Intelligent single-piece scrubbing and cleaning machine

Abstract

The utility model relates to an intelligent single-piece scrubbing cleaning machine which comprises a feeding mechanism, a spraying cleaning mechanism, a scrubbing mechanism, a spin-drying mechanism and a discharging mechanism which are arranged in sequence. According to the intelligent single-wafer scrubbing and cleaning machine and the wafer cleaning method, through cooperation of the feeding mechanism, the spraying and cleaning mechanism, the scrubbing mechanism, the spin-drying mechanism and the discharging mechanism which are specially designed, the contact area and the stress area with the surface of the wafer can be reduced as much as possible, and the surface of the wafer is prevented from being damaged; therefore, the cleaning and scrubbing effects of the surfaces of the wafers are improved, cleaning and scrubbing without dead corners are achieved, the product quality is greatly improved, and meanwhile the cleaning efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer processing, in particular to an intelligent single-wafer scrubbing and cleaning machine. Background Art

[0002] When processing existing semiconductor wafers, surface cleaning is required. In the past, a tank-type cleaning device was used for cleaning in multiple stations. The wafer was integrally sent into the cleaning tank by a manipulator. Since the cleaning tank has a large volume, more cleaning liquid is wasted, the manufacturing cost is high, and the cleaning efficiency is low. Summary of the Utility Model

[0003] In view of the above problems, the utility model provides an intelligent single-wafer scrubbing and cleaning machine with high cleaning efficiency, good cleaning effect and low manufacturing cost, and a wafer cleaning method based on the intelligent single-wafer scrubbing and cleaning machine.

[0004] The utility model is realized by the following technical solutions:

[0005] An intelligent single-wafer scrubbing and cleaning machine includes a loading mechanism, a spray cleaning mechanism, a scrubbing mechanism, a drying mechanism and an unloading mechanism which are arranged in sequence;

[0006] The loading mechanism is used for automatically grasping wafers and sending them to the spray cleaning mechanism, and includes a loading platform, a wafer-taking component capable of taking out the wafers in the loading platform, and a loading manipulator capable of grasping the wafers of the wafer-taking component;

[0007] The spray cleaning mechanism is used for cleaning the surface of the wafer, and includes a wafer-clamping and rotating component capable of clamping the edge of the wafer and driving it to rotate, and a first spray head capable of spraying on the top and bottom of the wafer;

[0008] The scrubbing mechanism is used for scrubbing the surface of the wafer, and includes a first scrubbing mechanism and a second scrubbing mechanism. The first scrubbing mechanism or the second scrubbing mechanism includes a conveying component for supporting and conveying the wafer, a blocking component for blocking and driving the wafer to rotate, and a scrubbing component for scrubbing the top and bottom of the wafer;

[0009] The drying mechanism is used for drying the wafer, and includes a drying component capable of supporting and driving the wafer to rotate, and a second spray head capable of spraying on the surface of the wafer;

[0010] The unloading mechanism is used for automatically grasping wafers and sending them out, and includes an unloading platform, an unloading manipulator capable of grasping the wafers on the drying mechanism, and a wafer-sending component capable of sending the wafers on the unloading manipulator to the unloading platform.

[0011] To facilitate wafer picking or feeding, the wafer picking component or feeding component includes a first cylinder and a wafer fork connected to the first cylinder. The first cylinder can drive the wafer fork to move back and forth. A plurality of positioning grooves for positioning wafers of different sizes are formed on the top surface of the wafer fork.

[0012] To facilitate the grasping of wafers of different sizes and avoid damaging the surface of the wafers by the manipulator, the present utility model cancels the original suction cup adsorption structure and adopts a special lifting support structure to reduce the contact area with the surface of the wafer and at the same time reduce the force-bearing surface on the surface of the wafer. Specifically, the loading manipulator or unloading manipulator includes a second cylinder, a lifting seat, a first servo motor, a transverse slide rail, a support arm, a jaw cylinder, a jaw plate and a jaw rod. The second cylinder is connected to the lifting seat, and the second cylinder can drive the lifting seat to move up and down. The transverse slide rail is fixed on the lifting seat. One end of the support arm is slidably connected to the transverse slide rail. The first servo motor is connected to the support arm, and the first servo motor can drive the support arm to move horizontally. The jaw cylinder is fixed to the other end of the support arm. The jaw cylinder is connected to a set of jaw plates. There are multiple jaw rods fixed to the bottom end of the jaw plates. A supporting wheel capable of lifting the edge of the wafer is provided at the bottom end of the jaw rod. The jaw cylinder can drive the jaw plates to move so that the jaw rods and the supporting wheels lift the wafer.

[0013] To drive the wafer to rotate, ensure the cleaning effect and avoid damaging the surface of the wafer, the present utility model cancels the original adsorption type or clamping type rotary cleaning structure and adopts a friction type rotary structure to reduce the contact area with the surface of the wafer and at the same time reduce the force-bearing surface on the surface of the wafer, so as to achieve 360-degree dead-angle-free spray cleaning. Specifically, the wafer clamping and rotating component includes a third cylinder, a lifting support, a first stepping motor, a first ball screw, a slider, a second stepping motor, a support plate and a friction wheel. The third cylinder is connected to the lifting support, and the third cylinder can drive the lifting support to move up and down. The first ball screw is rotatably connected to the lifting support. A set of sliders is arranged on the first ball screw. The first stepping motor is connected to the first ball screw, and the first stepping motor can drive the two sliders to move along the first ball screw. Support plates are respectively fixed on the two sliders. The second stepping motor is fixed to one end of the support plate. There is a set of friction wheels rotatably connected to the other end of the support plate. The second stepping motor is connected to the friction wheel through a pulley group. A clamping groove for the edge of the wafer to be inserted is formed on the friction wheel. The second stepping motor can drive the friction wheel to rotate, thereby driving the wafer to rotate.

[0014] In order to ensure the scrubbing effect, the utility model adopts a special blocking component in conjunction with a brush, which can achieve 360-degree scrubbing without dead angles. Specifically, the blocking component includes a third stepper motor, a second ball screw, a slide, a second servo motor, a blocking rod and a block. The third stepper motor is connected to the second ball screw, and a group of slides are provided on the second ball screw. The third stepper motor can drive the two slides to move along the second ball screw. The two slides are respectively fixed with a second servo motor, and the second servo motor is connected to the blocking rod. The block is fixed to the top of the blocking rod, and a blocking groove is provided on the block for the edge of the wafer to be embedded in the blocking groove. The second servo motor can drive the blocking rod and the block to rotate, thereby driving the wafer to rotate; the scrubbing component includes It includes a lower brush, a third servo motor, an upper brush, a fourth servo motor and a lifting component. The third servo motor is connected to the lower brush, and the third servo motor can drive the lower brush to rotate. The upper brush is correspondingly arranged above the lower brush. The fourth servo motor is connected to the upper brush, and the fourth servo motor can drive the upper brush to rotate. The lifting component is a group, which is respectively arranged at both ends of the upper brush, including a module base plate, a fourth cylinder, a lifting slide rail, and a lifting plate. The lifting slide rail is fixed on the module base plate, and the lifting plate is slidably connected to the lifting slide rail. The upper brush is rotatably connected to the lifting plate. The fourth cylinder is connected to the lifting plate, and the fourth cylinder can drive the lifting plate to move up and down, thereby realizing the up and down lifting of the upper brush.

[0015] In order to ensure the drying effect and adapt to wafers of different sizes, the drying assembly includes a fifth servo motor, a carrying plate, a support column and a stop column. The fifth servo motor is connected to the carrying plate, and the fifth servo motor can drive the carrying plate to rotate axially. The top of the carrying plate is provided with at least one group of support columns that can support the bottom end surface of the wafer, and at least one group of stop columns that can limit the edge of the wafer. The stop columns are correspondingly arranged on one side of the support columns and are higher than the support columns.

[0016] In order to avoid liquid splashing during spinning, the spinning mechanism also includes a water-blocking assembly, which includes a water-blocking cover, a lifting cylinder and a fifth cylinder. The lifting cylinder is mounted outside the supporting plate, the water-blocking cover is mounted outside the lifting cylinder, and the fifth cylinder is connected to the lifting cylinder. The fifth cylinder can drive the lifting cylinder up and down.

[0017] The beneficial effect of the present invention is that the intelligent single-wafer scrubbing cleaning machine and wafer cleaning method can reduce the contact area and force area with the wafer surface as much as possible through the cooperation of specially designed loading mechanism, spray cleaning mechanism, scrubbing mechanism, drying mechanism and unloading mechanism, avoid damaging the wafer surface, thereby improving the cleaning and scrubbing effect of the wafer surface, achieving cleaning and scrubbing without dead angles, thereby greatly improving product quality and improving cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic three-dimensional structure diagram of the intelligent single-chip brushing and cleaning machine of the present utility model;

[0019] Figure 2 Schematic three-dimensional structure diagram of the loading mechanism of the present utility model;

[0020] Figure 3 Schematic three-dimensional structure diagram of the spray cleaning mechanism of the present utility model;

[0021] Figure 4 Schematic three-dimensional structure diagram of the brushing mechanism of the present utility model;

[0022] Figure 5 Schematic three-dimensional structure diagram of the drying mechanism of the present utility model. Specific embodiments

[0023] The following elaborates on the preferred embodiments of the present utility model in conjunction with the accompanying drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present utility model. In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "top", "bottom", "side", "end", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0024] As Figure 1 shown, an intelligent single-chip brushing and cleaning machine includes a loading mechanism 1, a spray cleaning mechanism 2, a brushing mechanism, a drying mechanism 5, and a blanking mechanism 6 arranged in sequence. Among them, the loading mechanism 1 is used to automatically grab the wafer and send it to the spray cleaning mechanism 2, the spray cleaning mechanism 2 is used to clean the surface of the wafer, the brushing mechanism is used to brush the surface of the wafer, including a first brushing mechanism 3 and a second brushing mechanism 4, the drying mechanism 5 is used to dry the wafer, and the blanking mechanism 6 is used to automatically grab the wafer and send it out.

[0025] Specifically, in combination with Figure 2The feeding mechanism shown includes a feeding platform 101, a wafer picking component capable of taking out the wafers in the feeding platform 101, and a feeding manipulator capable of grasping the wafers of the picking component. The picking component includes a first cylinder 102 and a wafer fork 103 connected to the first cylinder. The first cylinder 102 can drive the wafer fork 103 to move back and forth. A plurality of positioning grooves for positioning wafers of different sizes are formed on the top surface of the wafer fork 103. The feeding manipulator includes a second cylinder 104, a lifting seat 105, a first servo motor 106, a horizontal slide rail 107, a support arm 112, a jaw cylinder 108, a jaw plate 109 and a jaw rod 110. The second cylinder 104 is connected to the lifting seat 105, and the second cylinder 104 can drive the lifting seat 105 to move up and down. The horizontal slide rail 107 is fixed on the lifting seat 105. One end of the support arm 112 is slidably connected to the horizontal slide rail 107. The first servo motor 106 is connected to the support arm 112, and the first servo motor 106 can drive the support arm 112 to move horizontally. The jaw cylinder 108 is fixed at the other end of the support arm 112. The jaw cylinder 108 is connected to a set of jaw plates 109. There are multiple groups of jaw rods 110, and each group has multiple jaw rods. They are fixed at the bottom end of the jaw plate 109. A supporting wheel 111 capable of lifting the edge of the wafer is provided at the bottom end of the jaw rod 110. The jaw cylinder 108 can drive the jaw plate 109 to move so that the jaw rods 110 and the supporting wheels 111 lift the wafer. Multiple jaw rods 110 and supporting wheels 111 can lift wafers of different sizes. In addition, there are two sets of feeding manipulators, which can realize the switching between double workstations.

[0026] Specifically, in combination with Figure 3The shown spray cleaning mechanism includes a wafer clamping and rotating assembly capable of clamping the edge of the wafer and driving its rotation, and a first spray head capable of spraying the top and bottom of the wafer. The wafer clamping and rotating assembly includes a third cylinder 201, a lifting support 202, a first stepping motor 203, a first ball screw 204, a slider 205, a second stepping motor 206, a support plate 207, and a friction wheel 208. The third cylinder 201 is connected to the lifting support 202, and the third cylinder 201 can drive the lifting support 202 to move up and down. The first ball screw 204 is rotatably connected to the lifting support 202, and a set of sliders 205 is arranged on the first ball screw 204. The first stepping motor 203 is connected to the first ball screw 204, and the first stepping motor 203 can drive the two sliders 205 to move along the first ball screw 204. Support plates 207 are respectively fixed on the two sliders 205. A second stepping motor 206 is respectively fixed at one end of the support plate 207, and a set of friction wheels 208 is respectively fixed at the other end of the support plate 207. The second stepping motor 206 is connected to the two friction wheels 208 through a pulley group. A clamping groove for the edge of the wafer to be embedded is formed in the friction wheel 208. The four friction wheels 208 cooperate to horizontally clamp the wafer. The second stepping motor 206 can drive each friction wheel 208 to rotate, and the friction wheel 208 drives the wafer to rotate. The first spray head can then spray the top and bottom of the wafer. Since only the edge of the wafer is embedded in the clamping groove and rotates continuously, 360-degree dead-angle-free cleaning of the wafer can be achieved.

[0027] Specifically, in combination with Figure 4The shown brushing mechanism includes a first brushing mechanism and a second brushing mechanism. The first brushing mechanism and the second brushing mechanism have the same structure, including a conveying component for supporting and conveying the wafer, a blocking component for blocking and driving the wafer to rotate, and a brushing component for brushing the top and bottom of the wafer. The conveying component consists of a plurality of parallel conveying rollers 315 and a servo motor. The blocking component includes a third stepping motor 301, a second ball screw 302, a sliding seat 303, a second servo motor 304, a blocking rod 305 and a blocking block 306. The third stepping motor 301 is connected to the second ball screw 302. A set of sliding seats 303 is arranged on the second ball screw 302. The third stepping motor 301 can drive the two sliding seats 303 to move along the second ball screw 302. The second servo motors 304 are respectively fixed on the two sliding seats 303. The second servo motor 304 is connected to the blocking rod 305 through a coupling. The blocking block 306 is fixed at the top of the blocking rod 305. A blocking groove for the edge of the wafer to be embedded is formed on the blocking block 306. The second servo motor 304 can drive the blocking rod 305 and the blocking block 306 to rotate axially. The brushing component includes a lower brush 310, a third servo motor 309, an upper brush 308, a fourth servo motor 307 and a lifting component. The third servo motor 309 is connected to the lower brush 310. The third servo motor 309 can drive the lower brush 310 to rotate. The upper brush 308 is correspondingly arranged above the lower brush 310. The fourth servo motor 307 is connected to the upper brush 308. The fourth servo motor 307 can drive the upper brush 308 to rotate. The lifting component is a set and is respectively arranged at both ends of the upper brush 308, including a module bottom plate 311, a fourth cylinder 312, a lifting slide rail 313 and a lifting plate 314. The lifting slide rail 313 is fixed on the module bottom plate 311. The lifting plate 314 is slidably connected to the lifting slide rail 313. The upper brush 308 is rotatably connected to the lifting plate 314. The fourth cylinder 312 is connected to the lifting plate 314. The fourth cylinder 312 can drive the lifting plate 314 to lift up and down, so as to realize the up and down lifting of the upper brush 308. When the upper brush 308, the lower brush 310 and the blocking block 306 rotate, since one end of the wafer is blocked by the blocking block 306 and embedded in the blocking groove of the blocking block 306, the upper brush 308 and the lower brush 310 will generate a forward thrust on the wafer. This thrust, combined with the rotation of the blocking block 306, can realize the rotation of the wafer, so as to realize 360-degree dead-angle-free brushing.

[0028] Specifically, in combination with Figure 5The spin-drying mechanism shown includes a spin-drying component capable of supporting and driving the rotation of the wafer, a second spray head 508 capable of spraying the surface of the wafer, and a water-blocking component capable of preventing liquid splashing. The spin-drying component includes a fifth servo motor 502, a carrier plate 504, support columns 505, and stop columns 506. The fifth servo motor 502 is arranged at the bottom end of the workbench 501. The fifth servo motor 502 is connected to the carrier plate 504 through a main shaft 503. The carrier plate 504 is located above the workbench 501. The fifth servo motor 502 can drive the carrier plate 504 to rotate axially. Multiple groups (two groups in the figure) of support columns 505 capable of supporting the bottom end face of the wafer and multiple groups of stop columns 506 capable of limiting the edge of the wafer are arranged at the top end of the carrier plate 504. The stop columns 506 are correspondingly arranged on one side (the outside) of the support columns 505 and are higher than the support columns 505. The second spray head 508 is arranged above the workbench 501 through a swing rod cylinder 507. The swing rod cylinder 507 can drive the second spray head 508 to swing. The water-blocking component includes a water-blocking cover 509, a lifting cylinder 510, and a fifth cylinder 511. The lifting cylinder 510 is sleeved outside the carrier plate 504. The water-blocking cover 509 is sleeved outside the lifting cylinder 510. There is one group of fifth cylinders 511, which are respectively connected to both ends of the lifting cylinder 510. The fifth cylinder 511 can drive the lifting cylinder 510 to move up and down. The lifting cylinder 510 can wrap around the periphery of the carrier plate 504 to prevent liquid splashing.

[0029] The blanking mechanism includes a blanking platform, a blanking manipulator capable of grasping the wafer on the spin-drying mechanism, and a wafer feeding component capable of sending the wafer on the blanking manipulator to the blanking platform. The blanking manipulator has basically the same structure as the loading manipulator, and the wafer feeding component has basically the same structure as the wafer picking component. Therefore, no repeated description will be made.

[0030] The cleaning method of the above intelligent single-chip scrubbing and cleaning machine is as follows:

[0031] The wafers completed in the previous process are stacked in the loading platform 101. The first cylinder 102 of the wafer picking component drives the fork piece 103 to enter the loading platform 101, lift and take out the wafers in the loading platform 101. The loading manipulator descends to the corresponding position. The jaw cylinder 108 drives the two jaw plates 109 to move inward so that the jaw rod 110 and the supporting wheel 111 lift the wafer. The loading manipulator can then send the wafer to the spray cleaning mechanism station;

[0032] The four friction wheels 208 of the wafer clamping and rotating component clamp the edge of the wafer. The two second stepping motors 206 drive each friction wheel 208 to rotate. The friction wheels 208 drive the wafer to rotate. The first spray head can then spray the top and bottom of the wafer to complete the 360-degree non-dead-angle spray cleaning with alkaline chemicals;

[0033] After cleaning is completed, the loading manipulator sends the wafer to the first brushing mechanism. One end of the wafer is blocked and positioned by the stopper 306 of the blocking component. The lifting component drives the upper brush 308 to descend. The upper brush 308 and the lower brush 310 clamp the top and bottom surfaces of the wafer. The upper brush 308, the lower brush 310 and the stopper 306 rotate to drive the wafer to rotate, so that the top and bottom surfaces of the wafer can be brushed, and 360-degree dead-angle-free brushing of the acidic agent can be completed.

[0034] Then the wafer is sent to the second brushing mechanism to complete 360-degree dead-angle-free brushing of pure water.

[0035] After the secondary brushing is completed, the unloading manipulator of the unloading mechanism sends the wafer to the drying mechanism. Wafers of different sizes (6 inches, 8 inches) are supported by different groups of support columns 505, and the edge of the wafer is blocked by the outer blocking column 506. The two fifth cylinders 511 act simultaneously to lift the lifting cylinder 510. Then the swing cylinder 507 of the spraying component acts, and the spray head 508 rotates to the center position of the wafer. Subsequently, the fifth servo motor 502 drives the carrier plate 504 to rotate to brush dry the wafer. At the same time, the spray head 508 first sprays pure water, and then sprays nitrogen after a few seconds until the drying is completed.

[0036] After drying is completed, the unloading manipulator sends the wafer to the wafer feeding component, and the wafer feeding component sends the wafer into the unloading platform to complete the processing.

[0037] In the description of the embodiments of the present invention, unless otherwise clearly defined and limited, the terms "installation", "connection", "connection", "setting", "provided with", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0038] Finally, it should be noted that the above embodiments are only specific implementation manners of the present utility model, used to illustrate the technical solutions of the present utility model, rather than limiting it. The protection scope of the present utility model is not limited thereto. Although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that any person skilled in the art within the technical scope disclosed by the present utility model can still modify the technical solutions recorded in the foregoing embodiments, or can easily think of changes, or perform equivalent replacements on some of the technical features; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present utility model, and should all be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. An intelligent single-chip brushing and cleaning machine, characterized in that: It includes a feeding mechanism, a spray cleaning mechanism, a brushing mechanism, a drying mechanism and a discharging mechanism which are arranged in sequence; The feeding mechanism is used to automatically grasp the wafer and send it to the spray cleaning mechanism, and includes a feeding platform, a wafer taking component capable of taking out the wafer in the feeding platform, and a feeding manipulator capable of grasping the wafer of the wafer taking component; The spray cleaning mechanism is used to clean the surface of the wafer, and includes a wafer clamping and rotating component capable of clamping the edge of the wafer and driving it to rotate, and a first spray head capable of spraying the top and bottom of the wafer; The brushing mechanism is used to brush the surface of the wafer, and includes a first brushing mechanism and a second brushing mechanism. The first brushing mechanism or the second brushing mechanism includes a conveying component for supporting and conveying the wafer, a blocking component for blocking and driving the wafer to rotate, and a brushing component for brushing the top and bottom of the wafer; The drying mechanism is used to dry the wafer, and includes a drying component capable of supporting and driving the wafer to rotate, and a second spray head capable of spraying the surface of the wafer; The discharging mechanism is used to automatically grasp the wafer and send it out, and includes a discharging platform, a discharging manipulator capable of grasping the wafer on the drying mechanism, and a wafer sending component capable of sending the wafer on the discharging manipulator to the discharging platform; 2. The intelligent single-chip brushing and cleaning machine according to claim 1, characterized in that: The wafer taking component or the wafer sending component includes a first cylinder and a wafer fork connected to the first cylinder. The first cylinder can drive the wafer fork to move back and forth, and a wafer positioning groove for positioning the wafer is arranged on the top surface of the wafer fork; 3. The intelligent single-chip brushing and cleaning machine according to claim 1, characterized in that: The feeding manipulator or the discharging manipulator includes a second cylinder, a lifting seat, a first servo motor, a transverse slide rail, a support arm, a jaw cylinder, a jaw plate and a jaw rod. The second cylinder is connected to the lifting seat, and the second cylinder can drive the lifting seat to move up and down. The transverse slide rail is fixed on the lifting seat. One end of the support arm is slidably connected to the transverse slide rail. The first servo motor is connected to the support arm, and the first servo motor can drive the support arm to move horizontally. The jaw cylinder is fixed at the other end of the support arm. The jaw cylinder is connected to a group of jaw plates. There are multiple jaw rods fixed at the bottom end of the jaw plate. A supporting wheel capable of lifting the edge of the wafer is arranged at the bottom end of the jaw rod. The jaw cylinder can drive the jaw plate to move so that the jaw rod and the supporting wheel lift the wafer; 4. The intelligent single-chip brushing and cleaning machine according to claim 1, characterized in that: The wafer clamping and rotating component includes a third cylinder, a lifting support, a first stepping motor, a first ball screw, a slider, a second stepping motor, a support plate and a friction wheel. The third cylinder is connected to the lifting support, and the third cylinder can drive the lifting support to move up and down. The first ball screw is rotatably connected to the lifting support, and a group of sliders are arranged on the first ball screw. The first stepping motor is connected to the first ball screw, and the first stepping motor can drive the two sliders to move along the first ball screw. Support plates are respectively fixed on the two sliders. The second stepping motor is fixed at one end of the support plate. There is a group of friction wheels rotatably connected to the other end of the support plate. The second stepping motor is connected to the friction wheel through a pulley group. A clamping groove for the edge of the wafer to be embedded is arranged on the friction wheel. The second stepping motor can drive the friction wheel to rotate, so as to drive the wafer to rotate; 5. The intelligent single-chip brushing and cleaning machine according to claim 1, characterized in that: The blocking component includes a third stepping motor, a second ball screw, a sliding seat, a second servo motor, a blocking rod and a blocking block. The third stepping motor is connected to the second ball screw. A set of sliding seats is arranged on the second ball screw. The third stepping motor can drive the two sliding seats to move along the second ball screw. Second servo motors are respectively fixed on the two sliding seats. The second servo motor is connected to the blocking rod. The blocking block is fixed at the top of the blocking rod. A blocking groove for the edge of the wafer to be embedded is formed on the blocking block. The second servo motor can drive the blocking rod and the blocking block to rotate, so as to drive the wafer to rotate. The brushing component includes a lower brush, a third servo motor, an upper brush, a fourth servo motor and a lifting component. The third servo motor is connected to the lower brush. The third servo motor can drive the lower brush to rotate. The upper brush is correspondingly arranged above the lower brush. The fourth servo motor is connected to the upper brush. The fourth servo motor can drive the upper brush to rotate. The lifting component is a set and is respectively arranged at both ends of the upper brush. It includes a module bottom plate, a fourth air cylinder, a lifting slide rail and a lifting plate. The lifting slide rail is fixed on the module bottom plate. The lifting plate is slidably connected to the lifting slide rail. The upper brush is rotatably connected to the lifting plate. The fourth air cylinder is connected to the lifting plate. The fourth air cylinder can drive the lifting plate to move up and down, so as to realize the up and down movement of the upper brush.

6. The intelligent single-chip brushing and cleaning machine according to claim 1, wherein: The drying component includes a fifth servo motor, a bearing plate, a support column and a stop column. The fifth servo motor is connected to the bearing plate. The fifth servo motor can drive the bearing plate to rotate axially. At least one set of support columns for supporting the bottom end face of the wafer and at least one set of stop columns for limiting the edge of the wafer are arranged at the top of the bearing plate. The stop column is correspondingly arranged on one side of the support column and is higher than the support column.

7. The intelligent single-chip brushing and cleaning machine according to claim 6, wherein: The drying mechanism further includes a water blocking component. The water blocking component includes a water blocking cover, a lifting cylinder and a fifth air cylinder. The lifting cylinder is sleeved outside the bearing plate. The water blocking cover is sleeved outside the lifting cylinder. The fifth air cylinder is connected to the lifting cylinder. The fifth air cylinder can drive the lifting cylinder to move up and down.

Images