Operation machine table

Abstract

The utility model relates to an operation machine table which comprises a loading part (1), a cleaning device (3) and a splash guard (4), and the loading part (1) is configured to support a to-be-cleaned piece (2); the cleaning device (3) is configured to clean the to-be-cleaned part (2), the cleaning device (3) comprises a nozzle (33), and the nozzle (33) is used for spraying first cleaning liquid to the to-be-cleaned part (2); the anti-splashing cover (4) is arranged on the periphery of the nozzle device (33) in a surrounding mode, and a shielding face is arranged on the side, facing the loading part (1), of the anti-splashing cover (4) so that the first cleaning liquid can be prevented from splashing through the shielding face. According to the operation machine table, by arranging the anti-splashing cover (4), splashing of the first cleaning liquid can be reduced, the cleaning efficiency of the to-be-cleaned part (2) is improved, and the final product quality is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and particularly to a working machine. Background Art

[0002] In the field of semiconductor production and manufacturing, a high-temperature cleaning machine is usually used to clean wafers to remove organic contaminants and ensure the cleanliness of the wafer surface. During the cleaning process, a mixed cleaning solution containing sulfuric acid and hydrogen peroxide is usually used. This mixture has very strong oxidizing and corrosive properties, thus easily causing some problems during the cleaning process.

[0003] For example, in a high-temperature cleaning environment, sulfuric acid and hydrogen peroxide can react quickly and generate a large amount of heat, resulting in liquid sputtering. This not only may cause contamination of the wafer surface but also corrode the mechanical structure inside the machine. Or, at high temperatures, hydrogen peroxide liquid may vaporize and react with sulfuric acid to produce acid gas, thus affecting the gas composition in the wafer cleaning chamber and further affecting the quality of the wafer. In addition, the existence of these splashing liquids and acid gas phenomena easily increases the frequency of equipment cleaning and maintenance and shortens the service life of the equipment.

[0004] It should be noted that the information disclosed in the background art part of this application is only intended to increase the understanding of the overall background of this application and should not be regarded as an admission or any form of implication that this information constitutes the prior art known to those skilled in the art. Summary of the Utility Model

[0005] This application provides a working machine that can reduce the splashing of the cleaning solution and improve the quality of the workpiece to be cleaned.

[0006] According to one aspect of this application, a working machine is provided, including:

[0007] A loading part configured to support the workpiece to be cleaned;

[0008] A cleaning device configured to clean the workpiece to be cleaned. The cleaning device includes a nozzle for spraying a first cleaning solution onto the workpiece to be cleaned; and

[0009] A splash guard disposed around the outer periphery of the nozzle, and a shielding surface is provided on the side of the splash guard facing the loading part to block the splashing of the first cleaning solution through the shielding surface.

[0010] In some embodiments, the cleaning device further includes an infusion pipeline and a back suction valve. The infusion pipeline is used to convey the first cleaning solution to the nozzle. The nozzle is connected to the outlet of the infusion pipeline, and the back suction valve is disposed between the infusion pipeline and the nozzle to suck back the residual first cleaning solution in the nozzle after cleaning to the infusion pipeline.

[0011] In some embodiments, the liquid spraying direction of the nozzle coincides with the axis of the splash guard.

[0012] In some embodiments, the shielding surface forms a first space around the outer periphery of the nozzle, and in the direction of the self-cleaning device approaching the loading part, the cross-sectional area of the first space gradually increases.

[0013] In some embodiments, a second space is formed between the projection of the splash guard on the loading part and the shielding surface. The working machine platform further includes an exhaust pipe, and the exhaust pipe is provided with an exhaust passage which is communicated with the second space to discharge the steam of the first cleaning liquid located in the second space.

[0014] In some embodiments, the working machine platform further includes a filtering unit and a protective cover arranged around the loading part. In the vertical direction, the filtering unit is arranged above the splash guard, and at least part of the protective cover is higher than the lower edge of the splash guard to block at least part of the steam of the first cleaning liquid from flowing towards the filtering unit through the protective cover.

[0015] In some embodiments, the working machine platform further includes a cleaning device which is configured to clean and / or dry the splash guard in the cleaning mode of the working machine platform.

[0016] In some embodiments, the cleaning device includes a liquid spraying pipeline and a purging pipeline. The liquid spraying pipeline is configured to convey a second cleaning liquid for cleaning the shielding surface to the splash guard, and the purging pipeline is configured to convey a gas for drying the shielding surface to the splash guard.

[0017] In some embodiments, the cleaning device further includes a cleaning cup arranged opposite to the splash guard. The cleaning cup is provided with a first outlet and a second outlet. The first outlet is communicated with the liquid spraying pipeline so that the second cleaning liquid is sprayed out through the first outlet onto the shielding surface, and the second outlet is communicated with the purging pipeline so that the gas is blown out through the second outlet onto the shielding surface.

[0018] In some embodiments, the cleaning cup is provided with a plurality of first outlets and a plurality of second outlets. The plurality of first outlets are arranged at intervals along the circumferential direction of the cleaning cup, and / or the plurality of second outlets are arranged at intervals along the circumferential direction of the cleaning cup.

[0019] Based on the above technical solutions, by setting the splash guard, the present application can, to a certain extent, block the splashing of the first cleaning liquid, reduce the amount of the first cleaning liquid splashing onto the cleaning device or other key components in the working machine platform, which not only helps to reduce the frequency of equipment maintenance and cleaning, but also can reduce the risk of pollution and even corrosion of the relevant components in the working machine platform, so as to extend the service life of the working machine platform. At the same time, it can also reduce the risk of secondary contamination of the parts to be cleaned caused by splashing liquid. Description of the Drawings

[0020] The accompanying drawings described herein are used to provide a further understanding of the present application and form a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0021] Figure 1 A schematic structural diagram of an embodiment of the working machine of the present application is shown.

[0022] Figure 2 A schematic structural diagram of a cleaning cup in an embodiment of the working machine of the present application is shown.

[0023] Figure 3 Shown is Figure 2 A top view of the cleaning cup in

[0024] In the figure:

[0025] 1. Loading part; 2. Part to be cleaned; 3. Cleaning device; 31. First infusion tube; 32. Second infusion tube; 33. Nozzle; 4. Splash guard; 5. Cantilever; 6. Exhaust pipe; 7. Protective cover; 8. Liquid spraying pipeline; 9. Blowing pipeline; 10. Cleaning cup; 101. First outlet; 102. Second outlet; 103. Waste discharge port; 11. Filter unit; 12. Waste discharge pipe; 13. Cleaning cavity. Specific embodiments

[0026] Next, the technical solutions in the embodiments will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0027] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "transverse", "longitudinal", "front", "rear", "left", "right", "up", "down", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the protection scope of the present application.

[0028] In the field of semiconductor manufacturing, a cleaning solution containing sulfuric acid and hydrogen peroxide is usually used to clean wafers to remove organic contaminants on the wafer surface. In a high-temperature cleaning environment, sulfuric acid and hydrogen peroxide can react rapidly and generate a large amount of heat, resulting in the sputtering of a highly oxidizing and corrosive liquid. Moreover, the hydrogen peroxide liquid may vaporize and react with sulfuric acid to produce acid gas. These phenomena may not only cause corrosion of the cleaning equipment but also affect the gas composition in the wafer cleaning chamber, leading to wafer contamination.

[0029] As shown in the reference Figure 1 In some embodiments of the processing machine provided in the present application, the processing machine includes a loading unit 1, a cleaning device 3, and a splash guard 4. The loading unit 1 is configured to support the workpiece 2 to be cleaned; the cleaning device 3 is configured to clean the workpiece 2 to be cleaned. The cleaning device 3 includes a nozzle 33, and the nozzle 33 is used to spray a first cleaning solution onto the workpiece 2 to be cleaned; the splash guard 4 is disposed around the outer periphery of the nozzle 33, and a shielding surface is provided on the side of the splash guard 4 facing the loading unit 1 to block the splashing of the first cleaning solution through the shielding surface.

[0030] Specifically, the shielding surface of the splash guard 4 can be arranged facing the workpiece 2 to be cleaned. When the first cleaning solution sprayed by the nozzle 33 impacts the surface of the loading unit 1 or the workpiece 2 to be cleaned and splashes, the shielding surface can block the first cleaning solution to prevent further splashing.

[0031] In the embodiments provided in the present application, the workpiece 2 to be cleaned can be a wafer in the field of semiconductor manufacturing, and the cleaning device 3 can be configured to output an SPM solution (a mixed solution of sulfuric acid and hydrogen peroxide) to clean the wafer to remove the residual photoresist on the wafer surface.

[0032] However, the workpiece 2 to be cleaned is not limited to wafers. It can also be other equipment in the processing machine that is prone to adhering photoresist, such as a tray for carrying wafers. Alternatively, the processing machine of the present application can also be used in other manufacturing fields to clean the components with impurities adhered thereto and can reduce the splashing of the cleaning solution during the cleaning process.

[0033] By providing the splash guard 4 in the present application, the splashing of the first cleaning solution can be blocked to a certain extent, and the amount of the first cleaning solution splashing onto the inner wall of the cleaning chamber or components such as a blower can be reduced. This not only helps to reduce the frequency of equipment maintenance and cleaning but also can reduce the risk of contamination and even corrosion of relevant components in the processing machine, so as to extend the service life of the processing machine. At the same time, it can also reduce the risk of secondary contamination of the workpiece 2 to be cleaned caused by splashing liquid.

[0034] In some embodiments, the shielding surface can be a surface that has been subjected to corrosion-resistant treatment, or a corrosion-resistant material can be coated on the shielding surface to reduce the corrosion caused by the first cleaning solution.

[0035] In addition, by designing the specific orientation and shape of the shielding surface, the movement path of the splashing first cleaning liquid can be changed, and the splashing first cleaning liquid can be guided to a preset area. For example, a guiding portion is provided on the shielding surface to guide the first cleaning liquid below the working machine table or to a dedicated recovery location, so as to facilitate the collection and treatment of the first cleaning liquid.

[0036] Reference Figure 1 As shown in the figure, in some embodiments, the shielding surface forms a first space around the outer periphery of the nozzle 33, and in the direction from the self-cleaning device 3 towards the loading portion 1, the cross-sectional area of the first space gradually increases.

[0037] Since the first cleaning liquid is ejected from the outlet of the nozzle 33 towards the workpiece 2 to be cleaned, the first cleaning liquid is likely to splash back towards the direction of the nozzle 33 and the area near the nozzle 33. By providing the shielding surface around the outlet of the nozzle 33, the first cleaning liquid can be blocked to the greatest extent, thereby avoiding damage to the cleaning device 3 and other parts in the working machine table caused by the splashing first cleaning liquid.

[0038] Specific reference Figure 1 In the direction shown in the figure, the opening of the splash guard 4 is arranged towards the loading portion 1, and the space enclosed inside the splash guard 4 is the above-mentioned first space, and this first space is in a tapered shape that gradually expands from top to bottom. In this way, not only can the first cleaning liquid splashing directly towards the cleaning device 3 be blocked, but also the first cleaning liquid splashing to both sides can be blocked, effectively increasing the blocking range of the first cleaning liquid and improving the splash prevention efficiency.

[0039] In the embodiments provided in the present application, there are various choices for the setting method of the nozzle 33. For example, it can be set as an inclined spraying type, or a direct spraying type, or a form with a changeable spraying direction.

[0040] In addition, the output parameters of the nozzle 33 can also be set to adjust the ejection speed, ejection flow rate, etc. of the first cleaning liquid, or a movable nozzle 33 can also be used to adjust the ejection angle of the first cleaning liquid, so as to adapt to different cleaning requirements.

[0041] In some embodiments, the liquid spraying direction of the nozzle 33 coincides with the axis of the splash guard 4, so as to avoid directly spraying the first cleaning liquid onto the inner wall of the splash guard 4, reduce splashing, and also improve the cleaning efficiency of the first cleaning liquid on the workpiece 2 to be cleaned.

[0042] Reference Figure 1 As shown in the figure, in some other embodiments, the cleaning device further includes an infusion pipeline and a back suction valve. The infusion pipeline is used to convey the first cleaning liquid to the nozzle 33. The nozzle 33 is connected to the outlet of the infusion pipeline, and the back suction valve is arranged between the infusion pipeline and the nozzle 33 to suck back the residual first cleaning liquid in the nozzle 33 after cleaning to the infusion pipeline.

[0043] By setting the back suction valve to suck back the residual first cleaning liquid in the nozzle 33 in time, secondary contamination of the workpiece 2 to be cleaned after the cleaning is completed can be avoided. Especially in the embodiment where the nozzle 33 is vertically arranged, if the residual first cleaning liquid in the nozzle 33 drips under the action of gravity, it may contaminate the workpiece 2 below it or the loading part 1.

[0044] In addition, during the cleaning process, affected by the characteristics of the first cleaning liquid and its spraying state, the first cleaning liquid may vaporize to form steam, thereby affecting its cleaning effect on the workpiece 2 to be cleaned.

[0045] Reference Figure 1 As shown, in some embodiments, a second space is formed between the projection of the splash guard 4 on the loading part 1 and the shielding surface. The working machine table further includes an exhaust pipe 6. The exhaust pipe 6 is provided with an exhaust passage, and the exhaust passage is communicated with the second space to discharge the steam of the first cleaning liquid located in the second space.

[0046] By setting the exhaust pipe 6, the steam of the first cleaning liquid can be discharged in time, preventing the accumulation of steam, thereby improving the contact efficiency between the first cleaning liquid and the surface of the workpiece 2 to be cleaned.

[0047] In some embodiments, the exhaust pipe 6 is connected to the splash guard 4.

[0048] As some specific implementation manners, the splash guard 4 is provided with mounting holes, and the exhaust pipe 6 is inserted into the mounting holes and extends into the second space between the shielding surface and the loading part 1.

[0049] Reference Figure 1 As shown, in the working machine table provided with the cleaning chamber 13, the cleaning of the workpiece to be cleaned 2 is completed in the cleaning chamber 13. If the steam of the first cleaning liquid is not discharged in time, the concentration of the residual steam will gradually increase, thereby affecting the cleanliness of the environment in the cleaning chamber 13 and reducing the cleaning effect on the workpiece 2 to be cleaned.

[0050] Especially during the wafer cleaning process in the semiconductor field, when using the first cleaning liquid containing sulfuric acid and hydrogen peroxide, a large amount of steam will be generated under high temperature conditions. These steams are mainly composed of vaporized hydrogen peroxide and by-products generated by the reaction of sulfuric acid and hydrogen peroxide, and have strong acidity and corrosiveness. They will not only have a negative impact on the quality of the wafer, but also cause damage to the cleaning equipment, increasing the maintenance cost of the equipment.

[0051] Therefore, by exhausting through the exhaust pipe 6, the residual acid gas in the cleaning chamber 13 can be effectively reduced, the gas composition in the cleaning chamber 13 can be improved, which is beneficial to improving the consistency and quality of wafer cleaning, and can also improve production safety.

[0052] Further, the exhaust outlet of the exhaust pipe 6 can be connected to the post-treatment system of the working machine platform to recover and treat the acid gas / acid mist together with the waste gas / waste liquid generated in other production processes. The exhaust pipe 6 can also be connected to a separately provided waste gas / waste liquid treatment system for dedicated treatment, so as to improve the treatment efficiency and ensure production safety.

[0053] In some embodiments, the working machine platform further includes a filtering unit 11 and a protective cover 7 surrounding the loading portion 1. In the vertical direction, the filtering unit 11 is arranged above the splash-proof cover 4, and at least part of the protective cover 7 is higher than the lower edge of the splash-proof cover 4, so as to block at least part of the steam of the first cleaning liquid from flowing towards the filtering unit 11 through the protective cover 7.

[0054] By providing the filtering unit 11, the air entering the interior of the cleaning chamber 13 can be filtered to ensure that the air in the chamber has sufficient cleanliness. Especially in the field of semiconductor manufacturing, the filtering unit 11 can filter out particles, dust and other pollutants in the air, and can also maintain a positive pressure environment inside the cleaning chamber 13, so as to maintain a high cleanliness of the internal environment of the cleaning chamber 13 in the equipment, which is crucial for ensuring the high-quality production and manufacturing process reliability of semiconductor devices.

[0055] Setting at least part of the protective cover 7 higher than the lower edge of the splash-proof cover 4 can effectively block the upward flow of the steam of the first cleaning liquid that cannot be blocked by the splash-proof cover 4, thereby protecting the filtering unit 11 from being damaged by corrosive steam, extending its service life, and avoiding the condensation of steam on the filtering unit 11 and affecting its filtering effect.

[0056] Among them, parameters such as the structure, shape and height of the protective cover 7 can be designed according to specific application requirements to suit different working conditions. For example, a multi-layer structure, a liftable structure, etc. can be provided.

[0057] Reference Figure 1 As shown, in some embodiments, the protective cover 7 is provided with a three-layer cover structure, and each layer of the cover structure can be lifted separately. The outermost layer of the cover structure is configured to block organic liquid / mist, the middle layer of the cover structure is configured to block the splash of alkaline liquid / mist, and the innermost layer of the cover structure is configured to block acid liquid / mist. When each layer of the cover structure is lifted to the maximum height, it is higher than the lower edge of the splash-proof cover 4 to play a role of assisting the splash-proof cover 4 in collecting waste gas / waste liquid.

[0058] It can also be as Figure 1 shown in the embodiment, the upper end of the protective cover 7 is bent towards the splash-proof cover 4 to improve the blocking effect on steam.

[0059] In some embodiments, the working machine platform further includes a cleaning device configured to clean and / or dry the splash guard 4 in the cleaning mode of the working machine platform.

[0060] Cleaning and drying the splash guard 4 can reduce the accumulation of corrosive substances on its surface, thereby extending the service life of the splash guard 4.

[0061] Since the shielding surface of the splash guard 4 has the most contact with the first cleaning liquid and is the most contaminated during the cleaning process, the shielding surface can be specifically cleaned and dried in the cleaning mode of the working machine platform.

[0062] Reference Figure 1 and Figure 2 As shown in

[0063] In some embodiments, the cleaning device includes a liquid spraying pipeline 8 and a purging pipeline 9. The liquid spraying pipeline 8 is configured to convey a second cleaning liquid for cleaning the shielding surface to the splash guard 4, and the purging pipeline 9 is configured to convey a gas for drying the shielding surface to the splash guard 4.

[0064] Specifically, in some embodiments, the second cleaning liquid is set as deionized water, and the gas used for drying is set as nitrogen.

[0065] Reference Figure 1 and Figure 2 As shown in

[0066] In some embodiments, the cleaning device further includes a cleaning cup 10 disposed opposite to the splash guard 4. The cleaning cup 10 is provided with a first outlet 101 and a second outlet 102. The first outlet 101 is communicated with the liquid spraying pipeline 8 so that the second cleaning liquid is ejected through the first outlet 101 to the shielding surface, and the second outlet 102 is communicated with the purging pipeline 9 so that the gas is blown through the second outlet 102 to the shielding surface.

[0067] Reference Figure 3As shown, in some embodiments, the cleaning cup 10 is provided with a plurality of first outlets 101 and a plurality of second outlets 102. The plurality of first outlets 101 are arranged at intervals along the circumferential direction of the cleaning cup 10, and / or the plurality of second outlets 102 are arranged at intervals along the circumferential direction of the cleaning cup 10.

[0068] The arrangement shapes of the plurality of first outlets 101 and the plurality of second outlets 102 can be set with reference to the shape of the splash guard 4. For example, as Figure 3 In the embodiment, the plurality of first outlets 101 and the plurality of second outlets 102 are both arranged to form an annular shape corresponding to the contour of the splash guard 4 to improve the cleaning efficiency of the splash guard 4.

[0069] Furthermore, a plurality of spray liquid pipelines 8 and purge pipelines 9 can also be provided (for example Figure 1 and Figure 2 symmetrically arranged relative to the cleaning cup 10 in [reference], and can be arranged along the circumferential direction of the cleaning cup 10 to improve the uniformity of liquid / gas supply to the cleaning cup 10.

[0070] In some other embodiments, the cleaning cup 10 is further provided with a waste discharge port 103 to discharge the exhausted gas and waste liquid consumed in the cleaning process of the splash guard 4.

[0071] Or, in some other embodiments, in the semiconductor manufacturing process, it is set that a chemical liquid circulates regularly in the cleaning device 3 to automatically flush the pipeline to maintain the quality of the chemical liquid in the pipeline, and thus ensure the quality of semiconductor products in each link. Refer to Figure 1 and Figure 2 As shown, the working machine platform further includes a waste discharge pipe 12, and the waste discharge pipe 12 is communicated with the post-treatment system of the working machine platform. In this case, the chemical liquid can be discharged through the waste discharge port 103 of the cleaning cup 10 and output to the post-treatment system of the working machine platform through the waste discharge pipe 12.

[0072] The following describes a specific embodiment of the working machine platform of the present application:

[0073] Refer to Figures 1 to 3 As shown, the working machine platform of the present application includes a loading part 1, a cleaning device 3, a splash guard 4, an exhaust pipe 6, a protective cover 7, a filtering unit 11, a waste discharge pipe 12, a cleaning device, a cleaning chamber 13 and a cantilever 5.

[0074] In this embodiment, the workpiece to be cleaned is a wafer, and the first cleaning liquid is a mixed liquid of high-temperature sulfuric acid and hydrogen peroxide (SPM cleaning liquid).

[0075] The cleaning device 3 is connected to the cantilever 5, and the cantilever 5 can drive the cleaning device 3 to rotate to a set process position (such as the wafer cleaning process position and the splash guard cleaning process position).

[0076] Refer to Figure 1As shown, the cleaning device 3 includes a nozzle 33, a liquid delivery pipeline, and a back suction valve. The liquid delivery pipeline includes a first liquid delivery pipe 31 for delivering high-temperature sulfuric acid and a second liquid delivery pipe 32 for delivering hydrogen peroxide. The high-temperature sulfuric acid and hydrogen peroxide are mixed at the outlet of the cleaning device 3 and sprayed onto the wafer through the nozzle 33.

[0077] The splash guard 4 is circumferentially installed around the outer periphery of the nozzle 33. A shielding surface is provided on the side of the splash guard 4 facing the loading portion 1. The shielding surface extends away from the outer periphery of the nozzle 33, and the shielding surface forms a first space around the outer periphery of the nozzle 33. In the direction approaching the loading portion 1 from the cleaning device 3, the cross-sectional area of this first space gradually increases.

[0078] Reference Figure 1 As shown, in this embodiment, the nozzle 33 is vertically arranged to spray the SPM cleaning liquid vertically downward to avoid directly spraying it onto the splash guard 4. A second space is formed between the projection of the splash guard 4 on the loading portion 1 and the shielding surface. The splash guard 4 is provided with a mounting hole, and the exhaust pipe 6 is inserted into the mounting hole and extends into this second space to discharge the vapor of the first cleaning liquid located in the second space. The loading portion 1 is arranged in the cleaning chamber 13 for loading wafers. The filtering unit 11 is arranged at the top of the cleaning chamber 13.

[0079] The protective cover 7 is arranged around the loading portion 1, and in the vertical direction, the filtering unit 11 is arranged above the splash guard 4. The protective cover 7 is arranged as a liftable structure. When it is lifted to the highest position, the upper edge of the protective cover 7 is higher than the lower edge of the splash guard 4 to block at least part of the vapor of the first cleaning liquid from flowing towards the filtering unit 11 through the protective cover 7.

[0080] The cleaning device includes a liquid spraying pipeline 8, a purging pipeline 9, and a cleaning cup 10. The cleaning cup 10 is provided with a plurality of first outlets 101 and a plurality of second outlets 102, and the plurality of first outlets 101 and the plurality of second outlets 102 are respectively arranged at intervals along the circumferential direction of the cleaning cup 10. The cleaning cup 10 is further provided with a waste discharge port 103 connected to the waste discharge pipe 12, and this waste discharge pipe 12 is communicated with the post-treatment system of the working machine. The waste discharge port 103 is used to discharge the exhausted gas and waste liquid consumed in the cleaning process of the splash guard 4, or to discharge the chemical liquid in the automatic flushing process.

[0081] After completing the cleaning process of the wafer using the working machine of the present application, the cantilever 5 drives the cleaning device 3 to move to the position of the cleaning cup 10 and aligns the splash guard 4 with the cleaning cup 10 for cooperation, and then performs the cleaning process of the splash guard 4, and flushes and dries the shielding surface of the splash guard 4 through the liquid spraying pipeline 8 and the purging pipeline 9.

[0082] Through the description of multiple embodiments of the working machine of the present application, it can be seen that the working machine of the present application has at least the following advantages:

[0083] A splash guard is provided, which can effectively reduce the splashing of the first cleaning liquid, reduce the erosion of the splashed liquid on the internal structure of the machine, thereby reducing the equipment maintenance frequency and improving the cleaning efficiency of the parts to be cleaned;

[0084] A nozzle is provided, which helps to adjust the ejection speed, flow rate and angle of the first cleaning liquid to meet different cleaning requirements;

[0085] A back suction valve is provided, which can timely back suck the residual first cleaning liquid in the nozzle to avoid secondary contamination of the parts to be cleaned after cleaning;

[0086] An exhaust pipe is provided, which can timely discharge the steam, reduce the steam accumulation, and improve the cleaning environment in the cleaning chamber;

[0087] The protective cover is set at least partially higher than the lower edge of the splash guard, which can reduce the erosion of the steam on the filter unit and extend its service life;

[0088] A cleaning device is provided to clean and dry the splash guard, which can effectively reduce the accumulation of corrosive substances on the splash guard and extend its service life;

[0089] The cleaning cup is provided with a plurality of first outlets and a plurality of second outlets, which can be optimally arranged according to the shape of the splash guard to improve the cleaning efficiency of the splash guard.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit them; although the present application has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that without departing from the principle of the present application, modifications can still be made to the specific implementation manners of the present application or equivalent replacements can be made to some technical features, and these modifications and equivalent replacements should all be covered within the scope of the technical solutions claimed in the present application.

Claims

1. An operating machine, characterized in that, Comprising: A loading part (1), configured to support the part to be cleaned (2); A cleaning device (3), configured to clean the part to be cleaned (2), the cleaning device (3) includes a nozzle (33), and the nozzle (33) is used to spray a first cleaning liquid onto the part to be cleaned (2); And A splash guard (4), which is arranged around the outer periphery of the nozzle (33), and a shielding surface is provided on the side of the splash guard (4) facing the loading part (1) to block the splashing of the first cleaning liquid through the shielding surface.

2. The working machine according to claim 1, wherein, The cleaning device further includes an infusion pipeline and a back suction valve. The infusion pipeline is used to convey the first cleaning liquid to the nozzle (33). The nozzle (33) is connected to the outlet of the infusion pipeline. The back suction valve is arranged between the infusion pipeline and the nozzle (33) to suck back the residual first cleaning liquid in the nozzle (33) after cleaning to the infusion pipeline.

3. The working machine according to claim 1, characterized in that, The liquid spraying direction of the nozzle (33) coincides with the axial direction of the splash guard (4).

4. The working machine according to claim 1, characterized in that, The shielding surface forms a first space around the outer periphery of the nozzle (33), and in the direction approaching the loading part (1) from the cleaning device (3), the cross-sectional area of the first space gradually increases.

5. The working machine according to claim 1, characterized in that, A second space is formed between the projection of the splash guard (4) on the loading part (1) and the shielding surface. The working machine platform further includes an exhaust pipe (6). The exhaust pipe (6) is provided with an exhaust passage, and the exhaust passage is communicated with the second space to discharge the steam of the first cleaning liquid located in the second space.

6. The working machine according to claim 1, characterized in that, It further includes a filtering unit (11) and a protective cover (7) arranged around the loading part (1). In the vertical direction, the filtering unit (11) is arranged above the splash guard (4), and at least part of the protective cover (7) is higher than the lower edge of the splash guard (4) to block at least part of the steam of the first cleaning liquid from flowing towards the filtering unit (11) through the protective cover (7).

7. The working machine according to claim 1, characterized in that, It further includes a cleaning device, which is configured to clean and / or dry the splash guard (4) in the cleaning mode of the working machine platform.

8. The working machine according to claim 7, characterized in that, The cleaning device includes a liquid spraying pipeline (8) and a purging pipeline (9). The liquid spraying pipeline (8) is configured to convey a second cleaning liquid for cleaning the shielding surface to the splash guard (4), and the purging pipeline (9) is configured to convey a gas for drying the shielding surface to the splash guard (4).

9. The working machine according to claim 8, wherein, The cleaning device further includes a cleaning cup (10) arranged opposite to the splash guard (4). The cleaning cup (10) is provided with a first outlet (101) and a second outlet (102). The first outlet (101) is communicated with the liquid spraying pipeline (8) to enable the second cleaning liquid to be sprayed onto the shielding surface through the first outlet (101), and the second outlet (102) is communicated with the purging pipeline (9) to enable the gas to be blown onto the shielding surface through the second outlet (102).

10. The working machine platform according to claim 9, characterized in that, The cleaning cup (10) is provided with a plurality of the first outlets (101) and a plurality of the second outlets (102), the plurality of the first outlets (101) are arranged at intervals along the circumferential direction of the cleaning cup (10), and / or the plurality of the second outlets (102) are arranged at intervals along the circumferential direction of the cleaning cup (10).

Images