (2) is provided. Corresponding to the position of the electromagnet (4) on the side edge of the tank cover (2), a steel plate (7) is provided. On the upper side surface of the tank body (1), a sealing gasket (5) is provided.

2. The plasma etching cleaning tank according to claim 1, wherein: In the center of the tank cover (2), an observation window (3) is provided. On the upper side of the sliding rod (9), a conveying pipe (10) is provided.

3. The plasma etching cleaning tank according to claim 1, wherein: The tank cover (2) and the tank body (1) are connected through the electromagnet (4) and the steel plate (7). The output end of the driving motor (6) and the rotating frame (14) are connected by bolts.

4. A plasma etching cleaning tank according to claim 2, characterized in that: The sliding rod (9) and the tank body (1) are connected through the threaded rod (13). The cleaning spray head (11) and the sliding rod (9) are connected by threads. The conveying pipe (10) and the sliding rod (9) are connected by a pipe clamp.

5. The plasma etching cleaning tank according to claim 2, wherein: The electromagnet (4) and the tank body (1) are connected by bolts. The steel plate (7) and the tank cover (2) are welded. The tank cover (2) and the observation window (3) are adhesively bonded.

6. The plasma etching cleaning tank according to claim 1, wherein: The pressing plate (16) and the rotating frame (14) are connected by bolts. Both ends of the rotating frame (14) and the tank body (1) are connected by bearings.

7. The plasma etching cleaning tank according to claim 1, wherein: The outer shell of the servo motor (12) and the tank body (1) are connected by bolts.

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