Chip temperature control system

Abstract

The utility model provides a chip temperature control system, which comprises a heat exchange tube 1 and a heat exchange tube 2, the inner wall of a case is fixedly connected with a bracket, a chip is arranged on the inner wall of the bracket, the heat exchange tube 1 is fixed at the bottom of the bracket, the heat exchange tube 1 is in contact fit with the chip, the heat exchange tube 2 is fixed on the outer wall of one side of the case, and the heat exchange tube 2 is in contact fit with the chip. The two ends of the first heat exchange pipe and the two ends of the second heat exchange pipe communicate with each other through a valve assembly and a circulating pump correspondingly, the first heat exchange pipe and the second heat exchange pipe are filled with cooling liquid, and a heat dissipation assembly used for cooling the cooling liquid is arranged on the inner wall of the side, close to the second heat exchange pipe, of the case. The heat dissipation assembly comprises a fixed cylinder fixedly mounted on the inner wall of the case and two hollow plates fixedly connected to the inner wall of the fixed cylinder; according to the utility model, the heat exchange tube I and the heat exchange tube II are arranged, the temperature control of the chip is realized by adopting a tubular structure, and a relatively flat two-dimensional structure is formed, so that the space occupancy rate can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip temperature control, and particularly relates to a chip temperature control system. Background Art

[0002] Chip temperature control is to ensure that the chip operates normally within a specific temperature range, thereby improving the stability and safety of electronic devices.

[0003] After retrieval, a patent with the Chinese patent publication number CN201853148U discloses a highly reliable modular chip temperature control device, which dissipates heat from the chip through a plurality of vertically arranged heat sinks. The heat sinks form a relatively large three-dimensional structure, resulting in a relatively high space occupancy rate.

[0004] Therefore, a chip temperature control system is proposed. Summary of the Utility Model

[0005] In view of this, embodiments of the utility model hope to provide a chip temperature control system to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial choice.

[0006] The technical solution of the embodiments of the utility model is realized as follows: A chip temperature control system is arranged in a chassis together with a chip. The chip temperature control system includes a first heat exchange tube and a second heat exchange tube. A bracket is fixedly connected to the inner wall of the chassis, and the chip is installed on the inner wall of the bracket. The first heat exchange tube is fixed to the bottom of the bracket and is in contact with the chip. The second heat exchange tube is fixed to the outer wall of one side of the chassis. The two ends of the first heat exchange tube and the second heat exchange tube are respectively communicated with each other through a valve assembly and a circulation pump, and a coolant is filled in the first heat exchange tube and the second heat exchange tube. A heat dissipation assembly for cooling the coolant is arranged on the inner wall of the chassis near the second heat exchange tube.

[0007] In some embodiments, the heat dissipation assembly includes a fixed cylinder fixedly installed on the inner wall of the chassis and two hollowed-out plates fixedly connected to the inner wall of the fixed cylinder.

[0008] In some embodiments, the valve assembly includes a heat conduction plate, a heat conduction tube, and a housing.

[0009] In some embodiments, the heat conduction plate is fixed to the outer wall of the chip, the housing is fixedly connected to the inner wall of the bracket, and the two ends of the heat conduction tube are respectively fixedly connected to the heat conduction plate and the housing.

[0010] In some embodiments, the first heat exchange tube and the second heat exchange tube are both fixedly connected and communicated with the inner wall of the housing. A piston is slidably fitted on the inner wall of the housing, and through holes communicating with the first heat exchange tube and the second heat exchange tube are formed in the inner wall of the piston.

[0011] In some embodiments, a spring is snap-connected to the bottom of the piston, and the other end of the spring is snap-connected to the upper surface of the bottom of the housing.

[0012] In some embodiments, a limiting component for limiting the moving stroke of the piston is arranged in the housing.

[0013] In some embodiments, the limiting component includes a first limiting ring and a second limiting ring, and both the first limiting ring and the second limiting ring are fixedly connected to the inner wall of the housing.

[0014] Due to the adoption of the above technical solutions in the embodiments of the present utility model, it has the following advantages:

[0015] 1. A chip temperature control system, by arranging a first heat exchange tube and a second heat exchange tube, realizes the temperature control of the chip by adopting a tubular structure, forms a relatively flat two-dimensional structure, and thus can reduce the space occupancy rate.

[0016] 2. A chip temperature control system, by arranging a heat conduction plate and a heat conduction tube, automatically adjusts the overlapping range of the through holes and the first heat exchange tube and the second heat exchange tube by using the principle of gas thermal expansion, thereby realizing the automatic adjustment of the coolant flow rate and simplifying the control logic.

[0017] 3. A chip temperature control system, by arranging a first limiting ring and a second limiting ring to limit the movement of the piston, avoids the coolant flow interruption caused by excessive movement, and thus ensures the stable operation of the entire temperature control system.

[0018] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the above-described illustrative aspects, embodiments and features, further aspects, embodiments and features of the present utility model will be readily apparent by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 It is the front view structure diagram of the present utility model;

[0021] Figure 2 It is the internal structure diagram of the chassis of the present utility model;

[0022] Figure 3 It is the bottom view of the first heat exchange tube and the second heat exchange tube of the present utility model;

[0023] Figure 4 Structural disassembly diagram of the heat dissipation component of the present utility model;

[0024] Figure 5 Schematic structural diagram of the valve component of the present utility model;

[0025] Figure 6 Schematic diagram of the internal structure of the housing of the present utility model.

[0026] Reference numerals:

[0027] 1, chassis; 2, bracket; 3, chip; 4, heat dissipation component; 5, first heat exchange tube; 6, valve component; 7, circulation pump; 8, second heat exchange tube; 9, motor; 10, rotating shaft; 11, fan blade; 12, fixed cylinder; 13, hollowed-out plate; 14, heat conducting plate; 15, heat conducting tube; 16, housing; 17, spring; 18, first limiting ring; 19, piston; 20, through hole; 21, second limiting ring. Detailed implementation manners

[0028] In the following text, only some exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present utility model. Therefore, the drawings and descriptions are considered to be exemplary in nature rather than restrictive.

[0029] In the present utility model, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0030] The embodiments of the present utility model will be described in detail below with reference to the drawings.

[0031] Embodiment 1:

[0032] As Figure 1-6 shown, a chip temperature control system is disposed in the chassis 1 together with the chip 3, and the chip temperature control system includes a first heat exchange tube 5 and a second heat exchange tube 8.

[0033] A bracket 2 is fixedly connected to the inner wall of the chassis 1, a chip 3 is installed on the inner wall of the bracket 2, a first heat exchange tube 5 is fixed to the bottom of the bracket 2, and the first heat exchange tube 5 is in contact with the chip 3. A second heat exchange tube 8 is fixed to the outer wall of one side of the chassis 1. The two ends of the first heat exchange tube 5 and the second heat exchange tube 8 are respectively communicated with each other through a valve assembly 6 and a circulation pump 7, and a coolant is filled in the first heat exchange tube 5 and the second heat exchange tube 8. A heat dissipation assembly 4 for cooling the coolant is arranged on the inner wall of the chassis 1 close to the second heat exchange tube 8.

[0034] When the chassis 1 starts to work, the circulation pump 7 is started, and the coolant forms a circulation in the first heat exchange tube 5 and the second heat exchange tube 8. When the coolant passes through the first heat exchange tube 5, the heat generated by the chip 3 is taken away. When the coolant reaches the second heat exchange tube 8, the heat dissipation assembly 4 cools the coolant, and the cooled coolant is transported back into the first heat exchange tube 5 for heat exchange again, and so on.

[0035] By arranging the first heat exchange tube 5 and the second heat exchange tube 8, the temperature control of the chip 3 is realized by adopting a tubular structure, forming a relatively flat two-dimensional structure, so as to reduce the space occupancy rate.

[0036] In this embodiment, the heat dissipation assembly 4 includes a fixed cylinder 12 fixedly installed on the inner wall of the chassis 1 and two hollow plates 13 fixedly connected to the inner wall of the fixed cylinder 12.

[0037] A motor 9 is fixed to the outer wall of one of the hollow plates 13 by bolts. The output shaft of the motor 9 is fixedly connected to a rotating shaft 10 through a coupling, and the rotating shaft 10 is rotatably matched with the other hollow plate 13.

[0038] A plurality of radially arranged fan blades 11 are fixedly connected to the outer wall of the rotating shaft 10.

[0039] A heat dissipation groove is formed in the inner wall of the chassis 1. After the motor 9 is started, it drives the rotating shaft 10 and all the fan blades 11 to rotate around the axis of the rotating shaft 10 as the center of rotation. The gas enters the chassis 1 from the heat dissipation groove and finally blows to the outer wall of the second heat exchange tube 8 through the fixed cylinder 12, forming an air flow, so as to realize the cooling of the second heat exchange tube 8 and the internal coolant.

[0040] In this embodiment, the valve assembly 6 includes a heat conduction plate 14, a heat conduction tube 15 and a housing 16. The heat conduction plate 14 is fixed to the outer wall of the chip 3, the housing 16 is fixedly connected to the inner wall of the bracket 2, and the two ends of the heat conduction tube 15 are respectively fixedly connected to the heat conduction plate 14 and the housing 16.

[0041] The first heat exchange tube 5 and the second heat exchange tube 8 are both fixedly connected and communicated with the inner wall of the housing 16. A piston 19 is slidably matched with the inner wall of the housing 16, and a through hole 20 communicating with the first heat exchange tube 5 and the second heat exchange tube 8 is formed in the inner wall of the piston 19.

[0042] A spring 17 is buckled to the bottom of the piston 19, and the other end of the spring 17 is buckled to the upper surface of the bottom of the housing 16.

[0043] When the temperature of the chip 3 rises, the heat conducting plate 14 absorbs heat, causing the gas in the heat conducting pipe 15 to expand, thereby pushing the piston 19 downward, increasing the overlapping range of the through hole 20 and the first heat exchange pipe 5 and the second heat exchange pipe 8, and realizing the adjustment of the coolant flow rate.

[0044] By providing the heat conducting plate 14 and the heat conducting pipe 15, the overlapping range of the through hole 20 and the first heat exchange pipe 5 and the second heat exchange pipe 8 is automatically adjusted by using the principle of gas expansion when heated, thereby realizing the automatic adjustment of the coolant flow rate and simplifying the control logic.

[0045] Embodiment 2:

[0046] A chip temperature control system, in this embodiment, the following improvements are made on the basis of Embodiment 1, as Figure 1-6 shown:

[0047] A limiting component for limiting the moving stroke of the piston 19 is arranged in the housing 16. The limiting component includes a first limiting ring 18 and a second limiting ring 21, and both the first limiting ring 18 and the second limiting ring 21 are fixedly connected to the inner wall of the housing 16.

[0048] By providing the first limiting ring 18 and the second limiting ring 21 to limit the movement of the piston 19, it is avoided that the coolant flow is cut off due to excessive movement, thereby ensuring the stable operation of the entire temperature control system.

[0049] Working principle: When the chassis 1 starts to work, the circulation pump 7 is started, and the coolant forms a circulation in the first heat exchange pipe 5 and the second heat exchange pipe 8. When the coolant passes through the first heat exchange pipe 5, it takes away the heat generated by the chip 3. When the coolant reaches the second heat exchange pipe 8, the motor 9 drives the rotating shaft 10 to drive all the fan blades 11 to rotate. The gas enters the chassis 1 from the heat dissipation groove and finally blows to the outer wall of the second heat exchange pipe 8 through the fixed cylinder 12, forming an air flow, thereby realizing the cooling of the second heat exchange pipe 8 and the internal coolant. The cooled coolant is transported back to the first heat exchange pipe 5 for heat exchange again, and so on; when the temperature of the chip 3 rises, the heat conducting plate 14 absorbs heat, causing the gas in the heat conducting pipe 15 to expand, thereby pushing the piston 19 downward, increasing the overlapping range of the through hole 20 and the first heat exchange pipe 5 and the second heat exchange pipe 8, and realizing the adjustment of the coolant flow rate.

[0050] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various changes or substitutions, and these should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A chip temperature control system, which is arranged in a chassis (1) together with a chip (3), the chip temperature control system comprising a first heat exchange tube (5) and a second heat exchange tube (8), and characterized in that: The inner wall of the chassis (1) is fixedly connected with a bracket (2), a chip (3) is installed on the inner wall of the bracket (2), a first heat exchange tube (5) is fixed to the bottom of the bracket (2), and the first heat exchange tube (5) is in contact with the chip (3). A second heat exchange tube (8) is fixed to the outer wall of one side of the chassis (1). The two ends of the first heat exchange tube (5) and the second heat exchange tube (8) are respectively communicated with each other through a valve assembly (6) and a circulation pump (7), and a coolant is filled in the first heat exchange tube (5) and the second heat exchange tube (8). A heat dissipation assembly (4) for cooling the coolant is arranged on the inner wall of the chassis (1) close to the second heat exchange tube (8).

2. The chip temperature control system according to claim 1, characterized in that: The heat dissipation assembly (4) includes a fixed cylinder (12) fixedly installed on the inner wall of the chassis (1) and two hollowed-out plates (13) fixedly connected to the inner wall of the fixed cylinder (12).

3. The chip temperature control system according to claim 1, wherein: The valve assembly (6) includes a heat conducting plate (14), a heat conducting tube (15) and a housing (16).

4. The chip temperature control system according to claim 3, characterized in that: The heat conducting plate (14) is fixed to the outer wall of the chip (3), the housing (16) is fixedly connected to the inner wall of the bracket (2), and the two ends of the heat conducting tube (15) are respectively fixedly connected to the heat conducting plate (14) and the housing (16).

5. A chip temperature control system according to claim 4, characterized in that: The first heat exchange tube (5) and the second heat exchange tube (8) are both fixedly connected and communicated with the inner wall of the housing (16). A piston (19) is slidably fitted on the inner wall of the housing (16), and a through hole (20) communicating with the first heat exchange tube (5) and the second heat exchange tube (8) is formed in the inner wall of the piston (19).

6. The chip temperature control system according to claim 5, wherein: A spring (17) is buckled at the bottom of the piston (19), and the other end of the spring (17) is buckled on the upper surface of the bottom of the housing (16).

7. The chip temperature control system according to claim 3, characterized in that: A limiting assembly for limiting the moving stroke of the piston (19) is arranged in the housing (16).

8. The chip temperature control system according to claim 7, wherein: The limiting assembly includes a first limiting ring (18) and a second limiting ring (21), and both the first limiting ring (18) and the second limiting ring (21) are fixedly connected to the inner wall of the housing (16).

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