Semiconductor packaging back-end production device

Abstract

The utility model relates to a semiconductor packaging rear-end production device. The semiconductor packaging rear-end production device comprises a conveying track used for conveying front-end products; the feeding machine table is connected to the end of the conveying rail and used for receiving front-end products. And the multiple rear-end process machine tables are sequentially arranged in the conveying direction of the conveying track, all the rear-end process machine tables are connected with the conveying track, and the multiple rear-end process machine tables are used for implementing various different rear-end processes on the front-end products. According to the utility model, the overall occupied area of rear-end process equipment is reduced, the automation degree of the rear-end process technology is improved, and the product quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit manufacturing, and particularly relates to a semiconductor packaging backend production device. Background Art

[0002] The production and manufacturing in the packaging and testing industry are facing more and more challenges. Realizing the automation of semiconductor packaging and testing is not only a technical development trend, but also one of the important strategies for enterprises to enhance competitiveness and meet market demands. Especially in fields such as automotive electronic products, due to the requirements of improving production efficiency, ensuring product quality and consistency, and reducing human errors, the packaging and testing processes usually require a high degree of automation to ensure consistency and repeatability and to provide complete traceability. However, currently, the backend production process of semiconductor packaging mostly relies on single-machine operations, and each machine tool device in the backend process is independent of each other, which not only results in a relatively long overall length and a large floor area of the backend machine tool devices. In addition, the front-end products are transferred between each machine tool through a cassette or other tooling devices. This discrete backend production method not only takes a lot of time for waiting and confirmation, resulting in a low production efficiency of the backend process, but also has a high labor cost, and manual operations may lead to inconsistencies in the production process, affecting the quality and stability of the products.

[0003] Therefore, how to improve the backend production efficiency, reduce the labor cost, improve the product consistency, improve the product quality, and at the same time reduce the floor area of the backend equipment, so as to reduce the cost of the semiconductor packaging backend process, is a technical problem that needs to be solved urgently at present. Summary of the Invention

[0004] The utility model provides a semiconductor packaging backend production device, which is used to improve the backend production efficiency, reduce the labor cost, improve the product consistency, improve the product quality, and at the same time reduce the floor area of the backend equipment, so as to reduce the cost of the semiconductor packaging backend process.

[0005] According to some embodiments, the utility model provides a semiconductor packaging backend production device, including:

[0006] A conveying track for transporting front-end products;

[0007] A loading machine tool connected to the end of the conveying track for receiving front-end products;

[0008] A plurality of backend process machine tools arranged in sequence along the transmission direction of the conveying track, and a plurality of the backend process machine tools are all connected to the conveying track, and the plurality of backend process machine tools are used to perform a variety of different backend processes on the front-end products.

[0009] In some embodiments, the multiple back-end processing machines include a de-tabber, a former, an open / short tester, a laser printer, a trimmer, a separator, and an automatic optical inspection machine arranged in sequence along the extending direction of the conveying track.

[0010] In some embodiments, it further includes:

[0011] A buffer area, located between the separator and the automatic optical inspection machine, and the buffer area is connected to the conveying track for accommodating the front-end products.

[0012] In some embodiments, it further includes:

[0013] A discharge port, located below the automatic optical inspection machine, for outputting the front-end products processed by the multiple back-end processing machines.

[0014] In some embodiments, the loading machine includes:

[0015] A loading port for receiving a cassette carrying the front-end products;

[0016] A cassette identification reading structure, including an image sensor, for reading the identity identification on the cassette;

[0017] A lead frame direction confirmation structure, facing the end of the conveying track, for identifying the direction of the lead frame in the front-end products.

[0018] In some embodiments, it further includes:

[0019] A lead frame identification reading structure, located between the loading machine and the back-end processing machines, for reading the identity identification on the lead frame in the front-end products.

[0020] In some embodiments, the number of the lead frame identification reading structures is multiple, and the multiple lead frame identification reading structures are distributed between the loading machine and the back-end processing machines and between adjacent back-end processing machines.

[0021] In some embodiments, it further includes:

[0022] A controller;

[0023] Multiple communicators, all electrically connected to the controller, the multiple communicators are respectively distributed in the multiple back-end processing machines one by one, and the communicators in two adjacent back-end processing machines along the transmission direction of the conveying track can perform two-way communication.

[0024] In some embodiments, it further includes:

[0025] A plurality of material pulling structures are respectively distributed between the plurality of backend processing machines and the conveying track. The material pulling structure is used to transfer the front-end products on the conveying track into the corresponding backend processing machine.

[0026] In some embodiments, it further includes:

[0027] A plurality of sensors, all electrically connected to the controller, are respectively distributed between the plurality of backend processing machines and the conveying track. The sensor is used to detect whether the front-end product is transferred to the position corresponding to the backend processing machine, and feedback the detection result to the material pulling structure corresponding to the backend processing machine.

[0028] The semiconductor package backend production device provided by the present invention sets a transmission track, arranges a plurality of backend processing machines in sequence along the transmission direction of the conveying track, and all the plurality of backend processing machines are connected to the conveying track, so as to integrate the plurality of backend processing machines into an integral whole connected by the conveying track. This not only reduces the overall length of the backend processing equipment and the overall floor area occupied by the backend processing equipment, but also, since the front-end products are automatically transferred between the backend processing machines through the conveying track, the automation degree of the backend manufacturing process is improved, thereby improving the efficiency of backend production, reducing labor costs, improving product consistency, and improving product quality. Moreover, the present invention does not need to set independent loading / unloading equipment in each backend processing machine, which helps to simplify the structure of the backend processing equipment, further reduce the cost and time of the backend process, and improve the efficiency of the backend manufacturing process. Description of the Drawings

[0029] Figure 1 is the front view of the semiconductor package backend production device in the specific embodiment of the present invention;

[0030] Figure 2 is the top view of the semiconductor package backend production device in the specific embodiment of the present invention;

[0031] Figure 3 is the structural schematic diagram of the semiconductor package backend production device in the specific embodiment of the present invention;

[0032] Figure 4 is the control block diagram of the semiconductor package backend production device in the specific embodiment of the present invention. Specific Embodiments

[0033] The following will describe in detail the specific embodiments of the semiconductor package backend production device provided by the present invention with reference to the drawings.

[0034] This specific embodiment provides a semiconductor package backend production device. Figure 1 It is the front view of the semiconductor package backend production device in the specific embodiment of the present utility model. Figure 2 It is the top view of the semiconductor package backend production device in the specific embodiment of the present utility model. Figure 3 It is the structural schematic diagram of the semiconductor package backend production device in the specific embodiment of the present utility model. As Figures 1-3 shown, the semiconductor package backend production device includes:

[0035] A conveying track 22 for transporting the front-end product 28.

[0036] A loading machine platform 11 connected to the end of the conveying track 22 for receiving the front-end product 28.

[0037] A plurality of backend process machine platforms are arranged in sequence along the transmission direction of the conveying track 22, and a plurality of the backend process machine platforms are all connected to the conveying track 22. The plurality of backend process machine platforms are used to perform a variety of different backend processes on the front-end product.

[0038] In some embodiments, the plurality of backend process machine platforms include a lead cutting machine platform 13, a forming machine platform 15, an open / short circuit test machine platform 16, a laser printer platform 17, a shaping machine platform 18, a separating machine platform 19, and an automatic optical inspection machine platform 21 arranged in sequence along the extension direction of the conveying track.

[0039] Specifically, the front-end product 28 refers to a semiconductor product that has completed the front-end manufacturing process. For example, the conveying track 22 extends in the horizontal direction and transports the front-end product 28 in the horizontal direction. The loading machine station 11, the de-bonding machine station 13, the molding machine station 15, the open / short circuit detection machine station 16, the laser printer station 17, the shaping machine station 18, the separation machine station 19, and the automatic optical inspection machine station 21 are arranged in sequence along the transmission direction of the conveying track 22, and the loading machine station 11, the de-bonding machine station 13, the molding machine station 15, the open / short circuit detection machine station 16, the laser printer station 17, the shaping machine station 18, the separation machine station 19, and the automatic optical inspection machine station 21 are connected by the conveying track 22. The de-bonding machine station 13, the molding machine station 15, the open / short circuit detection machine station 16, the laser printer station 17, the shaping machine station 18, the separation machine station 19, and the automatic optical inspection machine station 21 are connected by the conveying track 22, thus integrating multiple back-end process machine stations into an integral whole connected by the conveying track 22. This not only reduces the overall length of the back-end process equipment and the overall floor area occupied by the back-end process equipment, but also, since the front-end product 28 is automatically transferred between the various back-end process machine stations through the conveying track, improves the automation level of the back-end manufacturing process, thereby increasing the efficiency of back-end production, reducing labor costs, improving product consistency, and enhancing product quality. In one example, the open / short circuit detection machine station 16 performs open / short circuit detection on the front-end product 28 in a strip-based manner.

[0040] During the operation of the semiconductor package back-end production device, transfer devices such as intelligent mobile robots transfer the front-end product 28 to the loading machine table 11, and then the mechanical gripper 25 in the loading machine table 11 transfers the front-end product 28 to the conveying track 22. Next, the conveying track 22 transports the front-end product 28 to the lead cutting machine table 13 for lead cutting. After the lead cutting process is completed, the conveying track 22 transports the front-end product 28 to the molding machine table 15 for molding. After the molding process is completed, the conveying track 22 transports the front-end product 28 to the open / short circuit detection machine table 16 for open / short circuit testing. After the open / short circuit test, the conveying track 22 transports the front-end product 28 to the laser printer table 17, and the laser printer table 17 marks the front-end product 28 according to the detection result of the open / short circuit detection machine table 16. Then, the conveying track 22 transports the front-end product 28 to the shaping machine table 18 to shape the front-end product 28. After the shaping process is completed, the conveying track 22 transports the front-end product 28 to the separating machine table 19 for separation. After the separation process, the conveying track 22 transports the front-end product 28 to the automatic optical inspection machine table 21 to perform automatic optical inspection on the front-end product 28. After the automatic optical inspection, the front-end product 28 is unloaded from the semiconductor package back-end production device. In the entire semiconductor package back-end production device, only loading ports and unloading ports are provided at opposite ends of the conveying track 22, and no separate loading / unloading equipment is provided in individual back-end process machine tables, which helps to simplify the structure of the back-end process equipment, further reduce the cost of the back-end process, and improve the efficiency of the back-end manufacturing process.

[0041] In some embodiments, the semiconductor package back-end production device further includes:

[0042] A temporary storage area 20, located between the separating machine table 19 and the automatic optical inspection machine table 21, and the temporary storage area 20 is connected to the conveying track 22 for accommodating the front-end product 28.

[0043] Specifically, the separation machine platform 19 includes a buffer cartridge 32, and the temporary storage area 20 includes a transfer arm 31 and a waiting cartridge 33. After the separation machine platform 19 separates the front-end product 28 into multiple unit products, the unit products are transferred to the buffer cartridge 32. The transfer arm 31 transfers the unit products in the buffer cartridge 32 to the waiting cartridge 33. After the number of the unit products in the waiting cartridge 33 reaches a preset number or all the unit products in a batch are transferred to the waiting cartridge 33, the automatic optical inspection machine platform 21 is started to perform automatic optical inspection on the preset number or a batch of the unit products, so as to improve the inspection efficiency of the automatic optical inspection machine platform 21.

[0044] In some embodiments, the semiconductor package backend production device further includes:

[0045] A blanking port 23, located below the automatic optical inspection machine platform 21, for outputting the front-end product 28 processed by a plurality of the backend process machine platforms.

[0046] In some embodiments, the loading machine platform 11 includes:

[0047] A loading port 24, for receiving a cartridge carrying the front-end product 28;

[0048] A cartridge identification reading structure 26, including an image sensor, for reading the identity identification on the cartridge;

[0049] A lead frame direction confirmation structure 29, facing the end of the conveying track 22, for identifying the direction of the lead frame in the front-end product 28.

[0050] For example, as Figure 3 shown, a transfer device such as an intelligent mobile robot transfers a transfer cartridge carrying the front-end product 28 to the loading port 24 in the loading machine platform 11. Then, a conveyor belt in the loading machine platform 11 transfers the transfer cartridge to a feeding position, and the cartridge identification reading structure 28 reads the identity identification on the transfer cartridge for subsequent traceability. Then, a feeding push rod in the loading machine platform 11 sequentially pushes the front-end product 28 in the transfer cartridge into the waiting track 27, and then the mechanical gripper 25 transfers the front-end product 28 on the waiting track 27 to the conveying track 22. The lead frame direction confirmation structure 29 will confirm the direction of the lead frame of the front-end product on the conveying track 22 to ensure the smooth progress of subsequent backend manufacturing processes.

[0051] In some embodiments, the semiconductor package backend production device further includes:

[0052] The lead frame identification reading structure 30 is located between the loading machine table 11 and the back-end processing machine table, and is used to read the identity identification on the lead frame in the front-end product 28.

[0053] In some embodiments, the number of the lead frame identification reading structures 30 is multiple, and the multiple lead frame identification reading structures 30 are distributed between the loading machine table 11 and the back-end processing machine table and between adjacent back-end processing machine tables.

[0054] For example, as Figures 1-3 shown, a lead frame two-dimensional code reading unit 12 before trim is arranged between the loading machine table 11 and the trim machine table 13, and a lead frame two-dimensional code reading unit 14 before molding is arranged between the trim machine table and the molding machine table 15. The lead frame identification reading structure 30 is arranged in both the lead frame two-dimensional code reading unit 12 before trim and the lead frame two-dimensional code reading unit 14 before molding to read the identity identification on the lead frame in the front-end product 28, facilitating subsequent traceability and analysis. In an example, the lead frame identification reading structure 30 is arranged in the open / short circuit detection machine table 16, the laser printer table 17, the shaping machine table 18, and the separating machine table 19, so as to facilitate subsequent traceability of the back-end manufacturing process of the front-end product 28 and further reduce the overall size of the semiconductor package back-end production device.

[0055] Figure 4 It is a control block diagram of the semiconductor package back-end production device in the specific embodiment of the present invention. In some embodiments, the semiconductor package back-end production device further includes:

[0056] A controller 40;

[0057] Multiple communicators, all electrically connected to the controller 40. The multiple communicators are distributed in the multiple back-end processing machine tables one by one, and the communicators in two adjacent back-end processing machine tables along the transmission direction of the conveying track can perform two-way communication.

[0058] For example, the communicators are provided in the die bonder 13, the molder 15, the open / short detector 16, the laser printer 17, the trimmer 18, the separator 19, and the automatic optical inspector 21. Along the transmission direction of the conveying track 22, the communicators in any two adjacent backend processing machines can perform two-way communication. In an example, the communicator is a communicator based on SMEMA (Surface Mount Equipment Manufacturers Association, a communication protocol between surface mount devices). Taking the die bonder 13 and the molder 15 as an example, after the die bonder 13 finishes the die bonding process on the front-end product 28, the communicator in the die bonder 13 sends a ready signal (i.e., Ready signal) to the communicator in the molder 15. After receiving the ready signal, the communicator in the molder 15 feeds back a request signal (i.e., Request signal) to the communicator in the die bonder 13. After the controller 40 confirms that the communicator in the die bonder 13 receives the request signal fed back by the communicator in the molder 15, it controls the front-end product 28 that has completed the die bonding process to be transferred to the molder 15 through the conveying track 22, thereby realizing the automatic transfer of the front-end product 28 between different backend processing machines, further improving the automation degree of the backend manufacturing process, and thus further improving the efficiency of backend production.

[0059] In some embodiments, the semiconductor package backend manufacturing apparatus further includes:

[0060] A plurality of pulling structures, which are respectively distributed between the plurality of backend processing machines and the conveying track 22, and the pulling structures are used to transfer the front-end product 28 on the conveying track 22 into the corresponding backend processing machine.

[0061] In some embodiments, the semiconductor package backend manufacturing apparatus further includes:

[0062] A plurality of sensors, all of which are electrically connected to the controller 40. The plurality of sensors are respectively distributed between the plurality of backend processing machines and the conveying track 22, and the sensors are used to detect whether the front-end product is transferred to the position corresponding to the backend processing machine and feed back the detection result to the pulling structure corresponding to the backend processing machine.

[0063] For example, a plurality of pulling positions corresponding to the plurality of backend processing machines are provided on the conveying track 22. The semiconductor package backend production device further includes a plurality of sensors respectively distributed between the plurality of backend processing machines and the conveying track 22. When the sensor corresponding to a backend processing machine detects that the front-end product 28 is at the pulling position corresponding to the backend processing machine, it feeds back to the controller 40, and the controller 40 controls the pulling arm 35 corresponding to the backend processing machine to transfer the front-end product 28 into the backend processing machine. When the sensor corresponding to a backend processing machine does not detect that the front-end product 28 is at the pulling position corresponding to the backend processing machine, it feeds back to the controller 40, and the controller 40 controls the pulling arm 35 not to pull the material. By providing the sensors, the accuracy and reliability of pulling the material can be improved.

[0064] In one example, the loading machine 11, the lead cutting machine 13, the molding machine 15, the open / short circuit detection machine 16, the laser printer 17, the shaping machine 18, the separation machine 19, the automatic optical inspection machine 21, and the plurality of lead frame identification reading structures 30 are all connected to the controller 40, so that the information of the front-end product 28 during the backend manufacturing process can be received and stored in real time through the controller 40. For example, through the controller 40, it can be determined whether the current product information is correct by judging the identity identification of the lead frame read by the lead frame identification reading structure 30. For another example, according to the detection result of the open / short circuit detection machine 16, the stored information in the memory is updated in real time and transmitted to the laser printer 17 for subsequent processing and traceability, thereby further improving the production efficiency of the backend manufacturing process.

[0065] The semiconductor package backend production device provided in this specific embodiment integrates a plurality of backend processing machines into an integrated whole connected by the conveying track by setting the conveying track, arranging the plurality of backend processing machines in sequence along the conveying direction of the conveying track, and connecting the plurality of backend processing machines to the conveying track. This not only reduces the overall length of the backend processing equipment and the overall floor area occupied by the backend processing equipment, but also improves the automation degree of the backend manufacturing process because the front-end product is automatically transferred between the backend processing machines through the conveying track, thereby improving the efficiency of backend production, reducing labor costs, improving the consistency of products, and improving the quality of products. Moreover, in this specific embodiment, there is no need to set up independent loading / unloading equipment in each backend processing machine, which helps to simplify the structure of the backend processing equipment, further reduce the cost and time of the backend process, and improve the efficiency of the backend manufacturing process.

[0066] The above are only the preferred embodiments of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and modifications can still be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. A semiconductor package back-end production device, characterized in that, Comprising: A conveying track for transporting front-end products; A loading machine station connected to the end of the conveying track for receiving front-end products; A plurality of back-end process machine stations arranged in sequence along the conveying direction of the conveying track, and all of the plurality of back-end process machine stations are connected to the conveying track. The plurality of back-end process machine stations are used to perform a variety of different back-end processes on the front-end products.

2. The semiconductor package back-end production device according to claim 1, wherein The plurality of back-end process machine stations include a lead frame cutting machine station, a forming machine station, an open / short circuit testing machine station, a laser printing machine station, a shaping machine station, a separating machine station, and an automatic optical inspection machine station arranged in sequence along the extending direction of the conveying track.

3. The semiconductor package back-end production device according to claim 2, wherein, It further comprises: A temporary storage area located between the separating machine station and the automatic optical inspection machine station, and the temporary storage area is connected to the conveying track for accommodating the front-end products.

4. The semiconductor package back-end production device according to claim 2, wherein, It further comprises: An unloading opening located below the automatic optical inspection machine station for outputting the front-end products processed by the plurality of back-end process machine stations.

5. The semiconductor package back-end production device according to claim 1, wherein, The loading machine station comprises: A loading port for receiving a magazine carrying the front-end products; A magazine identification reading structure including an image sensor for reading the identity identification on the magazine; a lead frame direction confirmation structure facing the end of the conveying track for identifying the direction of the lead frame in the front-end products.

6. The semiconductor package back-end production device according to claim 1, characterized in that, It further comprises: A lead frame identification reading structure located between the loading machine station and the back-end process machine stations for reading the identity identification on the lead frame in the front-end products.

7. The semiconductor package back-end production apparatus according to claim 6, wherein, The number of the lead frame identification reading structures is a plurality, and the plurality of lead frame identification reading structures are distributed between the loading machine station and the back-end process machine stations and between adjacent back-end process machine stations.

8. The semiconductor package back-end production device according to claim 1, characterized in that, It further comprises: A controller; A plurality of communicators, all electrically connected to the controller. The plurality of communicators are respectively distributed in the plurality of back-end process machine stations one by one, and the communicators in two adjacent back-end process machine stations along the conveying direction of the conveying track can perform two-way communication.

9. The semiconductor package back-end production device according to claim 8, wherein, It further comprises: A plurality of pulling structures respectively distributed between the plurality of back-end process machine stations and the conveying track. The pulling structures are used to transfer the front-end products on the conveying track into the corresponding back-end process machine stations.

10. The semiconductor package back-end production device according to claim 9, wherein, It further comprises: A plurality of sensors, all electrically connected to the controller. The plurality of sensors are respectively distributed between the plurality of back-end process machine stations and the conveying track. The sensors are used to detect whether the front-end products are transported to the positions corresponding to the back-end process machine stations and feed back the detection results to the corresponding pulling structures of the back-end process machine stations.

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