Wafer moving and clamping device

Abstract

The utility model provides a wafer moving and clamping device, which is used for clamping a wafer pull ring on film expanding equipment and comprises a mounting plate, the clamping mechanism comprises a clamping arm, the first end of the clamping arm is movably connected to the mounting plate, and the second end of the clamping arm is provided with a first clamping jaw and a second clamping jaw; the clamping jaw shaft extends in the length direction of the clamping arm, is connected with the first clamping jaw or the second clamping jaw and drives the first clamping jaw or the second clamping jaw to be away from or close to the second clamping jaw or the first clamping jaw; the fork arm is connected with the clamping jaw shaft and provided with a cam groove extending in the preset direction, a cam is arranged in the cam groove and connected with a pin shaft, the pin shaft is driven by a first air cylinder to rotate and drives the cam to rotate in the cam groove, and the fork arm swings in response to rotation of the cam. The first clamping jaw and the second clamping jaw are close to or separated from each other. The wafer moving and clamping device provided by the utility model can improve the wafer processing quality and efficiency.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing equipment, in particular to a wafer moving and clamping device. Background Art

[0002] In semiconductor processes, it is necessary to move wafers from a wafer cassette to a film expanding device. Most of the existing wafer clamping devices use a manipulator to clamp the wafers. When clamping the wafers, the clamping force of the manipulator or other devices for clamping the wafers is insufficient, resulting in the wafers detaching from the manipulator or other clamping devices, leading to improper clamping of the wafers. It is necessary to re-clamp and move the wafers, and in this process, the wafers may be damaged, which not only reduces the wafer processing quality but also reduces the wafer processing efficiency. Summary of the Utility Model

[0003] In order to overcome the defects in the prior art, an embodiment of the utility model provides a wafer moving and clamping device, which can increase the clamping force of the wafer pull ring and improve the wafer processing quality and processing efficiency.

[0004] To achieve the above object, the technical solution adopted by the utility model is:

[0005] The utility model discloses a wafer moving and clamping device for clamping the pull ring of a wafer on a film expanding device, including:

[0006] A mounting plate;

[0007] A clamping mechanism, including a clamping arm, the first end of the clamping arm is movably connected to the mounting plate, and the second end of the clamping arm is provided with a first jaw and a second jaw;

[0008] A jaw shaft, which extends along the length direction of the clamping arm and is connected to the first jaw or the second jaw, driving the first jaw or the second jaw to move away from or close to the second jaw or the first jaw;

[0009] A fork arm, which is connected to the jaw shaft, the fork arm is provided with a cam groove extending along a preset direction, a cam is arranged in the cam groove, the cam is connected with a pin shaft, the pin shaft is driven to rotate by a first cylinder, driving the cam to rotate in the cam groove, and the fork arm swings in response to the rotation of the cam. When the fork arm swings, the first jaw and the second jaw approach or separate.

[0010] The above technical solution drives the fork arm to swing through a cam mechanism, and then drives the jaw shaft to rotate, thereby driving the first jaw and the second jaw to approach or separate to clamp the wafer pull ring. The provided cam mechanism can increase the force amplification ratio, amplify the driving force output by the pin shaft and transmit it to the jaw shaft, improve the clamping force of the first jaw and the second jaw, thereby enhancing the clamping effect of the first jaw and the second jaw, preventing the wafer pull ring from detaching from the jaws during the moving process, and being able to improve the wafer processing quality and processing efficiency.

[0011] Further, the fork arm is arranged between the mounting plate and the clamping arm. The first end of the fork arm is fixedly connected to the jaw shaft, and the second end of the fork arm is swingably connected to the cam. The second end of the fork arm is driven to swing through the cam mechanism, and the applied force is transmitted to the jaw shaft connected to the first end of the fork arm.

[0012] Further, the cam groove is arranged at the second end of the fork arm and extends along the length direction of the fork arm. The preset extension direction of the cam groove is along the length direction of the fork arm, extending from the first end to the second end. The groove length and groove width of the cam groove are set according to the actual situation so that the cam mechanism rolls along the cam groove.

[0013] Further, the clamping arm includes a first clamping arm and a second clamping arm. The first clamping arm is arranged parallel to the mounting plate, the second clamping arm is arranged perpendicular to the mounting plate. The first end of the second clamping arm is connected to the first clamping arm to form an L-shaped structure. The second end of the second clamping arm is connected to the first jaw and the second jaw.

[0014] The first clamping arm and the second clamping arm form an L-shaped structure, which is convenient for fixing the clamping arm on other structures or arranging other structures on the clamping arm, making the layout of the clamping device more reasonable and compact.

[0015] Further, the first cylinder is arranged above the first clamping arm. The first cylinder is connected to the pin shaft and drives the pin shaft to rotate. The first cylinder drives the pin shaft to rotate to drive the cam to rotate in the cam groove, driving the jaws to approach or separate. The provided structure for driving the first jaw and the second jaw is simple and more compact, requires fewer parts, and has higher efficiency and flexibility in clamping the wafer.

[0016] Further, a fixed seat is provided at the second end of the clamping arm. A first sensor and a second sensor are provided on the fixed seat. The first sensor is arranged above the second sensor, and there is a preset height between the first sensor and the second sensor. The preset height is the distance at which the first jaw or the second jaw is separated from the second jaw or the first jaw. The provided first sensor and second sensor can sense the positions of the first jaw and the second jaw and judge whether the first jaw and the second jaw are separated or approaching.

[0017] Further, a motor is installed on one side of the mounting plate. A synchronous belt and a slide rail are provided on the side of the mounting plate opposite to the motor. The synchronous belt and the slide rail are arranged at different heights, and a slider is connected between the synchronous belt and the slide rail. By driving the synchronous belt with the motor, the clamping mechanism is driven to move along the slide rail. The transmission speed is fast and the transmission efficiency is high, which is suitable for the situation where the moving distance of the wafer is limited.

[0018] Further, a second cylinder is provided on the side of the slider opposite to the mounting plate. The clamping mechanism is arranged above the second cylinder. The second cylinder is a lifting cylinder, which drives the clamping mechanism to move along the slider. After the wafer moving and clamping device moves the wafer to the film expanding device, the second cylinder is used to move the clamping mechanism upward as a whole, so as to avoid the clamping mechanism interfering with the wafer and causing damage to the wafer.

[0019] Further, a first idler wheel and a second idler wheel are provided on the side of the mounting plate opposite to the motor. The first idler wheel is connected to the motor. The first idler wheel and the second idler wheel are separately arranged at both ends of the mounting plate, and the synchronous belt rotates through the first idler wheel and the second idler wheel.

[0020] Further, a photoelectric sensor is provided on the side of the mounting plate opposite to the motor, and a light-shielding sheet is provided on the side of the slider opposite to the mounting plate.

[0021] Due to the application of the above technical solutions, the utility model has the following advantages compared with the prior art:

[0022] 1. In this application, by setting the fork arm, a cam groove is arranged in the fork arm, a cam is arranged to rotate in the cam groove to drive the fork arm to swing, a jaw shaft is connected to the fork arm, when the fork arm swings, the jaw shaft connected to the fork arm is driven to rotate, so as to drive the first jaw and the second jaw connected to the jaw shaft to approach the second jaw or the first jaw to clamp the wafer pull ring. The set cam mechanism can increase the force amplification ratio, amplify the driving force output by the pin shaft and transmit it to the jaw shaft, improve the clamping force of the first jaw and the second jaw, thereby enhancing the clamping effect of the first jaw and the second jaw, avoiding the wafer pull ring falling off from the jaws during the moving process, and improving the wafer processing quality and processing efficiency.

[0023] 2. In this application, by setting the cam and the pin shaft to drive the first jaw and the second jaw to separate or approach to clamp the wafer pull ring, the structure of the clamping device can be made more compact, and there are fewer parts for driving the first jaw and the second jaw, which can improve the efficiency and flexibility of clamping the wafer, enhance the stability of clamping the wafer. Moreover, by setting the first sensor and the second sensor to sense the positions of the first jaw and the second jaw, the wafer pull ring can be clamped more accurately, improving the accuracy of clamping the wafer and further enhancing the efficiency of clamping the wafer.

[0024] In order to make the above and other objects, features and advantages of the present utility model more obvious and understandable, the following will specifically describe preferred embodiments in conjunction with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the accompanying drawings required for use in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0026] Figure 1 is a perspective view of a wafer moving and clamping device in an embodiment of the present utility model;

[0027] Figure 2 is a top view structural schematic diagram of a clamping mechanism in an embodiment of the present utility model;

[0028] Figure 3 is a right view structural schematic diagram of a clamping mechanism in an embodiment of the present utility model;

[0029] Figure 4 is a front view of a wafer moving and clamping device in an embodiment of the present utility model;

[0030] Figure 5 is a schematic diagram of a wafer clamping device in an embodiment of the present utility model;

[0031] Figure 6 is a schematic diagram of a wafer moving device in an embodiment of the present utility model.

[0032] The reference numerals of the above accompanying drawings: 1. mounting plate; 2. clamping mechanism; 3. first clamping arm; 4. second clamping arm; 5. first jaw; 6. second jaw; 7. jaw shaft; 8. fork arm; 9. cam; 10. pin shaft; 11. first cylinder; 12. second cylinder; 13. fixed seat; 14. first sensor; 15. second sensor; 16. motor; 17. synchronous belt; 18. slide rail; 19. slider; 20. first idler pulley; 21. second idler pulley; 22. photoelectric sensor; 23. light shielding sheet. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. Additionally, it is hereby stated that the accompanying drawings of the present utility model are only simple schematic illustrations and are not drawn according to actual dimensions.

[0034] In the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "outer", "frontward", "backward", "between", "close to", "far from", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. It should also be noted that unless otherwise clearly specified and defined, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0035] It should be understood that although terms such as "first", "second", "third", etc. may be used in this article to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this article may, depending on the actual situation, include any one or a combination of more of the associated listed items.

[0036] Referring to Figures 1 to 5 , an embodiment of the present application provides a wafer moving and clamping device, which includes a mounting plate 1 and a clamping mechanism 2. The clamping mechanism 2 can move along the length direction of the mounting plate 1 on the mounting plate 1, so as to move the wafer from the wafer cassette to the film expanding device. The clamping mechanism 2 includes a clamping arm, a jaw shaft 7 and a fork arm 8. The first end of the clamping arm is movably connected to the mounting plate 1. The second end of the clamping arm is provided with a first jaw 5 and a second jaw 6 for clamping the wafer pull ring on the film expanding device. The jaw shaft 7 extends along the length direction of the clamping arm and is connected to the first jaw 5 or the second jaw 6 to drive the first jaw 5 or the second jaw 6 to move away from or close to the second jaw 6 or the first jaw 5. The fork arm 8 is provided with a cam groove extending in a preset direction. A cam 9 is arranged in the cam groove. The cam 9 is connected with a pin shaft 10. The pin shaft 10 is driven by a first cylinder 11 to drive the cam 9 to rotate in the cam groove. The fork arm 8 swings in response to the rotation of the cam 9. The fork arm 8 is connected to the jaw shaft 7. When the fork arm 8 swings, the jaw shaft 7 drives the first jaw 5 and the second jaw 6 to approach or separate.

[0037] With the above structure, the structure in which the cam 9 provided in the embodiment of the present application rotates in the cam groove to drive the jaw shaft 7 to rotate can improve the clamping force of the first jaw 5 and the second jaw 6, enhance the clamping effect of the first jaw 5 and the second jaw 6, prevent the wafer pull ring from detaching between the first jaw 5 and the second jaw 6 during the moving process, and improve the wafer processing quality and processing efficiency.

[0038] Specifically, as Figures 1 to 3 shown, the clamping arm includes a first clamping arm 3 and a second clamping arm 4. The first clamping arm 3 is arranged parallel to the length direction of the mounting plate 1, the second clamping arm 4 is arranged perpendicular to the length direction of the mounting plate 1, the first end of the second clamping arm 4 is connected to the first clamping arm 3 to form an L-shaped structure, and the second end is connected to the first jaw 5 and the second jaw 6.

[0039] The fork arm 8 is arranged between the mounting plate 1 and the first clamping arm 3. The first end of the fork arm 8 is fixedly connected to the jaw shaft 7, and the second end of the fork arm 8 is swingably connected to the cam 9.

[0040] A cam groove is formed in the fork arm 8. In a possible embodiment, the cam groove is arranged at the second end of the fork arm 8. The preset extension direction of the cam groove is from the second end to the first end of the fork arm 8 along the length direction of the fork arm. The extended length, formed shape and size of the cam groove can be set according to actual situations, and the present application does not make specific limitations here. A cam 9 is arranged in the cam groove, and the cam 9 is connected to the pin shaft 10, so that the cam 9 rotates along the cam groove to drive the fork arm 8 to swing.

[0041] It should be noted that in the above embodiment, the first end of the clamping arm is the end close to the mounting plate 1, the second end of the clamping arm is the end far from the mounting plate 1, the first end of the second clamping arm 4 is the end close to the mounting plate 1, the second end of the second clamping arm 4 is the end far from the mounting plate 1, the first end of the fork arm 8 is the end connected to the jaw shaft 7, and the second end of the fork arm 8 is the end far from the jaw shaft 7.

[0042] Referring to Figure 4 and Figure 5 shown, the embodiment of the present application provides a front view of a wafer moving clamping device and a schematic diagram of the clamping device, including a mounting plate 1 and a clamping mechanism 2. The clamping mechanism 2 can move along the length direction of the mounting plate 1 on the mounting plate 1. The clamping mechanism 2 includes a first clamping arm 3, a second clamping arm 4, a jaw shaft 7 and a fork arm 8. The jaw shaft 7 extends along the length direction of the second clamping arm 4 and is connected to the first jaw 5 or the second jaw 6 to drive the first jaw 5 or the second jaw 6 to move away from or close to the second jaw 6 or the first jaw 5, so as to clamp the wafer pull ring.

[0043] Specifically, a first cylinder 11 is provided on the first clamping arm 3. The first cylinder 11 is connected to the pin shaft 10. The fork arm 8 is connected to the jaw shaft 7. The fork arm 8 is provided with a cam groove extending in a preset direction. A cam 9 is arranged in the cam groove. The cam 9 is connected to the pin shaft 10. When it is necessary to clamp the wafer pull ring, the first cylinder 11 drives the pin shaft 10 to rotate, driving the cam 9 to rotate in the cam groove. The fork arm 8 swings in response to the rotation of the cam 9. When the fork arm 8 swings, the jaw shaft 7 drives the first jaw 5 or the second jaw 6 to approach the second jaw 6 or the first jaw 5 to clamp the wafer pull ring. When moving the wafer to the film expanding device, the first cylinder 11 drives the pin shaft 10 to rotate, driving the cam 9 to rotate in the cam groove. The fork arm 8 swings in response to the rotation of the cam 9. When the fork arm 8 swings, the jaw shaft 7 drives the first jaw 5 or the second jaw 6 to separate from the second jaw 6 or the first jaw 5 to release the wafer pull ring.

[0044] Further, in order to make the clamping mechanism 2 clamp the wafer pull ring more precisely, a first sensor 14 and a second sensor 15 are arranged on the clamping mechanism 2 to determine the positions of the first jaw 5 and the second jaw 6. Refer to Figure 2 and Figure 3 As shown, a fixed seat 13 is provided at the second end of the second clamping arm 4. The first sensor 14 and the second sensor 15 are arranged on the fixed seat 13. The first sensor 14 is arranged above the second sensor 15. There is a preset height between the first sensor 14 and the second sensor 15. The preset height is the distance between the separation of the first jaw 5 and the second jaw 6, which can be set according to the actual situation and is not specifically limited in this application.

[0045] Refer to Figure 1 、 Figures 4 to 6 As shown, a motor 16 is installed on one side of the mounting plate 1. A synchronous belt 17 and a slide rail 18 are provided on the side of the mounting plate 1 opposite to the motor 16. The synchronous belt 17 and the slide rail 18 are arranged at different heights. A slider 19 is connected between the synchronous belt 17 and the slide rail 18. A second cylinder 12 is provided on the side of the slider 19 opposite to the mounting plate 1. The clamping mechanism 2 is arranged above the second cylinder 12. The second cylinder 12 is a lifting cylinder, driving the clamping mechanism 2 to move along the slider 19. The slider 19 moves along the slide rail 18, driving the clamping mechanism 2 to move so as to move the wafer from the wafer cassette to the film expanding device. Then, the second cylinder 12 drives the clamping mechanism 2 to move up and down along the slider 19 to avoid interference between the clamping mechanism 2 and the wafer.

[0046] Specifically, a first idler pulley 20 and a second idler pulley 21 are provided on the side of the mounting plate 1 opposite to the motor 16. The first idler pulley 20 is connected to the motor 16. The first idler pulley 20 and the second idler pulley 21 are separately arranged at both ends of the mounting plate 1. The synchronous belt 17 is connected through the first idler pulley 20 and the second idler pulley 21 to drive the synchronous belt 17 to rotate.

[0047] Further, asFigure 5 and Figure 6 As shown in Figure 6 , on one side of the mounting plate 1 facing away from the motor 16, a photoelectric sensor 22 is provided, and on one side of the slider 19 opposite to the mounting plate 1, a light-shielding piece 23 is provided. The provided photoelectric sensor 22 and the light-shielding piece 23 can cooperate with each other to detect whether the clamping mechanism 2 has moved in place, which can improve the accuracy of wafer picking and placing in place. In a possible embodiment, at least two photoelectric sensors 22 are provided, and the at least two photoelectric sensors 22 are separately arranged at both ends of the mounting plate 1 to detect whether the clamping mechanism 2 has moved to a preset position, and the preset position is the position on the mounting plate 1 where the clamping mechanism 2 is located and can take out the wafer from the wafer cassette and move the wafer to the film expanding device.

[0048] When the entire wafer moving and clamping device works, the motor 16 drives the synchronous belt 17 to rotate, driving the slider 19 to move to the position of the wafer pull ring to be clamped through the synchronous belt 17 and the slide rail 18. Thus, the slider 19 drives the clamping mechanism 2 to move to the position of the wafer pull ring to be clamped. When clamping the wafer pull ring, the first cylinder 11 drives the pin shaft 10 to rotate, driving the cam 9 to rotate in the cam groove. The fork arm 8 swings in response to the rotation of the cam 9. When the fork arm 8 swings, it drives the jaw shaft 7 connected to the fork arm 8 to rotate, and the jaw shaft 7 drives the first jaw 5 and the second jaw 6 to approach. At the same time, the first sensor 14 and the second sensor 15 sense the positions of the first jaw 5 and the second jaw 6. After the first jaw 5 and the second jaw 6 clamp the wafer pull ring, the slider 19 moves to the position where the wafer can be placed on the film expanding device through the synchronous belt 17 and the slide rail 18. The first cylinder 11 drives the pin shaft 10 to rotate, driving the cam 9 to rotate in the cam groove. The fork arm 8 swings in response to the rotation of the cam 9. When the fork arm 8 swings, it drives the jaw shaft 7 connected to the fork arm 8 to rotate, and the jaw shaft 7 drives the first jaw 5 and the second jaw 6 to separate to release the wafer pull ring. The second cylinder 12 moves upward along the slider 19, driving the entire clamping mechanism 2 to move upward.

[0049] When the slider 19 moves through the synchronous belt 17 and the slide rail 18, driving the clamping mechanism 2 to move, the photoelectric sensor 22 fixed on the mounting plate 1 cooperates with the light-shielding piece 23 on the slider 19 to confirm whether the clamping mechanism 2 has moved to the preset position.

[0050] In the present utility model, specific embodiments are applied to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the method and its core idea of the present utility model; at the same time, for those of ordinary skill in the art, according to the idea of the present utility model, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present utility model.

Claims

1. A wafer moving and clamping device for clamping the wafer pull ring on the film expanding equipment, characterized in that, Comprising: Mounting plate; Clamping mechanism, including clamping arms, the first end of the clamping arm is movably connected to the mounting plate, and the second end of the clamping arm is provided with a first jaw and a second jaw; Jaw shaft, the jaw shaft extends along the length direction of the clamping arm, is connected to the first jaw or the second jaw, and drives the first jaw or the second jaw to move away from or close to the second jaw or the first jaw; Fork arm, the fork arm is connected to the jaw shaft, the fork arm is provided with a cam groove extending along a preset direction, a cam is arranged in the cam groove, the cam is connected with a pin shaft, the pin shaft is driven to rotate by a first cylinder, drives the cam to rotate in the cam groove, the fork arm swings in response to the rotation of the cam, and when the fork arm swings, the first jaw and the second jaw approach or separate.

2. The wafer moving and clamping device according to claim 1, wherein The fork arm is arranged between the mounting plate and the clamping arm, the first end of the fork arm is fixedly connected to the jaw shaft, and the second end of the fork arm is swingably connected to the cam.

3. The wafer moving and clamping device according to claim 1, characterized in that, The cam groove is arranged at the second end of the fork arm and is formed by extending along the length direction of the fork arm.

4. A wafer moving and clamping device according to claim 1, wherein, The clamping arm includes a first clamping arm and a second clamping arm, the first clamping arm is arranged parallel to the mounting plate, the second clamping arm is arranged perpendicular to the mounting plate, the first end of the second clamping arm is connected to the first clamping arm to form an L-shaped structure, and the second end of the second clamping arm is connected to the first jaw and the second jaw.

5. The wafer moving and clamping device according to claim 4, characterized in that, The first cylinder is arranged above the first clamping arm, and the first cylinder is connected to the pin shaft to drive the pin shaft to rotate.

6. A wafer moving and clamping device according to claim 1, characterized in that, A fixed seat is arranged at the second end of the clamping arm, a first sensor and a second sensor are arranged on the fixed seat, the first sensor is arranged above the second sensor, and a preset height is provided between the first sensor and the second sensor.

7. A wafer moving and clamping device according to claim 1, wherein A motor is installed on one side of the mounting plate, a synchronous belt and a slide rail are arranged on the side of the mounting plate opposite to the motor, the synchronous belt and the slide rail are arranged at different heights, and a slider is connected between the synchronous belt and the slide rail.

8. A wafer moving and clamping device according to claim 7, wherein A second cylinder is arranged on the side of the slider opposite to the mounting plate, the clamping mechanism is arranged above the second cylinder, and the second cylinder is a lifting cylinder to drive the clamping mechanism to move along the slider.

9. The wafer moving and clamping device according to claim 7, wherein, A first idler wheel and a second idler wheel are arranged on the side of the mounting plate opposite to the motor, the first idler wheel is connected to the motor, the first idler wheel and the second idler wheel are separately arranged at both ends of the mounting plate, and the synchronous belt rotates through the first idler wheel and the second idler wheel.

10. A wafer moving and clamping device according to claim 7, characterized in that, A photoelectric sensor is arranged on the side of the mounting plate opposite to the motor, and a light-shielding sheet is arranged on the side of the slider opposite to the mounting plate.

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