Wafer manipulator and wafer conveying equipment

Abstract

The utility model discloses a wafer manipulator and wafer conveying equipment, and relates to the technical field of wafer conveying equipment, the wafer manipulator comprises a mounting part and at least one finger body, the finger body is arranged on the mounting part, and the finger body is provided with at least two placing grooves along the length direction of the finger body. Limiting walls are formed on the side walls of the two sides, in the length direction of the finger body, of the containing groove, the two limiting walls of the containing groove are in an arc shape and located on the same circumference, a supporting face is formed on the bottom face of the containing groove, and a weight reducing opening penetrating in the thickness direction of the finger body is formed in the supporting face. According to the wafer manipulator and the wafer conveying equipment, side slipping of the wafers can be avoided, supporting is more stable, a plurality of wafers can be supported at the same time, and the conveying efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer conveying, in particular to a wafer manipulator and a wafer conveying device. Background Art

[0002] A wafer manipulator is a component on a wafer conveying device for conveying wafers. Some wafer manipulators include a finger body. The finger body is provided with a plurality of limiting blocks. An accommodating space is formed between the plurality of limiting blocks. The limiting blocks are formed with inclined surfaces. The edge of the wafer is supported on the inclined surfaces. In this way, the contact area between the finger body and the wafer can be reduced, and further the influence of the finger body on the wafer can be reduced. However, since the limiting blocks support through the inclined surfaces, it is easy to cause the wafer to slide laterally and the support is not stable. In addition, the existing wafer manipulators are only convenient for carrying one wafer, and the conveying efficiency is low. Summary of the Utility Model

[0003] The utility model aims to at least solve one of the technical problems existing in the prior art. For this purpose, the utility model provides a wafer manipulator, which can not only avoid the wafer from sliding laterally and the support is more stable, but also can support a plurality of wafers at the same time, and thus can improve the conveying efficiency.

[0004] The utility model also provides a wafer conveying device with the above wafer manipulator.

[0005] The wafer manipulator according to the first aspect embodiment of the utility model includes a mounting portion and at least one finger body. The finger body is arranged on the mounting portion. The finger body is provided with at least two placing grooves along its own length direction. The two side walls of the placing groove along the length direction of the finger body both form limiting walls. The two limiting walls of the placing groove are both arc-shaped and are on the same circumference. The bottom surface of the placing groove forms a supporting surface. The supporting surface is provided with a weight-reducing opening penetrating along the thickness direction of the finger body.

[0006] The wafer manipulator according to the embodiment of the utility model has at least the following beneficial effects:

[0007] The wafer manipulator is mounted on the wafer conveying device through the mounting part. When it is necessary to convey wafer sheets, a plurality of wafer sheets are respectively placed in a plurality of placement grooves. The support surface of the placement groove supports the wafer sheets, and the limiting walls on both sides of the placement groove along the length direction of the finger body limit the wafer sheets. According to the wafer manipulator of the embodiment of the present invention, the outer peripheral wall of the wafer sheet is limited by two arc-shaped limiting surface limiting walls, and the limiting effect is better, side slipping is not likely to occur, the support is more stable, and a plurality of placement grooves are provided, so that a plurality of wafer sheets can be supported simultaneously, thereby improving the conveying efficiency. In addition, a weight reduction port is provided, which can not only reduce the contact area between the finger body and the wafer sheet, avoid affecting the wafer sheet due to too large a contact area, but also perform weight reduction treatment on the finger body, avoid large deformation due to the finger body being too heavy, and further affect the support and positioning effect on the wafer sheet.

[0008] According to some embodiments of the present invention, the width dimension of the weight reduction port near the end of the finger body gradually increases in the direction away from the mounting part.

[0009] According to some embodiments of the present invention, along the direction away from the mounting part, the side walls on both sides of the weight reduction port near the end of the finger body in the width direction of the finger body extend obliquely in the direction away from each other.

[0010] According to some embodiments of the present invention, the side walls on both sides of the weight reduction port near the mounting part in the width direction of the finger body are parallel to each other, and the width dimension of the weight reduction port near the mounting part is less than or equal to the minimum width dimension of the weight reduction port near the end of the finger body.

[0011] According to some embodiments of the present invention, in the projection along the thickness direction of the finger body, the midpoint of the extending direction of the limiting wall is located on the center line in the width direction of the finger body.

[0012] According to some embodiments of the present invention, there is a spacing between the edge of the weight reduction port near the placement groove and the limiting wall.

[0013] According to some embodiments of the present invention, the placement groove is provided in a penetrating manner along the width direction of the finger body.

[0014] According to some embodiments of the present invention, the limiting wall includes a limiting surface and a guiding inclined surface. The limiting surface is connected to the support surface, the limiting surface is used to abut against the outer peripheral wall of the wafer sheet, the guiding inclined surface is connected to the side of the limiting surface away from the support surface, and the guiding inclined surface extends obliquely outward in the direction away from the support surface.

[0015] According to some embodiments of the present invention, at least two finger bodies are arranged side by side, and a clearance space is formed between two adjacent finger bodies.

[0016] The wafer conveying equipment according to the second embodiment of the present invention includes the wafer robot described in the first embodiment.

[0017] The wafer conveying device according to the embodiment of the present invention has at least the following beneficial effects:

[0018] In the wafer robot arm according to the first embodiment of the present invention, the outer peripheral wall of the wafer is limited by two arc-shaped limiting walls, which has a better limiting effect, is not prone to side slippage, and has a more stable support. In addition, multiple placement slots are provided, which can support multiple wafers at the same time, thereby improving the conveying efficiency. In addition, the weight-reducing port is provided, which can not only reduce the contact area between the finger body and the wafer, avoiding the contact area being too large and affecting the wafer, but also can reduce the weight of the finger body, avoiding the finger body being too heavy and causing large deformation, thereby affecting the support and positioning effect of the wafer.

[0019] Additional aspects and advantages of the present invention will be partially given in the following description, and some of the additional aspects and advantages will become apparent from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0021] Figure 1 This is a schematic diagram of the overall structure of the wafer robot of the present invention;

[0022] Figure 2 for Figure 1 One of the perspectives of

[0023] Figure 3 for Figure 2 Schematic diagram when a wafer is placed;

[0024] Figure 4 Schematic diagram of the connection between the limiting wall and the supporting surface;

[0025] Figure 5 Schematic diagram of the coordination among the limiting wall, the supporting surface and the wafer.

[0026] Figure Number:

[0027] Mounting portion 100;

[0028] Finger body 200; placement slot 201; limiting wall 202; support surface 203; weight reduction opening 204; limiting surface 205; guide slope 206; clearance space 207;

[0029] Wafer 300. DETAILED DESCRIPTION

[0030] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0031] In the description of the present invention, it should be understood that descriptions involving orientation, such as the orientation or positional relationship indicated by up, down, etc., are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] In the description of this utility model, "a plurality" refers to two or more. The use of "first" or "second" is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or implicitly indicating the order of the technical features indicated.

[0033] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0034] Reference below Figures 1 to 5 A wafer robot and a wafer conveying device according to embodiments of the present invention are described.

[0035] According to the wafer robot of the first embodiment of the utility model, Figures 1 to 5 As shown, it includes a mounting portion 100 and at least one finger body 200 .

[0036] Among them, the installation part 100 is used to be installed on the wafer conveying device. The number of finger bodies 200 can be one or more. For example, it can be two. The finger bodies 200 are arranged on the installation part 100. At least two placement grooves 201 are arranged along the length direction of the finger body 200. For example, two placement grooves 201 can be arranged, and the two placement grooves 201 are arranged along the length direction of the finger body 200. Limiting walls 202 are formed on both side walls of the placement groove 201 along the length direction of the finger body 200. The two limiting walls 202 of the placement groove 201 are both arc-shaped and on the same circumference. The bottom surface of the placement groove 201 forms a supporting surface 203. A weight-reducing opening 204 penetrating along the thickness direction of the finger body 200 is arranged on the supporting surface 203. The weight-reducing opening 204 can extend along the length direction of the finger body 200. Both sides in the width direction of the weight-reducing opening 204 can be close to both sides in the width direction of the finger body 200.

[0037] In this embodiment, the wafer manipulator is installed on the wafer conveying device through the installation part 100. When it is necessary to convey the wafer 300, multiple wafers 300 are respectively placed in multiple placement grooves 201. The supporting surface 203 of the placement groove 201 supports the wafer 300, and the limiting walls 202 on both sides of the placement groove 201 along the length direction of the finger body 200 limit the wafer 300. According to the wafer manipulator of the embodiment of the present utility model, the outer peripheral wall of the wafer 300 is limited by two arc-shaped limiting walls 202, the limiting effect is better, it is not easy to have side slip, the support is more stable, and multiple placement grooves 201 are arranged, so that multiple wafers 300 can be supported simultaneously, thereby improving the conveying efficiency. In addition, the weight-reducing opening 204 is arranged, which can not only reduce the contact area between the finger body 200 and the wafer 300, avoid affecting the wafer 300 due to too large contact area, but also perform weight reduction treatment on the finger body 200, avoid large deformation of the finger body 200 due to excessive weight, and further affect the support and positioning effect on the wafer 300.

[0038] Refer to Figure 1 and Figure 2 As shown in the figure, in some embodiments of the present utility model, the width dimension of the weight-reducing opening 204 near the end of the finger body 200 gradually increases in the direction away from the installation part 100. The shear force generated by the gravity of the wafer 300 on the end of the finger body 200 is small, and along the direction away from the installation part 100, the shear force received is smaller and smaller. Thus, along the direction away from the installation part 100, the width dimension of the weight-reducing opening 204 near the end of the finger body 200 can gradually increase, which can not only further reduce the weight of the finger body 200, avoid large deformation of the finger body 200 due to excessive weight, but also avoid large deformation due to insufficient structural strength at the end of the finger body 200.

[0039] Refer toFigure 1 and Figure 2 As shown in Figure 2 and Figure 1 , in some embodiments of the present utility model, along the direction away from the mounting portion 100, the weight-reducing openings 204 near the end of the finger body 200 extend obliquely in a direction away from each other along the two side walls in the width direction of the finger body 200. In this way, the weight-reducing openings 204 near the end of the finger body 200 are arranged approximately symmetrically with respect to the center line in the width direction of the finger body 200, so that the finger body 200 has higher structural strength and smaller deformation.

[0040] Refer to Figure 1 and Figure 2 As shown in Figure 2 and Figure 1 , in some embodiments of the present utility model, the two side walls of the weight-reducing opening 204 near the mounting portion 100 are parallel to each other in the width direction of the finger body 200, and the width dimension of the weight-reducing opening 204 near the mounting portion 100 is less than or equal to the minimum width dimension of the weight-reducing opening 204 near the end of the finger body 200. One end of the finger body 200 near the mounting portion 100 is subjected to a relatively large shearing force due to the gravity of the wafer 300. Therefore, although the weight-reducing opening 204 is provided, the side walls in the width direction of the weight-reducing opening 204 are set to be parallel to each other, and the width dimension of this weight-reducing opening 204 is less than or equal to the minimum width dimension of the weight-reducing opening 204 near the end of the finger body 200. In this way, while ensuring the weight-reducing effect, it can also avoid excessive deformation caused by insufficient structural strength at one end of the finger body 200 near the mounting portion 100.

[0041] Refer to Figure 1 and Figure 2 As shown in Figure 2 and Figure 1 , in some embodiments of the present utility model, in the projection along the thickness direction of the finger body 200, the midpoint of the extending direction of the limiting wall 202 is located on the center line in the width direction of the finger body 200. In this way, the contour of the placement groove 201 is approximately symmetrically distributed with respect to the center line in the width direction of the finger body 200. After the wafer 300 is placed in the placement groove 201, the finger body 200 is more evenly stressed, and further large deformation of the finger body 200 can be reduced.

[0042] Refer to Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown in Figure 5 , Figure 4 , Figure 2 and Figure 1 , in some embodiments of the present utility model, there is a gap between the edge of the weight-reducing opening 204 on the side close to the placement groove 201 and the limiting wall 202. That is, the weight-reducing opening 204 does not extend to contact the limiting wall 202, and there is a partial support surface 2 between the weight-reducing opening 204 and the limiting wall 202, so that the wafer 300 is more firmly supported.

[0043] Refer to Figures 1 to 3As shown, in some embodiments of the present invention, the placement groove 201 is provided along the width direction of the finger body 200. In this embodiment, the placement groove 201 is provided along the width direction of the finger body 200, thereby making it easier to place the wafer 300 and avoiding interference between the wafer 300 and the finger body 200.

[0044] refer to Figure 4 and Figure 5 As shown, in some embodiments of the present invention, the limiting wall 202 includes a limiting surface 205 and a guiding bevel 206. The limiting surface 205 is connected to the supporting surface 203 and is used to abut the outer peripheral wall of the wafer 300. The guiding bevel 206 is connected to the side of the limiting surface 205 away from the supporting surface 203, and the guiding bevel 206 extends outwardly in a direction away from the supporting surface 203. The limiting surface 205 is provided to abut the outer peripheral wall of the wafer 300. In this way, the wafer 300 can be accurately positioned and the wafer 300 can be effectively prevented from sliding sideways. The guiding bevel 206 can smoothly guide the wafer 300 onto the supporting surface 203 when the wafer 300 is placed, making the operation more convenient and saving time and effort.

[0045] refer to Figures 1 to 3 As shown, in some embodiments of the present invention, at least two finger bodies 200 are arranged side by side, and a clearance space 207 is formed between two adjacent finger bodies 200. In this embodiment, at least two finger bodies 200 are arranged side by side, thereby being able to support more wafers 300 at the same time, thereby being able to transport more wafers 300 at the same time, with higher transport efficiency and higher production capacity. A clearance space 207 is formed between two adjacent finger bodies 200, and the sides of the two outermost finger bodies 200 that are separated from each other can also form a clearance space 207. After the wafer 300 is processed, it is convenient for the equipment used to store the wafer 300 to pass through the clearance space 207 to support the wafer 300.

[0046] The wafer conveying equipment according to the second embodiment of the present invention includes the wafer robot of the first embodiment.

[0047] According to the wafer transfer device of the embodiments of the present utility model, by adopting the wafer manipulator of the embodiments of the first aspect of the present utility model, the outer peripheral wall of the wafer 300 is limited by two arc-shaped limiting walls 202, with a better limiting effect, not prone to side slip, more stable support, and multiple placement grooves 201 are provided, capable of supporting multiple wafers 300 simultaneously, thereby improving the transfer efficiency. In addition, a weight-reducing port 204 is provided, which can not only reduce the contact area between the finger body 200 and the wafer 300, avoid affecting the wafer 300 due to an excessive contact area, but also perform a weight-reducing treatment on the finger body 200, avoid large deformation of the finger body 200 due to excessive weight, and thus affect the support and positioning effects on the wafer 300.

[0048] It should be noted that since the wafer transfer device can adopt all the technical solutions of the wafer manipulator of the above-mentioned first aspect embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned first aspect embodiments. These additional beneficial effects will not be elaborated here.

[0049] It can be understood that the other components and operations of the wafer transfer device according to the embodiments of the present utility model are known to those of ordinary skill in the art, and will not be described in detail here.

[0050] The above has described the embodiments of the present utility model in detail with reference to the drawings, but the present utility model is not limited to the above embodiments. Various changes can be made without departing from the spirit of the present utility model within the scope of knowledge possessed by those of ordinary skill in the art.

Claims

1. A wafer manipulator, characterized in that, include: Installation Department; At least one finger body is arranged on the mounting portion, and the finger body is provided with at least two placement grooves along its own length direction, and the side walls of the placement groove on both sides along the length direction of the finger body form limiting walls, and the two limiting walls of the placement groove are both arc-shaped and on the same circumference, and the bottom surface of the placement groove forms a supporting surface, and the supporting surface is provided with a weight-reducing opening that passes through the thickness direction of the finger body.

2. The wafer manipulator according to claim 1, characterized in that, The width of the weight-reducing opening near the end of the finger body gradually increases in a direction away from the mounting portion.

3. The wafer manipulator according to claim 2, wherein Along the direction away from the mounting portion, the weight-reducing opening close to the end of the finger body extends obliquely along the directions away from each other on both side walls in the width direction of the finger body.

4. The wafer manipulator according to claim 3, wherein The weight-reducing opening near the mounting portion is parallel to both side walls of the finger body in the width direction, and the width dimension of the weight-reducing opening near the mounting portion is less than or equal to the minimum width dimension of the weight-reducing opening near the end of the finger body.

5. The wafer manipulator according to any one of claims 1 to 4, characterized in that, Along the projection in the thickness direction of the finger body, the midpoint of the extending direction of the limiting wall is located on the center line in the width direction of the finger body.

6. The wafer handling robot according to any one of claims 1 to 4, characterized in that, There is a distance between the edge of the weight-reducing opening on one side close to the placement groove and the limiting wall.

7. The wafer manipulator according to any one of claims 1 to 4, characterized in that The placement groove is arranged to penetrate along the width direction of the finger body.

8. The wafer manipulator according to any one of claims 1 to 4, characterized in that, The limiting wall includes: a limiting surface connected to the supporting surface, the limiting surface being used to abut against the outer peripheral wall of the wafer; The guiding inclined surface is connected to a side of the limiting surface away from the supporting surface, and the guiding inclined surface extends outwardly in a direction away from the supporting surface.

9. The wafer manipulator according to any one of claims 1 to 4, characterized in that, At least two finger bodies are arranged side by side, and a space is formed between two adjacent finger bodies.

10. A wafer transfer device, characterized in that, Comprising the wafer robot according to any one of claims 1 to 9.

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