LED screen

By adopting matrix-arranged light emitting components and multi-layer packaging adhesive and light shielding layer design in the LED screen, the problems of luminescence uniformity, light leakage and insufficient packaging protection are solved, and the display effect and service life are improved.

CN223167484UActive Publication Date: 2025-07-29DONGGUAN OPSCO OPTOELECTRONICS CO LTD
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Patent Information

Application Number
CN202422353968.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-26
Publication Date
2025-07-29
Estimated Expiration
2034-09-26

AI Technical Summary

Technical Problem

In the design and manufacturing process, existing LED screens face problems such as insufficient luminescence uniformity, light leakage, insufficient packaging protection and heat dissipation, which affect the display effect and service life.

Method used

The light emitting components arranged in matrix are combined with the multi-layer packaging adhesive and light-shielding layer design, and the light-out direction is controlled through the through-hole structure of the first and second light-shielding layers, enhancing packaging protection, reducing light leakage, and optimizing optical performance through different types of packaging adhesives.

Benefits of technology

It improves the display effect and photoelectric conversion efficiency, extends the service life of the luminescent components, enhances the protection ability to the environment, and reduces light leakage and heat accumulation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the utility model provides an LED screen which comprises an insulating base, a plurality of light-emitting assemblies, a plurality of first packaging adhesives and a first light shielding layer, the light-emitting assemblies are arranged on the insulating base, the light-emitting assemblies are arranged in a matrix mode to form an LED array, and the first packaging adhesives are arranged on the first light shielding layer. Each light-emitting assembly comprises a pin, a light-emitting wafer arranged on the pin and a driving chip used for driving the light-emitting wafer to emit light, each first packaging adhesive is packaged outside each light-emitting assembly, the first shading layer is arranged on the insulating base and comprises a plurality of first through holes, and the first packaging adhesives are located in the first through holes; when the multiple light-emitting assemblies emit light, the first light shielding layer can shield light emitted by the light-emitting assemblies from being emitted from the side face, and the light is emitted out of the first through hole. By improving the shading and packaging design, the display effect and the photoelectric conversion efficiency are improved, the service life of the light-emitting assembly is effectively prolonged, and remarkable technical progress and application value are achieved.
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Description

Technical Field

[0001] The utility model relates to the technical field of LED, in particular to an LED screen. Background Art

[0002] In modern display technologies, LED (light emitting diode) screens are widely used in devices such as billboards, monitors, and TVs due to their advantages of high brightness, long lifespan, and low power consumption. An LED screen usually consists of multiple light-emitting units, which are arranged in a certain pattern to form a matrix for displaying the required images or texts. However, in practical applications, how to effectively improve the display effect of the LED screen, enhance its working performance, and extend its lifespan remains an important issue that technicians in related fields focus on and research. In the prior art, during the design and manufacturing process of LED screens, there are technical problems such as insufficient light-emitting uniformity (since the light output direction and intensity of each light-emitting unit may vary, resulting in uneven overall display effects, such as bright spots or dark spots, which affect the visual effect of the screen), light leakage (when the light-emitting units are working, due to the lack of effective light-shielding design, some light may leak from the sides, leading to light pollution and reduced photoelectric conversion efficiency, which affects the display quality), insufficient encapsulation protection (the working state of the light-emitting units in the external environment is easily affected by factors such as dust and humidity. If the encapsulation is not perfect, it may cause a decline in the performance of the light-emitting units or even failure), and heat dissipation (when LEDs emit light, heat is generated. If the heat cannot be dissipated in a timely and effective manner, it may cause the light-emitting units to overheat, affecting their working stability and lifespan).

[0003] Therefore, it is urgent to improve the display uniformity and reduce light leakage while ensuring the efficient operation and long lifespan of the light-emitting units. Summary of the Invention

[0004] The utility model provides an LED screen, aiming to solve the technical problems faced by existing LED screens during the design and manufacturing process, such as insufficient light-emitting uniformity, light leakage, insufficient encapsulation protection, and heat dissipation (when LEDs emit light, heat is generated. If the heat cannot be dissipated in a timely and effective manner, it may cause the light-emitting units to overheat, affecting their working stability and lifespan).

[0005] In a first aspect, an embodiment of the present utility model provides an LED screen, comprising: an insulating base, a plurality of light-emitting components, a plurality of first encapsulation adhesives, and a first light-shielding layer. The light-emitting components are disposed on the insulating base, and the plurality of light-emitting components are arranged in a matrix to form an LED array. The light-emitting component includes a lead, a light-emitting chip disposed on the lead, and a driving chip for driving the light-emitting chip to emit light. Each of the first encapsulation adhesives encapsulates the outside of each light-emitting component. The first light-shielding layer is disposed on the insulating base, and the first light-shielding layer includes a plurality of first through-holes. The first encapsulation adhesive is located in the first through-holes. When the plurality of light-emitting components emit light, the first light-shielding layer can block the light emitted by the light-emitting components from emitting from the side, and enable the light to exit from the first through-holes.

[0006] The light-emitting components of the provided LED screen are arranged in a matrix, ensuring the uniformity of the position and light output of each light-emitting unit, and improving the overall display effect. A plurality of first encapsulation adhesives are used to encapsulate the outside of the light-emitting components, enhancing the protection ability against the environment and prolonging the service life of the light-emitting components. The first light-shielding layer is provided and includes a plurality of first through-holes, enabling the light to exit from the through-holes, but blocking the light scattered from the side, reducing light leakage, and improving the photoelectric conversion efficiency and display quality.

[0007] In summary, the LED screen proposed by the present utility model effectively prolongs the service life of the light-emitting components while improving the display effect and photoelectric conversion efficiency through the improved light-shielding and encapsulation designs, having significant technological progress and application value.

[0008] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0010] Figure 1 is a schematic structural diagram of the first type of LED screen provided by the embodiment of the present utility model;

[0011] Figure 2 is an exploded view of the first type of LED screen provided by the embodiment of the present utility model;

[0012] Figure 3 is a front view of the first type of LED screen provided by the embodiment of the present utility model;

[0013] Figure 4 This is an exploded schematic diagram of the second LED screen provided by the embodiment of the present utility model;

[0014] Figure 5 This is a structural diagram of the second LED screen provided by the embodiment of the present utility model;

[0015] Figure 6 This is a schematic structural diagram of the second light-shielding layer and the second packaging adhesive corresponding to the second type of LED screen provided by an embodiment of the present utility model;

[0016] Figure 7 This is a schematic structural diagram of a single light-emitting component provided by an embodiment of the present utility model;

[0017] Figure 8 This is a schematic block diagram of the structures corresponding to the first conductive sheet, the second conductive sheet, and the signal input unit provided in an embodiment of the present utility model;

[0018] Fig. 9 It is a schematic structural diagram of the protection plate provided in an embodiment of the utility model.

[0019] Description of main components and symbols:

[0020] 10. LED screen.

[0021] 11. Insulating seat; 111. Conductive through-hole; 12. Light-emitting component; 121. Driver chip; 122. Light-emitting chip; 123. Pin; 1231. Ground pin; 1232. Power pin; 1233. Signal input pin; 1234. Signal output pin; 13. First light-shielding layer; 131. First through-hole; 14. First packaging glue; 15. First conductive sheet; 16. Second conductive sheet; 17. SMD board; 18. Signal input terminal; 19. Signal input interface; 10a. Second light-shielding layer; 10a1. Second through-hole; 10b. Second packaging glue; 10c. Conductive column.

[0022] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory and are not restrictive of the present invention. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] The flowcharts shown in the drawings are merely illustrative examples, and do not necessarily include all the contents and operations / steps, nor do they necessarily have to be executed in the order described. For example, some operations / steps can also be decomposed, combined or partially merged, so the actual execution order may change according to the actual situation.

[0025] It should be understood that the terms used in the description of the present utility model herein are merely for the purpose of describing specific embodiments and are not intended to limit the present utility model. As used in the description of the present utility model and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include the plural forms.

[0026] It should be understood that in order to facilitate a clear description of the technical solutions of the embodiments of the present utility model, in the embodiments of the present utility model, terms such as "first" and "second" are used to distinguish the same items or similar items with basically the same functions and effects. For example, the first encapsulating adhesive and the second encapsulating adhesive are only used to distinguish different support members, and do not limit their order. Those skilled in the art can understand that the terms "first", "second", etc. do not limit the quantity and execution order, and the terms "first", "second", etc. do not necessarily mean different.

[0027] It should also be understood that the term " / and" used in the description of the present utility model and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0028] In modern display technologies, LED (light-emitting diode) screens are widely used in devices such as billboards, monitors, and televisions due to their advantages of high brightness, long lifespan, and low power consumption. An LED screen is typically composed of multiple light-emitting units, which are arranged in a certain pattern to form a matrix for displaying the desired images or texts. However, in practical applications, how to effectively improve the display effect of the LED screen, enhance its working performance, and extend its lifespan remains an important topic of concern and research for technicians in related fields. In the existing technologies, during the design and manufacturing process of LED screens, there are technical problems such as insufficient light-emitting uniformity (since the light output directions and intensities of each light-emitting unit may vary, resulting in uneven overall display effects, such as bright spots or dark spots, which affect the visual effect of the screen), light leakage (when the light-emitting units are working, due to the lack of effective light-shielding design, some light may leak from the sides, leading to light pollution and reduced photoelectric conversion efficiency, which affects the display quality), insufficient encapsulation protection (the working state of the light-emitting units in the external environment is easily affected by factors such as dust and humidity. If the encapsulation is not perfect, it may cause a decline in the performance of the light-emitting units or even failure), and heat dissipation (when LEDs emit light, heat is generated. If the heat cannot be dissipated in a timely and effective manner, it may cause the light-emitting units to overheat, affecting their working stability and lifespan).

[0029] Therefore, it is urgent to ensure the efficient operation and long lifespan of the light-emitting units while improving the display uniformity and reducing light leakage.

[0030] Please refer to Figures 1 to 9

[0031] ​Specifically, the light-emitting components 12 of the provided LED screen 10 are arranged in a matrix, ensuring the uniformity of the position and light output of each light-emitting unit, and improving the overall display effect. A plurality of first encapsulation adhesives 14 are used to encapsulate the outside of the light-emitting components 12, enhancing the protection ability against the environment and extending the service life of the light-emitting components 12. A first light-shielding layer 13 is provided, and a plurality of first through-holes 131 are included thereon, enabling light to exit from the through-holes, but blocking the light scattered from the side, reducing light leakage, and improving the photoelectric conversion efficiency and display quality. In summary, the LED screen 10 proposed by the present utility model effectively extends the service life of the light-emitting components 12 while improving the display effect and photoelectric conversion efficiency through the improvement of the light-shielding and encapsulation designs, having significant technological progress and application value.

[0032] In some embodiments, as Figure 4-6 shown, it further includes: a plurality of second encapsulation adhesives 10b, each second encapsulation adhesive 10b being encapsulated between each first encapsulation adhesive 14 and the light-emitting component 12, wherein the area of the projection of the second encapsulation adhesive 10b on the insulating base 11 is smaller than the area of the projection of the first encapsulation adhesive 14 on the insulating base 11; a second light-shielding layer 10a, the second light-shielding layer 10a being provided between the first light-shielding layer 13 and the insulating base 11, the second light-shielding layer 10a including a plurality of second through-holes 10a1, and the second encapsulation adhesive 10b being located in the second through-holes 10a1; wherein, when the plurality of light-emitting components 12 emit light, the first light-shielding layer 13 and the second light-shielding layer 10a can block the light emitted by the light-emitting components 12 from emitting from the side, and enable the light to exit from the first through-holes 131.

[0033] The provided LED screen 10 adds a second encapsulation adhesive 10b between the first encapsulation adhesive 14 and the light-emitting component 12, and each light-emitting component 12 is encapsulated by the second encapsulation adhesive 10b, and the projection area of the first encapsulation adhesive 14 relative to the insulating base 11 is larger. This enables the first light-shielding layer 13 and the second light-shielding layer 10a to simultaneously block the side light of the light-emitting components 12, and the light mainly exits from the first through-holes 131. By controlling the light exit direction, the clarity and contrast of the display of the LED screen 10 are improved. The scattering of light is reduced, and the light interference between the screens is lowered. At the same time, the double-layer encapsulation and light-shielding design improve the protection effect and service life of the LED. By controlling the light direction, the loss of ineffective light is reduced, and the energy utilization efficiency can also be correspondingly improved. Furthermore, the LED screen 10 design provided by the embodiments of the present utility model realizes the precise control of LED light emission through a multi-layer encapsulation and light-shielding structure, is expected to improve the display quality, reduce light pollution, and bring improvements in energy efficiency and life.

[0034] Exemplarily, as Figure 3 and Figure 6As shown, the shape of the first packaging glue 14 is adapted to the shape of the first through hole 131, and the shape of the second packaging glue 10b is adapted to the shape of the second through hole 10a1; wherein, the shape of the first packaging glue 14 projected on the insulating seat 11 is different from the shape of the second packaging glue 10b projected on the insulating seat 11.

[0035] In the above embodiment, the first encapsulant 14 of the provided LED screen 10 is adapted to the shape of the first through hole 131, and the second encapsulant 10b is adapted to the shape of the second through hole 10a1. By making the projection shapes of the first encapsulant 14 and the second encapsulant 10b on the substrate different. The design of the shading layer and the through hole effectively blocks the light from being emitted from the side, so that the light is mainly emitted from the second through hole 10a1, reducing the scattering of light, improving the directionality and uniformity of the light emission, and enhancing the display effect. And through the design of double-layer packaging and different projection shapes, the emission path of the light is controlled, the display brightness and contrast are improved, and at the same time, the interference or light pollution caused by light overflow is reduced. At the same time, the multi-layer structure of the first encapsulant 14 and the second encapsulant 10b provides better physical protection for the light-emitting component 12, helps to extend the service life of the LED, and enhances the ability to resist environmental influences. This embodiment optimizes the luminous effect and service life of the LED screen 10 through innovative packaging and shading design, and effectively improves the display quality.

[0036] It should be noted that, in some embodiments, Figure 3 、 4 and Figure 6 As shown, the first encapsulant 14 projects a rectangular shape onto the insulating base 11, while the second encapsulant 10b projects a circular shape onto the insulating base 11. Furthermore, the provided LED screen 10 optimizes light diffusion and focusing by employing a combined rectangular and circular design for the first and second encapsulants 14, 10b, respectively, thereby improving display uniformity and clarity. The rectangular design within the circular design provides enhanced light guidance and protection.

[0037] It should be noted that in some embodiments, the rectangle is located within the circle. The center of the rectangle coincides with the center of the circle. This center coincidence design ensures the symmetry of the light output of the LED screen 10.

[0038] Exemplarily, the type of the first packaging glue 14 is different from the type of the second packaging glue 10b. The first packaging glue 14 is either transparent glue or diffusion glue, and the second packaging glue 10b is another type of transparent glue or diffusion glue different from the first packaging glue 14.

[0039] The transparent glue has a high light transmittance and can effectively transmit the light of the light-emitting component 12, improving the brightness and color purity of the emitted light. The diffusing glue can effectively scatter the light, making the light more uniform, reducing bright spots or dark spots, and enhancing the uniformity of the display effect. By combining different encapsulation glues, the high light transmittance of the transparent glue and the uniform light distribution effect of the diffusing glue can be combined, enabling the light-emitting component 12 to perform its functions to the fullest under different levels of encapsulation and optimizing the overall display effect. Different selections of the first encapsulation glue 14 and the second encapsulation glue 10b can more precisely control the emission and scattering paths of light in the design, increasing the design flexibility and helping to achieve the best display effect. Using different types of encapsulation glues also helps to improve the heat dissipation performance of the light-emitting component 12. Some colloids have higher thermal conductivity and can effectively dissipate heat, thus extending the lifespan of the light-emitting component 12. At the same time, the combined use of different types of encapsulation glues provides more design options, giving engineers greater flexibility when designing and adjusting the optical performance. By reasonably selecting the types of transparent glue and diffusing glue, the light efficiency can be improved while reducing the light interference to surrounding components, further optimizing the overall performance of the optical system. This enables the provided LED screen 10 to adapt to different usage scenarios and customer requirements. In some cases, a higher light output is required, while in other cases, a more uniform light distribution is needed. Through this measure, the product characteristics can be flexibly adjusted according to the requirements.

[0040] In summary, by using different types of encapsulation glues (transparent glue and diffusing glue) in the design of the LED screen 10 to optimize the optical performance at different levels, not only the display effect and optical performance of the LED screen 10 are enhanced, but also greater design flexibility and adaptability are provided. At the same time, the reliability and lifespan of the product can be effectively improved to meet the requirements under different application scenarios.

[0041] Exemplarily, the thickness of the first through hole 131 is greater than or equal to the thickness of the first encapsulation glue 14. This further ensures that the first encapsulation glue 14 is completely located within the first through hole 131, further precisely controlling the emission path and angle of the light. And it prevents the first encapsulation glue 14 from protruding from the surface of the first light-shielding layer 13, maintaining the flatness of the screen surface and enhancing the display quality. At the same time, the first through hole 131 completely covers the first encapsulation glue 14, maximizing the effect of the light-shielding layer and reducing light leakage. It provides sufficient space for the first encapsulation glue 14, enhancing the stability and durability of the overall structure.

[0042] For example, the thickness of the second through-hole 10a1 is greater than or equal to the thickness of the second encapsulant 10b. This ensures that the second encapsulant 10b is completely surrounded by the second through-hole 10a1, helping to better control the initial diffusion and direction of light. Sufficient space is also provided for the second encapsulant 10b, preventing it from overflowing or being squeezed, thereby protecting the integrity of the light-emitting assembly 12. Providing additional space for heat dissipation helps improve the heat dissipation performance of the LED. A certain margin of error is provided during the production process, facilitating the injection and molding of the encapsulant.

[0043] Exemplarily, the thickness of the first encapsulant 14 is less than or equal to the thickness of the second encapsulant 10b. Thus, the thicker second encapsulant 10b helps to initially diffuse and homogenize the light, while the thinner first encapsulant 14 can further finely control the light emission. The thicker second encapsulant 10b provides better physical protection and insulation for the light-emitting component 12. The thicker second encapsulant 10b helps to better disperse and manage heat, thereby improving the life and performance of the LED. This thickness configuration provides more possibilities for optical design, and the light output characteristics can be optimized by adjusting the thickness ratio of the two layers of encapsulant. The thicker second encapsulant 10b is easier to manufacture and mold, while the thinner first encapsulant 14 is conducive to fine adjustment and surface treatment.

[0044] In summary, any combination of the three aforementioned embodiments, as needed, not only optimizes the optical performance and structural stability of the LED screen 10, but also enhances manufacturing feasibility and product durability. Through a carefully designed thickness configuration, this utility model achieves precise control of light output while providing adequate protection and heat dissipation for the LED screen 10.

[0045] Exemplarily, the insulating base 11 and the second light-shielding layer 10a are made of a BT resin substrate. BT (Bismaleimide Triazine) resin is used as the material for the insulating base 11 and the second light-shielding layer 10a. Due to its excellent heat resistance, BT resin can maintain stable performance in high-temperature environments. Its low dielectric constant also helps reduce signal interference and improve circuit performance. Its low hygroscopicity reduces the impact of moisture on the circuit, improving product reliability. It also enhances the stability and durability of the overall structure and ensures effective isolation between circuit components.

[0046] Exemplarily, the first light-shielding layer 13 is a light-shielding adhesive layer. The adhesive layer provides better adaptability and processing convenience, effectively controls light scattering in unintended directions, and reduces light interference between devices.

[0047] It should be noted that in some embodiments, the insulating base 11 and the second light-shielding layer 10a are white. The white surface reflects light emitted by the LEDs, improving light utilization. This reflection also increases the overall brightness output of the LED screen 10, enhancing the display quality. The white surface helps reflect heat, improving heat distribution, and evenly diffuses light, improving display uniformity. Reflection also increases light output, improving overall energy efficiency.

[0048] In some embodiments, the first light-shielding layer 13 is black. Black materials (such as a black light-shielding adhesive layer) can effectively absorb light of various wavelengths, significantly reducing light leakage. The black background enhances the visual effect of the LED light and improves display contrast.

[0049] In some embodiments, the first encapsulant 14 projects onto the insulating base 11 in a rectangular shape. The LED screen 10 thus optimizes light diffusion and focusing by adopting a rectangular design for the first encapsulant 14, thereby improving display uniformity and clarity. The rectangular design provides a better light display effect.

[0050] The above embodiments combine these elements to create a highly efficient, high-contrast display system. The BT resin substrate provides excellent electrical and mechanical properties, while the black first light-shielding layer 13 (e.g., a light-shielding adhesive layer) ensures precise light control and high contrast. The white insulating base 11 and first light-shielding layer 13 optimize light utilization and thermal management. This design not only improves display quality and energy efficiency, but also enhances the overall performance and reliability of the device.

[0051] In some embodiments, the insulating seat 11 includes a first surface and a second surface relative to each other, and multiple rows of pin groups 123 are spaced apart on the first surface of the insulating seat 11, and each row of pin groups 123 includes multiple pin pairs 123; each pin pair 123 includes a power pin 1232, a ground pin 1231, a signal input pin 1233 and a signal output pin 1234, the light-emitting chip 122 and the driving chip 121 are electrically connected to the power pin 1232, and the driving chip 121 is electrically connected to the ground pin 1231, the signal input pin 1233 and the signal output pin 1234 respectively; wherein, the power pins 1232 of the multiple pin pairs 123 are integrally formed, and the ground pins 1231 of the multiple pin pairs 123 are integrally formed.

[0052] like Figure 3 and 4As shown, the designed 123-pin group provided optimizes space utilization and improves integration. The integrally formed power and ground pins 1231 simplify the circuit layout, reduce resistance, improve power supply efficiency, enhance power distribution, and contribute to maintaining a stable voltage supply. Meanwhile, the integrally formed pins 123 increase the heat conduction area, facilitating heat dissipation. By adopting independent signal input and output pins 123, it helps reduce signal interference and improve signal integrity. The integrally formed pins 123 simplify the manufacturing and assembly processes, improving production efficiency. Also, the number of independent pins 123 is reduced, lowering the risk of connection failures, and the simplified design reduces material and manufacturing costs. Meanwhile, the independent signal input and output pins 123 provide flexibility for different control schemes. The unified power and ground design helps reduce electromagnetic interference. Through optimizing electrical connections and structural layouts, this embodiment facilitates future expansion and maintenance while improving the performance, reliability, and production efficiency of the LED screen 10.

[0053] It should be noted that Figure 2 the numbers of the light-emitting wafers 122 and the driving chips 121 in [[]] are only for illustration, and whether to cover the pins 123 is set according to actual needs. The embodiments of the present invention do not limit this.

[0054] Exemplarily, the LED screen 10 further includes a first conductive sheet 15 and a second conductive sheet 16 disposed on the second surface of the insulating base 11; the first conductive sheet 15 includes a first conductive bar along the extending direction of the power supply pin 1232 and a plurality of first electrode fingers spaced apart on the first conductive bar; the second conductive sheet 16 includes a second conductive bar along the extending direction of the ground pin 1231 and a plurality of second electrode fingers spaced apart on the second conductive bar; wherein, the first conductive bar and the second conductive bar are oppositely disposed, the plurality of first electrode fingers and the plurality of second electrode fingers are alternately arranged, at least one first electrode finger is electrically connected to the power supply pin 1232, and at least one second electrode finger is electrically connected to the ground pin 1231.

[0055] The above embodiment provides a larger contact area by providing a comb-shaped conductive sheet, thereby improving the distribution of power and ground. At the same time, the alternating electrode fingers form an interlocking structure, which helps to reduce electromagnetic interference. The special conductive sheet design helps to optimize the impedance characteristics of the signal transmission line. The increased metal area helps to dissipate heat and improve the overall heat dissipation performance. It also reduces the distributed resistance of the power supply and grounding, and improves the electrical performance. The optimized power and ground distribution helps to maintain signal integrity. In addition, the alternating arrangement design of the above embodiment improves space utilization efficiency. The design of the electrode fingers provides flexibility for different connection requirements, and the multi-point connection increases the redundancy of the system and improves overall reliability. The increased conductive area also improves the power handling capability of the system, and the alternating structure produces a distributed capacitance effect, which helps filtering.

[0056] In summary, this design optimizes the power and ground distribution structure, improving electrical performance, heat dissipation, and signal integrity while also facilitating manufacturing and future expansion. This structure is specifically developed and designed for the high-performance, highly integrated LED screen 10 application.

[0057] It should be noted that, in some embodiments, multiple first electrode fingers are electrically connected to the power pin 1232, and the multiple first electrode fingers electrically connected to the power pin 1232 are arranged at equal intervals; multiple second electrode fingers are electrically connected to the ground pin 1231, and the multiple second electrode fingers electrically connected to the ground pin 1231 are arranged at equal intervals.

[0058] By placing the first and second conductive plates 15 and 16 on the second surface of the insulating base 11, combined with an alternating arrangement of electrode fingers, the entire system significantly optimizes power distribution, heat dissipation, and signal integrity. This layout not only improves electrical performance but also enhances electromagnetic interference resistance and heat dissipation, while also providing better support for manufacturing processes and equipment reliability. These technical features work together to make the overall performance of the LED screen 10 more efficient, stable, and reliable.

[0059] It should be noted that if Figure 2 and 4 As shown, the insulating seat 11 includes a plurality of conductive through holes 111, and the provided LED screen 10 also includes a plurality of conductive columns 10c (such as copper columns), which are arranged in the conductive through holes 111 to achieve electrical connection between the first electrode finger and the power pin 1232.

[0060] Exemplarily, the LED screen 10 further includes: a signal input unit disposed on one side of the second surface of the insulating base 11. The signal input unit includes a plurality of signal input terminals 18 and a signal input interface 19 disposed on one side of the second surface. The signal input interface 19 is electrically connected to the plurality of signal input terminals 18; a patch board. The patch board 17 is disposed on the second surface of the insulating base 11. The patch board 17 includes an input slot, and the signal input unit is located in the input slot. Wherein, the signal input pins 1233 disposed on one side of the insulating base 11 are electrically connected to the signal input terminals 18. In each group of pins 123, the signal input pins 1233 and the signal output pins 1234 of adjacent pairs of pins 123 are integrally formed. The control signal is input to the signal input pins 1233 through the signal input unit, and each driving chip 121 controls the corresponding light-emitting wafer 122 to emit light according to the control signal.

[0061] In the above embodiment, the signal input unit centrally processes the signal input, simplifies the signal transmission path, and improves the stability and efficiency of signal transmission. The patch board design makes the signal input unit stable and occupies less space, which helps to improve the integration of the system and reduce complex wiring. The design of integrally forming the signal input pins 1233 and the output pins 123 reduces the connection nodes in signal transmission, thereby reducing signal interference and helping to maintain signal integrity. The design of the patch board and the input slot makes the installation and fixation of the signal input unit simpler, facilitating the assembly and maintenance of the device. At the same time, each driving chip 121 independently controls the light-emitting component 12 according to the input control signal, providing precise control over the light-emitting state and improving the display effect of the LED screen 10. By reducing the connection of individual pins 123, the integrally formed design reduces the risk of wire breakage or poor contact, improving the reliability of the device. The integrally formed pin 123 design simplifies the manufacturing process, reduces the number of required components, and lowers the production cost. In summary, the above signal input and transmission design not only simplifies the system structure, but also improves the efficiency, stability, and reliability of signal transmission, and is applicable to the application scenarios of high-performance LED screens 10.

[0062] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0063] The foregoing disclosure provides many different embodiments or examples for implementing different structures of the present utility model. To simplify the disclosure of the present utility model, the components and settings of specific examples are described above. Of course, they are only examples and are not intended to limit the present utility model. In addition, the present utility model may repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present utility model provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0064] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. An LED screen, characterized in that, Comprising: An insulating base, a plurality of light-emitting components, a plurality of first encapsulation adhesives, and a first light-shielding layer. The light-emitting components are disposed on the insulating base, and the plurality of light-emitting components are arranged in a matrix to form an LED array. The light-emitting component includes pins, a light-emitting wafer disposed on the pins, and a driving chip for driving the light-emitting wafer to emit light. Each of the first encapsulation adhesives encapsulates the outside of each light-emitting component. The first light-shielding layer is disposed on the insulating base. The first light-shielding layer includes a plurality of first through-holes, and the first encapsulation adhesives are located in the first through-holes. When the plurality of light-emitting components emit light, the first light-shielding layer can block the light emitted by the light-emitting components from emitting from the side, and enable the light to exit from the first through-holes.

2. The LED screen according to claim 1, wherein Further comprising: A plurality of second encapsulation adhesives and a second light-shielding layer; each of the second encapsulation adhesives encapsulates between each of the first encapsulation adhesives and the light-emitting component. Wherein, the area of the projection of the second encapsulation adhesive on the insulating base is smaller than the area of the projection of the first encapsulation adhesive on the insulating base. The second light-shielding layer is disposed between the first light-shielding layer and the insulating base. The second light-shielding layer includes a plurality of second through-holes, and the second encapsulation adhesives are located in the second through-holes. Wherein, when the plurality of light-emitting components emit light, the first light-shielding layer and the second light-shielding layer can block the light emitted by the light-emitting components from emitting from the side, and enable the light to exit from the first through-holes.

3. The LED screen according to claim 2, wherein The shape of the first encapsulation adhesive is adapted to the shape of the first through-hole, and the shape of the second encapsulation adhesive is adapted to the shape of the second through-hole; wherein, the shape of the projection of the first encapsulation adhesive on the insulating base is different from the shape of the projection of the second encapsulation adhesive on the insulating base.

4. The LED screen according to claim 3, characterized in that, The shape of the projection of the first encapsulation adhesive on the insulating base is rectangular, and the shape of the projection of the second encapsulation adhesive on the insulating base is circular.

5. The LED screen according to claim 4, characterized in that, The rectangle is located inside the circle, and the center of the rectangle coincides with the center of the circle.

6. The LED screen according to claim 2, wherein The type of the first encapsulation adhesive is different from the type of the second encapsulation adhesive. The type of the first encapsulation adhesive is any one of a transparent adhesive or a diffusing adhesive, and the type of the second encapsulation adhesive is the other one different from the type of the first encapsulation adhesive among the transparent adhesive or the diffusing adhesive.

7. The LED screen according to claim 2, wherein The thickness of the first through-hole is greater than or equal to the thickness of the first encapsulation adhesive; and / or, The thickness of the second through-hole is greater than or equal to the thickness of the second encapsulation adhesive; and / or, The thickness of the first encapsulation adhesive is less than or equal to the thickness of the second encapsulation adhesive.

8. The LED screen according to claim 2, wherein, The insulating base and the first light-shielding layer are light-shielding adhesive layers; and / or, the second light-shielding layer is a BT resin substrate.

9. The LED screen according to claim 8, characterized in that, The insulating base and the second light-shielding layer are white in color.

10. The LED screen according to claim 1, wherein, The first light-shielding layer is black in color; and / or, The shape of the projection of the first encapsulation adhesive on the insulating base is rectangular.

11. The LED screen according to claim 1, characterized in that, The insulating base includes opposite first and second surfaces. A plurality of rows of pin groups are spaced on the first surface of the insulating base. Each row of the pin groups includes a plurality of pin pairs. Each of the pin pairs includes a power supply pin, a ground pin, a signal input pin, and a signal output pin. The light-emitting wafer and the driving chip are electrically connected to the power supply pin, and the driving chip is electrically connected to the ground pin, the signal input pin, and the signal output pin respectively; wherein, the power supply pins of multiple pin pairs are integrally formed, and the ground pins of multiple pin pairs are integrally formed.

12. The LED screen according to claim 11, wherein, The LED screen further includes: a first conductive sheet and a second conductive sheet disposed on the second surface of the insulating base; the first conductive sheet includes a first conductive strip along the extending direction of the power supply pin and a plurality of first electrode fingers spaced apart on the first conductive strip; the second conductive sheet includes a second conductive strip along the extending direction of the ground pin and a plurality of second electrode fingers spaced apart on the second conductive strip; Wherein, the first conductive strip and the second conductive strip are disposed opposite to each other, the plurality of first electrode fingers and the plurality of second electrode fingers are alternately arranged, at least one of the first electrode fingers is electrically connected to the power supply pin, and at least one of the second electrode fingers is electrically connected to the ground pin.

13. The LED screen according to claim 12, wherein The plurality of first electrode fingers are electrically connected to the power supply pin, and the plurality of first electrode fingers electrically connected to the power supply pin are arranged at equal intervals; The plurality of second electrode fingers are electrically connected to the ground pin, and the plurality of second electrode fingers electrically connected to the ground pin are arranged at equal intervals.

14. The LED screen according to claim 11, characterized in that, The LED screen further includes: a signal input unit and a patch board disposed on one side of the second surface of the insulating base; the signal input unit includes a plurality of signal input terminals and a signal input interface disposed on one side of the second surface, and the signal input interface is electrically connected to the plurality of signal input terminals; the patch board is disposed on the second surface of the insulating base, and the patch board includes an input slot, and the signal input unit is located in the input slot; Wherein, the signal input pin located on one side of the insulating base is electrically connected to the signal input terminal. In each pin group, the signal input pins and the signal output pins of adjacent pin pairs are integrally formed. The control signal is input to the signal input pin through the signal input unit, and each driving chip controls the corresponding light-emitting wafer to emit light according to the control signal.