Clamping and conveying mechanism for silicon wafer corrosion

Abstract

The utility model relates to the technical field of silicon wafer processing, in particular to a clamping and conveying mechanism for silicon wafer corrosion, which comprises a cross beam. A mounting frame is fixed to the front end face of the sliding block, and two electric cylinders are fixed to the top of the mounting frame. Two symmetrical adjusting plates capable of synchronously and relatively moving are arranged between the two side plates, and connecting blocks are fixed to the left side wall and the right side wall of each adjusting plate. The motor drives the screw rod to rotate, the connecting frame can move horizontally, so that the clamping part can move horizontally conveniently, the clamping part loaded with the silicon wafer can be conveyed to the position above corrosive liquid through the design, and follow-up corrosion operation is facilitated; by arranging the clamping part, the plurality of silicon wafers can be clamped among the plurality of clamping grooves, so that the plurality of silicon wafers can be conveniently placed into corrosive liquid for corrosion treatment; and by arranging the adjusting plates capable of moving relatively, the distance between the two adjusting plates can be adjusted, so that silicon wafers with different sizes can be conveniently clamped and fixed.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a clamping and conveying mechanism for silicon wafer etching. Background Technique

[0002] Silicon wafers are the basic materials in the semiconductor industry, mainly made of silicon (Si) elements, and have excellent semiconductor properties. Silicon wafer etching refers to the process of treating the surface of a silicon wafer by chemical or electrochemical methods to remove the surface damaged layer, improve the surface morphology, or form a specific structure. Currently, during the process of silicon wafer etching, a fixture is required to fix the silicon wafer and then place it in the etching solution for etching treatment.

[0003] The common silicon wafer fixture in the market is a flower basket. The flower basket is usually formed by four side plates enclosing a rectangular area and fixedly connected end to end in sequence. When etching a silicon wafer, the silicon wafer can be placed and clamped in the rectangular area. However, the flower basket still has the following defects in use: since the multiple side plates are fixedly connected to each other, the width of the rectangular area is fixed. In the actual processing process, silicon wafers have different sizes, and the flower basket with a fixed size is difficult to meet the fixing requirements of silicon wafers with different sizes, thereby affecting the processing efficiency of silicon wafer etching. In view of this, we propose a clamping and conveying mechanism for silicon wafer etching. Content of the Utility Model

[0004] The purpose of the utility model is to provide a clamping and conveying mechanism for silicon wafer etching to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A clamping and conveying mechanism for silicon wafer etching includes a cross beam. A chute is opened on the cross beam. A threaded rod is rotatably installed in the chute. A slider that can move horizontally is threadedly connected to the threaded rod. An installation frame is fixed to the front end face of the slider. Two electric cylinders are fixed to the top of the installation frame.

[0007] A clamping part is arranged below the installation frame. The clamping part includes two symmetric side plates. Strip-shaped grooves are opened near the top ends of the outer walls of the side plates. A guide rod is fixed in the left strip-shaped groove. A double-headed lead screw is rotatably installed in the right strip-shaped groove. A plurality of stop rods are fixed near the bottom ends between the two side plates. A detachable connecting frame is arranged above the two side plates, and the bottom end of the piston rod of the electric cylinder is fixed to the top end of the connecting frame.

[0008] Two symmetric adjusting plates that can move synchronously relative to each other are arranged between the two side plates. Connecting blocks are fixed to the left and right side walls of the adjusting plates. The guide rod passes through one of the connecting blocks and is slidably connected to the connecting block. The double-headed lead screw passes through the other connecting block and is threadedly connected to the connecting block. A plurality of clamping grooves for clamping silicon wafers are opened on the two opposite end faces of the two adjusting plates.

[0009] Preferably, two guide rails are fixed to two opposite end faces of the two adjusting plates, and guide grooves slidably connected to the guide rails are formed on both side walls of the adjusting plates.

[0010] Preferably, limit pins are fixed to the outer walls of the guide rails near the ends, and the limit pins are fixedly connected to the guide rails by bolts.

[0011] Preferably, through holes are formed in the side plates, and the through holes penetrate through the side plates.

[0012] Preferably, fixing blocks are fixed to the centers of the tops of the side plates, and two fixing holes are formed in the fixing blocks; two connecting bolts are threadedly connected to both side walls of the connecting frame, and the ends of the connecting bolts are inserted into the fixing holes.

[0013] Preferably, the cross-sectional shape of the connecting frame is U-shaped, and the end of the piston rod of the electric cylinder is fixedly connected to the connecting frame by a bolt.

[0014] Preferably, limiting strips are fixed to both the upper and lower walls of the sliding groove, and limiting grooves slidably connected to the limiting strips are formed on both the upper and lower walls of the slider.

[0015] Preferably, the cross-sectional shape of the mounting bracket is L-shaped, and the mounting bracket is fixedly connected to the slider by bolts.

[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0017] By providing the cross beam, the connecting frame and the clamping part: the motor drives the screw rod to rotate, and the connecting frame can move horizontally, thereby facilitating the horizontal movement of the clamping part. This design is conducive to transporting the clamping part loaded with silicon wafers above the etching solution, which is beneficial to subsequent etching operations; by providing the clamping part, multiple silicon wafers can be clamped between multiple clamping grooves, thus facilitating the placement of multiple silicon wafers into the etching solution for etching treatment; by providing the relatively movable adjusting plates, the distance between the two adjusting plates can be adjusted, thereby facilitating the clamping and fixing of silicon wafers of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is the overall structural schematic diagram of the present utility model;

[0019] Figure 2 is the structural schematic diagram of the mounting bracket in the present utility model;

[0020] Figure 3 is the structural schematic diagram of the clamping part in the present utility model;

[0021] Figure 4 is the partial structural schematic diagram of the clamping part in the present utility model;

[0022] Figure 5 Structural schematic diagram of the side plate in the present utility model;

[0023] Figure 6 Structural schematic diagram of the adjusting plate in the present utility model;

[0024] In the figure:

[0025] 1. Cross beam; 10. Chute; 11. Limit strip; 12. Threaded rod; 13. Motor; 14. Slide block; 140. Limit groove; 15. Mounting bracket; 16. Electric cylinder;

[0026] 2. Clamping part; 20. Connecting frame; 201. Connecting bolt; 21. Side plate; 210. Through hole; 211. Strip-shaped groove; 212. Guide rail; 213. Limit pin; 22. Guide rod; 23. Double-headed lead screw; 230. Adjusting head; 24. Fixed block; 25. Stop bar; 26. Adjusting plate; 260. Guide groove; 261. Connecting block; 262. Clamping groove. Specific implementation mode

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0028] This embodiment provides a technical solution:

[0029] Please refer to Figures 1-6As shown in the figure, the clamping and transfer mechanism for silicon wafer etching includes a cross beam 1. A chute 10 is provided on the cross beam 1. A threaded rod 12 is rotatably installed in the chute 10. A slider 14 that can move horizontally is threadedly connected to the threaded rod 12. The front end face of the slider 14 is fixed with a mounting frame 15. Two electric cylinders 16 are fixed on the top of the mounting frame 15. A clamping part 2 is provided below the mounting frame 15. The clamping part 2 includes two symmetric side plates 21. Strip-shaped grooves 211 are provided on the outer walls of the side plates 21 near the top. A guide rod 22 is fixed in the left strip-shaped groove 211. A double-headed screw rod 23 is rotatably installed in the right strip-shaped groove 211. A plurality of stop rods 25 are fixed between the two side plates 21 near the bottom. A detachable connecting frame 20 is provided above the two side plates 21. The bottom end of the piston rod of the electric cylinder 16 is fixed to the top end of the connecting frame 20. Two symmetric adjusting plates 26 that can move synchronously relative to each other are provided between the two side plates 21. Connecting blocks 261 are fixed on the left and right side walls of the adjusting plate 26. The guide rod 22 passes through the connecting block 261 on one side and is slidably connected to the connecting block 261. The double-headed screw rod 23 passes through the connecting block 261 on the other side and is threadedly connected to the connecting block 261. A plurality of clamping grooves 262 for clamping the silicon wafer are provided on the two opposite end faces of the two adjusting plates 26.

[0030] In this embodiment, two guide rails 212 are fixed on the two opposite end faces of the two adjusting plates 26. Guide grooves 260 that are slidably connected to the guide rails 212 are provided on the two side walls of the adjusting plate 26. The setting of the guide rails 212 and the guide grooves 260 increases the stability and smoothness of the horizontal movement of the adjusting plate 26.

[0031] In this embodiment, limit pins 213 are fixed on the outer walls of the guide rails 212 near the ends. The limit pins 213 are fixedly connected to the guide rails 212 by bolts. The setting of the limit pins 213 plays a limiting role on the adjusting plate 26 and ensures the stability of the adjusting plate 26.

[0032] In this embodiment, through holes 210 are provided on the side plates 21, and the through holes 210 penetrate the side plates 21. The setting of the through holes 210 is beneficial for the etching solution to pass through, so as to facilitate the etching treatment of the silicon wafer by the etching solution.

[0033] In this embodiment, fixing blocks 24 are fixed at the centers of the tops of the side plates 21. Two fixing holes are provided in the fixing blocks 24. Two connecting bolts 201 are threadedly connected to the two side walls of the connecting frame 20, and the ends of the connecting bolts 201 are inserted into the fixing holes. This design facilitates the disassembly and assembly of the connecting frame 20 and is beneficial for later maintenance and repair work.

[0034] In this embodiment, the cross-sectional shape of the connecting frame 20 is U-shaped, and the end of the piston rod of the electric cylinder 16 is fixedly connected to the connecting frame 20 by bolts. The U-shaped design facilitates the connection of the side plates 21, and the bolt fixing method ensures the reliability and stability of the installation.

[0035] In this embodiment, limiting strips 11 are fixedly arranged on the upper and lower walls of the sliding groove 10, and limiting grooves 140 which are slidably connected to the limiting strips 11 are formed on the upper and lower walls of the slider 14. The arrangement of the limiting grooves 140 and the limiting strips 11 increases the stability and smoothness of the horizontal movement of the slider 14, ensuring the stable movement of the mounting frame 15.

[0036] In this embodiment, the cross-sectional shape of the mounting frame 15 is L-shaped, and the mounting frame 15 is fixedly connected to the slider 14 by bolts. The L-shaped mounting frame 15 facilitates the installation and fixation of the electric cylinder 16.

[0037] It should be added that the thread winding directions at both ends of the double-headed lead screw 23 in this embodiment, one end of the double-headed lead screw 23 passes through the side plate 21 and is coaxially fixed with an adjusting head 230; on the one hand, when the double-headed lead screw 23 rotates, the connecting blocks 261 on both sides can move relatively synchronously, and then it is convenient for the two adjusting plates 26 to move relatively synchronously to adjust the distance; on the other hand, it is convenient to rotate the double-headed lead screw 23 through the adjusting head 230, improving the convenience of operation.

[0038] It is worth noting that the motor 13 involved in this embodiment is an existing conventional technology and will not be elaborated here.

[0039] During specific use, the user first holds the adjusting head 230 and rotates it. The adjusting head 230 drives the double-headed lead screw 23 to rotate, and the connecting blocks 261 on both sides move horizontally relatively synchronously. The connecting blocks 261 simultaneously drive the adjusting plates 26 on both sides to move horizontally relatively synchronously. When the distance between the two adjusting plates 26 is adjusted to an appropriate value, the user stops rotating the adjusting head 230; then the user places the silicon wafer between two adjacent clamping grooves 262; then the user turns on the power supply of the motor 13, the motor 13 starts to work, the output shaft of the motor 13 rotates to drive the threaded rod 12 to rotate, and the slider 14 moves along the sliding groove 10, driving the mounting frame 15 and the clamping part 2 to move horizontally. When the clamping part 2 moves above the etching solution, the user stops the power supply of the motor 13 and turns on the power supply of the electric cylinder 16. The piston rod of the electric cylinder 16 extends and drives the clamping part 2 to move downward, and the clamping part 2 drives multiple silicon wafers to be immersed in the etching solution for etching.

[0040] The above has shown and described the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present utility model and are not used to limit the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. The clamping and conveying mechanism for silicon wafer etching, including a cross beam (1), is characterized in that: A chute (10) is provided on the cross beam (1), a threaded rod (12) is rotatably installed in the chute (10), a motor (13) for driving the threaded rod (12) to rotate is installed at the end of the cross beam (1), a horizontally movable slider (14) is threadedly connected to the threaded rod (12), a mounting bracket (15) is fixed to the front end face of the slider (14), and two electric cylinders (16) are fixed to the top of the mounting bracket (15); A clamping part (2) is provided below the mounting bracket (15). The clamping part (2) includes two symmetrical side plates (21). Strip-shaped grooves (211) are provided on the outer walls of the side plates (21) near the top. A guide rod (22) is fixed in the left strip-shaped groove (211), and a double-headed screw rod (23) is rotatably installed in the right strip-shaped groove (211); A plurality of stop rods (25) are fixed between the two side plates (21) near the bottom; An adjustable connecting frame (20) is provided above the two side plates (21), and the bottom end of the piston rod of the electric cylinder (16) is fixed to the top end of the connecting frame (20); Two symmetrical and synchronously relatively movable adjusting plates (26) are provided between the two side plates (21). Connecting blocks (261) are fixed to the left and right side walls of the adjusting plate (26). The guide rod (22) passes through the connecting block (261) on one side and is slidably connected to the connecting block (261), and the double-headed screw rod (23) passes through the connecting block (261) on the other side and is threadedly connected to the connecting block (261); A plurality of clamping grooves (262) for clamping silicon wafers are provided on the two opposite end faces of the two adjusting plates (26).

2. The clamping and transferring mechanism for silicon wafer etching according to claim 1, wherein: Two guide rails (212) are fixed to the two opposite end faces of the two adjusting plates (26), and guide grooves (260) slidably connected to the guide rails (212) are provided on both side walls of the adjusting plate (26).

3. The clamping and transferring mechanism for silicon wafer etching according to claim 2, wherein: Limit pins (213) are fixed to the outer walls of the guide rails (212) near the ends, and the limit pins (213) are fixed to the guide rails (212) by bolts.

4. The clamping and transmission mechanism for silicon wafer etching according to claim 1, characterized in that: Through holes (210) are provided on the side plates (21), and the through holes (210) penetrate the side plates (21).

5. The clamping and transferring mechanism for silicon wafer etching according to claim 1, characterized in that: Fixing blocks (24) are fixed to the centers of the tops of the side plates (21), and two fixing holes are provided in the fixing blocks (24); Two connecting bolts (201) are threadedly connected to both side walls of the connecting frame (20), and the ends of the connecting bolts (201) are inserted into the fixing holes.

6. The clamping and transferring mechanism for silicon wafer etching according to claim 1, wherein: The cross-sectional shape of the connecting frame (20) is U-shaped, and the end of the piston rod of the electric cylinder (16) is fixed to the connecting frame (20) by a bolt.

7. The clamping and transferring mechanism for silicon wafer etching according to claim 1, characterized in that: Limit strips (11) are fixed to the upper and lower walls of the chute (10), and limit grooves (140) slidably connected to the limit strips (11) are provided on the upper and lower walls of the slider (14).

8. The clamping and transferring mechanism for silicon wafer etching according to claim 1, characterized in that: The cross-sectional shape of the mounting bracket (15) is L-shaped, and the mounting bracket (15) is fixed to the slider (14) by bolts.

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