Device for measuring thickness of semiconductor wafer

Abstract

The utility model relates to the technical field of semiconductor wafers, and discloses a semiconductor wafer thickness measuring device, which comprises a moving assembly and a compression measuring assembly, the moving assembly is arranged below the compression measuring assembly, the moving assembly comprises a fixed bottom plate, the upper end of the fixed bottom plate is connected with a moving motor, and the moving motor is connected with the compression measuring assembly. The output end of the moving motor is fixedly connected with a threaded rod, the threaded rod is connected with a threaded block, the upper end of the threaded block is connected with a sliding block, and the sliding block is connected with a sliding groove. According to the utility model, the thickness information of a plurality of positions can be rapidly acquired, the flexibility during measurement is improved, the measurement work of the thickness of the whole wafer can be rapidly completed, the measurement efficiency is improved, different areas of the semiconductor wafer can be measured, the distribution condition of the thickness of the semiconductor wafer can be completely mastered, and the measurement accuracy is improved. And omission of areas possibly having abnormal thickness is avoided, so that the measurement is more comprehensive.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor wafer technical field, specifically for a kind of semiconductor wafer thickness measuring device. BACKGROUND

[0002] With the rapid development of semiconductor technology, as the core component of electronic device, the quality and performance of semiconductor wafer have crucial influence on the performance of entire electronic product, and in the manufacturing process of semiconductor wafer, the accurate measurement of its thickness is one of the key links to ensure product quality and performance.

[0003] There are still some deficiencies in the existing semiconductor wafer thickness measuring device: the existing semiconductor wafer thickness measuring device often cannot drive semiconductor wafer to rotate to adjust the position of measurement when measuring semiconductor wafer, reduces the flexibility during measurement, and cannot measure different areas during measurement, resulting in insufficient comprehensive measurement. UTILITY MODEL CONTENTS

[0004] The utility model aims at solving the shortcomings in prior art and provides a semiconductor wafer thickness measuring device.

[0005] In order to achieve the above object, the utility model adopts the following technical scheme: a semiconductor wafer thickness measuring device, including moving assembly and compression measuring assembly, the moving assembly is located below compression measuring assembly, and moving assembly includes fixed bottom plate, and fixed bottom plate upper end is connected with moving motor, the output end of moving motor is fixedly connected with threaded rod, and threaded rod is connected with threaded block, the threaded block upper end is connected with sliding block, and sliding block is connected with sliding groove, the compression measuring assembly includes rotating motor, and the output end of rotating motor is fixedly connected with first gear, and first gear side is connected with second gear, the second gear is connected with rotating column, and rotating column upper end is connected with first suction cup, the first suction cup upper end is equipped with second suction cup, and second suction cup upper end is connected with connecting block, and connecting block upper end is connected with hydraulic telescopic rod, the hydraulic telescopic rod upper end is connected with fixed block, and fixed block upper end is connected with T-shaped sliding block, and T-shaped sliding block is connected with T-shaped sliding groove.

[0006] As a further description of the above technical scheme:

[0007] The lower end of the rotating motor is fixedly connected to the threaded block, one side of the first gear is engaged with the second gear, and the second gear is fixedly connected to the rotating column, and the lower end of the rotating column is rotatably connected to the threaded block.

[0008] As a further description of the above technical scheme:

[0009] The end of the rotating column away from the threaded block is fixed to the first suction disc, the first suction disc is vertically arranged with the second suction disc, and the end of the second suction disc away from the first suction disc is fixed to the connecting block.

[0010] As a further description of the above technical solution:

[0011] The end of the connecting block away from the second suction disc is rotationally connected to the hydraulic telescopic rod, the end of the hydraulic telescopic rod away from the connecting block is fixed to the fixed block, and the upper end of the fixed block is fixed to the T-shaped sliding block.

[0012] As a further description of the above technical solution:

[0013] The T-shaped sliding block is slidingly connected in the T-shaped sliding groove, and the T-shaped sliding groove is arranged on the fixed column, and the fixed column is fixed to one end of the fixed frame.

[0014] As a further description of the above technical solution:

[0015] The bottom of the fixed frame is fixed to the fixed base plate, a laser detection head is fixed to the upper end of the fixed frame, and two groups of the laser detection head are symmetrically arranged above and below.

[0016] As a further description of the above technical solution:

[0017] The moving motor is fixed to the fixed base plate through the support, and the threaded block is threadedly connected to the threaded rod in the middle, and the threaded rod is rotationally connected to the fixed base plate through the support.

[0018] As a further description of the above technical solution:

[0019] The upper end of the sliding block is fixed to the threaded block, and the sliding block is slidingly connected in the sliding groove arranged on the fixed base plate.

[0020] The utility model has the advantages of the following beneficial effects:

[0021] 1. By starting the rotating motor, the rotating motor drives the first gear to rotate, thereby driving the first suction disc and the second suction disc to rotate, so that the thickness information of multiple positions can be quickly obtained, the flexibility during measurement is improved, and the entire wafer thickness measurement work is completed faster, and the measurement efficiency is improved.

[0022] 2. By starting the moving motor, the moving motor drives the threaded rod to rotate, thereby driving the threaded block to move and adjust the position, and then adjusting the position of the semiconductor wafer clamped above, so that different regions of the semiconductor wafer can be measured, thereby completely grasping the distribution of the semiconductor wafer thickness, avoiding missing regions that may have abnormal thickness, and making the measurement more comprehensive. DRAWINGS

[0023] Figure 1 A three-dimensional structural schematic diagram of a semiconductor wafer thickness measuring device is provided for the utility model.

[0024] Figure 2 A partial structural schematic diagram of a semiconductor wafer thickness measuring device is provided for the utility model. Figure One ;

[0025] Figure 3 A partial structural schematic diagram of a semiconductor wafer thickness measuring device is provided for the utility model. Figure Two ;

[0026] Figure 4 A partial structural schematic diagram of a semiconductor wafer thickness measuring device is provided for the utility model. Figure Three .

[0027] Legend:

[0028] 1, moving assembly; 2, compression measuring assembly; 101, fixed bottom plate; 102, moving motor; 103, threaded rod; 104, threaded block; 105, sliding block; 106, sliding groove; 201, rotary motor; 202, first gear; 203, second gear; 204, rotating column; 205, first suction cup; 206, second suction cup; 207, connecting block; 208, hydraulic telescopic rod; 209, fixed block; 210, T-shaped sliding block; 211, T-shaped sliding groove; 212, fixed column; 213, fixed frame; 214, laser detection head. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0030] With reference to Figures 1-4 , the utility model provides a kind of semiconductor wafer thickness measuring device, including moving assembly 1 and compression measuring assembly 2.

[0031] ​Specifically, the moving assembly 1 is arranged below the compression measuring assembly 2, and the moving assembly 1 comprises a fixed bottom plate 101, the upper end of the fixed bottom plate 101 is connected with a moving motor 102, the output end of the moving motor 102 is fixedly connected with a threaded rod 103, the threaded rod 103 is connected with a threaded block 104, the upper end of the threaded block 104 is connected with a sliding block 105, the sliding block 105 is connected with a sliding groove 106, the compression measuring assembly 2 comprises a rotating motor 201, the output end of the rotating motor 201 is fixedly connected with a first gear 202, one side of the first gear 202 is connected with a second gear 203, the second gear 203 is connected with a rotating column 204, the upper end of the rotating column 204 is connected with a first suction disc 205, the upper end of the first suction disc 205 is provided with a second suction disc 206, the upper end of the second suction disc 206 is connected with a connecting block 207, the upper end of the connecting block 207 is connected with a hydraulic telescopic rod 208, the upper end of the hydraulic telescopic rod 208 is connected with a fixed block 209, the upper end of the fixed block 209 is connected with a T-shaped sliding block 210, and the T-shaped sliding block 210 is connected with a T-shaped sliding groove 211.

[0032] In the embodiment, the moving assembly 1 and the compression measuring assembly 2 constitute the semiconductor wafer thickness measuring device related to the application, and the thickness of the semiconductor wafer is measured.

[0033] In the embodiment, the semiconductor wafer shape structure is circular, because in the semiconductor manufacturing process, the wafer is cut from a large circular wafer, and the wafer itself is made of high-purity silicon or other semiconductor materials.

[0034] In the embodiment, two groups of laser detection heads 214 are symmetrically arranged above and below, and the thickness of the semiconductor wafer can be measured at the same time.

[0035] It should be noted that the shape of the fixed frame 213 is inverted L-shaped, which is used to fix the fixed column 212 and the laser detection head 214, so that the laser detection head 214 can keep the fixed position during measurement.

[0036] Specifically, the lower end of the rotating motor 201 is fixedly connected to the threaded block 104, one side of the first gear 202 is engaged with the second gear 203, the middle of the second gear 203 is fixedly connected to the rotating column 204, the lower end of the rotating column 204 is rotatably connected to the threaded block 104, the end of the rotating column 204 away from the threaded block 104 is fixedly connected to the first suction disc 205, the first suction disc 205 is vertically arranged with the second suction disc 206, the end of the second suction disc 206 away from the first suction disc 205 is fixedly connected to the connecting block 207, the end of the connecting block 207 away from the second suction disc 206 is rotatably connected to the hydraulic telescopic rod 208, the end of the hydraulic telescopic rod 208 away from the connecting block 207 is fixedly connected to the fixed block 209, the upper end of the fixed block 209 is fixedly connected to the T-shaped sliding block 210, the T-shaped sliding block 210 is slidably connected in the T-shaped sliding groove 211, the T-shaped sliding groove 211 is arranged on the fixed column 212, the fixed column 212 is fixedly connected to one end of the fixed frame 213, the bottom of the fixed frame 213 is fixedly connected to the fixed base plate 101, the upper end of the fixed frame 213 is fixedly connected with the laser detection head 214, and two groups of the laser detection head 214 are symmetrically arranged above and below.

[0037] As a preferable embodiment, the lower end of the rotating column 204 is rotatably connected to the threaded block 104, and the upper end of the rotating column 204 is fixedly connected with the first suction disc 205, and the first suction disc 205 is used for sucking and fixing the wafer.

[0038] As a preferable embodiment, the shape of the T-shaped sliding block 210 is T-shaped, and the shape of the T-shaped sliding groove 211 arranged on the fixed column 212 is also T-shaped, so that the T-shaped sliding block 210 can slide in the T-shaped sliding groove 211 to prevent falling.

[0039] Specifically, the moving motor 102 is fixedly connected to the fixed base plate 101 through a support, the middle of the threaded block 104 is threadedly connected to the threaded rod 103, and the threaded rod 103 is rotatably connected to the fixed base plate 101 through a support, the upper end of the sliding block 105 is fixedly connected to the threaded block 104, and the sliding block 105 is slidably connected in the sliding groove 106 arranged on the fixed base plate 101.

[0040] As a preferable embodiment, the sliding block 105 fixedly connected to the lower end of the threaded block 104 slides in the sliding groove 106 arranged on the fixed base plate 101, which is used for preventing the threaded block 104 from rotating with the threaded rod 103 when moving.

[0041] It should be noted that when it is necessary to adjust the position of the wafer clamped above, the moving motor 102 can be driven forward and backward, so that the threaded rod 103 can rotate forward or backward, and then the threaded block 104 can move in two directions to adjust the position.

[0042] In use, when the thickness of the semiconductor wafer is measured, the hydraulic telescopic rod is started, the hydraulic telescopic rod drives the connecting block to move downwards, thereby driving the second suction disc to move downwards through the first suction disc to press the semiconductor wafer, then, the two groups of laser detection heads arranged up and down are started to measure the thickness of the semiconductor wafer, at this time, the moving motor is started, the moving motor drives the threaded rod to rotate, thereby driving the threaded block to move to adjust the position, thereby adjusting the position of the semiconductor wafer clamped on the upper side, at this time, the rotating motor is started, the rotating motor drives the first gear to rotate, thereby driving the semiconductor wafer clamped by the first suction disc and the second suction disc to rotate.

[0043] The semiconductor wafer thickness measuring device can quickly obtain thickness information of multiple positions, improve flexibility during measurement, thereby faster complete the whole wafer thickness measurement work, improve measurement efficiency, and can measure different regions of the semiconductor wafer, thereby completely master the distribution of the semiconductor wafer thickness, avoid missing regions that may have abnormal thickness, and make the measurement more comprehensive.

[0044] Finally, it should be noted that: the above only for the preferred embodiments of the utility model, and does not limit the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or equivalent replacement to part of technical features, any modification, equivalent replacement, improvement etc. within the spirit and principles of the utility model, should be included in the protection scope of the utility model.

Claims

1. A device for measuring the thickness of semiconductor wafers, characterized in that: The utility model provides mobile component (1) and compaction measuring component (2) including, mobile component (1) is located the lower of compaction measuring component (2), and mobile component (1) includes fixed bottom plate (101), and the upper end of fixed bottom plate (101) is connected with mobile motor (102), the output of mobile motor (102) is fixedly connected with threaded rod (103), and threaded rod (103) is connected with threaded block (104), the upper end of threaded block (104) is connected with sliding block (105), and sliding block (105) is connected with sliding slot (106), compaction measuring component (2) includes rotary motor (201), and the output of rotary motor (201) is fixedly connected with first gear (202), and one side of first gear (202) is connected with second gear (203), second gear (203) is connected with rotating column (204), and the upper end of rotating column (204) is connected with first suction disc (205), the upper end of first suction disc (205) is equipped with second suction disc (206), and the upper end of second suction disc (206) is connected with connecting block (207), and the upper end of connecting block (207) is connected with hydraulic telescopic rod (208), the upper end of hydraulic telescopic rod (208) is connected with fixed block (209), and the upper end of fixed block (209) is connected with T-shaped sliding block (210), and T-shaped sliding block (210) is connected with T-shaped sliding slot (211).

2. A device for measuring the thickness of a semiconductor wafer as defined in claim 1, wherein: The lower end of the rotary motor (201) is fixedly connected to the threaded block (104), one side of the first gear (202) is engaged with the second gear (203), and the second gear (203) is fixedly connected to the rotating column (204) in the middle, and the lower end of the rotating column (204) is rotatably connected to the threaded block (104).

3. A device for measuring the thickness of a semiconductor wafer as defined in claim 2, wherein: The end of the rotating column (204) away from the threaded block (104) is fixedly connected to the first suction disc (205), and the first suction disc (205) and the second suction disc (206) are vertically arranged, and the end of the second suction disc (206) away from the first suction disc (205) is fixedly connected to the connecting block (207).

4. The apparatus for measuring the thickness of a semiconductor wafer as defined in claim 3 wherein: The end of the connecting block (207) away from the second suction disc (206) is rotatably connected to the hydraulic telescopic rod (208), the end of the hydraulic telescopic rod (208) away from the connecting block (207) is fixedly connected to the fixed block (209), and the upper end of the fixed block (209) is fixedly connected to the T-shaped sliding block (210).

5. A device for measuring the thickness of a semiconductor wafer as defined in claim 4, wherein: The T-shaped sliding block (210) is slidably connected in the T-shaped sliding slot (211), and the T-shaped sliding slot (211) is arranged on the fixed column (212), and the fixed column (212) is fixedly connected to one end of the fixed frame (213).

6. A device for measuring the thickness of a semiconductor wafer as defined in claim 5, wherein: The bottom of the fixed frame (213) is fixedly connected to the fixed bottom plate (101), the upper end of the fixed frame (213) is fixedly connected with the laser detection head (214), and two groups of the laser detection head (214) are symmetrically arranged above and below.

7. A device for measuring the thickness of a semiconductor wafer as defined in claim 6, wherein: The mobile motor (102) is fixedly connected to the fixed bottom plate (101) through the support, the middle of the threaded block (104) is threadedly connected to the threaded rod (103), and the threaded rod (103) is rotatably connected to the fixed bottom plate (101) through the support.

8. A device for measuring the thickness of a semiconductor wafer as defined in claim 7, wherein: The upper end of the sliding block (105) is fixed to the threaded block (104), and the sliding block (105) is slidingly connected in the sliding groove (106) provided on the fixed bottom plate (101).

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